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Application of industrial control screens in intelligent security
Industrial control screens play a vital role in the field of intelligent security. They are widely used in monitoring, data analysis, early warning and alarm, and provide efficient and reliable visual support for security systems.
1. Video monitoring and processing
The industrial control screen is the core display device of the security monitoring system. It can display multiple monitoring videos in real time and support high-definition, multi-screen display and picture-in-picture functions. By cooperating with the industrial computer, the industrial control screen can realize video recording, storage, playback and real-time transmission, providing comprehensive video support for security monitoring. For example, in the smart city monitoring center, through the 55-inch LCD splicing wall, 16 channels of 4K signals can be displayed synchronously, combined with intelligent analysis algorithms, abnormal behaviors can be automatically marked and early warnings can be pushed.
2. Intelligent analysis and early warning
The industrial control screen supports advanced image recognition and analysis technologies, such as face recognition, license plate recognition and behavior analysis. These functions can help the system quickly and accurately identify abnormal behaviors or potential threats, and trigger early warning or alarm mechanisms. For example, in some intelligent security systems, the industrial control screen cooperates with the liveness detection algorithm to achieve millisecond-level response, shortening the identity verification time of the customs clearance personnel from 8 seconds to 2 seconds, with an accuracy rate of up to 99.6%.
3. Data storage and management
The industrial control screen is usually used in conjunction with the industrial computer, with a large-capacity storage device, which can save a large amount of monitoring data and image information. At the same time, it also supports rapid retrieval and playback of data to ensure the security and integrity of the monitoring data.
4. Environmental adaptability
The industrial control screen adopts a wide temperature design (-10℃ to 60℃), anti-electromagnetic interference, dustproof and waterproof structure to ensure stable operation in the monitoring room and outdoor scenes. For example, in the case of oil drilling platform monitoring, the industrial control screen still maintains 99.2% display stability under salt spray corrosion and severe vibration environment.
5. Intelligent interaction and operation
The industrial control screen supports a variety of interaction methods, such as capacitive touch screens and gesture recognition algorithms, so that monitoring personnel can quickly locate abnormal images by dragging and zooming, improving operation efficiency. For example, actual tests at a financial monitoring center showed that the event processing efficiency was improved by more than 60% through the use of an industrial control screen with an integrated capacitive touch screen.
About Us: Shenzhen Zhiyan Optronics Co., Ltd. (zylcdshop.com) is a trusted LCD screen distributor based in China. We are dedicated to providing high-quality products and tailored support to meet your unique LCD display requirements.
#interactive display#TFT COLOR LCD MODULE#touch monitor Display#lcd panel#lcd touch panel#lcd screen#touch screen#lcd module#Plastic injection machine LCD#lcd modules#touch panel#Industrial Computer Accessories#for sharp industrial monitor model#LCD Monitors#lcd projector
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Introducing SHE378 Fixed Pump Injection Molding Machine, manufactured by China Sanshun. This advanced machine is designed for producing high-quality plastic products, featuring a large color LCD display screen, a convenient hopper sliding arrangement for easy material removal, a durable mold platen, and a shaking ejector for multi-cavity molds.
Contact us now for further information and to inquire about the latest pricing details.
#fixed pump injection moulding machine#injection molding machines#injection moulding machine#injection molding#machine learning#she430 fixed pump injection moulding machine#she400 fixed pump injection moulding machine#servo energy saving injection moulding machine#SHE378 Fixed Pump Injection Molding Machine
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UV LED Drying Tunnel
The UV curing drying tunnel is a greater existence than the UV curing machine; in general, the UV curing drying tunnel is also called UV curing machine; UV is Ultra-VioletRay, English meaning is ultraviolet, and the common UV wavelength of the industry is between 200 nm-450 nm, using UV to irradiate the needled material to make it hardening the process called "UVCuring process". It is the principle of the UV curing machine with ultraviolet radiation to produce a polymerization. Industrial Comparable UV ultraviolet bands have four bands of UVA, UVB, UVC, and UVV, and the UVA band is now a commonly used industrial. Items that are cured different sizes require different sizes of curing machines. Therefore, the UV curing machine has a lot of type, like a hand style, desktop box style, hanging style, and large curing machine (UV curing drying tunnel). At the same time, the corresponding glue should select the UV cured machine source of the corresponding band, and the UV curing machine needs to consider the source strength, temperature, power, and irradiation time of UV curing machine ultraviolet light. The principle is to use a strong UV high pressure mercury lamp, a UV curing machine made from mature UV light sources. This is a transport UV curing device, widely used in mobile phone case, disc. Thin film switch, electronic plastic housing UV surface painting; various UV coatings, IMD injection molding products ink solidification; for cured electronic components, liquid wafers, terminal enhancement, mobile phone components, bonding, plastic assembly, etc., etc. And LCDs;
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Automatic Plastic Zipper Open-end Injection Machine (QLQ-DOIM-1)

Automatic Plastic Zipper Open-end Injection Machine (only for zipper without slider)
Model number : QLQ-DOIM-1
Summary : This machine is with extra brightness LCD display screen, fast speed, accurate control, PID auto learning temperature control system with good stablity.
PRODUCT DESCRIPTION
Automatic Plastic Zipper Open-end Injection Machine (for zipper without slider only)
MODEL NO.QLQ-DOIM-1
NW (KG) 900
M/C SIZE(M) 1.20*0.80*2.10
AVG OUTPUT 900-1100 MOULD/H
GW (KG) 1000
PKGS SIZE(M) 1.30*0.90*2.20
VOLTAGE(V)380V
POWER(KW)5.4
PHASE (PH)3
Advantages:
1-This machine is with extra brightness LCD display screen, fast speed, accurate control, PID auto learning temperature control system with good stablity.
2- New stepping motor tape pulling system is used on this machine to solve the tape pulling, and deformed hole punching problem happened in machine with adjustable-speed motor.
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Ningbo Sanshun Machinery & Technology CO., LTD provides SHE400 Fixed Pump Injection Moulding Machine for plastic product manufacturing. It features high torque hydraulic motor for the drive of plasticizing screw counter, low pressure mold protection device, high-performance and large color LCD display screen, and control position of the injection device.
Please contact us today for more information and current pricing.
#machine learning#fixed pump injection moulding machine#injection molding machines#injection moulding machine#injection molding#servo energy saving injection moulding machine#SHE400 Fixed Pump Injection Moulding Machine
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ZNC Die Sinking EDM Machine
ZNC electrical discharge machining machine is the traditional type with X and Y axis manual control, usually operator needs to manually move the working table to the location of where to do spark eroding on the workpiece. Z axis is automatically controlled by servo motor, operation of ZNC EDM machine is simple compared to CNC die sinking EDM. Due to the limitation of no control of X and Y axis, ZNC EDM machine can't do simultaneous orbital machining, even use an orbital cutting head, the result of accuracy and surface is not as good as what can achieve on CNC EDM machines. But thinking about the cost of ZNC EDM, it's ideal for the start or jobs without a strict requirement of accuracy and surface finish.
ZNC350 ZNC Spark Erosion Machine
ZNC430 ZNC Electrical Discharge Machine
ZNC450 Electrical Discharge Machining Machine
ZNC540 Electric Discharge Machining
ZNC600 ZNC EDM Sparking Machine
ZNC860 ZNC Die Sinking EDM With Heavy Load Capacity
ZNC Die Sinking EDM Machine Highlights
Original Taiwan C-Tek controller, LCD monitor, Industrial Computer Controller.
High accuracy X, Y, Z three axes C3 grade Taiwan made ball screw.
Z axis imported Japanese Sanyo servo motor control.
Three axes DROs of 0.005mm resolution.
