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The Changing Style Road Of Microsoft And Google
From the current point of view, our future is still very clear: AI can take care of us, bring entertainment, but also help us make money ~ the existing industry will be more and more efficient, such as health care and manufacturing; many new industries are Will be possible, such as AR glasses and unmanned taxi and so on. But in the technology industry is busy building this new era of artificial intelligence, and continue to improve revenue, but suffered a large bottleneck on the speed: the computer in some specific computing needs is far less powerful and efficient. When we focus more on the use of algorithms in poker, chess and other areas to defeat the human, we have to support the future of AI to support the new computer chip is little concern. In fact, in the face of the huge demand for more powerful chips, software and Google have been familiar with the development of their own chips in the complex tasks. They are also facing competition from other emerging start-up companies, these companies are independent research and development with AI-centric chip. Probably, Apple is still doing it quietly. Just as our future lives are being changed by artificial intelligence, these competitions will also shake the existing chip industry.
On Sunday, Microsoft has just announced its AI chip manufacturing program. At the upcoming CVPR conference in Hawaii, Dr. Shen Xiangyang, Microsoft's global executive vice president for the Department of Artificial Intelligence and Research, showed track of the new chips and hand movements developed specifically to enhance the reality of the lens, HoloLens. The chip includes a set of custom modules that can efficiently run deep learning software. Microsoft wants us to be able to interact with the virtual items we see. They also said that there is no device on the market that can support enough software to run the machine on top of the battery-powered device. Before Microsoft opened its plans, Google announced in 2016 its depth of learning chip research and development. Its TPU is to support the company within the cloud more efficient depth of learning operations. Google said earlier this year that with the outbreak of speech recognition technology, TPU has saved the company to build 15 new data center costs. This year, Google announced that it has developed a stronger version of the TPU, and will be the company's cloud computing business customers rent the use of the chip. From Microsoft's development of a deep learning processor for HoloLens, you can see that they do not need to start developing their own server chips from scratch to compete with Google's TPU. Microsoft has spent several years allowing field-programmable gate arrays (FPGAs) to make its own cloud computing more efficient in deep learning. This chip is designed to increase the speed of a particular software or algorithm, and can then be reconfigured. Microsoft plans to provide the chip to cloud customers next year. However, when asked recently whether Microsoft will also create a similar to Google's consumer server chip, Microsoft FPGA technology leader Doug Burger said that does not rule out this possibility. Partial design and supply chain processes used to develop HoloLens depth learning chips can be redefined to suit the server chip.
Google and Microsoft's two projects are clearly in order to counter the existing semiconductor manufacturers giant Intel, NVIDIA and other layout. In recent years, Apple has been developing a processor for its mobile devices. It is widely believed that Apple is also developing new chips, so that the future of the iPhone in the artificial intelligence performance more color. Many of the start-up companies are also developing their own depth of learning chips, such as the former Google TPU project engineers founded Groq. "Intel and NVIDIA are struggling to sell products that were in the past," said Linley Gwennap, founder of Linley Group, a semiconductor industry analyst. "But we've seen that running faster will be the leading Cloud computing companies and start-ups because they are the ones who best understand their own data centers and the broader market needs. " "In recent years, graphics chip maker NVIDIA sales and profits continue to soar, it is from the chip than the traditional processor is more suitable for in-depth learning software, but they have recently chosen the existing chip design transformation and expansion, and Not developing products specifically designed for depth, "Gwennap said. Of course, the traditional chip manufacturers will not sit still. As the world's largest chip maker, Intel acquired a company called Nervana's AI chip startup last summer, and is currently developing a technology specifically for depth learning based on company technology. Intel has the world's most complex and expensive chip production business. However, a new group of rising people said they were not afraid. One reason is that they do not have to stick to the existing chip ecosystem, subject to the original development of other software for the purpose of the restrictions. "Our mission is simpler, because we just have to do one thing, and we can start research and development from scratch." Nigel Toon, CEO of Graphcore, a startup in the UK that specializes in AI chip development. Last week they had just announced a $ 30 million grant, including DeepMind CEO Demise Hassabis, which also had several leaders from OpenAI. You can learn more information about electronic parts from omoelec.com. On the other hand, large cloud technology companies can apply their experience to running and developing machine learning services and technology. "One of the things that we really can benefit from Google is that we can work directly with our counterparts, such as voice recognition and street view," says Norm Jouppi, chief engineer of the Google TPU project. "When you focus only on Customers and working with them, the development turnaround time will be greatly reduced. " Both Google and Microsoft have grown with innovative software, but the software is designed and developed for others. With the AI more and more important, the basis of the technology industry, "silicon chip" is changing, followed by manufacturers who have begun to bear it!
