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heshmore · 2 months
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SK telecom and Intel develops technology to reduce communication delays for 6G
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SK telecom and Intel develops technology to reduce communication delays for 6G. SKT Develops Key Technology for Low-latency Core Network for 6G Evolution February 01, 2024 - SK Telecom (NYSE:SKM, “SKT”) announced that, in collaboration with Intel, it has successfully developed technology to reduce communication delays necessary for the evolution of 6G Core Architecture. The Core network is the gateway through which all voice and data traffic generated from a customer's mobile device passes through to access the Internet network. It is a mobile communication service system that is responsible for security and service quality through the interconnection of various systems. The 6G Core Architecture is required to have higher flexibility and safety than previous generations of communications and to provide stable AI service quality and technologies to customers by embedding intelligent and automation technologies. As Core network technology continues to develop, the various systems that make up the network and the detailed functions that provide various services are also explosively increasing. As network complexity continues to increase, the process of sending and receiving messages is frequently recreated. Therefore, communication delays will increase compared to before. It is difficult to address these limitations with communication standard technologies (service communication proxies) for interconnection between unit functions within the existing Core network. Inline Service Mesh, a technology the two companies developed utilizing Intel Xeon processors with built in AI, is capable of increasing the communication speed within the Core network by reducing latency between unit function without Proxy. Through this technology development, AI, which requires a large amount of computation, can be applied to the Core network in a wider variety of models. SKT has already commercialized a technology that reduces wireless resources by 40% and improves connectivity by analyzing movement patterns of real users in real time. Through this cooperation, the two companies will be able to reduce communication delays by 70% and increase service efficiency by 33% in the Core network through the application of the 6G Core Architecture. SKT aims to apply the results of this study to commercial equipment next year. A technical white paper has been published that describes the technology, development process and benefits. SKT and Intel have been continuing to cooperate for research on the development of key wired/wireless mobile communication technologies for the past 10 years. Based on the results of this study, the two companies plan to continue research and development for traffic processing improvement technologies incorporating AI technology in various areas of the Core network. "We have made another technical achievement through continuous technology development cooperation with Intel to secure leadership in 6G," said Yu Takki, Vice President and Head of Infra Tech at SKT. "We will continue our research and make efforts to commercialize AI-based 6G Core Architecture.” "Our research and development efforts with SK Telecom continue to deliver innovations that have been deployed by Communications Service Providers worldwide”, said Dan Rodriguez, Corporate Vice President of Intel Network & Edge Solutions Group. “By leveraging the latest Intel Xeon processors with built in AI features, our companies are able to drive both performance and efficiency improvements that will be vital to the future Core networks. Read the full article
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heshmore · 2 months
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Intel and UMC to develop 12-nanometer process platform at fabs in Arizona
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Intel and UMC to develop 12-nanometer process platform at fabs in Arizona.
Highlights
- Companies to collaborate on the development of a 12-nanometer process platform targeting high-growth markets. - Collaboration builds on Intel’s commitment to partnering with innovative companies in Taiwan to help the company better serve global customers and expand its mature process capabilities for foundry customers. - Deal broadens customer access to a geographically diverse semiconductor supply chain. - Collaboration provides UMC with additional capacity, accelerates its development roadmap and demonstrates its leading process technology R&D. SANTA CLARA, Calif., and TAIPEI, Taiwan, ROC, Jan. 25, 2024 - Intel Corp. (Nasdaq: INTC) and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced that they will collaborate on the development of a 12-nanometer semiconductor process platform to address high-growth markets such as mobile, communication infrastructure and networking. The long-term agreement brings together Intel’s at-scale U.S. manufacturing capacity and UMC’s extensive foundry experience on mature nodes to enable an expanded process portfolio. It also offers global customers greater choice in their sourcing decisions with access to a more geographically diversified and resilient supply chain. “Taiwan has been a critical part of the Asian and global semiconductor and broader technology ecosystem for decades, and Intel is committed to collaborating with innovative companies in Taiwan, such as UMC, to help better serve global customers,” said Stuart Pann, Intel senior vice president and general manager of Intel Foundry Services (IFS). “Intel’s strategic collaboration with UMC further demonstrates our commitment to delivering technology and manufacturing innovation across the global semiconductor supply chain and is another important step toward our goal of becoming the world’s second-largest foundry by 2030.” “Our collaboration with Intel on a U.S.-manufactured 12 nm process with FinFET capabilities is a step forward in advancing our strategy of pursuing cost-efficient capacity expansion and technology node advancement in continuing our commitment to customers. This effort will enable our customers to smoothly migrate to this critical new node, and also benefit from the resiliency of an added Western footprint. We are excited for this strategic collaboration with Intel, which broadens our addressable market and significantly accelerates our development roadmap leveraging the complementary strengths of both companies.” The 12 nm node will utilize Intel’s U.S. based high-volume manufacturing capacity and experience in FinFET transistor design, offering a strong combination of maturity, performance and power efficiency. The production will markedly benefit from UMC’s decades of process leadership and history of providing customers with Process Design Kit (PDK) and design assistance for effectively providing foundry services. The new process node will be developed and manufactured in Fabs 12, 22 and 32 at Intel’s Ocotillo Technology Fabrication site in Arizona. Leveraging existing equipment in these fabs will significantly reduce upfront investment requirements and optimize utilization. The two companies will work to satisfy customer demand and cooperate on design enablement to support the 12 nm process by enabling electronic design automation and intellectual properties solutions from ecosystem partners. Production of the 12 nm process is expected to begin in 2027. Intel has been investing and innovating in the U.S. and globally for more than 55 years, with established or planned manufacturing sites and investments in Oregon, Arizona, New Mexico and Ohio, in addition to Ireland, Germany, Poland, Israel and Malaysia. IFS has made significant progress over the past year, building strong momentum with new customers, including new customers across the Intel 16, Intel 3 and Intel 18A process technologies, and expanding its growing foundry ecosystem. IFS expects to continue its progress this year. UMC has a more than 40-year history of being a preferred supplier of foundry services to critical applications including automotive, industrial, display and communications. Over the past two decades, UMC has successfully expanded its base across Asia and has continued to lead innovation across mature nodes and specialty foundry services. UMC is a significant supplier to the top 400+ semiconductor customers and has extensive expertise and know-how in supporting customers to reach high yields while maintaining industry-leading foundry utilization.