Resin sand casting as machine body and inner stress removed to make sure long-time rigidity and stability.
Z axis is equipped with a high precision roller guideway with a Japanese SANYO DC servo motor, to make the movement of Z axis more sensitive and smoother.
The machine has a wide machine base to make sure the machine is strong enough for heavy loading, X. and Y axis have V shape and flat guideway with FEFLON wear-resisting sticker, movement of heavy load is smooth and light, with no crawling phenomenon.
Working lamp, fire extinguisher and lubrication unit, and patented electrode holder are all Taiwan made.
ZNC Die Sinking EDM Machine Function Characteristic Introduction of Control System
More than 20,000 units of programming storage capacity. Normally, more than 20,000 different programmings of mold or customer numbering can be stored
With a mirror surface processing circuit, a true mirror effect can be performed. Furthermore, it is even better to use orbital processing and powder mixing processing.
10 segments auto-editing function. ① Manual edit: edit machining condition by experience. ②AUTO Z auto edit: Max. Depths, initial current and finished process, machining area selection are provided, and then machining condition edit can be finished automatically. ③ Intelligent condition edit electrode shape, electrode and workpiece material, workpiece section area and finished precision selection, depth setting area are provided, and then machining condition can be complete at a time by the way of a rough→moderate→fine.
X, Y, Z-axis coordinate are switch with Metric and English system
If machining is unstable, the discharging condition is auto-adjusted by modifying discharging efficiency and working time. After that, the condition will restore automatically. And it is also adjustable at any time.
Auto arcing detecting function, if unsteady caused by arcing occurs, the computer will adjust machining parameters and rise to jump up height, then the normal condition would return.
If could set that after 2~10 times discharging (jumping up control), the electrode will be raised (safe height Z) to the set arbitrary position and continue machining. This could achieve good slagging off performance for deep hole machining.
The function of avoiding second discharging and carbon deposition rapid raising or discharging boundary searching rapid rising.
Power control (equal energy) function for homogenizing machining effect. And this function could be switched off to accelerating graphite electrode machining.
Generator new design conforms to a power supply box and 15-inch LCD display criterion of European CE safety regulation, which is dustproof, waterproof, electric noise-proof and circuit board life could also be raised.
Industrial class PC-based controller is applied, and the traditional hard disk is substituted by new DOM type memory, which enables faster and more steadily speeds of file reading and it is more suitable for industry application.
Up discharging (reverse machining) function makes special machining easier.
Two independent machining coordinates. The male die and female die could be parted or machined in different coordinates.
After power off, system restarts and automatically reloads previous machining condition and coordinate of last time, so discharging could be finished by pushing remote control box without panel operation
Two jumps up to speed type, which serve speed could be raised when no electrode deformation and big area machining efficiency could also be raised.
Separately storage of coordinate and machining data and same machining condition could be rapidly added in different part machining.
Two high voltage circuits could be set in partial voltage or partial current according to the customer's need
Arcing detection setting function could start the carbon deposition hardware detecting circuit, and every charging pulse could be detected and the current will be cut off when an abnormal pulse occurs. So no short circuit is caused by a short circuit
Discharging high voltage pulse control, which enables the settings of different high voltage pulse types and it could go with machining speed and electrode wear.
Function Pic ZNC Die Sinking EDM Machine
Consumable Parts ZNC Die Sinking EDM Machine
Orbital Cutting Head
100A Generator
Products
Die Sinker EDM Machine
Windows Platform CNC EDM Machine
Automation CNC EDM Machine
CNC EDM Sinker Machine C Structure A30, A45
Ram Type CNC EDM Machine with Fixed Table
Double Heads Large CNC EDM Machine
General Purpose CNC EDM Machine P40
ZNC Die Sinking EDM Machine
CNC EDM Wire Cut Machine
Small Hole EDM Drilling Machine
High Speed CNC Milling Machine G-600
EDM Parts
Blog
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Die Sinking EDM Die Sinking EDM
Sep 21 2020
Small Hole Drilling EDM Small Hole Drilling EDM
Sep 21 2020
Wire Cut EDM Wire Cut EDM
Sep 21 2020
DIE SINKER EDM MACHINE FAQS
The Mostly Asked Questions about Die Sinker EDM Machines
What's EDM die sinking machining (EDM forming machining)?
The EDM die sinker machine is able to cope machining by prepared electrodes, the cavity that created is the same as the profile of the electrode. EDM spark erosion machining can process punches, drawing dies, and extension dies of various types of holes; process various forging dies, extrusion dies, plastic injection molds and extrusion dies; and also process various small holes, deep holes, heterosexual holes, and curved holes, and special materials with complex-shaped parts, etc.
Uses of EDM machining technology
(1) Processing various technologies and their alloy materials, conductive super-hard materials (such as polycrystalline diamond, cubic boron nitride, cermets, etc.), special heat-sensitive materials, semiconductor, and non-semiconductor materials.
(2) Processing various kinds of complex-shaped hole and cavity workpieces, including processing round hole, square hole, polygon hole, special-shaped hole, curved hole, threaded hole, micro hole, deep hole and other type hole workpieces, as well as various types Face cavity workpiece. For example, processing exceptionally large molds and parts ranging from a few micrometers of holes and grooves to several meters.
(3) Cutting of various workpieces and materials, including cutting of materials, cutting of parts with special structure, cutting of fine narrow slits and parts composed of fine narrow slits (such as metal grid, slow wave structure, heterogeneous orifice spinneret, laser Pieces, etc.).
(4) Processing all kinds of forming parts such as forming knives, samples, tools, measuring tools, threads and so on.
(5) Grinding of workpieces, including small holes, deep holes, inner circles, outer circles, flat surfaces, etc. and profile grinding.
(6) Engrave and print nameplates and marks.
(7) Surface strengthening and modification, such as high-speed quenching of metal surfaces, nitriding, carburizing, coating of special materials and alloying, etc.
(8) Auxiliary uses, such as removing taps and drill bits from parts in this segment, repairing worn parts, etc.
What is the EDM machine meaning in the metal working industry
Electrical spark erosion, also known as electrical discharge machining and electrical corrosion machining, called electrical discharge machining in Japan and electrical corrosion machining in the former Soviet Union. It is a method of processing the metal workpiece by utilizing the phenomenon of electric corrosion generated during the pulse discharge between the two poles (electrode and workpiece, should be conductive). Academically it belongs to the category of electrophysical processing. EDM technology is one of the most important parts of special machining technology.
What is the advantage of electrical discharging machining against traditional metal working method?
Answer: With the development of industrial production and the advancement of science and technology, more and more new materials with a high melting point, high hardness, high strength, high brittleness, high viscosity, high toughness, high purity and other properties continue to appear, and also some with various complex structures that can’t be machined by traditional metal working method, sometimes difficult or impossible to process. With traditional metal working technology.
Therefore, in addition to further development and improvement of traditional mechanical metal working methods, people also strive to find new processing methods. The electrical discharging machining (EDM) method can meet the needs of development, and shows many excellent performances in the application, so it has been rapidly developed and increasingly widely used.
Characteristics of EDM die sinking machining
(1). During machining, the tool electrode and the workpiece material are not actually touching and there is basically no macro-mechanical force between the two. Therefore, the "soft" tool electrode can be used to process the "hard" workpiece. For example, graphite and copper electrodes can process hardened steel, cemented carbide, and even diamond.
(2). Because the spark energy density of the high-frequency power discharging can be accurately controlled, and there is no macro mechanical force between the two poles (electrode and workpiece), so the precise and fine machining can be achieved. Such as the processing of narrow slits, narrow grooves, micro-small holes of molds and parts, the processing accuracy can reach micron level, even sub-micron level.
