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Productronica 2019
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Productronica 2019
Productronica 2019 saw 44,000 visitors and over 1500 stand holders. Overall, 44 different countries were represented. ��A massive success,’ Rob Walls called it. The numbers of both participants and visitors keep going up. Not only are the latest trends and gadgets in the electronics interconnect industry inspected, but people are also interested in being a jury member of the IPC Hand Soldering Competition.
Both Rob and Stefan Walls are in the jury of this contest, which actually consisted of two contests. On Tuesday and Wednesday the contest was for the best hand solderer in Germany. The winner of this round qualified as the last contestant for the world championship on Thursday. The top 17 hand solderers battled each other on Thursday to see who would get the number one spot.
‘The differences were very small indeed, and this year, too, the quality level was extremely high,’ says Stefan Walls. The winners of the best-of-Germany contest had the following prize money: €300 for first place, €200, for second place and €100 for third place. Apart from this various sponsors had also brought in some prizes. Ms Pauline Duval of the French company Thales DMS won first prize in the best-of-Germany contest. On Thursday the finals were a tense affair. All finalists were focused and on edge, as only one could win. This was Mr Indra Setiawan of the company Pt. SIIX EMS from Indonesia. As the winner of the world championship he can call himself the best hand solderer in the world. His prize money was €1,000 plus various other prizes donated by sponsors.
Comments Rob Walls: ‘Productronica is an important fair for everybody active in the electronic interconnect industry. All novelties can be found here, and all of our customers are here and visit our stand. We also talked to a number of prospects who had heard of the qualities of PIEK through their network. Of course, we were delighted to hear this, especially because we always strive to offer our customers a full-service package. On behalf of PIEK I would also like to congratulate the winners and hope to see them back in 2020.’
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Chain accountability and damage claims
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Chain accountability and damage claims
All around the world there is at least one recall action in the automotive industry every day. If we add all the recall actions in other industries, more than 100 million products are involved every year. Manufacturers would rather avoid damage claims resulting from these recall actions, not only because they damage a company´s reputation but also because they are a financial blow.
A generic cause of such recall actions cannot be pinpointed. What can be said, however, is that partners in the supply chain do not always have processes and procedures in place that are in accordance with the standards agreed on. Quality is an increasingly important factor, because products are ever becoming more technically complicated and their components are shrinking in size.
Chain accountability in the world of co-makership, where outsourcing certain operations is a common phenomenon, is no rarity. To prevent being affected by chain accountability and damage claims resulting from it, you can partner up with PIEK. There are three services that you can benefit from:
First of all, PIEK’s consultancy department can assist you in the following situations: • In case of a dispute between supplier and buyer our consultants can give you a second opinion; • Technical analysis of a product; • Assessment of the quality of a product, etc; • ESD Audit, PB en PBA process audits; • COP & COC; • PB Design validation in line with the IPC standards.
Secondly, PIEK has a test centre where you can have your own products and those of your suppliers tested, to see whether they meet the agreed standards. The tests that PIEK can do are the following: • Surfaces Characterization; • Chemical Laboratory; • Compliance with RoHS Directive and Environmental Analysis; • Shock and Vibration; • ESD Measures (ElectroStatic Discharge); • Rework and Repair Processes for Microelectronics; • Qualification / Validation of Materials and Processes; • Failure Analysis; • Statistical Analysis of Product Design, Process and Reliability; • Dimensional Analysis; • Reliability Analysis for Processes and Products Counterfeiting of Electronic Components.
Thirdly, PIEK is one of the few IPC educational centres in the world that has been certified to provide the IPC Validation Service. This service concerns both material and process aspects, as well as QPL (Qualified Process List) at a product level plus QML (Qualified Manufacturers List) at a supplier level.
With these services PIEK can help you keep your own products and services at a high level at all times.
If you have any questions, please contact Ms Wendy Wings of our customer care department. She can be reached on telephone number + 31 45 570 33 33 or at email address [email protected].
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Nanotechnology, the new weapon against cancer cells
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Nanotechnology, the new weapon against cancer cells
Worldwide 47.5 million people die annually of a top-five cause of death. With 9.5 million annual deaths cancer ranks third, and the toll it takes is going up. Research is working hard to reverse this trend, and nanotechnology may be very helpful. This article will share a number of developments in this field.
Innovations in the field of nanotechnology indicate that it can impede and even completely destroy cancer cells. It is still early days, but the current developments already show the enormous potential of the technology.
One nanometre is one billionth of a metre, to put things into perspective. It is at this microscopic scale that research takes place in various scientific disciplines, such as chemistry, physics, biology and engineering. Because these disciplines cooperate in health care, innovations in health care are speeded up. Nano technology can be defined as the manipulation of individual atoms and molecules so that devices at a nano scale can be created. These devices can in turn be deployed to attack and destroy cancer cells.
The Max Planck Institute for Intelligent Systems in Stuttgart is an example of a research group intensively exploring the possibilities of nanotechnology. Their scientists have developed propeller-shaped nanobots capable of penetrating very dense tissues. In the future these nanobots can be loaded with medication, so that infected cells can be infused with medicines.
