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When “GIF” was named word of the year in 2012, Oxford Dictionaries U.S.A. credited Tumblr for pushing the word.
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Represents the industry's highest technical level.
12L Rigid+8 Fly Tails(2L Flex)
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This is us -EAGLE DRIVER ELECTRONIC LIMITED, top PCB manufacturing capability!
18L HDI +8L Rigid+2L Rigid+4L Flex
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High difficulty PCB special PCB-- large set
Production difficult PCB, special PCB.For us, it's an art, it's a challenge, it's an accomplishment.I am EAGLE DRIVER ELECTRONIC LIMITED, PCB production fighter.The following is a list of some typical difficult PCB and special PCB produced by the company in the past six months.For our appreciation!
8L Rigid HDI+ 4L Flex；4L HDI Flex board；Ceramic board；Rogers 5880H Board；8L 2 Step HDI board；4L TaiYo Soldermask +Hard Gold 16u''；50L Rigid+10L Flex board；Out 8OZ Inner 6OZ board；8Layer HDI 3 step board；3L Rigid+2L Kaputon Board；10L HDI + 4L Flex (Fly Tail board)；12L board；8L HDI Fvss (half hole ) board；Alron 85N +40U'' hard gold (Intel Main Board )；10L Rogers+FR4 board。
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Analysis and method of plate deformation in PCB process
1. Causes and solutions of film deformation:
The reason:
(1) temperature and humidity control failure
(2) the temperature rise of the exposure machine is too high
Solution:
(1) usually the temperature control in 22 + 2 ℃, humidity in 55% + / - 5% RH.
(2) use a cold light source or an aerator with cooling device and constantly replace the backup film
2. Process method of film deformation correction:
1, in the mastery of digital programming instrument operation technology, the first film and drilling test board, two deformation measure its length, width, on the digital programming device according to the deformation on a long or shortening, the size of the hole, it with long or shorten the hole after drilling test plate to be close the deformation of the film, splicing of film from all the work, to ensure the integrity of the graphics and accuracy.This method is called "change hole location method".
2. According to the physical phenomenon that the negative changes with the change of environment temperature and humidity, the negative in the sealing bag is taken out before copying the negative. Under the working environment, the negative is hung for 4-8 hours to make it deform before copying.
3. For the graphs with simple lines, large line width and spacing and irregular deformation, the deformation part of the plate can be cut and compared to the hole position of the drilling test plate, which can be re-inserted before being copied. This method is called "splicing".
4. The hole on the test plate is used to enlarge the line sheet of the welding plate to deform and deform, so as to ensure the minimum ring width technical requirements. This method is called "welding plate overlapping method".
5. After enlarging the images on the deformed film in proportion, re-texturing is made. This method is called "mapping method".
6. Use a camera to enlarge or reduce the distorted figure, and call this method "photographic method".
3.Notes to relevant methods:
1. Splicing method:
Application: the line is not too dense, each layer of film deformation inconsistent film;It is especially suitable for the deformation of resistance welding film and multilayer power supply layer film.
Not applicable: film with high density, wire width and spacing less than 0.2mm;
Note: during splicing, wire should be cut as little as possible, and welding pad should not be damaged.When rework after splicing copy, attention should be paid to the correctness of the connection relationship.
2. Hole location changing method:
Application: the deformation of each layer of film is consistent.The same applies to line - intensive film;
Not applicable: film deformation is not uniform, local deformation is particularly serious.
Note: after the hole position is lengthened or shortened by using the programming device, the hole position of out-of-tolerance should be reset.
3. Hanging method:
Apply;A negative that has not yet deformed and prevents deforming after copying;
Not applicable: distorted film.
Cautions: hang the film in a ventilated and dark environment (safe or not) to avoid contamination.Make sure that the drying place is consistent with the temperature and humidity of the work place.
4. Overlapping pads:
Application: the graph line is not too dense, the line width and the spacing are larger than 0.30mm;
Not applicable: in particular, users have strict requirements on the appearance of printed circuit boards;
Note: due to overlapping copies, the pad is oval.After overlapping and copying, line, disk edge halo and deformation.
5. Photography:
Application: the film has the same deformation ratio in the direction of length and width. When it is inconvenient to re-drill the test board, it is only applicable to silver salt film.
Not applicable: the film is not consistent in the direction of deformation;
Note: the focus should be accurate when photographing to prevent line deformation.The negative has a lot of wastage. In general, it is necessary to have a lot of debugging before obtaining satisfactory circuit graphics.