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry company. The company provides high-quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI, BCD etc. Most of UMC's 12-in and 8-in fabs with its core R&D are in Taiwan, with additional ones throughout Asia. UMC has a total of 12 fabs in production with a combined capacity of more than 880,000 wafers per month (8-in equivalent), and all of them are certified with IATF 16949 automotive quality standards. UMC is headquartered in Hsinchu, Taiwan, plus local offices in the United States, Europe, China, Japan, Korea, and Singapore, with a worldwide total of 20,000 employees Read the full article
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heshmore · 2 months
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Vodafone, Qualcomm, and Xiaomi successfully tested new 5G uplink technology in Europe
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Vodafone, Qualcomm, and Xiaomi successfully tested new 5G uplink technology in Europe. Customers set to receive faster 5G upload speeds following successful test by Vodafone, Xiaomi and Qualcomm Jan 22, 2024 - Vodafone, Xiaomi, and Qualcomm Technologies Inc have successfully tested a new 5G technology that will pave the way for customers to get faster upload speeds and wider coverage with the arrival of new smartphones and devices expected during 2024. In the first European technical test of this advanced 5G uplink technology, Vodafone, Qualcomm, and Xiaomi achieved peak upload speeds of up to 273 megabits per second (Mbps). Most of today’s smartphones and home broadband services are capable of an average upload speed of 100 Mbps. The enhanced 5G technology raises upload speeds closer to download levels whilst also extending coverage and increasing capacity. The test combined the power of Vodafone’s new 5G Standalone (5G SA) networks in both Germany and Spain with the latest silicon technology from Qualcomm (The Snapdragon® 8 Gen 3 Mobile Platform) and the next Xiaomi flagship smartphone. Better uplink capabilities will enable customers to upload their photos, videos and files to social media sites and the cloud at almost double the speed possible today when next-generation devices arrive later this year. This is important to meet the growing demand for cloud storage, video streaming, augmented and virtual reality applications, and multi-player gaming. “We want our customers to be among the first anywhere in the world to benefit from this new 5G feature when it becomes available. That’s why we are working with key partners to lead the industry in pulling together and testing the necessary network, silicon chips and devices to turn it into a reality, all while driving a stronger vendor and developer ecosystem.” Alberto Ripepi, Chief Network Officer of Vodafone said This technological breakthrough is made possible using the advanced capabilities of 5G SA. Specifically, the ability to enhance the uplink performance using a technique called Uplink Carrier Aggregation with Tx Switching which combines multiple transmission channels supported by the smartphone and the mobile antenna. Whereas most existing 5G services offered by telecoms companies rely partly on 4G technology, known as 5G non-standalone, Vodafone is pioneering the rollout of 5G SA. The company has launched it commercially in Germany (the first in the EU) and the UK, while also running pilots in other markets, and will progressively update sites to support Uplink Carrier Aggregation with Tx Switching as new devices become available. “We are proud of our continued collaboration with Vodafone and Xiaomi to achieve another 5G milestone. The evolution of 5G towards 5G Standalone, the ultimate realisation of 5G technologies is a crucial step for enabling the full promise of 5G with 5G Advanced.” Enrico Salvatori, Senior Vice President and President, Qualcomm Europe/MEA of Qualcomm Europe, Inc., said “The successful pilot test of UL Tx switching highlights the added value that maximizes resource utilization with respect to user equipment’s capability and further enhances the uplink performance,” added Andi Zhang, Deputy General Manager of Product & Technology at Xiaomi. “We are committed to working with key partners in innovating in 5G and access technologies to enhance the customer experience and stay ahead.” Today’s smartphones either have one or two channels dedicated to uplink, with each one offering approximately 100 Mbps depending on where the user is (indoor or crowded areas tend to decrease capacity). Using Uplink Carrier Aggregation with Tx Switching, together with a commercial device, Vodafone and its technology vendors have been able to optimize ways of transmitting information. This boosted speed by 35% to 54% depending on the distance between the smartphone and mobile site. The successful tests took place in the Spanish city of Ciudad Real using Vodafone’s live, multi-vendor testing 5G network named ‘CREATE’ (Ciudad Real España Advanced Testing Environment) and Vodafone’s commercial 5G SA network in Hannover, Germany. The uplink boost is the latest 5G innovation from Vodafone, which also includes successful tests of 6GHz spectrum for boosting capacity in the future, as well as new software ideally suited to low-powered devices like smart watches, credit card readers and portable routers, which doesn’t drain battery life. Read the full article
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heshmore · 2 months
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Google's Gemini Pro and Imagen 2 produce text, voice and image AI features in Samsung Galaxy S24 series
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Google's Gemini Pro and Imagen 2 produce text, voice and image AI features in Samsung Galaxy S24 series. Samsung and Google Cloud Join Forces To Bring Generative AI to Samsung Galaxy S24 Series Korea and USA on January 18, 2024 - Samsung Electronics and Google Cloud today announced a new multi-year partnership to bring Google Cloud’s generative artificial intelligence (AI) technology to Samsung smartphone users around the globe. Starting with the Samsung Galaxy S24 series announced today at Galaxy Unpacked in San Jose, California, Samsung will be the first Google Cloud partner to deploy Gemini Pro and Imagen 2 on Vertex AI via the cloud to their smartphone devices. “Google and Samsung have long shared deeply held values around the importance of making technology more helpful and accessible for everyone. We’re thrilled that the Galaxy S24 series is the first smartphone equipped with Gemini Pro and Imagen 2 on Vertex AI,” said Janghyun Yoon, Corporate EVP and Head of Software Office of Mobile eXperience Business at Samsung Electronics. “After months of rigorous testing and competitive evaluation, the Google Cloud and Samsung teams worked together to deliver the best Gemini-powered AI experience on Galaxy.” Samsung is the first Google Cloud partner to deploy Gemini Pro on Vertex AI to consumers. Built from the ground up to be multimodal, Gemini can generalize and seamlessly understand, operate across, and combine different types of information, including text, code, images, and video. Starting with Samsung-native applications, users can take advantage of the summarization feature across Notes, Voice Recorder, and Keyboard.1 Gemini Pro on Vertex AI provides Samsung with critical Google Cloud features, including security, safety, privacy, and data compliance. Galaxy S24 series users can also immediately benefit from Imagen 2, Google’s most advanced text-to-image diffusion technology from Google DeepMind to date. With Imagen 2 on Vertex AI, Samsung can bring safe and intuitive photo-editing capabilities into users’ hands. These features can be found in Generative Edit2 in S24’s Gallery application. As part of this partnership, Samsung is also one of the first customers to test Gemini Ultra, Google’s most capable and largest model for highly complex tasks. The S24 series will also use Gemini Nano, an on-device LLM delivered as part of the Android 14 operating system, the most efficient model of Gemini for on-device tasks. “Together with Samsung, Google Cloud sees the tremendous opportunity for generative AI to create meaningful mobile experiences that stimulate and strengthen connection and communication for millions,” said Thomas Kurian, CEO, Google Cloud. “With Gemini, Samsung’s developers can leverage Google Cloud’s world-class infrastructure, cutting-edge performance, and flexibility to deliver safe, reliable, and engaging generative AI powered applications on Samsung smartphone devices.”
About Google Cloud
Google Cloud accelerates every organization’s ability to digitally transform its business and industry. We deliver enterprise-grade solutions that leverage Google’s cutting-edge technology and tools that help developers build more sustainably. Customers in more than 200 countries and territories turn to Google Cloud as their trusted partner to enable growth and solve their most critical business problems. Read the full article
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heshmore · 2 months
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Qualcomm Snapdragon 8 Gen 3 is powering the latest Galaxy S24 Ultra globally
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Qualcomm Snapdragon 8 Gen 3 is powering the latest Galaxy S24 Ultra globally. Qualcomm and Samsung Bring the Most Advanced Snapdragon Ever to the 1st Galaxy AI Powered Smartphones, Galaxy S24 Series.