Sino-American cooperation between the Chinese Academy of Science and the Arizona State University has led to the development of nanobots that can close down the blood supply to tumours. This makes them wither and die, as very successful tests in mice have shown. Comparable research in the UK has also been successful. There nanobots have been developed that can destroy cancer cells in 60 seconds. These devices start turning with a speed of two to three million revolutions per second when exposed to ultraviolet light, thereby completely cracking the membranes in cancer cells. It is hoped that these nanobots can soon be used for the treatment of people.
However, nanotechnology has still more to offer. It will not be long before organs can be repaired with nanotechnology. Think of the consequences of a stroke or any other disease and of damaged organs. Researchers of the Wexner Medical Center of Ohio State University and Ohio State’s College of Engineering are deep into this. They have developed a device that can cure diseased and damaged organs by changing the function of one cell with one single touch. By injecting a new genetic code into skin cells and giving these a different cell structure, it becomes possible to regenerate cells. It is obvious that this development offers tremendous possibilities for curing organs, blood vessels, tissues, etc.
When we view these developments, we can start to wonder whether nanotechnology can ensure that we may be able to live without fatal diseases. Nanobots injected into our bodies could continually be on the lookout for any faults in cell structures and immediately repair any that are found. This amazing perspective leads to another obvious question: could nanotechnology keep us forever young?
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Nanotechnology, the new weapon against cancer cells
New Post has been published on https://piek.international/nanotechnology-the-new-weapon-against-cancer-cells/
Nanotechnology, the new weapon against cancer cells
Worldwide 47.5 million people die annually of a top-five cause of death. With 9.5 million annual deaths cancer ranks third, and the toll it takes is going up. Research is working hard to reverse this trend, and nanotechnology may be very helpful. This article will share a number of developments in this field.
Innovations in the field of nanotechnology indicate that it can impede and even completely destroy cancer cells. It is still early days, but the current developments already show the enormous potential of the technology.
One nanometre is one billionth of a metre, to put things into perspective. It is at this microscopic scale that research takes place in various scientific disciplines, such as chemistry, physics, biology and engineering. Because these disciplines cooperate in health care, innovations in health care are speeded up. Nano technology can be defined as the manipulation of individual atoms and molecules so that devices at a nano scale can be created. These devices can in turn be deployed to attack and destroy cancer cells.
The Max Planck Institute for Intelligent Systems in Stuttgart is an example of a research group intensively exploring the possibilities of nanotechnology. Their scientists have developed propeller-shaped nanobots capable of penetrating very dense tissues. In the future these nanobots can be loaded with medication, so that infected cells can be infused with medicines.
Sino-American cooperation between the Chinese Academy of Science and the Arizona State University has led to the development of nanobots that can close down the blood supply to tumours. This makes them wither and die, as very successful tests in mice have shown. Comparable research in the UK has also been successful. There nanobots have been developed that can destroy cancer cells in 60 seconds. These devices start turning with a speed of two to three million revolutions per second when exposed to ultraviolet light, thereby completely cracking the membranes in cancer cells. It is hoped that these nanobots can soon be used for the treatment of people.
However, nanotechnology has still more to offer. It will not be long before organs can be repaired with nanotechnology. Think of the consequences of a stroke or any other disease and of damaged organs. Researchers of the Wexner Medical Center of Ohio State University and Ohio State’s College of Engineering are deep into this. They have developed a device that can cure diseased and damaged organs by changing the function of one cell with one single touch. By injecting a new genetic code into skin cells and giving these a different cell structure, it becomes possible to regenerate cells. It is obvious that this development offers tremendous possibilities for curing organs, blood vessels, tissues, etc.
When we view these developments, we can start to wonder whether nanotechnology can ensure that we may be able to live without fatal diseases. Nanobots injected into our bodies could continually be on the lookout for any faults in cell structures and immediately repair any that are found. This amazing perspective leads to another obvious question: could nanotechnology keep us forever young?
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Extension IPC certification now requires re-certification
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Extension IPC certification now requires re-certification
IPC has changed its terms and conditions. As from 1 January 2020 it will no longer be possible to get a temporary extension of your IPC certification. The only option is to do a re-certification course.
Re-certification can be done up to six months before the certification expires.
Example: Suppose that your certification expires on 14 September 2020. You can already participate in a re-certification course as from 14 March 2020, while still retaining the original date of your certification. When you do your re-certification on e.g. 2 April 2020, your certification will be valid until 14 September 2022. If you do your certification after 14 September 2020, e.g. on 5 October 2020, your certification will be valid until 5 October 2022.
As always, the PIEK team is ready to assist you if you already want to plan your IPC re-certification course for 2020.
For further questions and/or a booking, please contact Ms Wendy Wings of our Customer Care department on telephone number + 31 45 570 33 33 or at email address [email protected].