(3) "Copying". With direct use of electrical power for processing, it is easy to realize the automation, intelligence, and application of modern computer control technology to precisely control the machining process, which makes the machining of workpieces more realistic.
(4) Direct use of electrical energy for processing, which is convenient for automation of the machining process, and can reduce mechanical processing procedures, shorten processing steps, low labor intensity, and easy to use and maintain
https://www.dmncedm.com/products/znc-die-sinking-edm-machine/

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Detailed introduction of the process flow of COB LCD module assembly
The process flow of COB LCD module assembly can be simply expressed as: cleaning the PCB---dropping adhesive---chip sticking---testing---sealing glue and heating curing---testing---stocking. Let's talk about each step in detail below.
1. Clean the PCB
The cleaned PCB board still has oily dirt or oxide layer and other dirty parts. Use a skin wipe to test the positioning or test the needle position to wipe the PCB board with a brush or blow it with an air gun before flowing into the next process. For products with strict anti-static properties, use an ion blower. The purpose of cleaning is to remove the dust and oil on the PCB board bonding pads to improve the quality of bonding.
2. Adhesive glue
The purpose of the adhesive glue is to prevent the DIE from falling off during the transfer and bonding process of the product
Needle transfer and pressure injection are usually used in the COB process
Needle transfer method: Use a needle to take a small drop of adhesive from the container and apply it on the PCB. This is a very fast dispensing method
Pressure injection method: Put the glue into the syringe, apply a certain air pressure to squeeze the glue out. The size of the glue point is determined by the nozzle diameter of the syringe and the pressure time and pressure and is related to the viscosity. This process is generally used in dripping machines or DIE BOND automatic equipment
The size and height of the glue drop depends on the type, size, distance from the PAD position, and weight of the chip (DIE). The size and weight of the chip is larger, and the amount of glue drop should not be too large to ensure sufficient viscosity. At the same time, the bonding glue cannot pollute the bonding pad. If there is a certain standard, it can only be determined by different products. If you insist that the height of the chip cannot exceed 1/3 of the height and the amount of glue cannot be exposed as the standard, this is not necessary.
3. Chip paste
Chip pasting is also called DIE BOND (solid crystal) sticking DIE Bang DIE Bang IC and other companies have different names. In chip sticking, the hardness of the vacuum suction pen (suction nozzle) is required to be small (some companies also use cotton swabs for sticking). The diameter of the suction nozzle depends on the size of the chip, and the tip of the nozzle must be flat to avoid scratching the surface of the DIE. When pasting, check the DIE and PCB model and whether the pasting direction is correct. The DIE towel to the PCB must be "smooth and upright". "Flat" means that the DIE and the PCB are parallel and close to each other. "Stable" means that the DIE and the PCB are in the whole In the process, it is not easy to fall off. "Positive" means that the DIE and the reserved position of the PCB are attached to the front and cannot be twisted. It must be noted that the direction of the chip (DIE) must not be reversed.
4. Bond wire (wire bonding)
Bond wire (wire bonding) Wire Bond Bonding The connection name is different. Here is bonding as an example
Bonding connects the two solder joints of each state line according to the position determined by the BONDING diagram to achieve electrical and mechanical connection. Bonding PCB requires its tensile strength to meet the company's standard (reference 1.0 line greater than or equal to 3.5G and 1.25 line greater than or equal to 4.5G) when bonding the PCB for bonding tensile test, the shape of the aluminum wire solder joint is oval, and the shape of the gold wire solder joint is spherical.
Bonding melting point standard
Aluminum wire:
The wire tail is greater than or equal to 0.3 times the wire diameter and less than or equal to 1.5 times the wire diameter
The length of the solder joint is greater than or equal to 1.5 times the wire diameter and less than or equal to 5.0 times the wire diameter
The width of the solder joint is greater than or equal to 1.2 times the wire diameter and less than or equal to 3.0 times the wire diameter
The height of the arc is equal to the height of the parabola of the circle (not too high or too low, depending on the product)
Gold Line:
Solder balls are generally about 2.6-2.7 times the wire diameter
During the bonding process, handle with care, and the points must be accurate. The operator should observe the bonding process with a microscope to see if there is any disconnection, winding, deviation, cold and hot welding, aluminum lifting, etc. Then immediately notify the management or technical staff. Before the formal production, there must be a first inspection by a special person to check whether there is any fault, lack of state, and missing state. Every 2 hours there should be someone to check its correctness.
5. Plastic closures
Sealing glue mainly applies black glue to PCB boards that are tested OK. When dispensing glue, pay attention to that the black glue should completely cover the PCB sun circle and the aluminum wire of the bonding chip, and there should be no exposure. The black glue should not be sealed out of the sun circle and other places. There is black glue, if there is leakage of glue. Wipe off the cloth strips instantly. During the entire dispensing process, the needle or the wool stick should not touch the DIE and the bonded wire. The surface of the dried vinyl shall be free of pores and uncured vinyl. The height of the black glue should not exceed 1.8MM, and the special requirement should be less than 1.5MM. The temperature of the preheating plate and the drying temperature should be strictly controlled during dispensing. (Zhenqi BE-08 vinyl FR4PCB board as an example: the preheating temperature is 120±15 degrees, the time is 1.5-3.0 minutes, the drying temperature is 140±15 degrees, and the time is 40-60 minutes) The sealing method usually also adopts needle transfer Method and pressure injection method. Some companies also use glue dispensers, but their cost is high and efficiency is low. Usually, cotton swabs and syringes are used for glue, but the operators must have skilled operation ability and strict process requirements. If the chip is damaged, it will be very difficult to repair it. Therefore, this process management personnel and engineering personnel must be strictly controlled.
6. test
In the bonding process, there will be some undesirable phenomena such as wire breakage, wire winding, false soldering, etc., which will cause chip failure, so the chip scale package must be tested for performance
According to the detection method, it can be divided into two categories: non-contact detection (inspection) and contact detection (test). Non-contact detection has developed from manual visual inspection to automatic optical image analysis (AOI) X-ray analysis, from appearance circuit pattern inspection Developed to the quality inspection of inner layer solder joints, and developed from a single inspection to a combination of quality monitoring and defect repair.
Although the bonding machine is equipped with automatic welding wire quality inspection function (BQM), the automatic welding wire quality inspection of the bonding machine mainly adopts two methods of design rule detection (DRC) and pattern recognition. DRC is to check the quality of the welding wire according to some given rules such as how much the melting point is less than the wire diameter or how much greater than some set standards. The pattern recognition method compares the stored digitized image with the actual work. But this is all affected by process control, process regulations, parameter changes, etc. The specific method used should be determined according to the specific conditions of each unit's production line and the product. But no matter what the conditions are, visual inspection is the basic inspection method and one of the contents that COB technicians and inspectors must master. The two should complement each other and cannot replace each other
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Text
Detailed introduction of the process flow of COB LCD module assembly
The process flow of COB LCD module assembly can be simply expressed as: cleaning the PCB---dropping adhesive---chip sticking---testing---sealing glue and heating curing---testing---stocking. Let's talk about each step in detail below.
1. Clean the PCB
The cleaned PCB board still has oily dirt or oxide layer and other dirty parts. Use a skin wipe to test the positioning or test the needle position to wipe the PCB board with a brush or blow it with an air gun before flowing into the next process. For products with strict anti-static properties, use an ion blower. The purpose of cleaning is to remove the dust and oil on the PCB board bonding pads to improve the quality of bonding.
