#Plastic Injection Machine LCD

[zylcd]

Exploring the Industrial LCD Screen Market: Trends, Growth, and Applications

The global industrial LCD screen market has seen significant growth over the past decade, driven by rapid technological advancements, increased demand for automation, and the rising need for robust display solutions across industrial environments. Unlike consumer-grade displays, industrial LCD screens are built to endure harsh conditions such as extreme temperatures, vibration, dust, and moisture, making them essential in sectors like manufacturing, logistics, energy, and transportation.

Market Growth and Dynamics

Industrial LCDs have become increasingly integral to Human Machine Interface (HMI) systems, control panels, medical devices, and automotive applications. The market is expected to grow steadily, fueled by the rising demand for smart factories, IoT integration, and digital transformation. According to market research reports, the industrial LCD display segment is forecast to reach several billion USD in valuation over the next few years, with Asia-Pacific emerging as a dominant player due to the expansion of manufacturing hubs in China, Japan, and South Korea.

The evolution of LCD technology has led to the development of TFT (Thin-Film Transistor) LCD panels, high-brightness screens, sunlight-readable displays, and touch-enabled modules, all of which are crucial for efficient operation in industrial settings. Industrial LCD modules today offer high resolution, extended lifespan, enhanced readability, and low power consumption.

Vendors are also focusing on developing modular and easily integrated LCD display panels, compatible with various control systems and operating conditions. This has created demand for custom LCD solutions tailored to specific applications, such as wide temperature ranges or waterproof capabilities.

Applications in Key Industries

1. Manufacturing & Automation: Industrial LCDs are widely used in factory automation systems, robotic interfaces, machine control units, and programmable logic controllers (PLCs). These displays help operators monitor data and control machinery in real time.

2. Transportation & Logistics: From railway control panels to warehouse management systems, durable LCD panels ensure real-time visibility and communication, even in rugged or mobile environments.

3. Energy & Utilities: LCD screens are integral to control room monitoring, SCADA systems, and remote diagnostic units across energy and utility infrastructure.

4. Medical & Laboratory Equipment: Medical-grade LCD monitors are used in diagnostic equipment, lab instruments, and patient monitoring systems due to their precision and reliability.

Outlook and Opportunities

With the rise of Industry 4.0, AI-powered monitoring, and cloud-connected HMI, the demand for industrial LCD panels is poised to grow. Manufacturers who offer customizable, high-performance, and reliable displays will be at a competitive advantage.

For more LCD display information,click HERE.

[chinasanshun01]

Introducing SHE378 Fixed Pump Injection Molding Machine, manufactured by China Sanshun. This advanced machine is designed for producing high-quality plastic products, featuring a large color LCD display screen, a convenient hopper sliding arrangement for easy material removal, a durable mold platen, and a shaking ejector for multi-cavity molds.

Contact us now for further information and to inquire about the latest pricing details.

[led-taoyuan]

UV LED Drying Tunnel

The UV curing drying tunnel is a greater existence than the UV curing machine; in general, the UV curing drying tunnel is also called UV curing machine; UV is Ultra-VioletRay, English meaning is ultraviolet, and the common UV wavelength of the industry is between 200 nm-450 nm, using UV to irradiate the needled material to make it hardening the process called "UVCuring process". It is the principle of the UV curing machine with ultraviolet radiation to produce a polymerization. Industrial Comparable UV ultraviolet bands have four bands of UVA, UVB, UVC, and UVV, and the UVA band is now a commonly used industrial. Items that are cured different sizes require different sizes of curing machines. Therefore, the UV curing machine has a lot of type, like a hand style, desktop box style, hanging style, and large curing machine (UV curing drying tunnel). At the same time, the corresponding glue should select the UV cured machine source of the corresponding band, and the UV curing machine needs to consider the source strength, temperature, power, and irradiation time of UV curing machine ultraviolet light. The principle is to use a strong UV high pressure mercury lamp, a UV curing machine made from mature UV light sources. This is a transport UV curing device, widely used in mobile phone case, disc. Thin film switch, electronic plastic housing UV surface painting; various UV coatings, IMD injection molding products ink solidification; for cured electronic components, liquid wafers, terminal enhancement, mobile phone components, bonding, plastic assembly, etc., etc. And LCDs;

[anku000-blog]

Automatic Plastic Zipper Open-end Injection Machine (QLQ-DOIM-1)

Automatic Plastic Zipper Open-end Injection Machine (only for zipper without slider)

Model number : QLQ-DOIM-1

Summary : This machine is with extra brightness LCD display screen, fast speed, accurate control, PID auto learning temperature control system with good stablity.

PRODUCT DESCRIPTION

Automatic Plastic Zipper Open-end Injection Machine (for zipper without slider only)

MODEL NO.QLQ-DOIM-1    

NW (KG)   900    

M/C SIZE(M) 1.20*0.80*2.10

AVG OUTPUT 900-1100 MOULD/H

GW (KG) 1000

PKGS SIZE(M) 1.30*0.90*2.20

VOLTAGE(V)380V

POWER(KW)5.4

PHASE (PH)3

Advantages:

1-This machine is with extra brightness LCD display screen, fast speed, accurate control, PID auto learning temperature control system with good stablity.

2- New stepping motor tape pulling system is used on this machine to solve the tape pulling, and deformed hole punching problem happened in machine with adjustable-speed motor.

[zylcd]

Exploring LCD Screen Technology: Innovation in Modern Display Solutions

In today’s digital era, LCD screen display technology has become an integral part of our everyday lives. From smartphones and tablets to industrial machines and public signage, screens built on LCD technology are everywhere. Known for their clarity, energy efficiency, and versatility, LCD screens continue to evolve to meet the growing demands of both consumer and industrial markets.

LCD (Liquid Crystal Display) screens work by manipulating light through liquid crystals, producing clear and vibrant images with minimal power consumption. Compared to older technologies like CRT, LCD screens are thinner, lighter, and much more energy-efficient. These characteristics make LCD panels ideal for portable electronics and fixed installations alike.

Among the many types of LCDs, TFT LCD (Thin-Film Transistor Liquid Crystal Display) is the most popular. A TFT panel offers faster response times, better image quality, and wider viewing angles. The term display TFT typically refers to a full-color, active matrix display used in applications like car dashboards, industrial control systems, and medical devices.

When discussing advanced displays, the touch screen display is another revolutionary development. With the integration of touch screen panels or touch panels, users can interact directly with the screen using fingers, styluses, or even gloved hands. These are particularly valuable in settings like kiosks, ATMs, factory automation, and point-of-sale systems. A touch screen panel adds both functionality and efficiency, enhancing the user interface and simplifying control systems.

For specialized uses, the transparent LCD display has emerged as a game-changer. These displays allow viewers to see both the displayed content and the objects behind the screen. Transparent LCDs are increasingly being adopted in retail displays, museums, and even smart refrigerators—offering a futuristic, engaging way to present information.

Display LCD modules come in various shapes, sizes, and technologies to meet the requirements of diverse industries. Manufacturers now offer LCD panel options ranging from small wearable screens to large-scale industrial monitors. From 1.44-inch wearables to 65-inch advertising panels, the range is vast and constantly expanding.