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Training calendar 2020
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Training calendar 2020
For 2020 PIEK has greatly extended its training calendar. This means that you now have a wider choice of training courses where you can send your employees to follow a training course. Apart from this, PIEK still offers to come to you to give a course. More and more customers appreciate the possibility of these in-company courses.
The 2020 PIEK training calendar is now ready and includes all IPC and all PIEK training courses: piek.international/training-calendar/.
The only IPC educational institute authorized to give all IPC certifications and re-certifications, PIEK strives to get ever closer to its customers.
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Productronica 2019
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Productronica 2019
This year too PIEK is present at the Munich Productronica fair, together with IPC. This world famous fair is taking place from 12-15 November 2019.
This year the fair will again be overflowing with innovations, and experts in all sorts of fields will exchange ideas all the time. Themes like the electronics of the future, trends in various industries, growth markets, investment opportunities, etc. will be discussed throughout the fair.
Topics to be discussed during the fair will certainly be:
Embedded Systems and Cyber Physical Systems
Smart Factory
Machine-to-machine communication (M2M)
Sector-specific software and systems
Infrastructure and digital networks
Cloud Computing and Big Data
The four days in Munich promise to be exciting and rewarding.
It is also during the Productronica that the next round in the hand-soldering world championship will take place. In four days the best solderers in the electronic interconnect industry will compete against each other. The assignment is to build a functional electronic assembly within a timeframe of 45 minutes. The assembly has to meet the IPC-A-610 class 3 criteria.
The participants are assessed on the time they need to finish the assembly, the number of mistakes they have made and the operation of the assembly. The assessment will be made by IPC-A-610 Master Trainers.
As happens every year, IPC´s Management has asked PIEK to select two of its Master Trainers to act as members of the jury during the hand-soldering competition.
The prize money has been made available by IPC: 1st prize is € 300, 2nd prize is € 200 and 3rd prize is € 100. Apart from this the winner will be invited to defend his title during the IPC Hand Soldering Championship next year, and IPC will pay for the flights and accommodation then.
You can find IPC and PIEK in hall EWE, stand EW-1.
More information about this will appear in one of the next newsletters. You can also have a look at the website of the fair: http://www.productronica.com.
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PIEK visit to FIR in Aachen
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PIEK visit to FIR in Aachen
Ben Walls, PIEK´s Managing Director, attended a presentation by FIR Managing Director Ralf Bigge.
FIR is a non-profit, multidisciplinary research and development institute at the RWTH Aachen University in the field of corporate organisations, information logistics and corporate IT. Its aim is to lay the organisational foundation for the digitally integrated industry of the future. By researching innovative solutions and providing them to companies, FIR contributes to enhancing the competitive powers of companies.
FIR has the right infrastructure for experimental organisational research that is methodically justified, scientifically embedded and supported hands-on by experts from business.
Currently, the focus is on: Future Logistics, Smart Services and Smart Maintenance, and Smart Commercial Buildings and Smart Mobility. The institute coaches companies, researches, qualifies and teaches in the fields of service management, business transformation, information control and production control. As a member of the Association of Industrial Research Associations, FIR fosters research and development that favours small and medium-sized, but also larger enterprises.
Since 2010 FIR Managing Director, professor Volker Stich, is also in charge of the Smart Logistics Cluster on RWTH Aachen Campus. In the Smart Logistics Cluster FIR has created a so far unique form of cooperation between representatives of research and industry. FIR is financed by the German Federal State of Nordrheinland Westfalen and acts as the Research Institute of the Johannes Rau Foundation.
Mr Bigge’s fascinating lecture highlighted the FIR activities, and the subsequent tour of the facilities showed those people present various samples of research conducted or yet to be conducted for companies.
After the tour Ben Walls stated that he quite impressed with the FIR activities and that he saw parallels with PIEK’s activities, e.g. the constant search for innovation and the desire to provide tailor-made work.
If you want to know more about FIR, please click: https://www.fir.rwth-aachen.de.
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IPC-7711C/7721C Rework, Modification and Repair of Electronic Assemblies
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IPC-7711C/7721C Rework, Modification and Repair of Electronic Assemblies
With the previous version, the B-revision of IPC-7711/7721 Rework, Modification and Repair of Electronic Assemblies, being published in 2007, one could argue that an update was long overdue. It was therefore very good that in January 2017 we saw the publication of the C-Revision of this very popular document.
More practical work you cannot get in an IPC certification course. The focus in this training programme is on hands-on work, with theory being reduced to the bare minimum for CIS participants.
Previous users of this document will be happy that IPC kept the original setup of previous versions, which is the three-chapter policy, where the first chapter is a general part, the second deals with rework operations and the third part concentrates on repair and modification procedures. They will appreciate the familiar look and feel. In this way it will be easy to adapt to the newly added procedures, most of them on the modern SMD components like BGA and BTC components.