Highlights:
- This launch reflects another milestone in Qualcomm and Samsung’s strategic partnership that will open up a new era in the mobile AI experience. - Samsung Galaxy S24 features the most advanced Snapdragon Mobile Platform yet, designed with generative AI in mind to enable comprehensive and personalized AI experiences. Jan 17, 2024, San Diego - Qualcomm Technologies, Inc. announced that the premium Snapdragon® 8 Gen 3 Mobile Platform for Galaxy is powering Samsung Electronics Co. Ltd.’s latest flagship Galaxy S24 Ultra globally and Galaxy S24 Plus and S24 in select regions. The Samsung Galaxy S24 series introduces Galaxy AI, taking advantage of the new and enhanced Snapdragon 8 Gen 3 for Galaxy, the titan of intelligence and leader in performance and power efficiency. “We’re proud to continue working alongside Samsung to lead this new era for the mobile industry and provide consumers with extraordinary premium experiences,” said Chris Patrick, senior vice president and general manager of mobile handset, Qualcomm Technologies, Inc. “Snapdragon 8 Gen 3 for Galaxy instills its advanced AI capabilities in the Galaxy S24 series, to enable new experiences with AI features to empower users’ everyday life. It also fuels advanced professional-quality camera, gaming experiences and ultra-fast connectivity including Wi-Fi 71, plus offers one of the most reliable authentication solutions available with our Qualcomm® 3D Sonic Gen 2 technology." “Our strategic partnership with Qualcomm Technologies spans more than two decades, which speaks volumes to our strong relationship,” said Inkang Song, VP & Head of Technology Strategy team at Samsung Mobile. “They are at the forefront of the mobile industry, and now of on-device intelligence – the Snapdragon 8 Gen 3 for Galaxy sets the bar for premium mobile and Gen AI experiences. With the flagship Galaxy S24 series, Qualcomm and Samsung will provide consumers with the most premium and advanced mobile experiences to date, with Galaxy AI.” Read the full article
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heshmore · 2 months
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Framework from MIT can help businesses anticipate when Quantum Computing might be useful
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Framework from MIT can help businesses anticipate when Quantum Computing might be useful. Once-obscure technologies can emerge in an instant, causing companies to scramble to figure out how to effectively leverage them for competitive advantage. An overview of quantum computing When quantum computing will be useful Other things to consider about the current state of quantum computing Quantum computing, which most people can't define and still don't fully comprehend, could be the next obscure technology to have a seismic impact on business. Quantum computing uses quantum mechanics laws to simulate and solve complex problems that are too difficult for today's classical computers. In some cases, quantum computers can solve large-scale problems much faster than their classical counterparts. Simulating matter's behavior, analyzing compounds to create new drugs, optimizing factory floors or global supply chains, and detecting fraud and risk patterns in financial transactions are some examples. McKinsey estimates that 5,000 quantum computers will be operational by 2030, but that the hardware and software required to handle the most complex problems will not be available until 2035 or later. However, organizations must begin planning now for how they will use technology to solve real-world business problems. According to a November 2022 report, some companies expect to invest more than $15 million per year in quantum computing. A group of MIT researchers, in partnership with Accenture, has developed a framework to help tech-savvy executives start to evaluate the potential of quantum computing for problem-solving at their companies. “Implicitly, there’s a race going on between the classical computer and quantum computer. For each type of question you want to solve, you want to know which type of computer will win so you can take the best advantage of it,” Neil Thompson, a research scientist at MIT Sloan and the MIT Computer Science and Artificial Intelligence Laboratory, said at the 2023 MIT Initiative on the Digital Economy annual conference. Thompson is a co-author of “The Quantum Tortoise and the Classical Hare: A Simple Framework for Understanding Which Problems Quantum Computing Will Accelerate (and Which It Won’t),” along with Sukwoong Choi, an assistant professor at the University of Albany and a digital fellow at the MIT Initiative on the Digital Economy, and William S. Moses, an assistant professor at University of Illinois Urbana-Champaign. “This framework provides a way to analyze the potential impact of switching to quantum computing before making the investment,” The researchers’ takeaway is that small to moderate-sized problems, the most common types for typical businesses, will not benefit from quantum computing. Those trying to solve large problems with exponential algorithmic gains and those that need to process very large datasets, however, will derive advantages. “Quantum computing is not going to be better for everything, just for some things,” Thompson said.
An overview of quantum computing
The idea for building a system that leverages physics principles to simulate problems too difficult to model with traditional digital systems was first proposed in the 1980s. The concept was buttressed by MIT mathematician Peter Shor, who developed the first well-known quantum algorithm for breaking encryption in the 1990s. Unlike today’s computers and supercomputers that use binary electrical signals to represent ones or zeros, quantum computers employ quantum bits (qubits), which are subatomic particles. When managed properly, qubits can represent combinations of both ones and zeros simultaneously. The more qubits, the greater potential for large-scale compute power for problem-solving.
When quantum computing will be useful
The crux of the framework in "The Quantum Tortoise and the Classical Hare" is that classical computers (the hare) are generally faster than quantum computers (the tortoise), but require more steps to complete a task — which the researchers liken to taking an inefficient path from point A to point B. Quantum computers, with their ability to run more efficient algorithms, have the potential to take a more direct path — but because they have slower processing speeds, it may take longer to solve the problem. The framework developed by the researchers aims to assist businesses in determining whether the shorter route or the faster computer is more valuable, depending on the problem at hand. Scientists are working to achieve quantum advantage, or the ability to use quantum computers to solve problems that classical computers cannot. (It is estimated that some companies will achieve the quantum advantage by 2030.) However, the researchers believe that the emphasis on quantum advantage overshadows the utility of quantum computers as they become cost-competitive with traditional computers. To make up for this, their framework establishes the benchmark of quantum economic advantage, which occurs when a specific problem can be solved faster with a quantum computer than with a comparably priced classical computer. To determine the quantum economic advantage, business and technology leaders will have to consider two conditions: - Feasibility, meaning whether a quantum computer exists that is sufficiently powerful to solve a particular problem. - Algorithmic advantage, meaning that a quantum computer would be faster at completing a particular task compared with a comparably priced classical computer. The overlap between the two is the quantum economic advantage. Thompson advised businesses to consider the speed of the computer versus the route. “Think of it like a race in getting from point A to point B, and the algorithm is the route,” Thompson said. “If the race is short, it might not be worth investing in better route planning. For it to be worth it, it has to be a longer race.”