Reference: 74hc595 datesheet and ds18b20 datesheet
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NVIDIA Launched NVIDIA OptiX 5.0 SDK
NVIDIA today announced the NVIDIA OptiX 5.0 SDK, which has a powerful new ray tracing capability that injects the power of artificial intelligence into the rendering workflow. NVIDIA DGX Station is NVIDIA's newest desktop AI workstation running OptiX 5.0 on it to provide designers, artists and other content creation professionals with the equivalent of 150 standard CPU server-based rendering capabilities. Accelerated computing provided by the GPU to provide technical support will provide users with extraordinary rendering capabilities that will help them to iterate and innovate at less cost while ensuring speed and performance. "Developers using our platform can help millions of artists and designers access the rendering farm on desktops by creating applications based on OptiX," said Bob Pette, vice president of professional visualization at NVIDIA. "By creating the OptiX-based application, Provide to customers, increase their creativity, and greatly improve productivity. " OptiX 5.0's new ray tracing feature accelerates the process required for visualizing design or characterization, greatly improving the ability of creative professionals to interact with content. It has a new AI denoising function, can speed up the removal of grain in the image, and to achieve GPU-accelerated motion blur, and then create realistic animation.
By running NVIDIA OptiX 5.0 on DGXStation, content creators can significantly speed up training, reasoning, and rendering. NVIDIA DGX Station is a mute system that can be placed on the desktop, using NVIDIA's latest Volta series of GPUs as the most powerful AI rendering system available today. To achieve the equivalent rendering performance with DGX Station, the content creator needs to access a rendering farm based on more than 150 servers with a power of about 200 kW and DGX Station with a power of only 1.5 kW. The cost of purchasing and operating a farm will be $ 4 million in three years, compared to $ 65,000 for DGX Station. Industry support for AI-based graphics NVIDIA is working with a number of key global technology companies and creative thinkers from Hollywood studios to build, design, create roles and create virtual worlds with AI. They have given extensive support for NVIDIA's innovation: "AI has made changes in all walks of life around the world," said Steve May, vice president and chief technology officer at Pixar. "We are pleased to be able to witness NVIDIA's use of the new AI technology to improve the film production process." If you want to learn more information,please go to electronic parts website. "We are a loyal fan of NVIDIA OptiX," said Nicolas Guiard, chief engineer at Isotropix. "After we ported the Clarisse renderer's ray tracing core to NVIDIA GPUs, we have not only significantly reduced development costs, but also achieved fast performance. Denoising can significantly reduce the time required for rendering, making OptiX 5 a subversion of production workflow. " "AI is expected to bring about a great change in the creative process," said Sutha Kamal, vice president of technology strategy at Technicolor. "We can expect that future AI will help artists to fully release their creativity so that the brush can really think ' Able to create images and experiences that were unimaginable in the past.Technicolor has the same vision as NVIDIA, which uses technology to help creative people use a more powerful tool set to deepen the audience experience.
Reference: atmega328p datesheet and nrf51822 datesheet
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Where Is The Future For Intel?
In the past, the market capitalization was " Change, missed mobile Internet after Intel, in the field of chip manufacturing by Samsung beyond, it is regrettable, what causes Intel core areas continue to be opponents beyond? Prior to this, Intel underestimated the development of mobile Internet, especially since 2011, smart phone shipments over the PC, making mobile Internet into the rapid development stage, it can be said that the birth of Apple iPhone to promote the development of mobile Internet, with the rise of mobile Internet Of the ARM, it is almost monopoly of the smart phone chip, including the iPhone also uses the ARM architecture to design the chip, making ARM become the new overlord of mobile chips, and Intel can be used to describe the decline of mobile Internet.