Industrial applications demand displays that are not only clear and bright but also rugged and reliable. LCD panel designs for industrial use are built to endure harsh environments, with features like wide temperature ranges, sunlight readability, and anti-glare coatings. These panels are often mounted with touch screen panels to enable interactive control in places like warehouses, production lines, and outdoor kiosks.

As display technology continues to innovate, LCD screen display solutions will become even more intelligent and adaptive. Integration with IoT systems, enhanced connectivity, and AI-based controls are already transforming how we use display LCD modules.

In conclusion, whether you're sourcing for a commercial project or an industrial automation system, LCD, TFT LCD, and touch screen display technologies offer reliable, customizable, and cost-effective solutions. With continuous advancements and wider adoption across industries, the future of LCD panel displays is bright, clear, and interactive.

For more LCD display information,click here.

[chinasanshun01]

Ningbo Sanshun Machinery & Technology CO., LTD provides SHE400 Fixed Pump Injection Moulding Machine for plastic product manufacturing. It features high torque hydraulic motor for the drive of plasticizing screw counter, low pressure mold protection device, high-performance and large color LCD display screen, and control position of the injection device.

Please contact us today for more information and current pricing.

[dmncedm]

ZNC Die Sinking EDM Machine

ZNC electrical discharge machining machine is the traditional type with X and Y axis manual control, usually operator needs to manually move the working table to the location of where to do spark eroding on the workpiece. Z axis is automatically controlled by servo motor, operation of ZNC EDM machine is simple compared to CNC die sinking EDM. Due to the limitation of no control of X and Y axis, ZNC EDM machine can't do simultaneous orbital machining, even use an orbital cutting head, the result of accuracy and surface is not as good as what can achieve on CNC EDM machines. But thinking about the cost of ZNC EDM, it's ideal for the start or jobs without a strict requirement of accuracy and surface finish.

 ZNC350 ZNC Spark Erosion Machine

ZNC430 ZNC Electrical Discharge Machine

ZNC450 Electrical Discharge Machining Machine

ZNC540 Electric Discharge Machining

ZNC600 ZNC EDM Sparking Machine

ZNC860 ZNC Die Sinking EDM With Heavy Load Capacity

ZNC Die Sinking EDM Machine Highlights

  Original Taiwan C-Tek controller, LCD monitor, Industrial Computer Controller.

 High accuracy X, Y, Z three axes C3 grade Taiwan made ball screw.

 Z axis imported Japanese Sanyo servo motor control.

 Three axes DROs of 0.005mm resolution.

 Resin sand casting as machine body and inner stress removed to make sure long-time rigidity and stability.

 Z axis is equipped with a high precision roller guideway with a Japanese SANYO DC servo motor, to make the movement of Z axis more sensitive and smoother.

 The machine has a wide machine base to make sure the machine is strong enough for heavy loading, X. and Y axis have V shape and flat guideway with FEFLON wear-resisting sticker, movement of heavy load is smooth and light, with no crawling phenomenon.

 Working lamp, fire extinguisher and lubrication unit, and patented electrode holder are all Taiwan made.

 ZNC Die Sinking EDM Machine Function Characteristic Introduction of Control System

  More than 20,000 units of programming storage capacity. Normally, more than 20,000 different programmings of mold or customer numbering can be stored

 With a mirror surface processing circuit, a true mirror effect can be performed. Furthermore, it is even better to use orbital processing and powder mixing processing.

 10 segments auto-editing function. ① Manual edit: edit machining condition by experience. ②AUTO Z auto edit: Max. Depths, initial current and finished process, machining area selection are provided, and then machining condition edit can be finished automatically. ③ Intelligent condition edit electrode shape, electrode and workpiece material, workpiece section area and finished precision selection, depth setting area are provided, and then machining condition can be complete at a time by the way of a rough→moderate→fine.

 X, Y, Z-axis coordinate are switch with Metric and English system

 If machining is unstable, the discharging condition is auto-adjusted by modifying discharging efficiency and working time. After that, the condition will restore automatically. And it is also adjustable at any time.

 Auto arcing detecting function, if unsteady caused by arcing occurs, the computer will adjust machining parameters and rise to jump up height, then the normal condition would return.

 If could set that after 2~10 times discharging (jumping up control), the electrode will be raised (safe height Z) to the set arbitrary position and continue machining. This could achieve good slagging off performance for deep hole machining.

 The function of avoiding second discharging and carbon deposition rapid raising or discharging boundary searching rapid rising.

 Power control (equal energy) function for homogenizing machining effect. And this function could be switched off to accelerating graphite electrode machining.

 Generator new design conforms to a power supply box and 15-inch LCD display criterion of European CE safety regulation, which is dustproof, waterproof, electric noise-proof and circuit board life could also be raised.

 Industrial class PC-based controller is applied, and the traditional hard disk is substituted by new DOM type memory, which enables faster and more steadily speeds of file reading and it is more suitable for industry application.

 Up discharging (reverse machining) function makes special machining easier.

 Two independent machining coordinates. The male die and female die could be parted or machined in different coordinates.

 After power off, system restarts and automatically reloads previous machining condition and coordinate of last time, so discharging could be finished by pushing remote control box without panel operation

 Two jumps up to speed type, which serve speed could be raised when no electrode deformation and big area machining efficiency could also be raised.

 Separately storage of coordinate and machining data and same machining condition could be rapidly added in different part machining.

 Two high voltage circuits could be set in partial voltage or partial current according to the customer's need

 Arcing detection setting function could start the carbon deposition hardware detecting circuit, and every charging pulse could be detected and the current will be cut off when an abnormal pulse occurs. So no short circuit is caused by a short circuit

 Discharging high voltage pulse control, which enables the settings of different high voltage pulse types and it could go with machining speed and electrode wear.

  Function Pic ZNC Die Sinking EDM Machine

 Consumable Parts ZNC Die Sinking EDM Machine

  Orbital Cutting Head

100A Generator

  Products

Die Sinker EDM Machine

Windows Platform CNC EDM Machine

Automation CNC EDM Machine

CNC EDM Sinker Machine C Structure A30, A45

Ram Type CNC EDM Machine with Fixed Table

Double Heads Large CNC EDM Machine

General Purpose CNC EDM Machine P40

ZNC Die Sinking EDM Machine

CNC EDM Wire Cut Machine

Small Hole EDM Drilling Machine

High Speed CNC Milling Machine G-600

EDM Parts

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Die Sinking EDM Die Sinking EDM

Sep 21 2020

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Wire Cut EDM Wire Cut EDM

Sep 21 2020

DIE SINKER EDM MACHINE FAQS

The Mostly Asked Questions about Die Sinker EDM Machines

What's EDM die sinking machining (EDM forming machining)?

The EDM die sinker machine is able to cope machining by prepared electrodes, the cavity that created is the same as the profile of the electrode. EDM spark erosion machining can process punches, drawing dies, and extension dies of various types of holes; process various forging dies, extrusion dies, plastic injection molds and extrusion dies; and also process various small holes, deep holes, heterosexual holes, and curved holes,  and special materials with complex-shaped parts, etc.

 Uses of EDM machining technology

(1) Processing various technologies and their alloy materials, conductive super-hard materials (such as polycrystalline diamond, cubic boron nitride, cermets, etc.), special heat-sensitive materials, semiconductor, and non-semiconductor materials.