Other things to consider about the current state of quantum computing
Although it is still early days, quantum is heating up. Although quantum computing is still in its early stages of development, the landscape is heating up. IBM released Osprey, a 433-qubit machine, last year and plans to build a 100,000-qubit machine within the next ten years. Google's goal is to have a million qubits by the end of the decade. D-Wave Systems, IonQ, Rigetti Computing, Honeywell, Microsoft, Intel, and PsiQuantum are among the other companies offering quantum computing services in the cloud. According to Fortune Business Insights, the quantum computing market will grow from $928.8 million this year to $6.5 billion by 2030, representing a compound annual growth rate of 32.1%. The challenges of development, cost, and talent remain. Companies are still figuring out how to scale the number of physical qubits that can be built into quantum computing systems, as well as how to optimize how the various qubits interact with one another as horsepower scales. A lot of research is currently being done to reduce the error rates, or noise, in quantum computing. The technology is also expensive because the systems require complex cooling technologies to protect the qubits. The skills gap is another problem: Subject-matter experts are hard to come by outside of research and academic circles. McKinsey predicts that by 2025, fewer than half of quantum jobs will be filled, which is a major barrier to adoption. Benefits will come on a continuum. Quantum computing becomes more attractive when the quantum algorithm is exponentially faster or significantly better than the classical computing option, or if the problem size being tackled is larger than the speed differential between the two. Given the current state of quantum technology, it will be useful sooner for small-scale problems whose solutions offer smaller benefits and will only later be viable for solving more complex problems that promise larger benefits. Source: MIT Read the full article
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heshmore · 3 months
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Getty Images launches Generative AI powered image service at CES 2024
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Getty Images launches Generative AI powered image service. Getty Images Launches Generative AI by iStock for Small Businesses, Designers and Marketers. Launched at the Consumer Electronics Show (CES) and powered by NVIDIA Picasso, the new offering gives businesses an affordable option to explore commercially safe generative AI in their marketing and advertising visuals. New York – January 8, 2024 - Getty Images (NYSE: GETY), a preeminent global visual content creator and marketplace, today announced the launch of Generative AI by iStock, an affordable and commercially safe generative AI tool to help users and businesses easily turn their creative visions into powerful content. Powered by NVIDIA Picasso, a foundry for custom generative AI models for visual design, and trained exclusively using high‑quality content and proprietary data from Getty Images’ creative libraries, Generative AI by iStock has been engineered to guard against generations of known products, people, places or other copyrighted elements. Not only does this mean businesses can have confidence in the content they are generating, but any licensed visual that a customer generates comes with iStock’s standard $10K USD legal coverage that customers have with iStock’s broader image and video libraries. The tool works seamlessly with iStock’s library of authentic and commercial‑ready imagery, including millions of exclusive photos, illustrations and videos. The addition of Generative AI by iStock gives customers multiple ways to get the right visuals for any need, including print marketing, social posts, online promotions and more. “Using AI, creatives gain the ability to produce anything they can imagine. Our own VisualGPS research shows that 42% of SMBs and SMEs are already using AI‑generated content to support their marketing efforts. Our main goal with Generative AI by iStock is to provide customers with an easy and affordable option to use AI in their creative process, without fear that something that is legally protected has snuck into the dataset and could end up in their work,” said Grant Farhall, iStock’s Chief Product Officer. “Our AI Generator is easy to use, produces relevant and high‑quality visuals, and is backed by our legal protection so customers can now safely use this new service, in combination with our amazing pre‑shot library, to elevate their work.” Customers will be able to download and license any generated visual, with legal indemnification at no extra cost, giving them a low cost of entry to explore commercially safe generative AI for their marketing efforts. iStock is also enabling advanced generative AI features through APIs for easy integration into creative applications and plugins, allowing for the modification of images. Generative AI by iStock is now available for all iStock customers in over 75 languages. To learn more and sign up, visit: https://www.istockphoto.com/ai/generation/about Read the full article
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heshmore · 3 months
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IBM and SAP to develop new AI solutions for consumer packaged goods and retail industries
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IBM and SAP to develop new AI solutions for consumer packaged goods and retail industries. ARMONK, N.Y., Jan. 11, 2024 - IBM (NYSE: IBM) today announced its collaboration with SAP to develop solutions to help clients in the consumer packaged goods and retail industries enhance their supply chain, finance operations, sales and services using generative AI. With a shared legacy of technology expertise and the completed work of embedding IBM watsonx, an enterprise-ready AI and data platform and AI assistants, into SAP solutions, IBM is working with SAP to create new generative and traditional AI solutions to be focused on addressing the complexities of the direct store delivery business process and product portfolio management. IBM Consulting and SAP are already working with CPG clients worldwide to gather detailed requirements to create secured and scalable AI solutions that can be integrated with the SAP Direct Distribution® solution. The goal of the new solutions to be developed will be to help CPG companies, wholesale distributors and retailers more efficiently manage store-level assortments, improve product distribution and drive incremental revenue, by: Enhancing transportation planning and execution IBM plans to feed external data such as weather, traffic and local events into the SAP Direct Distribution solution and apply AI to help CPG companies identify optimal store delivery routes with the aim of helping to reduce costs and their carbon footprints. Real-time updates could provide drivers with information to make on-the-fly changes based on local conditions. Optimizing store-level assortments IBM plans to apply AI and generative AI to develop store-level assortments based on the market dynamics of each store, prior sales patterns, anticipated demand and current product mix. The goal is for the solutions to be able to make specific product recommendations and include preliminary planning so enough products are added to the assortment with the goal of maximizing sales and minimizing waste. Automating order settlement The complexities of direct store delivery can often prevent the automatic settlement of transactions. IBM will work with SAP to develop solutions that can use automation and intelligent workflows to proactively deliver operational efficiencies and help increase settlement accuracy based on the AI in the last mile distribution component for SAP Direct Distribution. "Global and regional consumer industry organizations must manage various commerce applications and need advanced insights to provide proactive recommendations that help improve operations and meet customer expectations," said Luq Niazi, Global Managing Partner, Industries and Global Consumer Industry, IBM Consulting. "With SAP, we are looking to build on the long-standing work of incorporating AI into SAP solutions that can help enterprise clients achieve further business value." IBM Consulting plans to build these solutions on SAP Business Technology Platform® (SAP BTP) and will integrate watsonx through APIs. Warehouse planners, frontline delivery associates and client representatives can have an enriched user experience by using watsonx Assistant to create chatbots using IBM's conversational search capabilities. "At SAP, we look forward to collaborating with IBM on this important initiative to help consumer goods companies transform their operations and improve their bottom line," said EJ Kenney, Senior Vice President Consumer Products Industry and Life Sciences Business Unit at SAP. "We understand the complexities that come with managing direct store delivery and by leveraging the power of AI we aim to help our customers better manage their last mile distribution more effectively, minimize waste, improve customer satisfaction and achieve business value in today's fast-paced consumer industry."
IBM Consulting's Deep AI Expertise and Capabilities