Mobile Internet chip battle, the end of Intel's success, but mobile technology is urging the networking, due to 5G, cloud computing AI technology development, will promote the development of Internet of things, tens of billions of intelligent terminals will access the network , To chip manufacturers to bring unprecedented opportunities, and Samsung is to benefit from the rise of smart phones and other smart devices, the last Samsung chip business benefits. Samsung's latest quarterly report shows that its semiconductor sector in the second quarter of this year brought about 15.8 billion in revenue, more than Intel's 14.76 billion dollars in chip revenue over the same period. In the last month, from the "Financial Times" reported that Samsung is expected to become the world's largest chip maker, and now, Samsung ahead of the realization of the Intel beyond, of course, Samsung can achieve beyond the year, yet to be further testing , But the author is curious, Intel continued the mobile Internet situation, in the era of all things interconnected, still did not seize this wave of opportunities, especially as the helm of the bureaucracy (Brian Krzanich) long way to go.
In the face of the trend of all things, Intel is also actively transition, focusing on artificial intelligence, unmanned and 5G and other eight areas, especially in the field of artificial intelligence and unmanned driving a lot of resources and capital, not only the acquisition of a number of related labor Smart innovation business, but also to 15.3 billion acquisition of Israeli auto driving caryeye company, huge funds for the acquisition, but also to see the importance of artificial intelligence and unmanned in the Intel strategy, but in my opinion, despite the current artificial Intelligence can be used to describe the hot, but the business application is extremely difficult to ground, especially looking forward to unmanned projects, five or six years is difficult to large-scale application, for Intel's long-term strategy to give a high rating, but also face reality.If you want to learn more information,please go to electronic component distributor website. The same as the chip manufacturers ARM is actively greeted the Internet of things, the abolition of the two core Internet of things processor licensing fees, that is, without any pre-licensing fees, you can design and manufacture based on Cortex-M0 and Cortex-M3 processor SoC, After the successful production of products shipped after the royalties to pay the mode of operation, reduce development risk. However, in the layout of the Internet of things, Intel chose to give up Galileo, Joule and Edison three for the Internet of things market computer module. It is difficult to imagine in the Internet of Things on the occasion of Intel, but in the initial stage of the production of three applications for the development of the Internet module, it is regrettable, of course, also hope that Intel can market to the more low-power Networking chip products and services to cope with the increasingly fierce market for all things.
Internet Big Bang is coming, in this wave of waves, before the Samsung, chip maker boss position was also taken away by Samsung, followed by ARM and NVIDIA up to catch up, especially the British Weida enjoy the artificial intelligence to bring this wave of dividends, Automated driving business is expected to usher in explosive growth, and Intel's "Wintel" built by the high barriers gone, Intel in the Internet of things and artificial intelligence era where to go?
Reference: 74hc595 and ds18b20
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AMD Completed The Composition Of AMD Ryzen 3
AMD continues to be the "Zen" core architecture that has been highly acclaimed by global professional commentators as "Best New Technology" and announced the availability of two high-performance AMD Ryzen 3 desktop processors at the mainstream price, including AMD Ryzen 3 1300X With AMD Ryzen 3 1200 CPU. Two Ryzen 3 processors offer four physical core and non-lock multiplier performance for gaming and computing, adding to the award-winning AMD Ryzen® 7 and Ryzen® 5 desktop processors for massive and growing growth in the AM4 motherboard industry System full support Note 1. AMD's global vice president and general manager of the Computing and Mapping Business Group, Jim Anderson, said the past few months have been a period of excitement for AMD, in addition to Ryzen 7, which is designed for the most demanding and demanding users, Able to meet or exceed the needs of productive consumers Ryzen 5. Ryzen 3 is the Ryzen desktop processor product line blessing, with flat prices for mainstream users to provide industry-leading response speed and performance. AMD Ryzen processor product line to re-activate the entire PC market innovation and competition to cover almost all the price range to meet the different computing needs for consumers to bring more processor options.