 (2) Processing various kinds of complex-shaped hole and cavity workpieces, including processing round hole, square hole, polygon hole, special-shaped hole, curved hole, threaded hole, micro hole, deep hole and other type hole workpieces, as well as various types Face cavity workpiece. For example, processing exceptionally large molds and parts ranging from a few micrometers of holes and grooves to several meters.

 (3) Cutting of various workpieces and materials, including cutting of materials, cutting of parts with special structure, cutting of fine narrow slits and parts composed of fine narrow slits (such as metal grid, slow wave structure, heterogeneous orifice spinneret, laser Pieces, etc.).

 (4) Processing all kinds of forming parts such as forming knives, samples, tools, measuring tools, threads and so on.

 (5) Grinding of workpieces, including small holes, deep holes, inner circles, outer circles, flat surfaces, etc. and profile grinding.

 (6) Engrave and print nameplates and marks.

 (7) Surface strengthening and modification, such as high-speed quenching of metal surfaces, nitriding, carburizing, coating of special materials and alloying, etc.

 (8) Auxiliary uses, such as removing taps and drill bits from parts in this segment, repairing worn parts, etc.

 What is the EDM machine meaning in the metal working industry

Electrical spark erosion, also known as electrical discharge machining and electrical corrosion machining, called electrical discharge machining in Japan and electrical corrosion machining in the former Soviet Union. It is a method of processing the metal workpiece by utilizing the phenomenon of electric corrosion generated during the pulse discharge between the two poles (electrode and workpiece, should be conductive). Academically it belongs to the category of electrophysical processing. EDM technology is one of the most important parts of special machining technology.

 What is the advantage of electrical discharging machining against traditional metal working method?

Answer: With the development of industrial production and the advancement of science and technology, more and more new materials with a high melting point, high hardness, high strength, high brittleness, high viscosity, high toughness, high purity and other properties continue to appear, and also some with various complex structures that can’t be machined by traditional metal working method, sometimes difficult or impossible to process. With traditional metal working technology.

 Therefore, in addition to further development and improvement of traditional mechanical metal working methods, people also strive to find new processing methods. The electrical discharging machining (EDM) method can meet the needs of development, and shows many excellent performances in the application, so it has been rapidly developed and increasingly widely used.

 Characteristics of EDM die sinking machining

(1). During machining, the tool electrode and the workpiece material are not actually touching and there is basically no macro-mechanical force between the two. Therefore, the "soft" tool electrode can be used to process the "hard" workpiece. For example, graphite and copper electrodes can process hardened steel, cemented carbide, and even diamond.

 (2). Because the spark energy density of the high-frequency power discharging can be accurately controlled, and there is no macro mechanical force between the two poles (electrode and workpiece), so the precise and fine machining can be achieved. Such as the processing of narrow slits, narrow grooves, micro-small holes of molds and parts, the processing accuracy can reach micron level, even sub-micron level.

 (3) "Copying". With direct use of electrical power for processing, it is easy to realize the automation, intelligence, and application of modern computer control technology to precisely control the machining process, which makes the machining of workpieces more realistic.

 (4) Direct use of electrical energy for processing, which is convenient for automation of the machining process, and can reduce mechanical processing procedures, shorten processing steps, low labor intensity, and easy to use and maintain

https://www.dmncedm.com/products/znc-die-sinking-edm-machine/

[printingproducts0318]

Detailed introduction of the process flow of COB LCD module assembly

The process flow of COB LCD module assembly can be simply expressed as: cleaning the PCB---dropping adhesive---chip sticking---testing---sealing glue and heating curing---testing---stocking. Let's talk about each step in detail below.

1. Clean the PCB

The cleaned PCB board still has oily dirt or oxide layer and other dirty parts. Use a skin wipe to test the positioning or test the needle position to wipe the PCB board with a brush or blow it with an air gun before flowing into the next process. For products with strict anti-static properties, use an ion blower. The purpose of cleaning is to remove the dust and oil on the PCB board bonding pads to improve the quality of bonding.

2. Adhesive glue

The purpose of the adhesive glue is to prevent the DIE from falling off during the transfer and bonding process of the product

Needle transfer and pressure injection are usually used in the COB process

Needle transfer method: Use a needle to take a small drop of adhesive from the container and apply it on the PCB. This is a very fast dispensing method

Pressure injection method: Put the glue into the syringe, apply a certain air pressure to squeeze the glue out. The size of the glue point is determined by the nozzle diameter of the syringe and the pressure time and pressure and is related to the viscosity. This process is generally used in dripping machines or DIE BOND automatic equipment

The size and height of the glue drop depends on the type, size, distance from the PAD position, and weight of the chip (DIE). The size and weight of the chip is larger, and the amount of glue drop should not be too large to ensure sufficient viscosity. At the same time, the bonding glue cannot pollute the bonding pad. If there is a certain standard, it can only be determined by different products. If you insist that the height of the chip cannot exceed 1/3 of the height and the amount of glue cannot be exposed as the standard, this is not necessary.

3. Chip paste

Chip pasting is also called DIE BOND (solid crystal) sticking DIE Bang DIE Bang IC and other companies have different names. In chip sticking, the hardness of the vacuum suction pen (suction nozzle) is required to be small (some companies also use cotton swabs for sticking). The diameter of the suction nozzle depends on the size of the chip, and the tip of the nozzle must be flat to avoid scratching the surface of the DIE. When pasting, check the DIE and PCB model and whether the pasting direction is correct. The DIE towel to the PCB must be "smooth and upright". "Flat" means that the DIE and the PCB are parallel and close to each other. "Stable" means that the DIE and the PCB are in the whole In the process, it is not easy to fall off. "Positive" means that the DIE and the reserved position of the PCB are attached to the front and cannot be twisted. It must be noted that the direction of the chip (DIE) must not be reversed.

4. Bond wire (wire bonding)

Bond wire (wire bonding) Wire Bond Bonding The connection name is different. Here is bonding as an example

Bonding connects the two solder joints of each state line according to the position determined by the BONDING diagram to achieve electrical and mechanical connection. Bonding PCB requires its tensile strength to meet the company's standard (reference 1.0 line greater than or equal to 3.5G and 1.25 line greater than or equal to 4.5G) when bonding the PCB for bonding tensile test, the shape of the aluminum wire solder joint is oval, and the shape of the gold wire solder joint is spherical.

Bonding melting point standard

Aluminum wire:

The wire tail is greater than or equal to 0.3 times the wire diameter and less than or equal to 1.5 times the wire diameter

The length of the solder joint is greater than or equal to 1.5 times the wire diameter and less than or equal to 5.0 times the wire diameter

The width of the solder joint is greater than or equal to 1.2 times the wire diameter and less than or equal to 3.0 times the wire diameter

The height of the arc is equal to the height of the parabola of the circle (not too high or too low, depending on the product)

Gold Line:

Solder balls are generally about 2.6-2.7 times the wire diameter

During the bonding process, handle with care, and the points must be accurate. The operator should observe the bonding process with a microscope to see if there is any disconnection, winding, deviation, cold and hot welding, aluminum lifting, etc. Then immediately notify the management or technical staff. Before the formal production, there must be a first inspection by a special person to check whether there is any fault, lack of state, and missing state. Every 2 hours there should be someone to check its correctness.