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Analysis and method of plate deformation in PCB process
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Power supply design,FPC design experience
1，The first is to have a reasonable direction
Such as input/output, ac/dc, strong/weak signal, high/low frequency, high/low pressure....Their movements should be linear (or separate) and not blend with each other.The aim is to prevent mutual interference.The best alignment is a straight line, but generally not easy to achieve, the most unfavorable alignment is circular, fortunately isolation can be set to bring improvement.For dc, small signal, low voltage PCB design requirements can be lower.So "reasonable" is relative.
2，Choose a destination: the destination is often the most important
In general, common ground is required, such as: forward amplifier of multiple ground lines should be joined before connecting to the main line, and so on.In reality, it is difficult to fully do because of various restrictions, but you should try to follow them.The problem is quite flexible in practice.Everyone has their own set of solutions.It is easy to understand if you can explain specific circuit boards.
3， Reasonably arrange power filter/decoupling capacitance
In general, only a few power filter/decoupling capacitors are shown in the schematic diagram, but it is not indicated where they should be connected.In fact, these capacitors are set for switching devices (gate circuits) or other components that need to be filtered/decoupled, and these capacitors should be arranged as close as possible to these components as far away from them as possible.Interestingly, when the power filter/decoupling capacitance is properly disposed, the problem of the connection location is less obvious.
4.，The lines are exquisite, the line diameter is required, and the hole size of the buried hole is appropriate
If you can make wide lines, never thin them.High pressure and high frequency line should slide, no sharp chamfer, no right Angle.The ground should be as wide as possible, preferably with a large area of copper coating, which is a considerable improvement in the docking site.The size of the weld pad or overwire hole is too small, or the size of the weld pad and drill hole are not suitable.The former is disadvantageous to artificial drilling and the latter to numerical control drilling.It is easy to drill the pad into "c" shape, then drill off the pad.The wire is too thin, and the large area of the unwired area is not set with copper, easy to cause corrosion uneven.That is, when the corrosion of the unwired area is finished, the thin wire is likely to be overcorroded, or not broken, or completely broken.Therefore, the function of setting copper coating is not only to increase ground area and anti-interference.
5.，Number of holes, solder joints, wire density
Although some problems occur in post-production, they are caused by PCB design. They are: too many holes in the lead wire, and any careless mistake in copper sinking process may lead to hidden dangers.Therefore, in the design should be minimized through holes.Parallel lines are so dense that they can easily be joined together.Therefore, the line density should be determined according to the level of the welding process.The distance of welding spot is too small, which is not good for manual welding.Otherwise there will be hidden dangers.
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Summary of practical tips for high frequency PCB design
The PCB is designed to be smaller, faster and cheaper.As the interconnection point is the weakest link in the circuit chain, in RF design, the electromagnetic property of the interconnection point is the main problem faced by engineering design. It is necessary to investigate each interconnection point and solve the existing problems.The interconnection of the circuit board system includes three types of interconnection, namely chip to circuit board, interconnection within PCB board and signal input/output between PCB and external device.This paper mainly introduces the practical skills of high frequency PCB design for interconnection in PCB board, and I believe this paper will bring convenience to future PCB design.The interconnection between chip and PCB in PCB design is important for design. However, the main problem of interconnection between chip and PCB is that too high interconnection density will lead to the basic structure of PCB material becoming the factor limiting the growth of interconnection density.This article shares practical tips for designing high frequency PCB.
For high frequency applications, PCB interconnection for high frequency PCB design techniques are:
1, the transmission line to the corner a 45 ° Angle, in order to reduce return loss;
2. High performance insulation board with strict control of insulation constant values should be adopted.This method can effectively manage the electromagnetic field between the insulation material and the adjacent wiring.
3. Perfect PCB design specifications for high-precision etching.Consider setting the total line width error to +/-0.0007 inches, managing undercuts and cross-sections of wiring shapes, and specifying lining plating conditions.The overall management of the wiring geometry and coating surface is very important for solving the skin effect problems related to microwave frequency and realizing these specifications.
4. There is tap inductance for protruding leads, and the components with leads should be avoided.In high frequency environments, it is best to use surface mount components.
5. For the signal via hole, it is necessary to avoid using the process of via hole processing (PTH) on the sensitive plate.Because this process will lead to lead inductance through the hole.A lead inductance can affect 4 to 19 layers if a through hole on a 20 - layer plate is used to connect 1 to 3 layers.
6. It should provide abundant ground.These layers are connected by moulded holes to prevent 3 - dimensional electromagnetic fields from affecting the circuit board.