All the time new component types are developed and marketed. If they have to be replaced in rework procedures, new techniques have to be developed. Specialists in the electronics industry are responsible for this, and they contribute to the steady development of these new procedures which then find their way into the IPC-7711/7721. Before a procedure is integrated, it is extensively tested in practice situations. Then they are reviewed by a committee with members from a variety of companies and organisations in the electronics industry. Here we find people working at training centres, OEMs and EMS companies and repair centres. Thus this standard is a true industry standard.
Topics dealt with are Introduction to common rework and repair procedures, Product classifications, Board types, Skill levels, Work stations, Tools, Materials and processes, Process goals and guidelines, Lead-free considerations, Basic surface mount and through-hole component removal, Land preparation and component installation, Primary heating methods: conductive, convective and others, Handling electronic assemblies, Through-hole component removal and installation, Chip and MELF component removal and installation, SOIC/SOT, J-lead and QFP component removal and installation, BTC, Flip-Chip and BGA component removal and installation, Printed wiring board conductor, Pad and laminate repair, Modifications, Jumper wires, Wire splicing, Conformal coating identification, Removal and replacement, and Tip care and maintenance.
The main part of this document consists of the procedures for a variety of rework, repair and modification tasks similar to the tasks that participants will be confronted with in their daily work. During the training they will profit from the clearly described operations in the standard, but even more from the support from our trainers.
Especially for workmanship courses it is of the utmost importance that trainees get proper education and support from experienced trainers, The trainers at PIEK are thoroughly experienced and offer optimum guidance in the proper use and interpretation of this standard. Benefit from the extensive experience the PIEK trainers have in the use of this document in daily practice and avoid the pitfalls in daily life caused by misinterpretation.
If you consider using the above-mentioned document, it might be a good idea to learn all the ins and outs by attending an IPC-7711C/7721 certification course based on them. These certification courses are provided by PIEK, both in your company or in regionally offered training sessions, and they will increase your knowledge level. Furthermore, training will help you in using the criteria correctly and avoid misinterpretation, which may save time and money. Benefit from the extensive experience the PIEK trainers have in the use of these documents in daily practice and avoid the pitfalls in daily life caused by misinterpretation.
It is good to know that with hands-on training provided by PIEK you have the choice of a variety of sophisticated brands of soldering equipment. If we consider a course based on the IPC-7711/7721 standard, you have the choice of all major brands soldering tools, like Ersa, Hakko, JBC, Metcal, Oki, Pace or Weller.
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IPC-J-STD-001G, Requirements for Soldered Electrical and Electronic Assemblies
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IPC-J-STD-001G, Requirements for Soldered Electrical and Electronic Assemblies
In October 2017 we saw the latest G revision publication of IPC-J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. It was one of the documents for which alignment with other commonly used IPC standards, such as IPC-A-620C and IPC-A-610G, was a major reason for updating. In the course of this alignment conflicting criteria in the various documents were addressed by a group of specialists and modifications were made. As is done in the other new document revisions, IPC now also states that the use of the newer revision is not automatically required.
Shortly after the release of the G Revision of IPC-J-STD-001, in March 2018, IPC also published the Space and Military Applications Addendum to this G revision, IPC-J-STD-001GS. In the base document there is a reference indicator to requirements that are different from the ones in the base document. This is done by means of the Space Station Symbol.
IPC-J-STD-001 is the document of choice if you need information on process control in relation to the assembly processes. It covers requirements on equipment to be used in soldering processes as well as materials, like for instance flux and solder alloys used in this process. It gives regulations to be followed for work facilities, such as lighting, temperature and humidity issues.
Topics dealt with are: general requirements e.g. on health and safety, personnel proficiency and definitions, materials, components and equipment requirements, general soldering and assembly requirements, wires and terminal connections, through-hole mounting and termination, surface mounting of components, and rework and repair.
Topics on cleaning that are specific for the IPC-J-STD-001 are found in a chapter called Cleaning process requirements. Apart from general information and criteria on cleaning, for instance ultrasonic cleaning, this chapter also describes several cleanliness test methods.
The chapter on PCB requirements addresses issues such as delamination, haloing, marking, bow and twist, depanelisation, edge contacts etc..
A chapter specific for IPC-J-STD-001 is Product assurance. It deals with issues such as process control requirements, opportunities determination and statistical process control.
If you consider using the above-mentioned document, it may be a good idea to learn all the ins and outs by attending an IPC certification course based on them. These certification courses are provided by PIEK both in your company or in regionally organised training sessions, and they will increase your knowledge level.
The certification course for IPC J-STD-001 not only comprises theory and a written exam, but also has hands-on soldering tasks on wire and terminals, through-hole technology and SMT. Also inspection will be performed in practical tasks. In a workmanship training course like IPC-J-STD-001 it is important that trainees get proper education and support from experienced instructors.
It is good to know that with hands-on training provided by PIEK you have the choice of a variety of sophisticated brands of soldering equipment. If we consider a course based on the IPC-7711/7721 standard, you can choose from all major soldering tool brands, such as Ersa, Hakko, JBC, Metcal, Oki, Pace or Weller.