Ryzen 3 product line has been officially listed, two 4-core 4-threaded desktop CPUs support the new AM4 platform, AM4 platform for the entire mainstream Ryzen processor family shared. The Ryzen 3 1300X and Ryzen 3 1200 are designed to provide the best performance for e-sports games with a variety of computing applications. With the built-in four solid processor cores, the Ryzen 3 1300X and Ryzen 3 1200 not only offer superior processing advantages over competitors, but also deliver superior gaming performance. Ryzen 3 and all AM4 slot processors are not unlocked, providing higher performance for users who prefer overclocking. The Ryzen 3 1300X basic clock is 3.5 GHz, which can be upgraded to 3.7 GHz, allowing the clock to be further raised to 3.9 GHz when installing the advanced cooling and enabling XFR function. The Ryzen 3 1200 maintains a basic clock of 3.1 GHz and can be upgraded to 3.4 GHz. All Ryzen 3 processors, like the entire Ryzen product line, have built-in real AI functions that can use the neural network to learn the various applications that users perform to deliver workloads through the fastest pipelines within the CPU to optimize efficacy. In addition, each Ryzen 3 processor is AMD VR Ready Note 3, through its advanced architecture and fast lightning speed to support virtual reality applications.
AMD Ryzen 3 models are now available worldwide for electronic distributors. All AMD Ryzen 3, Ryzen 5 and Ryzen 7 processors support AM4 infrastructure, the major ODM manufacturers will introduce the corresponding new motherboard design, designed for AMD Ryzen processor designed desktop chipset, including X370, B350 As well as the A320, which A320 will be aggressive strategy to attack the mainstream PC market. You can also buy it from electronic component distributors. Wraith Stealth and Wraith Max Thermal Solutions AMD Ryzen 3 series launched Ryzen 3 1300X and Ryzen 3 1200 also equipped with Wraith Stealth radiator. AMD's cooling solution is the quietest and most calm choice in the Wraith radiator portfolio. In addition, the board is only pre-installed in the selected partner vendor system cooling solution, AMD today announced the RGB can be set with LED lights Wraith Max flagship radiator will be 59 US dollars recommended market price sold separately. Wraith Max Radiator Compatible with AM4, AM3 and FM2 motherboards, the cooling performance is tough enough not only to include the Ryzen 7 1800X, 1700X and Ryzen 5 1600X to provide the required heat dissipation when starting XFR, 38 dBA Note 2.
In addition, AMD announced the introduction of the popular 7th generation AMD A series of desktop processors (codenamed "Bristol Ridge") and the AMD Athlon X4 CPU for the AM4 slot, providing entry-level processing for this advanced platform Solution. The 7th generation A series processor is designed to provide high-quality PC experience, providing excellent non-lock frequency doubling for entry-level PC performance Note 1 With efficiency, built-in Radeon® graphics card for stunning gaming performance, 4 core architecture But also bring the rapid response performance. The 7th Generation A, Athlon X4, and Ryzen® 3 processors have enabled the AM4 industry to be more mature and have been fully developed from the entry-level CPU to the high-end 8-core 16-run Ryzen® 7 1800X processor , The only platform to meet future needs.
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Infineon Technologies AG Launched A New Power IC
Car manufacturers want automotive electronics to dramatically improve energy efficiency in as small a space as possible. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) relies on the new power IC manufacturing technology SMART7 strongly support this trend. The technology is designed for automotive applications, such as body control modules or distribution centers. SMART7 power IC in the heating, power distribution, air conditioning, car interior and exterior lighting, seat and mirror adjustment and many other applications to drive, diagnose and protect the load. In addition, they can replace electromechanical relays and fuses in a cost-effective and reliable manner. SMART7 is based on a thin wafer process that reduces power consumption and reduces chip size. Based on SMART7, Infineon has introduced two high-side power switch series PROFET + 2 and high current PROFET. SPOC + 2 multi-channel SPI high-side power controller will be launched within a year. "In the past decade, we have delivered 1 billion PROFET + switches, the PROFET + switch is the predecessor of the PROFET + 2. The SMART7 Power ICs," said Andreas Doll, vice president and general manager of the Automotive Power Division's Infrared Power Division, Can provide enhanced protection for vehicle and convenience applications, lower power consumption, smaller package size and lower system cost. "
PROFET + 2 can reduce the power consumption and PCB space to double digits The PROFET + 2 product family is designed for automotive 12V lighting load applications and capacitive loads. They include halogen bulbs, in-car lighting and dimming and LED lighting in external lighting control devices. PROFET + 2 devices have first-class diagnostic and protection functions. They maintain pin compatibility with the previous generation product family PROFET +, ensuring zero cost migration. If the single-channel device is replaced by a dual-channel device, it is not necessary to change the ECU layout, and vice versa. Compared to the previous product line, PROFET + 2 device package size reduced by 40%, and improve energy efficiency, current consumption by 50%. The minimum resistance of the PROFET + 2 device is 8 mΩ dual channel switch BTS7008-2EPA, with many protection and diagnostic functions. The high current PROFET supports up to 20 A DC of load current in a small footprint that sets the industry benchmark The new high current PROFET extends the PROFET + 2 series of flexible methods to achieve the same TSDSO-14 package on-resistance RDS (ON) from 8 m to as low as 2 m. A high current PROFET in a TSDSO-14 package with a pin pitch of only 0.65 mm enables the world's