5. Plastic closures

Sealing glue mainly applies black glue to PCB boards that are tested OK. When dispensing glue, pay attention to that the black glue should completely cover the PCB sun circle and the aluminum wire of the bonding chip, and there should be no exposure. The black glue should not be sealed out of the sun circle and other places. There is black glue, if there is leakage of glue. Wipe off the cloth strips instantly. During the entire dispensing process, the needle or the wool stick should not touch the DIE and the bonded wire. The surface of the dried vinyl shall be free of pores and uncured vinyl. The height of the black glue should not exceed 1.8MM, and the special requirement should be less than 1.5MM. The temperature of the preheating plate and the drying temperature should be strictly controlled during dispensing. (Zhenqi BE-08 vinyl FR4PCB board as an example: the preheating temperature is 120±15 degrees, the time is 1.5-3.0 minutes, the drying temperature is 140±15 degrees, and the time is 40-60 minutes) The sealing method usually also adopts needle transfer Method and pressure injection method. Some companies also use glue dispensers, but their cost is high and efficiency is low. Usually, cotton swabs and syringes are used for glue, but the operators must have skilled operation ability and strict process requirements. If the chip is damaged, it will be very difficult to repair it. Therefore, this process management personnel and engineering personnel must be strictly controlled.

6. test

In the bonding process, there will be some undesirable phenomena such as wire breakage, wire winding, false soldering, etc., which will cause chip failure, so the chip scale package must be tested for performance

According to the detection method, it can be divided into two categories: non-contact detection (inspection) and contact detection (test). Non-contact detection has developed from manual visual inspection to automatic optical image analysis (AOI) X-ray analysis, from appearance circuit pattern inspection Developed to the quality inspection of inner layer solder joints, and developed from a single inspection to a combination of quality monitoring and defect repair.

Although the bonding machine is equipped with automatic welding wire quality inspection function (BQM), the automatic welding wire quality inspection of the bonding machine mainly adopts two methods of design rule detection (DRC) and pattern recognition. DRC is to check the quality of the welding wire according to some given rules such as how much the melting point is less than the wire diameter or how much greater than some set standards. The pattern recognition method compares the stored digitized image with the actual work. But this is all affected by process control, process regulations, parameter changes, etc. The specific method used should be determined according to the specific conditions of each unit's production line and the product. But no matter what the conditions are, visual inspection is the basic inspection method and one of the contents that COB technicians and inspectors must master. The two should complement each other and cannot replace each other

[littlecat0520]

Detailed introduction of the process flow of COB LCD module assembly

The process flow of COB LCD module assembly can be simply expressed as: cleaning the PCB---dropping adhesive---chip sticking---testing---sealing glue and heating curing---testing---stocking. Let's talk about each step in detail below.

1. Clean the PCB

The cleaned PCB board still has oily dirt or oxide layer and other dirty parts. Use a skin wipe to test the positioning or test the needle position to wipe the PCB board with a brush or blow it with an air gun before flowing into the next process. For products with strict anti-static properties, use an ion blower. The purpose of cleaning is to remove the dust and oil on the PCB board bonding pads to improve the quality of bonding.

2. Adhesive glue

The purpose of the adhesive glue is to prevent the DIE from falling off during the transfer and bonding process of the product

Needle transfer and pressure injection are usually used in the COB process

Needle transfer method: Use a needle to take a small drop of adhesive from the container and apply it on the PCB. This is a very fast dispensing method

Pressure injection method: Put the glue into the syringe, apply a certain air pressure to squeeze the glue out. The size of the glue point is determined by the nozzle diameter of the syringe and the pressure time and pressure and is related to the viscosity. This process is generally used in dripping machines or DIE BOND automatic equipment

The size and height of the glue drop depends on the type, size, distance from the PAD position, and weight of the chip (DIE). The size and weight of the chip is larger, and the amount of glue drop should not be too large to ensure sufficient viscosity. At the same time, the bonding glue cannot pollute the bonding pad. If there is a certain standard, it can only be determined by different products. If you insist that the height of the chip cannot exceed 1/3 of the height and the amount of glue cannot be exposed as the standard, this is not necessary.

3. Chip paste

Chip pasting is also called DIE BOND (solid crystal) sticking DIE Bang DIE Bang IC and other companies have different names. In chip sticking, the hardness of the vacuum suction pen (suction nozzle) is required to be small (some companies also use cotton swabs for sticking). The diameter of the suction nozzle depends on the size of the chip, and the tip of the nozzle must be flat to avoid scratching the surface of the DIE. When pasting, check the DIE and PCB model and whether the pasting direction is correct. The DIE towel to the PCB must be "smooth and upright". "Flat" means that the DIE and the PCB are parallel and close to each other. "Stable" means that the DIE and the PCB are in the whole In the process, it is not easy to fall off. "Positive" means that the DIE and the reserved position of the PCB are attached to the front and cannot be twisted. It must be noted that the direction of the chip (DIE) must not be reversed.

4. Bond wire (wire bonding)

Bond wire (wire bonding) Wire Bond Bonding The connection name is different. Here is bonding as an example

Bonding connects the two solder joints of each state line according to the position determined by the BONDING diagram to achieve electrical and mechanical connection. Bonding PCB requires its tensile strength to meet the company's standard (reference 1.0 line greater than or equal to 3.5G and 1.25 line greater than or equal to 4.5G) when bonding the PCB for bonding tensile test, the shape of the aluminum wire solder joint is oval, and the shape of the gold wire solder joint is spherical.

Bonding melting point standard

Aluminum wire:

The wire tail is greater than or equal to 0.3 times the wire diameter and less than or equal to 1.5 times the wire diameter

The length of the solder joint is greater than or equal to 1.5 times the wire diameter and less than or equal to 5.0 times the wire diameter

The width of the solder joint is greater than or equal to 1.2 times the wire diameter and less than or equal to 3.0 times the wire diameter

The height of the arc is equal to the height of the parabola of the circle (not too high or too low, depending on the product)

Gold Line:

Solder balls are generally about 2.6-2.7 times the wire diameter

During the bonding process, handle with care, and the points must be accurate. The operator should observe the bonding process with a microscope to see if there is any disconnection, winding, deviation, cold and hot welding, aluminum lifting, etc. Then immediately notify the management or technical staff. Before the formal production, there must be a first inspection by a special person to check whether there is any fault, lack of state, and missing state. Every 2 hours there should be someone to check its correctness.

5. Plastic closures

Sealing glue mainly applies black glue to PCB boards that are tested OK. When dispensing glue, pay attention to that the black glue should completely cover the PCB sun circle and the aluminum wire of the bonding chip, and there should be no exposure. The black glue should not be sealed out of the sun circle and other places. There is black glue, if there is leakage of glue. Wipe off the cloth strips instantly. During the entire dispensing process, the needle or the wool stick should not touch the DIE and the bonded wire. The surface of the dried vinyl shall be free of pores and uncured vinyl. The height of the black glue should not exceed 1.8MM, and the special requirement should be less than 1.5MM. The temperature of the preheating plate and the drying temperature should be strictly controlled during dispensing. (Zhenqi BE-08 vinyl FR4PCB board as an example: the preheating temperature is 120±15 degrees, the time is 1.5-3.0 minutes, the drying temperature is 140±15 degrees, and the time is 40-60 minutes) The sealing method usually also adopts needle transfer Method and pressure injection method. Some companies also use glue dispensers, but their cost is high and efficiency is low. Usually, cotton swabs and syringes are used for glue, but the operators must have skilled operation ability and strict process requirements. If the chip is damaged, it will be very difficult to repair it. Therefore, this process management personnel and engineering personnel must be strictly controlled.