Even though IPC documents can be bought and used by anybody that has an interest in them, proper training in many cases proves beneficial to the proper understanding and interpretation of the criteria contained within. The trainers at PIEK are experienced and offer optimum guidance in the proper use and interpretation of this standard. Benefit from the extensive experience the PIEK trainers have in the use of this document in daily practice.
If you consider using either of the above-mentioned documents, it may be a good idea to learn all the ins and outs by attending an IPC certification course based on them. These certification courses are provided by PIEK both in your company or in regionally offered training sessions, and they will increase your knowledge level. Furthermore, training will help you to use the criteria correctly and avoid misinterpretation, which may well save time and money. Profit from the extensive experience the PIEK trainers have in the use of these documents in daily practice and avoid the pitfalls in daily life caused by misinterpretation.
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IPC-A-610G, Acceptability of Electronic Assemblies Boards
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IPC-A-610G, Acceptability of Electronic Assemblies Boards
IPC-A-610 Acceptability of Electronic Assemblies, in its latest G Revision, was published in October 2017. Of all the acceptance criteria documents in the IPC portfolio it is the one that is used most frequently and is best known throughout the electronics industry. It has been the base document in inspection departments at EMS companies and OEMs for decades. Apart from this, it has been referred to in numerous contract documents for the procurement of PCBAs (Printed Circuit Board Assemblies) worldwide.
One major improvement in this G Revision has been the alignment with other commonly used IPC standards, like for instance IPC-A-620C and IPC-J-STD-001G. Conflicting criteria in the various documents have been addressed by a group of specialists, and modifications have been made, for instance to paragraph 4.2, Jackpost mounting, which is now in line with the other documents. Pictures have been exchanged and added for clarification of the texts.
Obviously, the criteria from Amendment 1 to the F-Revision were considered as well when the G-Revision was under development, which means for instance that table 7-4 is now completely up to date.
Even though this G Revision is the latest version of the document, IPC states that the use of the newer revision is not automatically required. Which revision is applicable will have to be decided by a customer.
The IPC-A-610 starts with a general introduction section where we find topics like product classification, definition of requirements, terms and definitions, personnel proficiency, inspection methodology, lighting, magnification aids, and materials and processes. Criteria have been revised and if necessary updated. New criteria have been added. Definitions have been added or the wording changed for clarification.
As usual the third chapter concentrates on handling, but only limited changes were made here. However, IPC now forbids not only the use of tobacco products but also includes smoking and even e-cigarettes.
Other topics dealt with are general soldering criteria, including lead-free connections, soldering anomalies, such as tombstoning, non-wetting and de-wetting, voiding and more, high voltage criteria, soldered connection requirements for connecting to terminals, soldered connection requirements for plated-through holes, surface mounting criteria for chip components, leadless and leaded chip carriers, component mounting criteria for DIPS, socket pins and card-edge connectors, jumper wire assembly requirements, solder fillet dimensional criteria for all major SMT component groups, criteria for component damage, laminate conditions, cleaning and solder mask and conformal coating, hardware installation and solderless wire wrap.
Like all IPC standards the IPC-A-610 is developed and reviewed by a committee with members from a variety of companies and organisations in the electronics industry. Here we find people working at training centres, OEMs and EMS companies. It is their knowledge and experience that nourishes this document, thus being a true industry standard.
The vast amount of pictures helps the user of the IPC-A-610 to better understand the criteria by providing pictorial information on the topics addressed in this standard. However, it is these pictures that may also lead to misinterpretation if used incorrectly. Even though IPC documents can be bought and used by anybody that has an interest in them, proper training in many cases proves beneficial to the proper understanding and interpretation of the criteria contained within.
The trainers at PIEK are experienced and offer optimum guidance in the proper use and interpretation of this standard. Benefit from the extensive experience the PIEK trainers have in the use of this document in daily practice and avoid the pitfalls in daily life caused by misinterpretation.
If you consider using either of the above-mentioned documents, it may be a good idea to learn all the ins and outs by attending an IPC-A-610 certification course based on them. These certification courses are provided by PIEK both in your company or in regionally organised training sessions, and they will increase your knowledge level. Furthermore, training will help you to use the criteria correctly and avoid misinterpretation, which may save time and money. Benefit from the extensive experience the PIEK trainers have in the use of these documents in daily practice and avoid the pitfalls in daily life caused by misinterpretation.
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IPC/WHMA-A-620C, Requirements and Acceptance for Cable and Wire Harness Assemblies
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IPC/WHMA-A-620C, Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC/WHMA-A-620C, Requirements and Acceptance for Cable and Wire Harness Assemblies, is the most important process, materials and inspection standard for the cable and wire harness industry at the moment. In the latest version, the C Revision, which was published in January 2017, IPC has managed to update many criteria and insert new pictures. It describes materials, methods, tests and acceptability criteria for producing crimped, mechanically secured, or soldered interconnections and the related assembly activities associated with cable and harness assemblies.