lowest RDS (ON) as a monolithic switch. The size of the TSDSO-14 is reduced by 50% compared to the mature smart power switch in the DPAK package. Compared to D2PAK, its size is reduced by 80%. The product family is capable of efficiently driving high current loads. In addition, the power consumption in the control module can be reduced by up to 60%. Through its support for 12 V high current load optimization features, including diagnostic and protection functions, the product line to meet a variety of heating and power distribution applications. They include glow plug controllers, PTC (positive temperature coefficient) heaters, starter relays, speakers, trailer loads and auxiliary power outlets.You can buy the electronic parts from electronics-chip.com. PROFET + 2 and high current PROFET are compatible with both product lines and feature the same main features. The on-resistance RDS (ON) varies from 2 m to 200 m. Nominal current below 5% of the load current detection accuracy (kILIS) set a new benchmark for the market. Its protection features include current trip, overtemperature, overvoltage, load dump and reverse battery function ReverSave®. Infineon is the first in the market to achieve reverse battery protection in a single chip. Another functional benchmark is the starting voltage capability, which can work as low as 3.1 V.
Reference: 74hc595 and ds18b20
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Artesyn Embedded Technologies Launched Skylake Intelò Xeonò Scalable Processor
Artesyn Embedded Technologies announces the launch of a new high-performance server blade system that supports packet handling. This model for the ATCA-7540 blade system using two just launched, code-named Skylake Intelò Xeonò Scalable processor. The ATCA-7540 blade system is suitable for military / military equipment such as data center computing systems, ground control stations, network data analysis systems, specific mobile networks and automated command systems (C4ISR), and to ensure that such applications are readily available Development needs to be renewed. Yate Health Technology not only uses Intel's processor with its own advanced technology, but also provides a sound supply chain management, so the production of the server blade system in terms of performance or long-term supply stability than existing competitive products The According to Yate Health Technology estimates that the choice of Intel processors will have up to 15 years of life. The ATCA-7540 blade system supports operations such as deep packet inspection (DPI), firewall, intrusion prevention, data encryption / decryption, and so on, making it ideal for enterprise systems, government information systems and defense communications networks Network system. AdvancedTCAò (ATCA) The blade system incorporates a variety of different production systems, which are fully compliant with the US Department of Defense (DoD) release of the modular open system design (MOSA). The ATCA blade system of AT & T has a high degree of flexibility, allowing users to adjust system performance levels as needed, as well as easy maintenance warranties, fewer cable numbers, and the ability to communicate with different branded products. A variety of different military equipment. Several departments of the US Department of Defense and its major contractors and system integrators have used the ATCA blade system as a platform to develop a variety of central operations for warships, aircraft or temporary command and control centers installed in field camps system.
The CentOS operating system is preloaded with AT & T's ATCA-7540 server blade system, and because the blade system is preloaded with BIOS, IPMC firmware and the basic blade service (BBS) Software, so its backplane can also support other open source and commercial operating systems. In addition, the backplane can also support RedHawk Linux RTOS, which is the industry standard real-time operating system, the US Navy has chosen this operating system as a number of development projects open architecture operating system. The ATCA-7540 server blade system can be configured with a system that supports virtualization with Linux KVM or VMware ESXi. In addition, this blade system also supports Intel (Intelò) information layer development kit (DPDK). The floor is optimized to ensure that the computing system can perform unparalleled in performance. As the floor itself built two Intel Xeon Gold gold processor or Xeon Silver silver processor, so users can adjust the system according to the level of performance standards. Each processor is equipped with six memory channels, and by the DDR4 memory support, so that the blade system can take full advantage of the main memory and input / output data between the channel to enhance the amount of data transmission. Each processor can take full advantage of 48 high-speed PCIe Gen 3 channel, so that the system can support fast network data transmission. Equipped with 12 slim (VLP) DIMM sockets to ensure that the memory capacity can be expanded to 384GB, not only to make the system configuration more cost-effective, but also to ensure that the need for a large memory capacity in order to implement the path selection or pattern matching function The program has a larger memory capacity to perform the function. You can buy them from electronic component distributors. This blade system can be used with a hardware accelerator, which is one of the customer's options. The optional hardware accelerator can be connected directly to the central processor. Optimized accelerators, in addition to supporting encryption / decryption algorithms, can also significantly increase the amount of encrypted data in the security system. Equipped with dual-star topology 40G Ethernet fiber interface can support high-speed data transmission. The backplane supports up to two built-in M.2 nonvolatile solid state memory hard drives (total memory capacity up to 1TB). Yate Health Technologies offers a wide range of compatible back-end conversion modules (RTMs) that allow customers to add input / output and expand memory when needed.