7. Choose non-electrolytic nickel plating or dip plating process instead of HASL electroplating.This electroplating provides a better skin effect for high-frequency currents.In addition, this high solderable coating requires less lead, helping to reduce environmental pollution.
8. The resistance welding layer can prevent the flow of solder paste.However, due to the uncertainty of thickness and the uncertainty of insulation performance, the whole surface of the board is covered with resistance welding material, which will lead to great changes in electromagnetic energy in microstrip design.Solderdam is usually used as solder barrier layer.
EAGLE DRIVER ELECTRONIC LIMITED。High frequency PCB, specialized board manufacturer.（[email protected]）
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Summary of practical tips for high frequency PCB design
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5G era -- opportunity for PCB industry to take off again
5G - has become a buzzword of the age.The main goal of 5G networks is to keep end users connected all the time.The devices are far more than just smartphones. They include smartwatches, fitness bands, smart home devices and more.According to the data, 5G related industries will generate about 2.9 trillion yuan of economic added value and 8 million new jobs by 2030.With the gradual emergence of new application demand, it is bound to drive the supply of PCB.5G, communications industry will greatly drive the high frequency high-speed PCB demand.
EAGLE DRIVER ELECTRONIC LIMITED.In 2017, 5G PCB technology will be developed and accumulated.Higher requirements have been put forward in production and management, and a firm step has been taken in the PCB industry to meet the arrival of 5G era.Now I'd like to show you a new 5G PCB:LCP r-705s special material, aluminum nitride + steel sheet reinforcement, nickel palladium gold Pa4, and 2Mil wide wire spacing. EAGLE DRIVER ELECTRONIC LIMITED - specialized in solving 5G system problems, we pioneer 5G.（E-mail:[email protected]）
10 layers, 3rd order HDI, nickel palladium pa6-gold4 plus IC program.
8 hard board +4 soft board, capton, resin plug hole soft and hard combination board, a whole set of system integration.
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5G era -- opportunity for PCB industry to take off again
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Practical summary of high frequency PCB design
The PCB is designed to be smaller, faster and cheaper.As the interconnection point is the weakest link in the circuit chain, the electromagnetic property at the interconnection point is the main problem faced by the engineering design in the RF design. Every interconnection point should be investigated and the existing problems solved.
Interconnection of PCB system includes chip to PCB, interconnection of PCB board and signal input/output between PCB and external device.This paper mainly introduces the practical summary of high frequency PCB design by interconnection in PCB board. It is believed that the understanding of this paper will bring convenience to PCB design in the future.
Interconnection between chip and PCB is important in PCB design. However, the main problem of interconnection between chip and PCB is that too high interconnection density will lead to the basic structure of PCB materials becoming a factor limiting the growth of interconnection density.This article shares the practical techniques of high frequency PCB design.For high frequency applications, the following techniques are used to design high frequency PCB with interconnection in PCB boards:
1, the transmission line to the corner a 45 ° Angle, in order to reduce return loss;
2. High performance insulation circuit board shall be strictly controlled by insulation constant value according to hierarchy.This method is beneficial to the effective management of the electromagnetic field between the insulating material and the adjacent wiring.
3. Improve the PCB design specifications for high precision etching.Consider setting the total line width error to +/-0.0007 inches, managing undercut and cross sections of the wire shape, and specifying the conditions for side wall plating of the wire.The overall management of the geometry and coating surfaces of wiring (wires) is very important for solving the skin effect related to microwave frequency and realizing these specifications.
4. Highlight the presence of tap inductor in the lead, and avoid the use of components with lead.In high frequency environments, it is best to use surface mounted components.
5. For signal perforation, avoid using PTH process on sensitive plate.Because this process will lead to lead inductance at the hole.For example, when a hole in a 20-layer plate is used to connect 1 to 3 layers, the lead inductor can affect 4 to 19 layers.
6. Provide a rich seam connection.A die hole is used to connect these layers together to prevent the impact of a 3-dimensional electromagnetic field on the circuit board.
7. To choose non-electrolytic nickel plating or dip plating process, do not use HASL method for plating.This electroplating surface can provide a better skin effect for high frequency current.In addition, the high solderable coating requires less lead wire and helps reduce environmental pollution.
8. The welding resistance layer can prevent the soldering paste from flowing.However, due to the uncertainty of thickness and the uncertainty of insulation performance, covering the entire plate surface with welding resistance materials will lead to a large change in electromagnetic energy in microstrip design.Solderdam is commonly used as the resistance layer.
· EAGLE DRIVER ELECTRONIC LIMITED--Outstanding in PCB production.
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Practical summary of high frequency PCB design
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