2. Adhesive glue
The purpose of the adhesive glue is to prevent the DIE from falling off during the transfer and bonding process of the product
Needle transfer and pressure injection are usually used in the COB process
Needle transfer method: Use a needle to take a small drop of adhesive from the container and apply it on the PCB. This is a very fast dispensing method
Pressure injection method: Put the glue into the syringe, apply a certain air pressure to squeeze the glue out. The size of the glue point is determined by the nozzle diameter of the syringe and the pressure time and pressure and is related to the viscosity. This process is generally used in dripping machines or DIE BOND automatic equipment
The size and height of the glue drop depends on the type, size, distance from the PAD position, and weight of the chip (DIE). The size and weight of the chip is larger, and the amount of glue drop should not be too large to ensure sufficient viscosity. At the same time, the bonding glue cannot pollute the bonding pad. If there is a certain standard, it can only be determined by different products. If you insist that the height of the chip cannot exceed 1/3 of the height and the amount of glue cannot be exposed as the standard, this is not necessary.
3. Chip paste
Chip pasting is also called DIE BOND (solid crystal) sticking DIE Bang DIE Bang IC and other companies have different names. In chip sticking, the hardness of the vacuum suction pen (suction nozzle) is required to be small (some companies also use cotton swabs for sticking). The diameter of the suction nozzle depends on the size of the chip, and the tip of the nozzle must be flat to avoid scratching the surface of the DIE. When pasting, check the DIE and PCB model and whether the pasting direction is correct. The DIE towel to the PCB must be "smooth and upright". "Flat" means that the DIE and the PCB are parallel and close to each other. "Stable" means that the DIE and the PCB are in the whole In the process, it is not easy to fall off. "Positive" means that the DIE and the reserved position of the PCB are attached to the front and cannot be twisted. It must be noted that the direction of the chip (DIE) must not be reversed.
4. Bond wire (wire bonding)
Bond wire (wire bonding) Wire Bond Bonding The connection name is different. Here is bonding as an example
Bonding connects the two solder joints of each state line according to the position determined by the BONDING diagram to achieve electrical and mechanical connection. Bonding PCB requires its tensile strength to meet the company's standard (reference 1.0 line greater than or equal to 3.5G and 1.25 line greater than or equal to 4.5G) when bonding the PCB for bonding tensile test, the shape of the aluminum wire solder joint is oval, and the shape of the gold wire solder joint is spherical.
Bonding melting point standard
Aluminum wire:
The wire tail is greater than or equal to 0.3 times the wire diameter and less than or equal to 1.5 times the wire diameter
The length of the solder joint is greater than or equal to 1.5 times the wire diameter and less than or equal to 5.0 times the wire diameter
The width of the solder joint is greater than or equal to 1.2 times the wire diameter and less than or equal to 3.0 times the wire diameter
The height of the arc is equal to the height of the parabola of the circle (not too high or too low, depending on the product)
Gold Line:
Solder balls are generally about 2.6-2.7 times the wire diameter
During the bonding process, handle with care, and the points must be accurate. The operator should observe the bonding process with a microscope to see if there is any disconnection, winding, deviation, cold and hot welding, aluminum lifting, etc. Then immediately notify the management or technical staff. Before the formal production, there must be a first inspection by a special person to check whether there is any fault, lack of state, and missing state. Every 2 hours there should be someone to check its correctness.
5. Plastic closures
Sealing glue mainly applies black glue to PCB boards that are tested OK. When dispensing glue, pay attention to that the black glue should completely cover the PCB sun circle and the aluminum wire of the bonding chip, and there should be no exposure. The black glue should not be sealed out of the sun circle and other places. There is black glue, if there is leakage of glue. Wipe off the cloth strips instantly. During the entire dispensing process, the needle or the wool stick should not touch the DIE and the bonded wire. The surface of the dried vinyl shall be free of pores and uncured vinyl. The height of the black glue should not exceed 1.8MM, and the special requirement should be less than 1.5MM. The temperature of the preheating plate and the drying temperature should be strictly controlled during dispensing. (Zhenqi BE-08 vinyl FR4PCB board as an example: the preheating temperature is 120±15 degrees, the time is 1.5-3.0 minutes, the drying temperature is 140±15 degrees, and the time is 40-60 minutes) The sealing method usually also adopts needle transfer Method and pressure injection method. Some companies also use glue dispensers, but their cost is high and efficiency is low. Usually, cotton swabs and syringes are used for glue, but the operators must have skilled operation ability and strict process requirements. If the chip is damaged, it will be very difficult to repair it. Therefore, this process management personnel and engineering personnel must be strictly controlled.
6. test
In the bonding process, there will be some undesirable phenomena such as wire breakage, wire winding, false soldering, etc., which will cause chip failure, so the chip scale package must be tested for performance
According to the detection method, it can be divided into two categories: non-contact detection (inspection) and contact detection (test). Non-contact detection has developed from manual visual inspection to automatic optical image analysis (AOI) X-ray analysis, from appearance circuit pattern inspection Developed to the quality inspection of inner layer solder joints, and developed from a single inspection to a combination of quality monitoring and defect repair.
Although the bonding machine is equipped with automatic welding wire quality inspection function (BQM), the automatic welding wire quality inspection of the bonding machine mainly adopts two methods of design rule detection (DRC) and pattern recognition. DRC is to check the quality of the welding wire according to some given rules such as how much the melting point is less than the wire diameter or how much greater than some set standards. The pattern recognition method compares the stored digitized image with the actual work. But this is all affected by process control, process regulations, parameter changes, etc. The specific method used should be determined according to the specific conditions of each unit's production line and the product. But no matter what the conditions are, visual inspection is the basic inspection method and one of the contents that COB technicians and inspectors must master. The two should complement each other and cannot replace each other
0 notes
Text
Detailed introduction of the process flow of COB LCD module assembly
The process flow of COB LCD module assembly can be simply expressed as: cleaning the PCB---dropping adhesive---chip sticking---testing---sealing glue and heating curing---testing---stocking. Let's talk about each step in detail below.
1. Clean the PCB
The cleaned PCB board still has oily dirt or oxide layer and other dirty parts. Use a skin wipe to test the positioning or test the needle position to wipe the PCB board with a brush or blow it with an air gun before flowing into the next process. For products with strict anti-static properties, use an ion blower. The purpose of cleaning is to remove the dust and oil on the PCB board bonding pads to improve the quality of bonding.
2. Adhesive glue
The purpose of the adhesive glue is to prevent the DIE from falling off during the transfer and bonding process of the product
Needle transfer and pressure injection are usually used in the COB process
Needle transfer method: Use a needle to take a small drop of adhesive from the container and apply it on the PCB. This is a very fast dispensing method
Pressure injection method: Put the glue into the syringe, apply a certain air pressure to squeeze the glue out. The size of the glue point is determined by the nozzle diameter of the syringe and the pressure time and pressure and is related to the viscosity. This process is generally used in dripping machines or DIE BOND automatic equipment
The size and height of the glue drop depends on the type, size, distance from the PAD position, and weight of the chip (DIE). The size and weight of the chip is larger, and the amount of glue drop should not be too large to ensure sufficient viscosity. At the same time, the bonding glue cannot pollute the bonding pad. If there is a certain standard, it can only be determined by different products. If you insist that the height of the chip cannot exceed 1/3 of the height and the amount of glue cannot be exposed as the standard, this is not necessary.
3. Chip paste
Chip pasting is also called DIE BOND (solid crystal) sticking DIE Bang DIE Bang IC and other companies have different names. In chip sticking, the hardness of the vacuum suction pen (suction nozzle) is required to be small (some companies also use cotton swabs for sticking). The diameter of the suction nozzle depends on the size of the chip, and the tip of the nozzle must be flat to avoid scratching the surface of the DIE. When pasting, check the DIE and PCB model and whether the pasting direction is correct. The DIE towel to the PCB must be "smooth and upright". "Flat" means that the DIE and the PCB are parallel and close to each other. "Stable" means that the DIE and the PCB are in the whole In the process, it is not easy to fall off. "Positive" means that the DIE and the reserved position of the PCB are attached to the front and cannot be twisted. It must be noted that the direction of the chip (DIE) must not be reversed.