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How To Optimize SDK By Opening AI Chips
In order to speed up the speed of smartphone processing AI tasks, technology companies are carrying out a variety of different attempts. Microsoft and ARM in the design is more suitable for running the neural network chip, Facebook and Google want to reduce the performance of the AI itself. But for the chip manufacturers Qualcomm, their current plan is more simple: the existing chip products to adapt. Qualcomm has developed a software development kit (SDK) called the Neural Processing Engine to help developers optimize their applications so that they can run AI tasks on the Xiao Long 600 and 800 series processors The That means that if you are developing an application that uses AI (such as image recognition), you can integrate Qualcomm's SDK to run it more quickly on a compatible processor. The neural processing engine was released by Qualcomm as part of the Zeroth platform (which was subsequently cut as a brand) a year ago. Since September last year, Qualcomm began with a number of partners to develop the SDK, and now, it is finally officially open for everyone to use. "Any developer who has already invested in deep learning - that is, they have data access and trained AI models - regardless of size, are our target users," Qualcomm AI and the machine learning department are responsible for "It's very easy to use, and we've got all the basics," Gary Brotman said. "You do not have to go to these heavy tasks." Qualcomm said Facebook will be one of the first manufacturers to integrate the SDK, they are currently using it to accelerate their mobile applications in the enhanced reality filter. By using the neural processing engine, Facebook's filter loading speed increased by 5 times.
As for how developers use this SDK, this will vary according to the content of the work, but its basic task is to assign different tasks to Xiaolong chip different parts. For example, if the developer wants to optimize the life or processing speed, they can extract the computing resources from different parts of the chip, such as CPU, GPU or DST. The SDK also supports the most popular AI system development architecture, including Caffe, Caffe2 and Google's TensorFlow. Qualcomm said it is also suitable for cars, unmanned aerial vehicles, VR helmets and smart home products, in addition to optimizing AI on mobile electronic parts. But deploying the architecture that can fit the existing processor is just the beginning. "AI workloads will increase the need for computing performance," Brotman said. In order to meet this demand, technology companies are working on AI to optimize the chip to develop a new architecture design. For example, Microsoft is developing a custom machine learning processor for HoloLens 2, and UK chip maker Graphcore recently raised $ 30 million to develop its own "smart processing unit" for mobile devices. And for Qualcomm, they will certainly take this strategy in the future, but now is not the time. "For us, adding new content to the chip is a bet, and we're not going to do that easily," Brotman said. "If we can optimize the existing product line, we've done a great job. In the long run, do we need a dedicated neural calculation? The answer is yes, the question is when we should bet.