IBM Consulting's more than 21,000 data and AI professionals are ready to help accelerate clients' business transformations with enterprise-grade AI, including technology from SAP, IBM and other partners through a collaborative and open ecosystem approach. IBM Consulting works with a diverse AI partner ecosystem that embraces multiple models on multiple clouds from industry leaders. This helps clients choose the right models and the right architecture best for them. IBM Consulting accelerates business transformation for our clients through hybrid cloud and AI technologies. With deep industry expertise spanning strategy, experience design, technology, and operations, we have become the trusted partner to many of the world's most innovative and valuable companies, helping modernize and secured their most complex systems. Our 160,000 consultants embrace an open way of working and apply our proven co-creation methodology, IBM Garage, to scale ideas into outcomes. Statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only. Read the full article
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heshmore · 3 months
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Qualcomm announces Snapdragon XR2+ Gen 2 Platform for 4.3K spatial computing
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Qualcomm announces Snapdragon XR2+ Gen 2 Platform for 4.3K spatial computing. Qualcomm Accelerates New Wave of Mixed Reality Experiences with Snapdragon XR2+ Gen 2
Highlights
- The Snapdragon XR2+ Gen 2 supports 4.3K per eye resolution and 12 or more concurrent cameras to deliver crisp, immersive mixed reality (MR) and virtual reality (VR) experiences. - Samsung and Google to provide leading XR experiences by utilizing Snapdragon XR2+ Gen 2. San Diego, Jan 4, 2024 - Qualcomm Technologies, Inc. today announced the Snapdragon® XR2+ Gen 2 Platform, a single-chip architecture that unlocks 4.3K spatial computing at 90 frames per second for breathtaking visual clarity across work and play. Building upon the capabilities of the recently announced Snapdragon XR2 Gen 2, the new '+' version helps to unleash a new tier of more realistic, detailed experiences in MR and VR with higher GPU frequency by 15% and CPU frequency by 20%. Supporting 12 or more concurrent cameras with powerful on-device AI, Snapdragon XR2+ Gen 2-powered devices can effortlessly track the user, their movements, and the world around them for effortless navigation and unparalleled experiences that merge physical and digital spaces. “Snapdragon XR2+ Gen 2 unlocks 4.3K resolution which will take XR productivity and entertainment to the next level by bringing spectacularly clear visuals to use cases such as room-scale screens, life-size overlays and virtual desktops,” said Hugo Swart, vice president and general manager of XR, Qualcomm Technologies, Inc. “We are advancing our commitment to power the best XR devices and experiences that will supercharge our immersive future.” “Samsung is thrilled to collaborate with Qualcomm Technologies and Google in revolutionizing the mobile industry once more." Inkang Song, vice president and head of technology strategy team at Samsung Electronics, expressed his excitement, "With Samsung's mobile expertise and our joint commitment, we aim to create the best-in-class XR experience for Galaxy users.” “We look forward to continuing our collaboration with Qualcomm Technologies and Samsung on the future of immersive and spatial XR,” said Shahram Izadi, vice president of AR at Google. “We’re excited for the Android ecosystem to take advantage of Snapdragon XR2+ Gen 2’s capabilities and enable new experiences.” Separately, to help accelerate time to market for OEMs, Qualcomm Technologies also unveiled a new MR & VR reference design developed by Goertek and features eye tracking technology from Tobii. This reference design supports both 3K per eye (Snapdragon XR2 Gen 2) and 4K per eye (Snapdragon XR2+ Gen 2) configurations. Read the full article
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heshmore · 3 months
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Intel and DigitalBridge launch Generative AI company Articul8
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Intel and DigitalBridge launch Generative AI company Articul8. As an independent company supported by industry investment, Articul8 will be able to accelerate its go-to-market strategy and scale its product offerings for the broader GenAI ecosystem. Articul8 SANTA CLARA, Calif., and BOCA RATON, Fla., Jan. 3, 2024 - Intel Corp. (Nasdaq: INTC) and DigitalBridge Group, Inc. (NYSE: DBRG; “DigitalBridge”), a global investment firm, today announced the formation of Articul8 AI, Inc. (Articul8), an independent company offering enterprise customers a full-stack, vertically-optimized and secure generative artificial intelligence (GenAI) software platform. The platform delivers AI capabilities that keep customer data, training and inference within the enterprise security perimeter. The platform also provides customers the choice of cloud, on-prem or hybrid deployment. Articul8 was created with intellectual property (IP) and technology developed at Intel, and the two companies will remain strategically aligned on go-to-market opportunities and collaborate on driving GenAI adoption in the enterprise. Arun Subramaniyan, formerly vice president and general manager in Intel’s Data Center and AI Group, has assumed leadership of Articul8 as its CEO. “With its deep AI and HPC domain knowledge and enterprise-grade GenAI deployments, Articul8 is well positioned to deliver tangible business outcomes for Intel and our broader ecosystem of customers and partners. As Intel accelerates AI everywhere, we look forward to our continued collaboration with Articul8," said Pat Gelsinger, Intel CEO. DigitalBridge Ventures, the venture initiative of DigitalBridge, served as lead investor of Articul8. In addition, Intel, along with a syndicate of established venture investors, including Fin Capital, Mindset Ventures, Communitas Capital, GiantLeap Capital, GS Futures and Zain Group, has taken an equity stake in the company. “Every global enterprise today is challenged to integrate GenAI capabilities into their workflows. Articul8 has built a scalable and easy-to-deploy GenAI software platform that is already enabling enterprises to unlock value from their proprietary data. We see GenAI as a pivotal force driving digital infrastructure, and we are pleased to collaborate with Intel to support Articul8’s growth,” said Marc Ganzi, DigitalBridge CEO.
Articul8
Articul8 offers a turnkey GenAI software platform that delivers speed, security and cost-efficiency to help large enterprise customers operationalize and scale AI. The platform was launched and optimized on Intel hardware architectures, including Intel® Xeon® Scalable processors and Intel® Gaudi® accelerators, but will support a range of hybrid infrastructure alternatives. Following the technology’s early deployment at Boston Consulting Group (BCG), the team has scaled the platform to enterprise customers in industry segments requiring high levels of security and specialized domain knowledge, including financial services, aerospace, semiconductors and telecommunications. “GenAI is at the forefront of our clients’ business strategy and needs. Our collaboration began nearly two years ago while the venture was still in the incubation stage at Intel. Since then, we have deployed Articul8 products for multiple clients seeking production-ready platforms with rapid time to market,” said Rich Lesser, global chair of BCG. As an independent company supported by industry investment, Articul8 will be able to accelerate its go-to-market strategy and scale its product offerings for the broader GenAI ecosystem. Read the full article
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heshmore · 3 months
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SK hynix ultra high performance memory products for AI at CES 2024
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SK hynix ultra high performance memory products for AI at CES 2024. - SK hynix to highlight role of memory chips in AI era - Ultra-high performance of HBM3E, interactive AI fortuneteller to be displayed - Company to solidify AI memory leadership, seek acceleration of business turnaround SEOUL, South Korea, Jan. 2, 2024 - SK hynix Inc. announced today that it will showcase the technology for ultra-high performance memory products, the core of future AI infrastructure, at CES 2024, the most influential tech event in the world taking place from January 9 through 12 in Las Vegas. SK hynix said that it will highlight its future vision represented by its Memory Centric (An SK hynix vision where memory products play a pivotal role in ICT devices) at the show and promote the importance of memory products accelerating technological innovation in the AI era and its competitiveness in the global memory markets. SK hynix plans to provide HBM3E, the world's best-performing memory product that it successfully developed in August, to the world's largest AI technology companies by starting mass production from the first half of 2024. At SK Group's space with an amusement-park theme, SK hynix will display an AI Fortuneteller where the generative AI technology based on HBM3E is applied. The AI fortuneteller is expected to give visitors fresh fun by creating an image of their cartoon characters based on their own faces and reading New Year fortunes. SK hynix's leading AI technology will also be displayed at the SK ICT Family Demo Room jointly run by other SK ICT companies. The company will showcase Compute Express Link(CXL), next-generation interface, a test product of Computational Memory Solution(CMS), memory solution that integrates the computational functions of CXL, and Accelerator-in-Memory based Accelerator(AiMX*), a processing-in-memory chip-based accelerator card with low-cost and high-efficiency for generative AI. **CXL(Compute Express Link): a PCIe-based next-generation interconnect protocol on which high-performance computing systems are based ***AiMX(Accelerator-in-Memory based Accelerator): SK hynix's accelerator card product that specializes in large language models using GDDR6-AiM chips Particularly, CXL memory, along with HBM, is one of the core products in the limelight with the rise of AI technology. SK hynix plans to commercialize 96GB and 128GB CXL 2.0 memory solutions based on DDR5 in the second half for shipments to AI customers. "We are thrilled to showcase our technology, which has risen to the core of the AI infrastructure in the U.S., home to AI technology," said Justin Kim, President (Head of AI Infra) at SK hynix. "SK hynix will step up its efforts for collaboration with global players, while seeking to accelerate a turnaround in business with its leadership in the AI memory space." Read the full article