6. test

In the bonding process, there will be some undesirable phenomena such as wire breakage, wire winding, false soldering, etc., which will cause chip failure, so the chip scale package must be tested for performance

According to the detection method, it can be divided into two categories: non-contact detection (inspection) and contact detection (test). Non-contact detection has developed from manual visual inspection to automatic optical image analysis (AOI) X-ray analysis, from appearance circuit pattern inspection Developed to the quality inspection of inner layer solder joints, and developed from a single inspection to a combination of quality monitoring and defect repair.

Although the bonding machine is equipped with automatic welding wire quality inspection function (BQM), the automatic welding wire quality inspection of the bonding machine mainly adopts two methods of design rule detection (DRC) and pattern recognition. DRC is to check the quality of the welding wire according to some given rules such as how much the melting point is less than the wire diameter or how much greater than some set standards. The pattern recognition method compares the stored digitized image with the actual work. But this is all affected by process control, process regulations, parameter changes, etc. The specific method used should be determined according to the specific conditions of each unit's production line and the product. But no matter what the conditions are, visual inspection is the basic inspection method and one of the contents that COB technicians and inspectors must master. The two should complement each other and cannot replace each other

[paper1125]

Detailed introduction of the process flow of COB LCD module assembly

The process flow of COB LCD module assembly can be simply expressed as: cleaning the PCB---dropping adhesive---chip sticking---testing---sealing glue and heating curing---testing---stocking. Let's talk about each step in detail below.

1. Clean the PCB

The cleaned PCB board still has oily dirt or oxide layer and other dirty parts. Use a skin wipe to test the positioning or test the needle position to wipe the PCB board with a brush or blow it with an air gun before flowing into the next process. For products with strict anti-static properties, use an ion blower. The purpose of cleaning is to remove the dust and oil on the PCB board bonding pads to improve the quality of bonding.

2. Adhesive glue

The purpose of the adhesive glue is to prevent the DIE from falling off during the transfer and bonding process of the product

Needle transfer and pressure injection are usually used in the COB process

Needle transfer method: Use a needle to take a small drop of adhesive from the container and apply it on the PCB. This is a very fast dispensing method

Pressure injection method: Put the glue into the syringe, apply a certain air pressure to squeeze the glue out. The size of the glue point is determined by the nozzle diameter of the syringe and the pressure time and pressure and is related to the viscosity. This process is generally used in dripping machines or DIE BOND automatic equipment

The size and height of the glue drop depends on the type, size, distance from the PAD position, and weight of the chip (DIE). The size and weight of the chip is larger, and the amount of glue drop should not be too large to ensure sufficient viscosity. At the same time, the bonding glue cannot pollute the bonding pad. If there is a certain standard, it can only be determined by different products. If you insist that the height of the chip cannot exceed 1/3 of the height and the amount of glue cannot be exposed as the standard, this is not necessary.

3. Chip paste

Chip pasting is also called DIE BOND (solid crystal) sticking DIE Bang DIE Bang IC and other companies have different names. In chip sticking, the hardness of the vacuum suction pen (suction nozzle) is required to be small (some companies also use cotton swabs for sticking). The diameter of the suction nozzle depends on the size of the chip, and the tip of the nozzle must be flat to avoid scratching the surface of the DIE. When pasting, check the DIE and PCB model and whether the pasting direction is correct. The DIE towel to the PCB must be "smooth and upright". "Flat" means that the DIE and the PCB are parallel and close to each other. "Stable" means that the DIE and the PCB are in the whole In the process, it is not easy to fall off. "Positive" means that the DIE and the reserved position of the PCB are attached to the front and cannot be twisted. It must be noted that the direction of the chip (DIE) must not be reversed.

4. Bond wire (wire bonding)

Bond wire (wire bonding) Wire Bond Bonding The connection name is different. Here is bonding as an example

Bonding connects the two solder joints of each state line according to the position determined by the BONDING diagram to achieve electrical and mechanical connection. Bonding PCB requires its tensile strength to meet the company's standard (reference 1.0 line greater than or equal to 3.5G and 1.25 line greater than or equal to 4.5G) when bonding the PCB for bonding tensile test, the shape of the aluminum wire solder joint is oval, and the shape of the gold wire solder joint is spherical.

Bonding melting point standard

Aluminum wire:

The wire tail is greater than or equal to 0.3 times the wire diameter and less than or equal to 1.5 times the wire diameter

The length of the solder joint is greater than or equal to 1.5 times the wire diameter and less than or equal to 5.0 times the wire diameter

The width of the solder joint is greater than or equal to 1.2 times the wire diameter and less than or equal to 3.0 times the wire diameter

The height of the arc is equal to the height of the parabola of the circle (not too high or too low, depending on the product)

Gold Line:

Solder balls are generally about 2.6-2.7 times the wire diameter

During the bonding process, handle with care, and the points must be accurate. The operator should observe the bonding process with a microscope to see if there is any disconnection, winding, deviation, cold and hot welding, aluminum lifting, etc. Then immediately notify the management or technical staff. Before the formal production, there must be a first inspection by a special person to check whether there is any fault, lack of state, and missing state. Every 2 hours there should be someone to check its correctness.

5. Plastic closures

Sealing glue mainly applies black glue to PCB boards that are tested OK. When dispensing glue, pay attention to that the black glue should completely cover the PCB sun circle and the aluminum wire of the bonding chip, and there should be no exposure. The black glue should not be sealed out of the sun circle and other places. There is black glue, if there is leakage of glue. Wipe off the cloth strips instantly. During the entire dispensing process, the needle or the wool stick should not touch the DIE and the bonded wire. The surface of the dried vinyl shall be free of pores and uncured vinyl. The height of the black glue should not exceed 1.8MM, and the special requirement should be less than 1.5MM. The temperature of the preheating plate and the drying temperature should be strictly controlled during dispensing. (Zhenqi BE-08 vinyl FR4PCB board as an example: the preheating temperature is 120±15 degrees, the time is 1.5-3.0 minutes, the drying temperature is 140±15 degrees, and the time is 40-60 minutes) The sealing method usually also adopts needle transfer Method and pressure injection method. Some companies also use glue dispensers, but their cost is high and efficiency is low. Usually, cotton swabs and syringes are used for glue, but the operators must have skilled operation ability and strict process requirements. If the chip is damaged, it will be very difficult to repair it. Therefore, this process management personnel and engineering personnel must be strictly controlled.

6. test

In the bonding process, there will be some undesirable phenomena such as wire breakage, wire winding, false soldering, etc., which will cause chip failure, so the chip scale package must be tested for performance

According to the detection method, it can be divided into two categories: non-contact detection (inspection) and contact detection (test). Non-contact detection has developed from manual visual inspection to automatic optical image analysis (AOI) X-ray analysis, from appearance circuit pattern inspection Developed to the quality inspection of inner layer solder joints, and developed from a single inspection to a combination of quality monitoring and defect repair.