Reference: 74hc595 datesheet and ds18b20 datesheet
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Samsung Chip Business Will Surpass Intel
According to the Financial Times reported that the market is expected to end Intel's chip market up to 25 years of the rule, but also in the quarterly profits than its smart phone market in the main rival Apple, all thanks mainly to its simplest One of the needs of the product is high: the memory chip. From smartphones to cars and "Internet of Things", the increase in storage chip usage leads to undercapral supply, pushing up their prices, and Samsung has become a major beneficiary. At the same time, Intel's main battlefield traditional PC processor market is continuing to shrink. IBM PC was the rise, so that Intel in 1992, overturned NEC, boarded the top of the global semiconductor market. With Intel and Samsung on Thursday announced their latest quarterly earnings, Intel will dominate the era will end. For the second quarter, Samsung expects its semiconductor revenue will be up to 15 billion US dollars, more than Intel's expected 14.4 billion US dollars. "Samsung has a phenomenal performance in the field of memory chips," said Geoff Blaber, an analyst at CCS Insight in Silicon Valley. "The demand for its memory chips is far greater than the supply, after all, it's a variety of products A very important part. " IT market research firm Gartner analysts expect global semiconductor revenue this year will be more than 400 billion US dollars for the first time, mainly due to Samsung's dominant memory chip market growth of 52%. "This gives Samsung a great opportunity to take hegemony from Intel this year," said Andrew Norwood, a chip analyst at Gartner. However, the current storage chip market in the event of a major change, or just at another top of the boom - depression cycle, analysts view different. "No matter how Samsung is now spending more than Intel, it will probably not last long," said Tim Bajarin, an analyst at Creative Strategies. Benefit from the high demand for data storage, the global storage chip industry is clearly in the unprecedented super cycle. This brings huge profits to leading companies such as Samsung and SK Hynix, and they are also struggling to expand capacity to keep up with the ever-increasing demand for networking equipment and data servers. Due to supply and demand imbalance, storage chip prices in the past year, a full doubled. The chip maker's share price rose by an average of 155% compared to the cyclical bottom they recorded in 2016. SK Hynix said on Tuesday that its net profit in the second quarter reached 2.5 trillion won (about 2.2 billion US dollars), up 763% year on year.
In the booming memory chip market, Samsung is expected to record a record profit, becoming the world's most profitable non-financial companies. In the quarter ended June, its operating profit is expected to reach $ 12.1 billion, more than Apple. Analysts estimate that Apple's earnings for the quarter will be $ 10.5 billion in the quarter, but the quarter is usually the slowest quarter of the iPhone maker. Samsung's storage chip field of the rule of the seeds in fact nearly 10 years ago had been buried, when the industry cycle turned to oversupply. In 2008, over-expansion of production capacity, coupled with the global financial crisis, forced many suppliers to withdraw from the flash chip market. However, while other manufacturers have retreated, Samsung is the opposite, and expand the input. "They will focus on the memory chip," said Barakari, "it is commendable that they see this as a great opportunity." At present, Samsung's operating margins from DRAM (Dynamic Random Access Memory) memory chips (typically for PC and data center servers) and NAND flash memory chips are estimated to exceed 60% and 45%, respectively. The company is investing heavily in a range of semiconductor electronic parts, with capital spending estimated at $ 12.5 billion this year, but the recent investments are targeted at NAND chips. This type of chip is mainly used for smart phones, solid state drives and camera memory cards. "There will be more and more devices and endpoints in the future that need to use memory chips to push up the demand for such chips." Brapp said, "Samsung has a huge scale advantage, so their cost base competencies are significantly more than others Manufacturers. "
Reference: atmega328p datesheet and nrf51822 datesheet
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The Performance Advantage Of LTC7150S
Linear Technology Corporation, a subsidiary of Analog Devices, Inc. (ADI), introduced the LTC7150S, a 20V, 20A monolithic synchronous buck converter with differential VOUT remote detection. The device's unique phase-lockable controlled turn-on time constant frequency current mode architecture reduces the burden of compensation and is well suited for high-voltage applications that require high-speed operation while requiring fast transient response. The LTC7150S utilizes Silent Switcher® 2 technology, including integrated channel capacitors to deliver cost-effective solutions with superior EMI performance while reducing layout constraints. Up to 12-phase multi-phase operation allows multiple devices to be directly connected in parallel to provide greater current with minimal input and output capacitance. VOUT remote detection ensures that, regardless of the load current or what kind of circuit board layout, the load voltage regulation is accurate. The LTC7150S's 3.1V to 20V wide input range supports a wide range of applications, including most intermediate bus voltage applications, and is compatible with many types of batteries. The integrated N-channel MOSFET provides up to 20A continuous load current with a minimum thermal derating in the output voltage range of 0.6V to VIN, making it ideal for point-of-load applications such as power supply to high current / low voltage DSP, FPGA and ASIC The Other applications include telecom / data communications systems, distributed power architectures, and general high power density systems.