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heshmore · 3 months
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Boeing built X-37B autonomous space plane embarks on its seventh mission
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Boeing built X-37B autonomous space plane embarks on its seventh mission. - Mission will expand the United States Space Force's knowledge of the space environment by experimenting with future space domain awareness technologies - Seventh flight follows record-breaking 908-day sixth mission KENNEDY SPACE CENTER, Fla., Dec. 29, 2023 - The Boeing -built X-37B autonomous spaceplane launched yesterday aboard a SpaceX Falcon Heavy rocket, marking the beginning of its seventh mission. "The X-37B government and Boeing teams have worked together to produce a more responsive, flexible, and adaptive experimentation platform," said William D. Bailey, Director, Department of the Air Force Rapid Capabilities Office. "The work they've done to streamline processes and adapt evolving technologies will help our nation learn a tremendous amount about operating in and returning from a space environment." As it has with every mission, the Orbital Test Vehicle will validate new technologies, fostering innovation and pushing the boundaries of space exploration and utility. On this seventh flight, the X-37B will test future space domain awareness technology experiments that are integral in ensuring safe, stable and secure operations in space for all users of the domain. "The technological advancements we're driving on X-37B will benefit the broader space community, especially as we see increased interest in space sustainability," said Michelle Parker, Space Mission Systems vice president at Boeing Defense, Space & Security. "We are pushing innovation and capability that will influence the next generation of spacecraft." Since its inaugural launch in April 2010, the X-37B has consistently set new endurance records, surpassing the initial design mission duration of 270 days. Its sixth mission set a new record with an impressive 908-day journey before returning to Earth in November 2022. The X-37B, which will now build on its more than 1.3 billion miles traveled during its 3,774 days in space, exemplifies the successful partnership between the Department of the Air Force Rapid Capabilities Office and the United States Space Force. Boeing teams deliver program management, engineering, production, test and mission support. In 2019, the X-37B was awarded the Robert J. Collier Trophy for advancing the performance, efficiency and safety of air and space vehicles. As a leading global aerospace company, Boeing develops, manufactures and services commercial airplanes, defense products and space systems for customers in more than 150 countries. As a top U.S. exporter, the company leverages the talents of a global supplier base to advance economic opportunity, sustainability and community impact. SOURCE Boeing Read the full article
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heshmore · 3 months
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LG unveils MYVIEW 4K smart monitors at CES 2024
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LG unveils MYVIEW 4K smart monitors at CES 2024. New-for-2024, LG MyView 4K Smart Monitors Present Impressive Image Quality, Access to Entertainment and Productivity Apps with webOS Key Specifications - MYVIEW 4K smart monitors: ENGLEWOOD CLIFFS, N.J., Dec. 29, 2023 - LG Electronics (LG) new lineup of 'LG MyView' smart monitors will be revealed at CES 2024. Designed for productivity and entertainment, each monitor comes with the acclaimed webOS platform and offers a variety of user-friendly features and connectivity options. The LG MyView branding, which is making its debut in 2024, communicates the personalized user experience delivered by the company's premium smart monitors. The 32SR85U will be available to purchase for $599.99 at LG.com and LG-authorized retailers. The 32SR70U and 32SR83U respectively will be available to purchase for $499.99. U.S. availability will be announced at a later date. LG MyView 4k smart monitors enable users to stream movies, series and sports, listen to music and work remotely without having to connect to a PC. The new-for-2024 models – including the CES Innovation Award-winning 32SR85U – are equipped with LG IPS 4K displays that provide impressive picture quality. Thanks to webOS, LG's latest smart monitors boast an intuitive interface, a tailored user experience and a world of apps to choose from. To suit different tastes, some LG MyView models are available in a variety of colors, including essence white, mild beige, cotton pink and cotton green. Adopting 31.5-inch, 4K (3,840 x 2,160) IPS panels, the new LG MyView displays (models 32SR85U, 32SR83U and 32SR70U) raise the bar for picture quality in the smart monitor category. The displays feature a slim form factor with a 3-side virtually borderless design to enhance the viewing experience and save space. The 32SR85U and 32SR83U come with an adjustable stand featuring a circular cutout, while the 32SR70U has a low-profile base for a compact and stylish appearance. The 32SR85U has been honored with a CES 2024 Innovation Award, a 2023 Red Dot Design Award and a 2023 iF Design Award. With webOS 23 onboard, LG MyView supports remote work and home entertainment, offering access to a vast and growing catalog of popular streaming services, productivity programs like Microsoft 365 and Google Calendar and compatibility with AirPlay 2 and Miracast for wireless screen mirroring. Built-in Wi-Fi and Bluetooth offer connection to the Internet and compatible peripherals. The 32SR85U can be paired with a detachable Full-HD (1,920 x 1,080) webcam ideal for video conferencing and interactive applications. "LG MyView smart monitors deliver excellent picture quality, the convenience of webOS and wireless connectivity, a sleek design and much more. Our personalized lifestyle monitors can meet each customer's individual needs, providing them with an elevated user experience whether they're watching, working or working out." YS Lee, vice president and head of the IT business unit of LG Electronics Business Solutions Company, emphasized The latest LG MyView Smart Monitor models will be on display at the LG booth at CES 2024 in Las Vegas from January 9-12.
Key Specifications - MYVIEW 4K smart monitors:
LG MyView Smart Monitor (32SR85U)LG MyView Smart Monitor (32SR83U)LG MyView Smart Monitor (32SR70U)Size / ResolutionScreen Size31.5-inch31.5-inchResolution4K UHD (3,840 x 2,160)4K UHD (3,840 x 2,160)4K UHD (3,840 x 2,160)GraphicsPanel (Brightness, Typ.)IPS (400cd/m2)IPS (400cd/m2)Color Gamut (Typ.)DCI-P3 95I-P3 95I-P3 95%HDRHDR 10HDR 10HDR 10Refresh Rate / Response Time60Hz / 5ms60Hz / 5ms60Hz / 5msInterfaceUSB Type-C™ / Charging PowerO (x3) / 90WO (x3) / 65WHDMIO (x2)O (x2)O (x2)USB 2.0--O (x2)Wi-FiOOOBluetoothOOOSpeaker5W (x2)5W (x2)5W (x2)CameraOSold separately-Smart Feature / ServiceOSwebOS 23webOS 23Windows 365OOOIoTOOOVoice AssistantOOOMobile Casting/ MirroringAirPlay 2 / ScreenShareAirPlay 2 / ScreenShareAirPlay 2 / ScreenShareAccessoryHDMI / Remote ControllerHDMI / Remote ControllerHDMI / Remote Controller Read the full article
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heshmore · 3 months
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LG Gram Pro boasts ultra-slim, lightweight design and powerful performance with AI
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LG Gram Pro boasts ultra-slim, lightweight design and powerful performance with AI 2024 LG gram Laptops Provide High-performance AI Capabilities and Innovative Connectivity Through 'LG gram Link' App. LG Gram Pro and LG gram Pro 2-in-1 2024 LG gram Specifications: ENGLEWOOD CLIFFS, N.J., Dec. 28, 2023 - LG Electronics (LG) is expanding its LG gram series in 2024, offering consumers a wider selection of compelling choices, including the new LG gram Pro. The perfect blend of power and portability, LG gram series ultra-lightweight laptops combine high-end specifications with exceptionally slim yet durable designs and all-day battery life. All 2024 models come with the latest AI-enabled functions on LG gram Link app, simplifying tasks like file sharing, photo sharing and screen mirroring across LG gram, Android and iOS devices. U.S. pricing and availability will be announced at a later date.