Although the bonding machine is equipped with automatic welding wire quality inspection function (BQM), the automatic welding wire quality inspection of the bonding machine mainly adopts two methods of design rule detection (DRC) and pattern recognition. DRC is to check the quality of the welding wire according to some given rules such as how much the melting point is less than the wire diameter or how much greater than some set standards. The pattern recognition method compares the stored digitized image with the actual work. But this is all affected by process control, process regulations, parameter changes, etc. The specific method used should be determined according to the specific conditions of each unit's production line and the product. But no matter what the conditions are, visual inspection is the basic inspection method and one of the contents that COB technicians and inspectors must master. The two should complement each other and cannot replace each other

[cat0620]

Detailed introduction of the process flow of COB LCD module assembly

The process flow of COB LCD module assembly can be simply expressed as: cleaning the PCB---dropping adhesive---chip sticking---testing---sealing glue and heating curing---testing---stocking. Let's talk about each step in detail below.

1. Clean the PCB

The cleaned PCB board still has oily dirt or oxide layer and other dirty parts. Use a skin wipe to test the positioning or test the needle position to wipe the PCB board with a brush or blow it with an air gun before flowing into the next process. For products with strict anti-static properties, use an ion blower. The purpose of cleaning is to remove the dust and oil on the PCB board bonding pads to improve the quality of bonding.

2. Adhesive glue

The purpose of the adhesive glue is to prevent the DIE from falling off during the transfer and bonding process of the product

Needle transfer and pressure injection are usually used in the COB process

Needle transfer method: Use a needle to take a small drop of adhesive from the container and apply it on the PCB. This is a very fast dispensing method

Pressure injection method: Put the glue into the syringe, apply a certain air pressure to squeeze the glue out. The size of the glue point is determined by the nozzle diameter of the syringe and the pressure time and pressure and is related to the viscosity. This process is generally used in dripping machines or DIE BOND automatic equipment

The size and height of the glue drop depends on the type, size, distance from the PAD position, and weight of the chip (DIE). The size and weight of the chip is larger, and the amount of glue drop should not be too large to ensure sufficient viscosity. At the same time, the bonding glue cannot pollute the bonding pad. If there is a certain standard, it can only be determined by different products. If you insist that the height of the chip cannot exceed 1/3 of the height and the amount of glue cannot be exposed as the standard, this is not necessary.

3. Chip paste

Chip pasting is also called DIE BOND (solid crystal) sticking DIE Bang DIE Bang IC and other companies have different names. In chip sticking, the hardness of the vacuum suction pen (suction nozzle) is required to be small (some companies also use cotton swabs for sticking). The diameter of the suction nozzle depends on the size of the chip, and the tip of the nozzle must be flat to avoid scratching the surface of the DIE. When pasting, check the DIE and PCB model and whether the pasting direction is correct. The DIE towel to the PCB must be "smooth and upright". "Flat" means that the DIE and the PCB are parallel and close to each other. "Stable" means that the DIE and the PCB are in the whole In the process, it is not easy to fall off. "Positive" means that the DIE and the reserved position of the PCB are attached to the front and cannot be twisted. It must be noted that the direction of the chip (DIE) must not be reversed.

4. Bond wire (wire bonding)

Bond wire (wire bonding) Wire Bond Bonding The connection name is different. Here is bonding as an example

Bonding connects the two solder joints of each state line according to the position determined by the BONDING diagram to achieve electrical and mechanical connection. Bonding PCB requires its tensile strength to meet the company's standard (reference 1.0 line greater than or equal to 3.5G and 1.25 line greater than or equal to 4.5G) when bonding the PCB for bonding tensile test, the shape of the aluminum wire solder joint is oval, and the shape of the gold wire solder joint is spherical.

Bonding melting point standard

Aluminum wire:

The wire tail is greater than or equal to 0.3 times the wire diameter and less than or equal to 1.5 times the wire diameter

The length of the solder joint is greater than or equal to 1.5 times the wire diameter and less than or equal to 5.0 times the wire diameter

The width of the solder joint is greater than or equal to 1.2 times the wire diameter and less than or equal to 3.0 times the wire diameter

The height of the arc is equal to the height of the parabola of the circle (not too high or too low, depending on the product)

Gold Line:

Solder balls are generally about 2.6-2.7 times the wire diameter

During the bonding process, handle with care, and the points must be accurate. The operator should observe the bonding process with a microscope to see if there is any disconnection, winding, deviation, cold and hot welding, aluminum lifting, etc. Then immediately notify the management or technical staff. Before the formal production, there must be a first inspection by a special person to check whether there is any fault, lack of state, and missing state. Every 2 hours there should be someone to check its correctness.

5. Plastic closures

Sealing glue mainly applies black glue to PCB boards that are tested OK. When dispensing glue, pay attention to that the black glue should completely cover the PCB sun circle and the aluminum wire of the bonding chip, and there should be no exposure. The black glue should not be sealed out of the sun circle and other places. There is black glue, if there is leakage of glue. Wipe off the cloth strips instantly. During the entire dispensing process, the needle or the wool stick should not touch the DIE and the bonded wire. The surface of the dried vinyl shall be free of pores and uncured vinyl. The height of the black glue should not exceed 1.8MM, and the special requirement should be less than 1.5MM. The temperature of the preheating plate and the drying temperature should be strictly controlled during dispensing. (Zhenqi BE-08 vinyl FR4PCB board as an example: the preheating temperature is 120±15 degrees, the time is 1.5-3.0 minutes, the drying temperature is 140±15 degrees, and the time is 40-60 minutes) The sealing method usually also adopts needle transfer Method and pressure injection method. Some companies also use glue dispensers, but their cost is high and efficiency is low. Usually, cotton swabs and syringes are used for glue, but the operators must have skilled operation ability and strict process requirements. If the chip is damaged, it will be very difficult to repair it. Therefore, this process management personnel and engineering personnel must be strictly controlled.

6. test

In the bonding process, there will be some undesirable phenomena such as wire breakage, wire winding, false soldering, etc., which will cause chip failure, so the chip scale package must be tested for performance

According to the detection method, it can be divided into two categories: non-contact detection (inspection) and contact detection (test). Non-contact detection has developed from manual visual inspection to automatic optical image analysis (AOI) X-ray analysis, from appearance circuit pattern inspection Developed to the quality inspection of inner layer solder joints, and developed from a single inspection to a combination of quality monitoring and defect repair.

Although the bonding machine is equipped with automatic welding wire quality inspection function (BQM), the automatic welding wire quality inspection of the bonding machine mainly adopts two methods of design rule detection (DRC) and pattern recognition. DRC is to check the quality of the welding wire according to some given rules such as how much the melting point is less than the wire diameter or how much greater than some set standards. The pattern recognition method compares the stored digitized image with the actual work. But this is all affected by process control, process regulations, parameter changes, etc. The specific method used should be determined according to the specific conditions of each unit's production line and the product. But no matter what the conditions are, visual inspection is the basic inspection method and one of the contents that COB technicians and inspectors must master. The two should complement each other and cannot replace each other

[sere22world]

Detailed introduction of the process flow of COB LCD module assembly

The process flow of COB LCD module assembly can be simply expressed as: cleaning the PCB---dropping adhesive---chip sticking---testing---sealing glue and heating curing---testing---stocking. Let's talk about each step in detail below.