4. Bond wire (wire bonding)
Bond wire (wire bonding) Wire Bond Bonding The connection name is different. Here is bonding as an example
Bonding connects the two solder joints of each state line according to the position determined by the BONDING diagram to achieve electrical and mechanical connection. Bonding PCB requires its tensile strength to meet the company's standard (reference 1.0 line greater than or equal to 3.5G and 1.25 line greater than or equal to 4.5G) when bonding the PCB for bonding tensile test, the shape of the aluminum wire solder joint is oval, and the shape of the gold wire solder joint is spherical.
Bonding melting point standard
Aluminum wire:
The wire tail is greater than or equal to 0.3 times the wire diameter and less than or equal to 1.5 times the wire diameter
The length of the solder joint is greater than or equal to 1.5 times the wire diameter and less than or equal to 5.0 times the wire diameter
The width of the solder joint is greater than or equal to 1.2 times the wire diameter and less than or equal to 3.0 times the wire diameter
The height of the arc is equal to the height of the parabola of the circle (not too high or too low, depending on the product)
Gold Line:
Solder balls are generally about 2.6-2.7 times the wire diameter
During the bonding process, handle with care, and the points must be accurate. The operator should observe the bonding process with a microscope to see if there is any disconnection, winding, deviation, cold and hot welding, aluminum lifting, etc. Then immediately notify the management or technical staff. Before the formal production, there must be a first inspection by a special person to check whether there is any fault, lack of state, and missing state. Every 2 hours there should be someone to check its correctness.
5. Plastic closures
Sealing glue mainly applies black glue to PCB boards that are tested OK. When dispensing glue, pay attention to that the black glue should completely cover the PCB sun circle and the aluminum wire of the bonding chip, and there should be no exposure. The black glue should not be sealed out of the sun circle and other places. There is black glue, if there is leakage of glue. Wipe off the cloth strips instantly. During the entire dispensing process, the needle or the wool stick should not touch the DIE and the bonded wire. The surface of the dried vinyl shall be free of pores and uncured vinyl. The height of the black glue should not exceed 1.8MM, and the special requirement should be less than 1.5MM. The temperature of the preheating plate and the drying temperature should be strictly controlled during dispensing. (Zhenqi BE-08 vinyl FR4PCB board as an example: the preheating temperature is 120±15 degrees, the time is 1.5-3.0 minutes, the drying temperature is 140±15 degrees, and the time is 40-60 minutes) The sealing method usually also adopts needle transfer Method and pressure injection method. Some companies also use glue dispensers, but their cost is high and efficiency is low. Usually, cotton swabs and syringes are used for glue, but the operators must have skilled operation ability and strict process requirements. If the chip is damaged, it will be very difficult to repair it. Therefore, this process management personnel and engineering personnel must be strictly controlled.
6. test
In the bonding process, there will be some undesirable phenomena such as wire breakage, wire winding, false soldering, etc., which will cause chip failure, so the chip scale package must be tested for performance
According to the detection method, it can be divided into two categories: non-contact detection (inspection) and contact detection (test). Non-contact detection has developed from manual visual inspection to automatic optical image analysis (AOI) X-ray analysis, from appearance circuit pattern inspection Developed to the quality inspection of inner layer solder joints, and developed from a single inspection to a combination of quality monitoring and defect repair.
Although the bonding machine is equipped with automatic welding wire quality inspection function (BQM), the automatic welding wire quality inspection of the bonding machine mainly adopts two methods of design rule detection (DRC) and pattern recognition. DRC is to check the quality of the welding wire according to some given rules such as how much the melting point is less than the wire diameter or how much greater than some set standards. The pattern recognition method compares the stored digitized image with the actual work. But this is all affected by process control, process regulations, parameter changes, etc. The specific method used should be determined according to the specific conditions of each unit's production line and the product. But no matter what the conditions are, visual inspection is the basic inspection method and one of the contents that COB technicians and inspectors must master. The two should complement each other and cannot replace each other
0 notes
Text
Detailed introduction of the process flow of COB LCD module assembly
The process flow of COB LCD module assembly can be simply expressed as: cleaning the PCB---dropping adhesive---chip sticking---testing---sealing glue and heating curing---testing---stocking. Let's talk about each step in detail below.
1. Clean the PCB
The cleaned PCB board still has oily dirt or oxide layer and other dirty parts. Use a skin wipe to test the positioning or test the needle position to wipe the PCB board with a brush or blow it with an air gun before flowing into the next process. For products with strict anti-static properties, use an ion blower. The purpose of cleaning is to remove the dust and oil on the PCB board bonding pads to improve the quality of bonding.
2. Adhesive glue
The purpose of the adhesive glue is to prevent the DIE from falling off during the transfer and bonding process of the product
Needle transfer and pressure injection are usually used in the COB process
Needle transfer method: Use a needle to take a small drop of adhesive from the container and apply it on the PCB. This is a very fast dispensing method
Pressure injection method: Put the glue into the syringe, apply a certain air pressure to squeeze the glue out. The size of the glue point is determined by the nozzle diameter of the syringe and the pressure time and pressure and is related to the viscosity. This process is generally used in dripping machines or DIE BOND automatic equipment
The size and height of the glue drop depends on the type, size, distance from the PAD position, and weight of the chip (DIE). The size and weight of the chip is larger, and the amount of glue drop should not be too large to ensure sufficient viscosity. At the same time, the bonding glue cannot pollute the bonding pad. If there is a certain standard, it can only be determined by different products. If you insist that the height of the chip cannot exceed 1/3 of the height and the amount of glue cannot be exposed as the standard, this is not necessary.
3. Chip paste
Chip pasting is also called DIE BOND (solid crystal) sticking DIE Bang DIE Bang IC and other companies have different names. In chip sticking, the hardness of the vacuum suction pen (suction nozzle) is required to be small (some companies also use cotton swabs for sticking). The diameter of the suction nozzle depends on the size of the chip, and the tip of the nozzle must be flat to avoid scratching the surface of the DIE. When pasting, check the DIE and PCB model and whether the pasting direction is correct. The DIE towel to the PCB must be "smooth and upright". "Flat" means that the DIE and the PCB are parallel and close to each other. "Stable" means that the DIE and the PCB are in the whole In the process, it is not easy to fall off. "Positive" means that the DIE and the reserved position of the PCB are attached to the front and cannot be twisted. It must be noted that the direction of the chip (DIE) must not be reversed.
4. Bond wire (wire bonding)
Bond wire (wire bonding) Wire Bond Bonding The connection name is different. Here is bonding as an example
Bonding connects the two solder joints of each state line according to the position determined by the BONDING diagram to achieve electrical and mechanical connection. Bonding PCB requires its tensile strength to meet the company's standard (reference 1.0 line greater than or equal to 3.5G and 1.25 line greater than or equal to 4.5G) when bonding the PCB for bonding tensile test, the shape of the aluminum wire solder joint is oval, and the shape of the gold wire solder joint is spherical.