LG Gram Pro and LG gram Pro 2-in-1
LG's best-in-class LG gram Pro laptops (models 16Z90SP and 17Z90SP) come equipped with a Intel Core Ultra processor with hybrid architecture, an NVMe PCIe 4.0 SSD and an NVIDIA GeForce RTX 3050 graphics card. The new LG gram Pro laptops are also embedded with the Intel® AI Boost, Intel's neural processing unit (NPU) that can handle AI workloads even without a network connection. Moreover, the new LG grams include the compatibility-boosting LG gram Link app, which facilitates effortless file sharing, photo transfers and screen mirroring between LG gram (Windows) and Android or iOS devices.2 The app also has an integrated AI function that intelligently categorizes photos stored on gram and simplifies image searches through keyword identification. Strengthening compatibility and the overall LG gram experience, LG gram Link builds an interconnected ecosystem of devices, such as running smartphones and tablets with LG gram's keyboard and mouse, offering users enhanced connectivity and scalability. LG gram Pro Lifestyle Image The new LG gram Pro models feature a dual cooling system. The extra cooling power helps the new laptops to perform optimally, even when handling demanding software such as video-editing suites and AI image creation tools. With their ultra-slim and ultra-lightweight design, both the 16- and 17-inch LG gram Pro provide outstanding portability, sleek styling and premium performance, making them ideal for on-the-go professionals or anyone seeking a high-spec, on-the-go computing solution. The LG gram Pro laptops deliver stunning picture quality with superb color and contrast, offering 100 percent coverage of the DCI-P3 color space.3 Both models come with a Wide Quad XGA resolution (WQXGA / 2,560 x 1,600) IPS display, while the 16-inch LG gram Pro is also available with a WQXGA+ (2,880 x 1,800) resolution OLED display. For convenient connectivity, each model incorporates a variety of ports, including Thunderbolt 4, USB Type-C, USB Type-A and HDMI. The LG gram Pro 2-in-1 (model 16T90SP) has won a CES 2024 Innovation Award and has recently been listed in the GUINNESS WORLD RECORDS™ as the lightest 16-inch 2-in-1 laptop. This versatile, 'convertible' laptop also features a WQXGA+ resolution OLED display.4 It boasts an incredibly slim and ultra-lightweight design, measuring just 12.4 millimeters thick and weighing only 1,399 grams, making it easy to transport and ideal for productivity and entertainment purposes. The 360-degree adjustable hinge, 4-way super-slim bezel design, responsive touchscreen and wirelessly-chargeable pen provide users with exceptional flexibility and an elevated user experience.
2024 LG gram
LG is also introducing new LG gram 17, 16, 15 and 14 laptops (models 17Z90S, 16Z90S, 15Z90S and 14Z90S) for 2024. Featuring slender, ultra-lightweight designs and long-lasting battery life, the LG grams are great for business travelers and busy go-getters. All 2024 LG gram models boast Intel® Core™ Ultra processors, NVMe PCIe 4.0 SSDs and high-brightness IPS panels with anti-glare coating. The LG gram 17 and gram 16 models come with WQXGA resolution displays and large screen sizes, making them suitable for both work and multimedia consumption. The smaller 15- and 14-inch models offer supreme transportability and an equally satisfying user experience. All models in the 2024 LG gram family are equipped with a built-in Full-HD (1,920 x 1,080) webcam for video calling and conferencing. They also come with a variety of user-friendly software, such as LG Glance by Mirametrix for security and privacy enhancement, as well as the new LG gram Link. "The LG gram Pro series introduces an exciting, new product range combining ultra-slim design with powerful performance," said YS Lee, vice president and head of the IT business unit of LG Electronics Business Solutions Company. "We will continue to expand the LG gram series, providing portable, high-spec devices that deliver a premium user experience." Visitors to CES 2024 in Las Vegas from January 9-12 can check out LG gram products at the company's booth (#16008, Central Hall, Las Vegas Convention Center). To keep up with all of LG's exciting announcements at CES, follow #LGCES2024 on social media.
Specifications:
LG gram Pro(16Z90SP)LG gram Pro(17Z90SP)LG gram Pro 2-in-1 (16T90SP)Display Size16-inch17-inch16-inchDisplay WQXGA+ (2,880 x 1,800) OLEDWQXGA (2,560 x 1,600)WQXGA+ (2,880 x 1,800) OLEDWQXGA (2,560 x 1,600) LCDWQXGA (2,560 x 1,600) LCDBrightness (Typ.)OLED: 400nit400nitOLED: 400nitLCD: 400nitLCD: 400nitRefresh RateOLED: 48-120Hz (VRR)31-144Hz (VRR)OLED: 48-120Hz (VRR)LCD: 31-144Hz (VRR)LCD: 31-144Hz (VRR)Weight1,199g (iGPU)1,299g (iGPU)1,399g1,279g (dGPU)1,379g (dGPU)Size357.7 x 251.6 x 12.4- 12.8mm (iGPU)12.6-12.9mm (iGPU)357.25 x 253.8 x 12.4- 12.9mm357.7 x 251.6 x 13- 14.4mm (dGPU)13.2-14.6mm (dGPU)Battery77Wh (iGPU) / 90Wh (dGPU)77WhThermalDual cooling systemCPUIntel® Core™ Ultra 7 processor / Intel® Core™ Ultra 5 processorGPUIntel® Arc™ graphics (iGPU)Intel® Arc™ graphicsNVIDIA RTX 3050 with GDDR6 4GB (dGPU)MemoryMax 32GB (LPDDR5X Max 7,467MHz, Dual Channel)StorageDual SSD (M.2) 256GB / 512GB / 1TB (Gen4 NVMe™)AudioHD Audio with Dolby AtmosSpeakersStereo Speaker (3.0W x2) Smart AMP (MAX 5W x2)I/O Port2x USB 3.2 Gen2, 2x USB 4 Gen3x2 Type C (with Power Delivery, DisplayPort, Thunderbolt 4), HDMI 2.1SoftwareLG gram Link, LG Glance by Mirametrix®, LG Smart AssistantWebcamFHD Webcam + IR Camera with Webcam & Dual Mic. LG gram 17 (17Z90S)LG gram 16 (16Z90S)LG gram 15 (15Z90S)LG gram 14 (14Z90S)Display Size17-inch16-inch15.6-inch14-inchDisplayWQXGA (2,560 x 1,600)FHD (1,920 x 1,080)WUXGA (1,920 x 1,200)Brightness (Typ.)350nit (60Hz non-touch), 320nit (60Hz, touch), 400nit (VRR)350nit (IPS) / 300nit (AIT)350nitRefresh Rate60Hz / 31-144Hz (VRR, option)60HzWeight1,350g (non-touch 60Hz) / 1,350g (non- touch VRR) / 1,415g (touch 60Hz)1,199g (non-touch 60Hz) / 1,204g (non- touch VRR) / 1,260g (touch 60Hz)1,290g (touch: 1,300g)1,100gSize378.8 x 258.8 x 17.8mm (non-touch 60Hz, non-touch VRR)355.1 x 242.3 x 16.8mm (non-touch 60Hz, non-touch VRR)356.27 x 223.4 x 16.95mm312 x 214.3 x 16.9mm378.8 x 258.8 x 18.8mm (touch 60Hz)355.1 x 242.3 x 17.8mm (touch 60Hz)Battery77Wh72WhThermalMega cooling systemCPUIntel® Core™ Ultra 7 processor / Intel® Core™ Ultra 5 processorGPUIntel® Arc™ graphicsMemory8 / 16 / 32GB LPDDR5X (Dual Channel, 7467MHz)8 / 16 / 32GB LPDDR5X (Dual Channel, 6400MHz)StorageM.2 (2280) Dual SSD slots, Gen42TB / 1TB / 512GB / 256GB (NVMe)SpeakersStereo Speaker 2.0W x 2Stereo Speaker 1.5W x 2Smart Amp (Max 5W)AudioHD Audio with Dolby AtmosI/O Port2x USB 3.2 Gen2x1, 2x USB 4 Gen3x2 Type C (with USB PD, DisplayPort, Thunderbolt 4), 1x HDMI2x USB 3.2 Gen2x1, 2x USB 4 Gen3x2 Type C (with Power Delivery, DisplayPort, Thunderbolt 4), 1x HDMI2x USB 3.2 GEN1x1: 5G1x USB 4 GEN3x2 (Thunderbolt): 40G1x USB3.2 GEN2x1/DP1.4: 10GHDMI 2.1 (4K@60Hz)SoftwareLG gram Link, LG Glance by Mirametrix®,LG Smart AssistantLG gram Link,LG Glance by Mirametrix®,LG Smart AssistantWebcamFHD IR Webcam with Dual Mic (face recognition) Read the full article
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heshmore · 3 months
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Leading semiconductor players form new company Quintauris to drive RISC-V ecosystem forward