1. Clean the PCB

The cleaned PCB board still has oily dirt or oxide layer and other dirty parts. Use a skin wipe to test the positioning or test the needle position to wipe the PCB board with a brush or blow it with an air gun before flowing into the next process. For products with strict anti-static properties, use an ion blower. The purpose of cleaning is to remove the dust and oil on the PCB board bonding pads to improve the quality of bonding.

2. Adhesive glue

The purpose of the adhesive glue is to prevent the DIE from falling off during the transfer and bonding process of the product

Needle transfer and pressure injection are usually used in the COB process

Needle transfer method: Use a needle to take a small drop of adhesive from the container and apply it on the PCB. This is a very fast dispensing method

Pressure injection method: Put the glue into the syringe, apply a certain air pressure to squeeze the glue out. The size of the glue point is determined by the nozzle diameter of the syringe and the pressure time and pressure and is related to the viscosity. This process is generally used in dripping machines or DIE BOND automatic equipment

The size and height of the glue drop depends on the type, size, distance from the PAD position, and weight of the chip (DIE). The size and weight of the chip is larger, and the amount of glue drop should not be too large to ensure sufficient viscosity. At the same time, the bonding glue cannot pollute the bonding pad. If there is a certain standard, it can only be determined by different products. If you insist that the height of the chip cannot exceed 1/3 of the height and the amount of glue cannot be exposed as the standard, this is not necessary.

3. Chip paste

Chip pasting is also called DIE BOND (solid crystal) sticking DIE Bang DIE Bang IC and other companies have different names. In chip sticking, the hardness of the vacuum suction pen (suction nozzle) is required to be small (some companies also use cotton swabs for sticking). The diameter of the suction nozzle depends on the size of the chip, and the tip of the nozzle must be flat to avoid scratching the surface of the DIE. When pasting, check the DIE and PCB model and whether the pasting direction is correct. The DIE towel to the PCB must be "smooth and upright". "Flat" means that the DIE and the PCB are parallel and close to each other. "Stable" means that the DIE and the PCB are in the whole In the process, it is not easy to fall off. "Positive" means that the DIE and the reserved position of the PCB are attached to the front and cannot be twisted. It must be noted that the direction of the chip (DIE) must not be reversed.

4. Bond wire (wire bonding)

Bond wire (wire bonding) Wire Bond Bonding The connection name is different. Here is bonding as an example

Bonding connects the two solder joints of each state line according to the position determined by the BONDING diagram to achieve electrical and mechanical connection. Bonding PCB requires its tensile strength to meet the company's standard (reference 1.0 line greater than or equal to 3.5G and 1.25 line greater than or equal to 4.5G) when bonding the PCB for bonding tensile test, the shape of the aluminum wire solder joint is oval, and the shape of the gold wire solder joint is spherical.

Bonding melting point standard

Aluminum wire:

The wire tail is greater than or equal to 0.3 times the wire diameter and less than or equal to 1.5 times the wire diameter

The length of the solder joint is greater than or equal to 1.5 times the wire diameter and less than or equal to 5.0 times the wire diameter

The width of the solder joint is greater than or equal to 1.2 times the wire diameter and less than or equal to 3.0 times the wire diameter

The height of the arc is equal to the height of the parabola of the circle (not too high or too low, depending on the product)

Gold Line:

Solder balls are generally about 2.6-2.7 times the wire diameter

During the bonding process, handle with care, and the points must be accurate. The operator should observe the bonding process with a microscope to see if there is any disconnection, winding, deviation, cold and hot welding, aluminum lifting, etc. Then immediately notify the management or technical staff. Before the formal production, there must be a first inspection by a special person to check whether there is any fault, lack of state, and missing state. Every 2 hours there should be someone to check its correctness.

5. Plastic closures

Sealing glue mainly applies black glue to PCB boards that are tested OK. When dispensing glue, pay attention to that the black glue should completely cover the PCB sun circle and the aluminum wire of the bonding chip, and there should be no exposure. The black glue should not be sealed out of the sun circle and other places. There is black glue, if there is leakage of glue. Wipe off the cloth strips instantly. During the entire dispensing process, the needle or the wool stick should not touch the DIE and the bonded wire. The surface of the dried vinyl shall be free of pores and uncured vinyl. The height of the black glue should not exceed 1.8MM, and the special requirement should be less than 1.5MM. The temperature of the preheating plate and the drying temperature should be strictly controlled during dispensing. (Zhenqi BE-08 vinyl FR4PCB board as an example: the preheating temperature is 120±15 degrees, the time is 1.5-3.0 minutes, the drying temperature is 140±15 degrees, and the time is 40-60 minutes) The sealing method usually also adopts needle transfer Method and pressure injection method. Some companies also use glue dispensers, but their cost is high and efficiency is low. Usually, cotton swabs and syringes are used for glue, but the operators must have skilled operation ability and strict process requirements. If the chip is damaged, it will be very difficult to repair it. Therefore, this process management personnel and engineering personnel must be strictly controlled.

6. test

In the bonding process, there will be some undesirable phenomena such as wire breakage, wire winding, false soldering, etc., which will cause chip failure, so the chip scale package must be tested for performance

According to the detection method, it can be divided into two categories: non-contact detection (inspection) and contact detection (test). Non-contact detection has developed from manual visual inspection to automatic optical image analysis (AOI) X-ray analysis, from appearance circuit pattern inspection Developed to the quality inspection of inner layer solder joints, and developed from a single inspection to a combination of quality monitoring and defect repair.

Although the bonding machine is equipped with automatic welding wire quality inspection function (BQM), the automatic welding wire quality inspection of the bonding machine mainly adopts two methods of design rule detection (DRC) and pattern recognition. DRC is to check the quality of the welding wire according to some given rules such as how much the melting point is less than the wire diameter or how much greater than some set standards. The pattern recognition method compares the stored digitized image with the actual work. But this is all affected by process control, process regulations, parameter changes, etc. The specific method used should be determined according to the specific conditions of each unit's production line and the product. But no matter what the conditions are, visual inspection is the basic inspection method and one of the contents that COB technicians and inspectors must master. The two should complement each other and cannot replace each other

[super-summer-ren-blog]

Where should the wall clock be hung? What should I pay attention to when using a wall clock?

Where should the wall clock be hung? What should I pay attention to when using a wall clock?

Abstract: The wall clock was first evolved from the tower clock. In the 16th century, the huge volume of tower clock buildings appeared in Europe. Due to the manufacturing technology at that time, the clocks were generally large. With the development of technology, the breakthrough of quartz clock technology in Japan in the mid-20th century and its application in timepieces. Small wall clocks are popular among thousands of households. The wall clock combines time and art, and an art wall clock can reflect the artist's artistic accomplishment and create an artistic atmosphere.

Keywords: Acrylic; Clock; Eco-friendly; manufacturer

Basic structure of the wall clock

1. Front shell (also called front cover): Surface treatment methods include: direct injection of color, painting, plating, coating (also called transfer), hot stamping, etc.