Even though the C Revision is the latest version of the document, IPC states that the use of the newer revision is not automatically required. The decision which revision to use rests with the customer who orders the wire harness products. One major improvement in this C Revision has been the alignment with other commonly used IPC standards.
Like all IPC standards the IPC-A-620 is developed and reviewed by a working group with members from a variety of companies and organisations in the electronics industry. Here we find people working at Wire Harness manufacturers, suppliers of materials and equipment, training centres, OEMs and EMS companies. It is their knowledge and experience that nourishes this document, thus being a true industry standard. The IPC/WHMA-A-620, however, takes a slightly different approach, since it is co-developed by IPC and WHMA, the Wire Harness Manufacturers Association.
Although one of the typical applications of the IPC/WHMA-A-620 is to be used as a reference for in-process and final inspection purposes of wire harnesses, it can be used as a single document for the purchasing of wire harnesses as well. To ensure consistent quality levels during the manufacturing of wire harness products, the document’s intent is to rely on process control methodology.
In the introduction section the IPC/WHMA-A-620 deals with topics such as product classification, inspection conditions, terms and definitions, personnel proficiency, inspection methodology, lighting, magnification aids, facilities, ESD considerations, tools and equipment, and materials and processes. Requirements for the maintenance of tools and equipment as well as calibration are to be found in here as well. Contamination, rework and repair are dealt with as well.
Studying this section gives you a good overview of the process requirements for the wire harness manufacturing processes. Utilizing these criteria in your organisation will give you a good preparation for audits related to the IPC-A-620 and general production process parameters.
Further topics in the IPC-A-620C are methods and criteria for stripping of wires, materials and equipment used for soldered terminations, criteria for inspection, criteria for crimped terminations and isolation displacement connection criteria. Ultrasonic welding, splices, connectorisation and over-moulding / potting are covered too. The correct measurement of cable assemblies and wires and tolerances are described. Also the chapters on marking / labelling, coaxial and biaxial cable assemblies, securing, electrical shielding, protective coverings and finished assembly have been slightly changed. Testing is still one of the topics.
A chapter on high voltage has been added to offer an even more complete basis, including the inspection of even these applications. Another significant addition is the criteria for the contamination of solder baths, which have been added in chapter 4. In Chapter 17 a paragraph on safety wiring has been added.
If you consider using the IPC/WHMA-A-620 document it may be a good idea to learn all the ins and outs by attending an IPC/WHMA-A-620 certification course based on them. These certification courses are provided by PIEK on a regular basis and will increase your knowledge level. Furthermore, training will help you to use the criteria correctly and avoid misinterpretation, which may well save time and money. Benefit from the extensive experience the PIEK trainers have in the use of these documents in daily practice and avoid the pitfalls in daily life caused by misinterpretation.
To get even more out of the training sessions, you could also opt for the additional hands-on module. Even though this is not part of the regular training, it is on offer and gives participants the possibility to practise and become familiar with the basics of wire harness manufacturing like soldering and crimping.
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IPC-6012 Qualification and Performance Specifications for Rigid Printed Boards
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IPC-6012 Qualification and Performance Specifications for Rigid Printed Boards
If we talk about purchasing rigid bare board (or PCB) manufacturing the IPC-6012 is the most used document. This is one of a series of documents, also called the Qualification and Performance Specifications for Printed Boards. At the basis of this series is the IPC-6011 standard, in here we find definitions for the product classes, and general requirements for instance on documentation, qualification assessment, quality assurance etcetera. The IPC-6012 is the document that contains the Qualification and Performance Specifications for Rigid Printed Boards. Other standards in this series are IPC-6013, IPC-6015, IPC-6017 and IPC-6018.
Topics in this IPC-6012 document are: Material requirements, Visual inspection requirements, Solder mask requirements, Electrical requirements and electrical tests to be performed, Cleanliness requirements and the applicable tests. Also, a variety of special requirements that might be specified by contract by the customer are listed and described. Also, definitions and requirements about rework and repair are to be found. One chapter concentrates on Quality Assurance Provisions.
The IPC-6012 also addresses the minimal thicknesses of final finishes and copper plating in the through-holes and via’s. In general, one might say that the dimensions and tolerances commonly used in circuit board manufacturing are implemented in numerous tables.
Catering for the electronics industry for space applications is the addendum to this general IPC-6012D, the IPC-6012DS document, providing specific criteria for this area. Specific automotive application considerations can be found in the IPC-6012DA. Both addendums built up on the general IPC-6012 providing typically used criteria for these areas.
For more information regarding the actual processes and materials used at the production stages and for in depth information on the applicable tests to be performed for quality assurance the IPC-6012 is the best if rigid printed circuit boards are involved. These can be single-sided boards, multi-layers, HDI boards, boards with integrated passive components and metal core boards. It is the document of choice for process engineers and purchasers at printed circuit manufacturers, but designers as well as assembly process engineers at the EMS or OEM might benefit greatly from it.