Bonding melting point standard
Aluminum wire:
The wire tail is greater than or equal to 0.3 times the wire diameter and less than or equal to 1.5 times the wire diameter
The length of the solder joint is greater than or equal to 1.5 times the wire diameter and less than or equal to 5.0 times the wire diameter
The width of the solder joint is greater than or equal to 1.2 times the wire diameter and less than or equal to 3.0 times the wire diameter
The height of the arc is equal to the height of the parabola of the circle (not too high or too low, depending on the product)
Gold Line:
Solder balls are generally about 2.6-2.7 times the wire diameter
During the bonding process, handle with care, and the points must be accurate. The operator should observe the bonding process with a microscope to see if there is any disconnection, winding, deviation, cold and hot welding, aluminum lifting, etc. Then immediately notify the management or technical staff. Before the formal production, there must be a first inspection by a special person to check whether there is any fault, lack of state, and missing state. Every 2 hours there should be someone to check its correctness.
5. Plastic closures
Sealing glue mainly applies black glue to PCB boards that are tested OK. When dispensing glue, pay attention to that the black glue should completely cover the PCB sun circle and the aluminum wire of the bonding chip, and there should be no exposure. The black glue should not be sealed out of the sun circle and other places. There is black glue, if there is leakage of glue. Wipe off the cloth strips instantly. During the entire dispensing process, the needle or the wool stick should not touch the DIE and the bonded wire. The surface of the dried vinyl shall be free of pores and uncured vinyl. The height of the black glue should not exceed 1.8MM, and the special requirement should be less than 1.5MM. The temperature of the preheating plate and the drying temperature should be strictly controlled during dispensing. (Zhenqi BE-08 vinyl FR4PCB board as an example: the preheating temperature is 120±15 degrees, the time is 1.5-3.0 minutes, the drying temperature is 140±15 degrees, and the time is 40-60 minutes) The sealing method usually also adopts needle transfer Method and pressure injection method. Some companies also use glue dispensers, but their cost is high and efficiency is low. Usually, cotton swabs and syringes are used for glue, but the operators must have skilled operation ability and strict process requirements. If the chip is damaged, it will be very difficult to repair it. Therefore, this process management personnel and engineering personnel must be strictly controlled.
6. test
In the bonding process, there will be some undesirable phenomena such as wire breakage, wire winding, false soldering, etc., which will cause chip failure, so the chip scale package must be tested for performance
According to the detection method, it can be divided into two categories: non-contact detection (inspection) and contact detection (test). Non-contact detection has developed from manual visual inspection to automatic optical image analysis (AOI) X-ray analysis, from appearance circuit pattern inspection Developed to the quality inspection of inner layer solder joints, and developed from a single inspection to a combination of quality monitoring and defect repair.
Although the bonding machine is equipped with automatic welding wire quality inspection function (BQM), the automatic welding wire quality inspection of the bonding machine mainly adopts two methods of design rule detection (DRC) and pattern recognition. DRC is to check the quality of the welding wire according to some given rules such as how much the melting point is less than the wire diameter or how much greater than some set standards. The pattern recognition method compares the stored digitized image with the actual work. But this is all affected by process control, process regulations, parameter changes, etc. The specific method used should be determined according to the specific conditions of each unit's production line and the product. But no matter what the conditions are, visual inspection is the basic inspection method and one of the contents that COB technicians and inspectors must master. The two should complement each other and cannot replace each other
0 notes
Text
Detailed introduction of the process flow of COB LCD module assembly
The process flow of COB LCD module assembly can be simply expressed as: cleaning the PCB---dropping adhesive---chip sticking---testing---sealing glue and heating curing---testing---stocking. Let's talk about each step in detail below.
1. Clean the PCB
The cleaned PCB board still has oily dirt or oxide layer and other dirty parts. Use a skin wipe to test the positioning or test the needle position to wipe the PCB board with a brush or blow it with an air gun before flowing into the next process. For products with strict anti-static properties, use an ion blower. The purpose of cleaning is to remove the dust and oil on the PCB board bonding pads to improve the quality of bonding.
2. Adhesive glue
The purpose of the adhesive glue is to prevent the DIE from falling off during the transfer and bonding process of the product
Needle transfer and pressure injection are usually used in the COB process
Needle transfer method: Use a needle to take a small drop of adhesive from the container and apply it on the PCB. This is a very fast dispensing method
Pressure injection method: Put the glue into the syringe, apply a certain air pressure to squeeze the glue out. The size of the glue point is determined by the nozzle diameter of the syringe and the pressure time and pressure and is related to the viscosity. This process is generally used in dripping machines or DIE BOND automatic equipment
The size and height of the glue drop depends on the type, size, distance from the PAD position, and weight of the chip (DIE). The size and weight of the chip is larger, and the amount of glue drop should not be too large to ensure sufficient viscosity. At the same time, the bonding glue cannot pollute the bonding pad. If there is a certain standard, it can only be determined by different products. If you insist that the height of the chip cannot exceed 1/3 of the height and the amount of glue cannot be exposed as the standard, this is not necessary.
3. Chip paste
Chip pasting is also called DIE BOND (solid crystal) sticking DIE Bang DIE Bang IC and other companies have different names. In chip sticking, the hardness of the vacuum suction pen (suction nozzle) is required to be small (some companies also use cotton swabs for sticking). The diameter of the suction nozzle depends on the size of the chip, and the tip of the nozzle must be flat to avoid scratching the surface of the DIE. When pasting, check the DIE and PCB model and whether the pasting direction is correct. The DIE towel to the PCB must be "smooth and upright". "Flat" means that the DIE and the PCB are parallel and close to each other. "Stable" means that the DIE and the PCB are in the whole In the process, it is not easy to fall off. "Positive" means that the DIE and the reserved position of the PCB are attached to the front and cannot be twisted. It must be noted that the direction of the chip (DIE) must not be reversed.
4. Bond wire (wire bonding)
Bond wire (wire bonding) Wire Bond Bonding The connection name is different. Here is bonding as an example
Bonding connects the two solder joints of each state line according to the position determined by the BONDING diagram to achieve electrical and mechanical connection. Bonding PCB requires its tensile strength to meet the company's standard (reference 1.0 line greater than or equal to 3.5G and 1.25 line greater than or equal to 4.5G) when bonding the PCB for bonding tensile test, the shape of the aluminum wire solder joint is oval, and the shape of the gold wire solder joint is spherical.
Bonding melting point standard
Aluminum wire:
The wire tail is greater than or equal to 0.3 times the wire diameter and less than or equal to 1.5 times the wire diameter
The length of the solder joint is greater than or equal to 1.5 times the wire diameter and less than or equal to 5.0 times the wire diameter
The width of the solder joint is greater than or equal to 1.2 times the wire diameter and less than or equal to 3.0 times the wire diameter
The height of the arc is equal to the height of the parabola of the circle (not too high or too low, depending on the product)
Gold Line:
Solder balls are generally about 2.6-2.7 times the wire diameter
During the bonding process, handle with care, and the points must be accurate. The operator should observe the bonding process with a microscope to see if there is any disconnection, winding, deviation, cold and hot welding, aluminum lifting, etc. Then immediately notify the management or technical staff. Before the formal production, there must be a first inspection by a special person to check whether there is any fault, lack of state, and missing state. Every 2 hours there should be someone to check its correctness.
5. Plastic closures
Sealing glue mainly applies black glue to PCB boards that are tested OK. When dispensing glue, pay attention to that the black glue should completely cover the PCB sun circle and the aluminum wire of the bonding chip, and there should be no exposure. The black glue should not be sealed out of the sun circle and other places. There is black glue, if there is leakage of glue. Wipe off the cloth strips instantly. During the entire dispensing process, the needle or the wool stick should not touch the DIE and the bonded wire. The surface of the dried vinyl shall be free of pores and uncured vinyl. The height of the black glue should not exceed 1.8MM, and the special requirement should be less than 1.5MM. The temperature of the preheating plate and the drying temperature should be strictly controlled during dispensing. (Zhenqi BE-08 vinyl FR4PCB board as an example: the preheating temperature is 120±15 degrees, the time is 1.5-3.0 minutes, the drying temperature is 140±15 degrees, and the time is 40-60 minutes) The sealing method usually also adopts needle transfer Method and pressure injection method. Some companies also use glue dispensers, but their cost is high and efficiency is low. Usually, cotton swabs and syringes are used for glue, but the operators must have skilled operation ability and strict process requirements. If the chip is damaged, it will be very difficult to repair it. Therefore, this process management personnel and engineering personnel must be strictly controlled.