2. Back shell (also called back cover)

3. Battery cover

4. Mirror surface: The material is made of glass (also divided into flat glass and arc glass) and plastic. The wall clock is basically glass, and the table clock is available in two types.

5. Clock face (also called literal): material is paper, PVC (plastic), metal. The scales, words and patterns on it are all screen printed.

6. Clock hands (also called hands): The material is made of plastic and metal. The wall clocks are basically made of metal, and the table clocks are available in two types.

7. Movement (when walking):

1)According to the operation mode of the second hand, it is divided into: the chronograph movement and the sweeping movement (also called the silent movement).

2)Wall-mounted clock movements are divided into: single-time movement (single machine) and music hour-time movement (also called the movement).

The 3 clock movements are divided into: single machine and alarm machine. Among them, the alarm machine is divided into a single-playing movement and an alarm machine with snooze function. The alarm sound of the alarm is divided into a single-segment BB sound and a 4-segment BB sound (that is, a BB sound that is weakly strong).

8. Screw

9.LCD (ie liquid crystal display) components: divided into Chinese and English. There is only one LCD component in a clock, and the general display contents are perpetual calendar (ie, calendar year, month, day, week, Chinese with lunar calendar month, day) and temperature; one LCD has two LCD components, one of which The perpetual calendar is displayed and the other one shows the temperature and humidity.

10. Pendulum movement (auxiliary movement): divided into a swing pendulum movement and a swing movement.

How To Place The Wall Clock

In the traditional Feng Shui theory, some halls and room wall clocks are necessary, especially in the integrated office, and should be linked to the clock. Hanging the clock in such a place can have five major functions. One is to recruit wealth into the treasure, the other is to avoid evil spirits, the third is to help the host fortune, the fourth is to manage the ministry, and the fifth is the most basic function of the clock. This is not to say that you can buy a clock and just find a place to put it, if you hang the wrong place, it will be counterproductive. In general, the front of the clock cannot be inward, and the direction toward the door or balcony is best.

Wall clock considerations

No matter the clock, the wall clock, its hour, minute, and second hand will continue to run. If placed in the living room, there are a few points to pay special attention to:

1, can be placed or hung on the Suzaku side, because the Suzaku side is the front, the front is the mover.

2, can be placed or hung in the Qinglong side, because the Qinglong side is the Kyrgyz side, so the left side of the living room should also put the clock.

3, do not place or hang in the white tiger side, because the white tiger side is a fierce party, so the right side of the living room should not put the clock.

4, do not place or hang in the Xuanwu side, because the Xuanwu side is the rear, should not be moved.

5, the top of the sofa should not hang the clock, otherwise, people who often sit in this position are prone to problems.

6. Place or hang the clock in the bedroom, which is roughly the same as the living room, but the clock cannot be hung at the bedside.

 Chongqing Chenghongzhi Import and Export Trade Co., Ltd. is a company of acrylic products manufacturing, which is from China. As is known to all, China is the industry of the whole world, so the price of the products is cheaper than others but with higher quality. Its main products are Acrylic Wall Stickers, Acrylic Wall Clocks, MDF Wall Clocks, Cake Toppers, Metal Posters and Sunrise Alarm Clocks.

 Welcome to buy it!

Chongqing Chenghongzhi Import and Export Trade Co., Ltd.

Website:www.preciserclock.com

Email:sum.preciser@gmail.com

Whatsapp: +18140232818

Tele: 1732323320

[anku000-blog]

Semi-automatic Plastic Zipper Closed-end and Open-end Injection Machine (QLQ-SDIM-1)

Semi-automatic Plastic Zipper Closed-end and Open-end Injection Machine (for zipper with/without slider)

Model number : QLQ-SDIM-1

Summary : This machine is with extra brightness LCD display screen, fast speed, accurate control, PID auto learning temperature control system, with good stablity.

PRODUCT DESCRIPTION

Semi-auto Plastic Zipper Closed-end and Open-end Injection Machine(for zipper with/without slider)

MODEL NO.QLQ-SDIM-1      

NW (KG)   900    

M / C SIZE (M) 1.20*0.80*2.10

AVG OUTPUT 1000-1300 MOULD/H

GW (KG) 1000

PKGS SIZE(M) 1.30*0.90*2.20

VOLTAGE(V) 380V POWER(KW)5.3

PHASE (PH)3

Advantages:

This machine is with extra brightness LCD display screen, fast speed, accurate control, PID auto learning temperature control system, with good stability.

[zylcd]

Enhancing Industrial Applications with TFT LCD Displays and Touch Panels

In today’s fast-evolving industrial landscape, TFT LCD displays, LCD touch panels, and industrial LCD panel displays are no longer optional components—they are essential for efficiency, precision, and safety. Whether integrated into control systems, automation panels, diagnostic machines, or human-machine interfaces (HMIs), these advanced display technologies are redefining how industries operate.

What Makes TFT LCD Displays Ideal for Industrial Use?

TFT (Thin-Film Transistor) LCD displays are widely recognized for their high-resolution output, fast response times, and vibrant color reproduction. Unlike traditional monochrome displays, TFT LCDs offer a much clearer and more detailed visual experience, making them ideal for environments where real-time data visualization is critical.

For industrial settings—where machine operators often work in low-light or high-glare environments—TFT LCDs provide excellent readability and wide viewing angles. They also feature energy-efficient LED backlighting and come in various sizes, from compact 3.5-inch panels to larger 21.5-inch displays, suitable for different machine interfaces.

LCD Touch Panels: Interaction Simplified

LCD touch panels combine display and input functionality into a single compact solution, allowing users to interact directly with the screen. Capacitive and resistive touch technologies are commonly used, each suited to specific industrial needs.

Capacitive touch panels offer multi-touch capability and superior clarity, ideal for clean environments like laboratories or electronics production.

Resistive touch panels are more rugged and can be operated with gloves or styluses, making them perfect for harsh conditions such as manufacturing plants, outdoor equipment, or oil and gas facilities.

Industrial LCD Panel Displays: Built for Harsh Conditions

Unlike commercial-grade screens, industrial LCD panel displays are designed to withstand extreme temperatures, vibrations, humidity, and exposure to chemicals or dust. They are typically housed in durable enclosures, often with IP65-rated front panels for water and dust resistance.

These displays play a central role in sectors such as manufacturing, logistics, mining, and transportation, where reliability is non-negotiable. An industrial LCD panel can operate 24/7 without screen degradation, making it ideal for monitoring systems, data logging, and process control.

Customization and Integration

Modern manufacturers of LCD module displays and panels offer customization options to suit specific industrial applications. These include brightness levels, screen size, aspect ratio, touch functionality, and LVDS (Low-Voltage Differential Signaling) interfaces for seamless communication with embedded systems.

We (zylcdshop.com )offer almost all LCD Screen on the market. If your business needs robust, high-quality display solutions tailored for industrial environments, partnering with a trusted LCD supplier can ensure long-term reliability and performance.

[chinasanshun01]

Ningbo Sanshun Machinery & Technology CO., LTD offers the SHE400 Fixed Pump Injection Moulding Machine, designed for creating plastic products. This machine features a high torque hydraulic motor for driving the plasticizing screw counter, a low-pressure mold protection device, a high-performance and large color LCD display screen, and injection device control position.

For more details and the latest pricing, please contact us.