If you consider using this document, it might be a good idea to learn all the ins- and outs by attending an IPC-6012 certification training based on them. These certification trainings are provided by PIEK on both documents and will increase your knowledge level. Furthermore, training will help you in using the criteria correctly and avoid misinterpretation, which might save time and money. Profit from the extensive experience the PIEK trainers have on the use of these documents in daily practice and avoid the pitfalls in daily life caused by misinterpretation.
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PIEK, a family firm with over 50 years of experience
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PIEK, a family firm with over 50 years of experience
PIEK was founded in 1965 by the parents of the current two Managing Directors, Ben and Rob Walls. The parents spotted a high demand for education in the field of electronics, as e.g. applied in radios. It did not take long before the range of courses and venues was extended. In the 70s PIEK was present in many towns and cities in the Dutch provinces Limburg and Noord Brabant, providing evening courses.
When microelectronics was making itself felt in the automotive industry in the early nineties, PIEK immediately recognized this gap in the market. At the time there were hardly any courses in this field. PIOEK developed tailor-made courses for the automotive industry. It was DAF Nederland that was quick to recognize PIEK’s qualities and that asked PIEK to also develop electronics courses for lorry production. DAF Germany was soon to follow, as was the rest of Europe. Not only DAF made use of PIEK’s knowledge and experience, but also other manufacturers did, such as Skoda, Opel and Daewoo. The Netherlands then saw the cooperation emerge with INNOVAM.
In the mid-nineties PIEK started to concentrate on and specialise in courses for the electronics producing industry. These included tailor-made courses and certifications, and services to go with them. In 1995 IPC was chosen as the standard, though it was still relatively unknown in Europe. It did not take long before all PIEK instructors were all MIT certified and PIEK was authorised to provide all IPC certifications and re-certifications on IPC’s behalf.
In the new millennium PIEK has extended its activities further internationally still. Cooperation with industry organisations in Germany such as ZVEI, Vdl and EITI is now a matter of course. Apart from the IPC certifications PIEK has also marketed its own PIEK certifications, the result of 100% in-house research and development. The latter courses provide more in-depth and widened information on top of existing IPC courses, and they may be good alternatives for companies that do not strive for IPC certifications but do want to keep the knowhow of their staff up-to-date.
More and more companies want to work with PIEK, especially suppliers of soldering equipment. Currently, PIEK can make use of the soldering equipment of the best known companies, such as Almit, Ersa, Hakko, JBC, Pace, Weller, Oki/Metcal and Tooltronics.
PIEK now offers a complete service package to its customers, including IPC certifications in the fields of PCB design, PCB manufacturing, PCB assembly, PCB rework and repair, and cable and wiring techniques. Moreover, PIEK has a test centre and it has a consultancy department. Finally, PIEK has also added validation services and qualification service to its wide range of services.
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IPC-A-600J, Acceptability of Printed Boards
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IPC-A-600J, Acceptability of Printed Boards
IPC-A-600 Acceptability of Printed Boards, is the best-known standard for the inspection of bare boards, often called PCBs, throughout the electronics industry. It has been the base document in inspection departments at bare board manufacturers for decades. And it has been referred to in the majority of contract documents for the procurement of bare boards worldwide.
The current J Revision was published in May 2016 and again showed a vast amount of improvements and clarifications with respect to the former H Revision. With users relying on the support of the pictorial display of the criteria at hand most have been very pleased with the many new pictures that were introduced when the IPC-A-600 J Revision was published. It is this pictorial support that has made the IPC-A-600 the document of choice for inspection as well as quality assurance departments globally for years. It is commonly used as a reference during the board manufacturing process steps, as a final inspection at the board shop or as an incoming inspection at the assembly plant or EMS.
Like all IPC standards the IPC-A-600 is developed and reviewed by a committee with members from a variety of companies and organisations in the electronics industry. Here we find people working at PCB manufacturers, training centres, OEMs and EMS companies. It is their knowledge and experience that nourishes this document, thus being a true industry standard.
Some topics from IPC-A-600 that are inspected at PCB level are Burrs, Nicks, Haloing, Measling, Delamination, Solder Coatings, Holes, both Plated-Through and Unsupported, Printed Contacts, Marking, Solder Mask, and Pattern Definition.
One chapter of IPC-A-600 deals with the inspection of micro-sections. The test coupons used for this might be inspected for issues such as Laminate Voids, Delamination, Smear Removal, Conductor Thickness, both for External and for Internal Layers, Layer-to-Layer Spacing, Cracks, Annular Ring, etc. Criteria have been revised and if necessary updated. New criteria have been added.
In the latest revision of IPC-A-600, the J-Revision published in 2016, there is also information to be found on Microvias, both unfilled and copper-filled and Copper Wrap Plating.
One of its chapters deals with inspection criteria for Flexible and Rigid-Flex Printed Boards as well as Metal Core Printed Boards. In the last chapter general handling considerations are discussed, as are the cleanliness and solderability tests which have to be performed. The solderability testing criteria have been updated and are now in line with the latest IPC/J-STD-003C Revision.