6. test
In the bonding process, there will be some undesirable phenomena such as wire breakage, wire winding, false soldering, etc., which will cause chip failure, so the chip scale package must be tested for performance
According to the detection method, it can be divided into two categories: non-contact detection (inspection) and contact detection (test). Non-contact detection has developed from manual visual inspection to automatic optical image analysis (AOI) X-ray analysis, from appearance circuit pattern inspection Developed to the quality inspection of inner layer solder joints, and developed from a single inspection to a combination of quality monitoring and defect repair.
Although the bonding machine is equipped with automatic welding wire quality inspection function (BQM), the automatic welding wire quality inspection of the bonding machine mainly adopts two methods of design rule detection (DRC) and pattern recognition. DRC is to check the quality of the welding wire according to some given rules such as how much the melting point is less than the wire diameter or how much greater than some set standards. The pattern recognition method compares the stored digitized image with the actual work. But this is all affected by process control, process regulations, parameter changes, etc. The specific method used should be determined according to the specific conditions of each unit's production line and the product. But no matter what the conditions are, visual inspection is the basic inspection method and one of the contents that COB technicians and inspectors must master. The two should complement each other and cannot replace each other
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Where should the wall clock be hung? What should I pay attention to when using a wall clock?
Where should the wall clock be hung? What should I pay attention to when using a wall clock?
Abstract: The wall clock was first evolved from the tower clock. In the 16th century, the huge volume of tower clock buildings appeared in Europe. Due to the manufacturing technology at that time, the clocks were generally large. With the development of technology, the breakthrough of quartz clock technology in Japan in the mid-20th century and its application in timepieces. Small wall clocks are popular among thousands of households. The wall clock combines time and art, and an art wall clock can reflect the artist's artistic accomplishment and create an artistic atmosphere.
Keywords: Acrylic; Clock; Eco-friendly; manufacturer
Basic structure of the wall clock
1. Front shell (also called front cover): Surface treatment methods include: direct injection of color, painting, plating, coating (also called transfer), hot stamping, etc.
2. Back shell (also called back cover)
3. Battery cover
4. Mirror surface: The material is made of glass (also divided into flat glass and arc glass) and plastic. The wall clock is basically glass, and the table clock is available in two types.
5. Clock face (also called literal): material is paper, PVC (plastic), metal. The scales, words and patterns on it are all screen printed.
6. Clock hands (also called hands): The material is made of plastic and metal. The wall clocks are basically made of metal, and the table clocks are available in two types.
7. Movement (when walking):
1)According to the operation mode of the second hand, it is divided into: the chronograph movement and the sweeping movement (also called the silent movement).
2)Wall-mounted clock movements are divided into: single-time movement (single machine) and music hour-time movement (also called the movement).
The 3 clock movements are divided into: single machine and alarm machine. Among them, the alarm machine is divided into a single-playing movement and an alarm machine with snooze function. The alarm sound of the alarm is divided into a single-segment BB sound and a 4-segment BB sound (that is, a BB sound that is weakly strong).
8. Screw
9.LCD (ie liquid crystal display) components: divided into Chinese and English. There is only one LCD component in a clock, and the general display contents are perpetual calendar (ie, calendar year, month, day, week, Chinese with lunar calendar month, day) and temperature; one LCD has two LCD components, one of which The perpetual calendar is displayed and the other one shows the temperature and humidity.
10. Pendulum movement (auxiliary movement): divided into a swing pendulum movement and a swing movement.
How To Place The Wall Clock
In the traditional Feng Shui theory, some halls and room wall clocks are necessary, especially in the integrated office, and should be linked to the clock. Hanging the clock in such a place can have five major functions. One is to recruit wealth into the treasure, the other is to avoid evil spirits, the third is to help the host fortune, the fourth is to manage the ministry, and the fifth is the most basic function of the clock. This is not to say that you can buy a clock and just find a place to put it, if you hang the wrong place, it will be counterproductive. In general, the front of the clock cannot be inward, and the direction toward the door or balcony is best.
Wall clock considerations
No matter the clock, the wall clock, its hour, minute, and second hand will continue to run. If placed in the living room, there are a few points to pay special attention to:
1, can be placed or hung on the Suzaku side, because the Suzaku side is the front, the front is the mover.
2, can be placed or hung in the Qinglong side, because the Qinglong side is the Kyrgyz side, so the left side of the living room should also put the clock.
3, do not place or hang in the white tiger side, because the white tiger side is a fierce party, so the right side of the living room should not put the clock.
4, do not place or hang in the Xuanwu side, because the Xuanwu side is the rear, should not be moved.
5, the top of the sofa should not hang the clock, otherwise, people who often sit in this position are prone to problems.
6. Place or hang the clock in the bedroom, which is roughly the same as the living room, but the clock cannot be hung at the bedside.
Chongqing Chenghongzhi Import and Export Trade Co., Ltd. is a company of acrylic products manufacturing, which is from China. As is known to all, China is the industry of the whole world, so the price of the products is cheaper than others but with higher quality. Its main products are Acrylic Wall Stickers, Acrylic Wall Clocks, MDF Wall Clocks, Cake Toppers, Metal Posters and Sunrise Alarm Clocks.
Welcome to buy it!
Chongqing Chenghongzhi Import and Export Trade Co., Ltd.
Website:www.preciserclock.com
Email:[email protected]
Whatsapp: +18140232818
Tele: 1732323320
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Semi-automatic Plastic Zipper Closed-end and Open-end Injection Machine (QLQ-SDIM-1)

Semi-automatic Plastic Zipper Closed-end and Open-end Injection Machine (for zipper with/without slider)
Model number : QLQ-SDIM-1
Summary : This machine is with extra brightness LCD display screen, fast speed, accurate control, PID auto learning temperature control system, with good stablity.
PRODUCT DESCRIPTION
Semi-auto Plastic Zipper Closed-end and Open-end Injection Machine(for zipper with/without slider)
MODEL NO.QLQ-SDIM-1
NW (KG) 900
M / C SIZE (M) 1.20*0.80*2.10
AVG OUTPUT 1000-1300 MOULD/H
GW (KG) 1000
PKGS SIZE(M) 1.30*0.90*2.20
VOLTAGE(V) 380V POWER(KW)5.3
PHASE (PH)3
Advantages:
This machine is with extra brightness LCD display screen, fast speed, accurate control, PID auto learning temperature control system, with good stability.
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This Fall, we are counting down the 100 best tracks of the 2000s with a new article every Monday. To learn more about the project and why the 2000s were amazing for music, click here.
After what felt like forever, we finally made it to the end: this week, we present the top 10 positions of the countdown. To listen to every single track listed in our top 100, you can head to the Spotify playlist we created at the bottom of the page.
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10. The Strokes - Hard to Explain
True, it is a little easy and inaccurate to say that The Strokes single-handily saved rock music in 2001. But during the summer of that year, the new band felt like a breath of fresh air, no matter how much they smelled like cigarette. Hard to Explain sounds easier than it is with a metronome-like drum beat and an endless stream of downstrokes. The track keeps moving forwards and forwards until it reaches its climax two minutes in and, just like that, disappears completely. The band then reels it right back and goes for the ride a second time, as exciting as the first. It is the track that rightfully set the expectations rocket high for the band’s first album Is This It and it’s a miracle they managed to reach them.