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Leading semiconductor players form new company Quintauris to drive RISC-V ecosystem forward. The new company, founded in Germany, has named Alexander Kocher as CEO Munich, December 22, 2023 - Semiconductor industry players Robert Bosch GmbH, Infineon Technologies AG, Nordic Semiconductor ASA, NXP® Semiconductors, and Qualcomm Technologies, Inc., have formally established Quintauris GmbH. Headquartered in Munich, Germany, the company aims to advance the adoption of RISC-V globally by enabling next-generation hardware development. The formation of Quintauris was formally announced in August, with the aim to be a single source to enable compatible RISC-V-based products, provide reference architectures, and help establish solutions to be widely used across various industries. The initial application focus will be automotive, but with an eventual expansion to include mobile and IoT. Alexander Kocher has been appointed as Quintauris CEO. Kocher joins the company having previously served as President and CEO of Elektrobit, a global supplier of embedded and connected software products for the automotive industry. Prior to joining Elektrobit in 2011, Kocher was Vice President and General Manager of Wind River's automotive business unit. “This is a very exciting opportunity for Quintauris and for the industries we will serve,” said Alexander Kocher, CEO, Quintauris. “We will bring game-changing innovation and scalability to the next generation of hardware development, with an emphasis on combining the best elements of RISC-V in a unified, commercialized proposition. We are fortunate to have the backing of some of the most established players in the semiconductor industry, which shows our ambition for Quintauris to be a long-term, sustainable offer. We absolutely believe in the power of collaboration with the RISC-V community, and as we continue to scale our company, we look forward to engaging with the ecosystem to speed development and enhance the resilience of the broader semiconductor ecosystem.” All required regulatory approvals have now been obtained and Quintauris has been formally established on Friday 22nd December 2023. RISC-V is an open-source chip architecture based on “Reduced Instruction Set Computer” (RISC) principles, originally developed by researchers at the University of California, Berkeley in 2010. For more information on RISC-V, please visit: https://riscv.org/about/. Read the full article
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heshmore · 3 months
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EuroHPC JU is inviting hosting entities to host and operate EuroHPC quantum computers
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EuroHPC JU is inviting hosting entities to host and operate EuroHPC quantum computers. The European High Performance Computing Joint Undertaking (EuroHPC JU) has launched a call for expression of interest to select hosting entities which will host and operate new EuroHPC quantum computers. The EuroHPC JU will select hosting entities to host and operate new EuroHPC JU quantum computers and will enter into hosting agreements to establish a stable and structured partnership between the JU and the hosting entity for the quantum computer's acquisition, integration, and operation. With a total EU contribution of EUR 20 million, the EuroHPC JU will purchase at least two quantum computers in 2024. The new quantum computers will be funded in part by the EuroHPC JU budget derived from the Digital Europe Program (DEP) and in part by contributions from EuroHPC JU participating countries. The Joint Undertaking will contribute up to 50% of the total cost of the quantum computers. The quantum computers will be integrated into the hosting entities' existing supercomputers. The selection will aim to ensure diversity in the technologies and architectures of the various quantum computers to be acquired in order to provide users with access to various quantum technologies. The EuroHPC Joint Undertaking will address the growing demand for quantum computing resources and services from European industry and academia by making quantum computers available to European users. The quantum computer infrastructure will help to develop a wide range of applications with industrial, scientific, and societal implications for Europe.
EuroHPC JU Mission:
The mission of the EuroHPC JU is : - to develop, deploy, extend and maintain in the European Union a federated, secure hyperconnected supercomputing, quantum computing, service and data infrastructure ecosystem; - to support the development and uptake of demand-oriented and user-driven innovative and competitive supercomputing systems based on a supply chain that will ensure components, technologies and knowledge limiting the risk of disruptions and the development of a wide range of applications optimised for these systems; - to widen the use of that supercomputing infrastructure to a large number of public and private users, and support the twin transition and the development of key skills for European science and industry. Following the signature of hosting agreements in June 2023 with six sites across Europe to host & operate EuroHPC quantum computers, the EuroHPC JU recently launched two calls for tender for the installation of two EuroHPC quantum computer: - EuroQCS-Poland based on trapped-ions and located in Poland - Euro-Q-Exa based on superconducting qubits and state-of-the-art entangling capabilities and located in Germany. The call is still open until 22nd January 2024. These quantum computers will come on top of two analogue quantum simulators currently being deployed within the EuroHPC JU project HPCQS which are based on neutral atoms, supplied by the French company PASQAL. HPCQS is the first initiative towards a federated European quantum computing infrastructure, tightly integrating two quantum computers, each controlling 100-plus qubits in the Tier-0 HPC systems Joliot-Curie of GENCI and the JUWELS modular supercomputer at the Julich Supercomputing Centre (JSC). Read the full article
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heshmore · 3 months
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US Department of Commerce to assess US semiconductor supply chain for national security
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US Department of Commerce to assess US semiconductor supply chain for national security. Commerce takes action to bolster the U.S. semiconductor supply chain and protect U.S. national security December 21, 2023 - The US Department of Commerce announced a new survey will be launched in January 2024 to serve as a foundation for ongoing analysis of the capabilities and challenges of the broader US semiconductor supply chain and national defense industrial base. The survey's goal is to determine how US companies source current-generation and mature-node semiconductors, also known as legacy chips. This analysis will help shape US policy to strengthen the semiconductor supply chain, promote a level playing field for legacy chip production, and reduce the People's Republic of China's (PRC) national security risks. “Legacy chips are essential to supporting critical U.S. industries, like telecommunications, automotive and the defense industrial base. Addressing non-market actions by foreign governments that threaten the U.S. legacy chip supply chain is a matter of national security,” said Secretary Gina Raimondo. “Over the last few years, we’ve seen potential signs of concerning practices from the PRC to expand their firms’ legacy chip production and make it harder for U.S. companies to compete. To get ahead of these concerns, the Department of Commerce is taking proactive measures to assess the U.S. semiconductor supply chain by collecting data from U.S. companies on the sourcing of their legacy chips. Government alone cannot create and sustain a robust supply chain – we need industry at the table. This survey will empower the Department with the data we need to inform our next steps in building strong, diverse, and resilient semiconductor supply chains.” The survey, which will focus on the use and sourcing of PRC-manufactured legacy chips in critical U.S. industries, will be launched by Commerce's Bureau of Industry and Security (BIS). The survey is in response to findings in a Congressionally mandated report released this week that evaluates the capabilities of the United States' microelectronics industrial base to support national defense. This report was produced in accordance with Section 9904 of the National Defense Authorization Act (NDAA) for Fiscal Year (FY) 2021. Companies headquartered in the United States account for roughly half of global semiconductor revenue, but they face intense competition from foreign governments, who are increasing their subsidies. According to the 9904 report, the United States should promote a level playing field for semiconductor manufacturing in the United States by supporting domestic fabrication, assembly, test, and packaging capabilities, continuing to protect U.S. technology through export controls, and further assessing potential non-market behavior. In May 2023, BIS completed data collection and developed the 9904 report and recommendations in collaboration with the CHIPS Program Office. The full study mandated by Section 9904 is available on the BIS website. Read the full article
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