LTC7150S is very short 25ns Shortest On Time Allows high step-down power over high frequencies to support operation in forced continuous and discontinuous mode. The operating frequency is optional in the 400kHz to 3MHz range and can be synchronized to an external clock. The LTC7150S has a total differential output voltage accuracy of ± 1% over the -40 ° C to 125 ° C operating junction temperature range. Other features include direct remote differential VOUT sampling at the load, PHMODE phase selector pin, accurate 1.2V RUN pin threshold, VIN overvoltage protection, power good mark and programmable soft start / trace.You can buy these electronic parts here. The LTC7150S is available in a heat-resistant, enhanced 42-lead 5mm x 6mm x 1.3mm BGA package with RoHS lead-free lead and leaded SnPb (63/37) coating. Class E and Class I versions are specified over the -40 ° C to 125 ° C operating junction temperature range. The E-level version starts at $ 5.60 each in 1,000-piece quantities.
Photo Description: 20VIN, 20A Single Silent Switcher 2 Synchronous Buck Regulator for High Power PoL Applications Performance Summary: LTC7150S · Silent Switcher 2 architecture · High efficiency: up to 96% Output current: 20A · VIN range: 3.1V to 20V · Integrated N-channel power MOSFET (6mΩ tube, 2.5mΩ on the tube) • Differential VOUT remote sampling Adjustable frequency: 400kHz to 3MHz • PolyPhase® operation: Up to 12 phases • Output tracking and soft start · Reference accuracy: 0.6V ± 1% • Current mode operation to achieve excellent voltage and load transient response • 400kHz to 3MHz syncable frequency · Accurate 1.2V RUN pin threshold Support for forced continuous / discontinuous mode · 42 lead 5mm x 6mm x 1.3mm BGA package
Reference: 74hc595 and ds18b20
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Tektronix Helps To Testing For The OIF-CEI-56G VSR / MR / LR PAM4 Standard
Tektronix, the world's leading provider of measurement solutions,has expanded its PAM4 test solution line to provide a full range of 400G electrical interface conformance testing for the OIF-CEI-56G VSR / MR / LR PAM4 standard. The latest 400G-TXE software package runs on the Tektronix High Performance DPO70000SX real-time oscilloscope, which includes a variety of models that provide up to 70 GHz of bandwidth. The new turnkey auto-test solution performs a PAM4 conformance test, shortens test time, provides more reliable, repeatable results, and is easier to use.
Compared to the NRZ (non-zero) scheme, the data rate of the serial data channel is doubled using PAM4 encoding. But as a complex modulation, it also brings some test measurement challenges. Many of the measurement specifications of PAM4 are still changing and are therefore difficult to align with the latest measurement techniques that are formally established by the standard. The time required to complete complex test procedures can be a major challenge, and there is a need to achieve correlation between test systems and have reliable results. "By automating the PAM4 test on the DPO70000SX oscilloscope, we offer easy-to-use turnkey test solutions that help customers move to 400G, this repeatable 400G electrical interface, the PAM4 standard," said Brian Reich, general manager, Tektronix Technologies' high performance oscilloscope. The Consistency Test Program further enriches the Tektronix PAM4 test tool to meet the growing demand for data center industry. " The Tektronix 400G software package allows users to evaluate the electrical interface PAM4 signal according to the limits specified in the specification, providing a comprehensive OIF-CEI specification level conformance test. The solution includes a digital clock recovery feature that provides reliable measurement results in all cases, including signals with ISI jitter or other damage. The Tektronix 400G-TXE conformance test package performs standard test scans in a single application, reduces test time, provides more reliable, more repeatable results, and is easier to use.You can find more information from electronic component distributors. In addition to conformance testing, Tektronix also provides PAM4 analysis and debugging software solutions for real-time oscilloscopes and sampling oscilloscopes, allowing designers to gain the necessary insight to fully evaluate test failure conditions such as BER and eye height and eye width. The 400G-TXE solution runs on high-performance DPO70000SX 70GHz, 59GHz and 50GHz real-time oscilloscopes for unprecedented low noise and measurement accuracy. High-speed standards such as OIF-CEI require the oscilloscope bandwidth currently available from the DPO70000SX series.
Reference: atmega328p and cr123a
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http://www.componentschip.com/pdf/05-TE28F640J3D75A.pdf TE28F640J3D75A Micron Technology Inc;TE28F640J3D75Adatasheet,TE28F640J3D75A IC FLASH 64MBIT 75NS 56TSOP inventory, get a price for TE28F640J3D75A by email.
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