9. Amy Winehouse - Rehab
If America wasn’t already sold to Amy Winehouse yet by the time Rehab was released, it took only about 30 seconds to get it all hooked. On the biggest single of her cruelly short career, Amy wastes no time belting out the chorus in the opening seconds, backed by soul band the Dap-Kings and immaculate production from Mark Ronson. Don’t get it twisted though; it truly is Amy’s presence at the center stage that infuses the song its magnetism, with her defiant and relentless personality, giving it enough character to live long after she’s gone. With Rehab, Amy Winehouse kicked the door wide open for women to sing their imperfections with sass and break from the picture perfect plastic mold.

8. Radiohead - Idioteque
Radiohead truly became immortals in the 2000s, thanks in no small part to key tracks like Idioteque. After all, only a rock band in full grace mode could ditch its guitars for 1970’s computer music samples and end up with such a compelling piece of music. Thom Yorke’s falsetto, which ranges from delicate to plain manic as the song progresses, clashes with the robotic and cold background provided by a highly compressed drum machine and a Paul Lansky chord progression. The result sounds both like a virtual nightmare Yorke tries to wake up from, and a real dream to IDM-trained ears.

7. Yeah Yeah Yeahs - Maps
As punk as the Yeah Yeah Yeahs were on their début album, no track they would ever release would reach the height of the tender ballad of Maps. Propelled by Nick Zinner’s rapid strum and secret weapon drummer Brian Chase’s thoughtful performance, the Fever To Tell highlight remains a love song for the ages. Meanwhile, Karen O’s feelings can’t help but burst out the iconic track, helped by its iconic “Wait, they don’t love you like I love you” line.

6. Grizzly Bear - Two Weeks
By the end of the decade, indie pop was still interested in bedroom aspirations, making delicate, intimate pieces of music. Grizzly Bear, however, was ready to make the most grandiose track they could with Two Weeks, and it sure feels like they reached both the moon and the stars. Starting with a bouncy piano motif and cartoonish whoa-ohs, Two Weeks builds upon a drum loop that would make Vampire Weekend jealous before crashing into a confetti convention in the chorus. The dizzying layers of synths and celestial backing vocals elevate the track to outer space for the band’s finest hour.

5. The Knife - Heartbeats
In the 2000s, few choruses felt as vital as the one The Knife cranked out on their synthpop masterpiece Heartbeats: “To call for hands from above to lean on/Wouldn’t be good enough/For Me, oh”. What is magical about the track, however, is the way Karin Dreijer Andersson sings. Channelling her inner Björk, she injects a duality of emotions in her delivery as she tiptoes between pure joy and pure nostalgia. Instead of “hands up above” though, she leans on a colourful yet robotic wall of synths and steel drums, one that is trying to rationalize her confused feelings. Heartbeats might not have been exactly a hit when it first came out, but such an ageless track can only win in notoriety through the years.

4. Arcade Fire - Rebellion (Lies)
With its first album Funerals, Arcade Fire launched nothing less than an indie revolution in the mid-2000s. This rings especially true with Rebellion (Lies). The cathartic single is a deep journey to the grandiose. The real tour-de-force here is how natural it sounds; how Win Butler and his friends manage to create such a resonating piece, such an emotionally heavy track without ever sounding fake, forced or cheesy. Instead, the band wears its feelings right on its sleeve with an attitude that would inspire thousands of alternative rock bands for generations to come. Sung from the point of view of a child, Rebellion (Lies) pleas for the listener to stop hiding underneath the covers and to be who they want to be and to dream outside of their bed, an advice that isn’t as naive as it sounds.

3. M.I.A. - Paper Planes
The Clash started as a punk band but quickly incorporated elements of funk, reggae, hip-hop and world music to its core. It is therefore fitting that an artist like rapper M.I.A., one who was born from DIY and punk ethos, would end up sampling a song of them. On Paper Planes, the Londonian celebrates globalization one cash register noise at a time. Migrants, refugees or stoners, there was something for everyone on this global track, even if the visa trouble that inspired the song come from M.I.A.’s very own personal experience. In a decade with so many male rappers using girls as props in their videos while literally calling themselves P.I.M.P. in the process, it is telling that the most essential rap single of the 2000s came from a woman.

2. The Rapture - House Of Jealous Lovers
If you can scream the title of this track and count to 8, you can already sing 90% of House Of Jealous Lovers. The Rapture forms here the tightest rock unit making the nastiest, sweatiest, slickest disco song possible, one that could make CBGB and Studio 54 burn simultaneously. The quintessential dance-punk number gets its power from a groovy bass for the ages, funky drumming, an incisive guitar sound, epileptic vibratos and a stupid amount of cowbell. In the 2000s, there was simply no other song that managed to channel such frenzy as effectively as House Of Jealous Lovers.

1. LCD Soundsystem - All My Friends
Growing old is scary as fuck, which is why our culture is so obsessed with staying young. Pop stars rarely survive long after they reach 30 years old, either because newer stars replace them, either because they literally die before they get old. James Murphy was, therefore, a bit of an oddity when he first came out of the New York scene with his début single Losing My Edge at 32 years old. Sure, his indie dance tales are a little too weird for him to truly become a star; he only got a number one album in the USA on his comeback album in 2017 on an especially slow chart week. But for a generation of well-informed music fans, he was the best-kept secret of the 2000s.
It also helped that, with LCD Soundsystem, Murphy wasn’t especially singing about being young. He preferred to sing about inviting an A-list electronic band to play in his basement, about death or about being the fat guy in a t-shirt doing all the singing. Losing my Edge, in fact, addressed this very situation, exposing a narrator who was starting to lag behind the cool kids, but who wanted to show he was still cooler because he “was there” when it started.
This all leads to All My Friends, without a doubt the greatest single track of the 2000s. Starting with a shivering piano riff, the song builds on as Murphy adds years to his odometer. All My Friends isn’t exactly a party track as much as it’s a song about trying to live the life of the party, about doing everything to get as much from our younger years, surviving the tomorrows and ruining our bodies just trying to fit in and live. Soon, the piano riff becomes drilling, it feels more and more urgent. The rapid-fire hi-hats open more and more often. The guitars and the synths are more and more present, leading to a mid-thirties James Murphy pleading to “see all my friends tonight”. As LCD Soundsystem reformed itself in 2016 after a five-year hiatus, Murphy’s words bear more and more weight, with the idea that each stupid decision, each thrill could be the last. All My Friends is more than a song about the midlife crisis: it touches themes of nostalgia, friendship, growing old and trying to make it work out in the end. And just like a lifestyle of partying, the song never puts the breaks on, drifting at 140 beats per minute before crashing seven minutes and a half later.
In the end, All My Friends is scary. It’s frenetic, it’s wise, but it’s also so brutally honest in its statement and subject matter that it ends up intimidating. In a decade that saw the increase of the influence of the internet, of social media, of phones and of everything else that would make our parents cringe, All My Friends arcs back to the universal idea that you are probably missing out, that you are missing your friends more than you think, that your life is getting empty and that your youth is slipping away. Goddammit, do something with it before it’s too late. Check the charts, figure it out and go out there.
(Note that Jay-Z’s 99 Problems and Primal Scream’s Kill All Hippies are not available on Spotify)
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#sound of awesome#list#top tracks of the 2000s#decade#amy winehouse#radiohead#yeah yeah yeahs#the strokes#grizzly bear#m.i.a.#the rapture#the knife#arcade fire#lcd soundsystem#Estelle
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