If you need to inspect either the entire board visually or by automatic equipment [AOI] or the micro-sections from the test coupons, then the IPC-A-600 is the document of choice, especially since this standard focuses on the criteria and provides a lot of pictorial examples.
The vast amount of pictures help the user of the IPC-A-600 to better understand the criteria by providing pictorial information on the topics addressed in this standard. However, it is these pictures that might also lead to misinterpretation if used incorrectly. Even though IPC documents can be bought and used by anybody that has an interest in them, proper IPC-A-600 training in many cases proves beneficial to the proper understanding and interpretation of the criteria contained within.
The trainers at PIEK are experienced and offer optimum guidance in the proper use and interpretation of this standard. Benefit from the extensive experience the PIEK trainers have in the use of this document in daily practice and avoid the pitfalls in daily life caused by misinterpretation.
If you consider using either of the above-mentioned documents, it may be a good idea to learn all the ins and outs by attending an IPC certification course based on them. These certification courses are provided by PIEK both in your company or in regionally organised training sessions, and they will increase your knowledge level. Furthermore, training will help you to use the criteria correctly and avoid misinterpretation, which may save time and money. Benefit from the extensive experience the PIEK trainers have in the use of these documents in daily practice and avoid the pitfalls in daily life caused by misinterpretation.
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e.GO: an affordable electric car for everybody
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e.GO: an affordable electric car for everybody
Electric mobility, a catchphrase that you see every day. Aachen, Germany is home to the production halls of the e.GO, the affordable electric car for everybody.
Production takes place in an ultra-modern hall in Aachen. One thing you do not see there are welding robots, as e.GO has turned the production process into a magnificent form of digital art. Far-reaching digitisation is at the heart of a tightly controlled production process, in which all the possibilities of 5G technology are used. The actual assembly work is done by humans rather than robots, as this much more efficient and cheaper than what you see in the intricate production lines of traditional car makers.
Ben Walls, PIEK’s Managing Director, was present during a tour of the production facilities and was quite impressed with what he saw. ‘Here at e.GO you see the possibilities that the electronic interconnect industry offers actually at work. It is unbelievable how digitisation is implemented here. This is industry 4.0. Apart from this, the opportunities opening up by using 5G are also phenomenal. The traditional car industry can learn a lot from these practices, especially in R&D and in saving costs. PIEK sees tremendous potential in the knowhow already present in e.GO and would love to play a role.’
To give you a few impressions of the e.Go, this article has been illustrated with a number of pictures taken in the production facilities. What is interesting about the car is that 3500 had already been sold before the first one was actually produced. And at a selling price of €12,000 in Germany it is the cheapest electric four-seater car by far that is available in today’s market. It is ideal for commutes and city traffic, and with its 100-150-kilometre range the e.GO is a serious alternative for many small car with a combustion engine.
If this has whetted your appetite, this website may be worth checking out: https://www.e-go-mobile.com
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2019 Trends, the sequel
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2019 Trends, the sequel
We already stated in an earlier newsletter that we were going to look into a number of trends for the year 2019. In this article we will look into digital ethics, fake content and blockchain.
Digital ethics In the week of 20 March the headlines in the Dutch media were about The Netherlands losing ground in the field of Artificial Intelligence (AI) if the government did not act up fast. However, is a wait-and-see approach so bad when it comes to AI? Currently, there is too little or no legislation on AI in place. The EU is calling for legislation on AI in order to set both an ethical and a legal framework. Let’s make the mental step to digital ethics in an autonomously driving car. Who is responsible when there is an accident? The producer, the software programmer, or the person commissioning the software programmer to do certain work? Such questions require answers. As AI is developing at a formula-1 pace, governments and judicial authorities will have to step up their efforts to keep up and provide a proper legal safety net.
Fake content Have you heard that Vladimir Putin and Donald Trump share the same mistress? Or that Mark Rutte has joined Forum voor Democratie? Fake news is not a new phenomenon, but it is becoming harder to distinguish real news from fake news. Modern communication and social media help fake news to travel fast, and once the established media get hold of it without adequate fact checking a fake news item can suddenly seem a fact. Artificial Intelligence plays a dubious role in this, creating totally believable content. In professional jargon such items are called deep fakes. Such deep fakes are subsequently used to put organisations under pressure or even blackmail them, as was the case with actress Emma Watson not long ago.
Blockchain Blockchain has tremendous potential. In principle blockchain is a sort of ledger in which separate items can no longer be changed and are stored de-centrally on many different computers. This prevents unauthorised people from gaining access to them. Many sectors can benefit from this technology, such as healthcare, the notary sector and governments. With blockchain technology in place payments can be greatly simplified and therefore made cheaper. Banks could even become redundant in time. Various countries and various industries are now experimenting with blockchain. One example is India, where the Land Registry Office uses blockchain. The government in Dubai is another example, figuring out how to streamline its services with blockchain. Universities could also benefit from blockchain, e.g. in reducing the workload for teachers with the creation of national databases of exam questions.
In our next newsletter about trends we will be discussing the workplace of the future, robots and basic income.
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