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allupdatesofmarket · 4 months ago

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The latest 2025! Summary of Analog-to-Digital Converter Chips Market share and trends in the world

Unlocking Hidden Growth: Must-Know Challenges, and Opportunities in the Analog-to-Digital Converter Chips Market

Market Overview

Technological advancements and evolving market demands are driving a profound transformation in the Analog-to-Digital Converter Chips Market. This report offers a strategic roadmap, providing businesses with a comprehensive analysis of emerging trends, key growth drivers, and potential obstacles. Our data-driven insights, spanning from 2025 to 2033, focus on vital aspects such as pricing strategies, adoption rates, product innovation, and regional market penetration.

Key Market Insights

Growth Projection: The Analog-to-Digital Converter Chips Market is projected to grow at a compound annual growth rate CAGR of 9.05% between 2024 and 2033.

Market Valuation: By 2033, the market is expected to reach a valuation of USD 8.41 billion.

Key Drivers: Technological innovations, changing regulatory landscapes, and evolving consumer preferences are influencing the market growth.

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Transformative Trends Shaping the Analog-to-Digital Converter Chips Market

Staying competitive in the Analog-to-Digital Converter Chips Market requires an understanding of key trends that are reshaping the landscape. Below are some of the most significant shifts:

1. The Rise of Smart Technologies and Digital Transformation

AI-powered automation and analytics are enhancing productivity and streamlining client interactions.

Businesses leveraging IoT and big data are gaining a competitive edge by optimizing operations and decision-making.

2. Personalization and Customization: A Growing Demand

Consumers’ increasing preference for personalized solutions is pushing companies to innovate in product offerings.

Customizations are becoming a game-changer, offering businesses new ways to meet consumer expectations and stand out in the market.

3. Navigating the Complex Regulatory Environment

Government regulations are reshaping cost structures and operational strategies across industries.

Adapting to new compliance standards is crucial for companies aiming for long-term sustainability in the market.

Competitive Landscape: Leading Players in the Analog-to-Digital Converter Chips Market

Understanding the competitive dynamics in the Analog-to-Digital Converter Chips Market is essential for informed decision-making. This section analyzes the forces shaping the industry and presents a SWOT analysis of the top key players driving market growth.

Leading Companies in the Analog-to-Digital Converter Chips Market

Texas Instruments

Analog Devices

Maxim Integrated Products

Microchip Technology Inc.

NXP Semiconductors N.V.

STMicroelectronics

Renesas Electronics Corporation

Cirrus Logic

ON Semiconductor

Rohm Co.

others

Strategic Moves: The latest mergers, acquisitions, and partnerships influencing market share.

Market Share Analysis: How the dominant players are strengthening their positions in the market.

Growth Potential: Identifying emerging opportunities for new entrants and existing players.

Explore the Full Competitive Report: Access the Report

Market Segmentation: Uncovering High-Growth Opportunities

Understanding the market segmentation is critical for companies aiming to refine their strategies. Our research breaks down the Analog-to-Digital Converter Chips Market based on

By Type

High-Speed ADCs

Low-Speed ADCs

By Resolution

8-bit

12-bit

16-bit

24-bit

By Applications

Consumer Electronics

Telecommunications

Automotive

Healthcare

Industrials

Others

Regional Market Demand: The Biggest Growth Markets

Each region offers unique growth opportunities and challenges. This section provides an in-depth look at regional demand trends, market drivers, and the factors influencing expansion across key geographies.

North America

Europe

Asia-Pacific

Latin America

The Middle East and Africa

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Why Choose Our Research?

Data Accuracy: Our research relies on verified sources and rigorous validation techniques.

Comprehensive Research Approach: Combining primary research (interviews, surveys) with secondary data for an accurate market overview.

Industry Expertise: In-depth knowledge from domain experts provides actionable insights for your business.

AI-Powered Analytics: State-of-the-art tools ensure precise market forecasting and insights.

Ethical Practices: Our reports are transparent, unbiased, and focused on delivering reliable market intelligence.

Frequently Asked Questions (FAQs)

What is the projected growth rate of the Analog-to-Digital Converter Chips Market?

What are the primary factors driving the expansion of the Analog-to-Digital Converter Chips Market?

What challenges are currently hindering the growth of the Analog-to-Digital Converter Chips Market?

How is the market segmented, and which segments are expected to experience the most growth?

Which regions are leading the demand for Analog-to-Digital Converter Chips Market, and why?

About Market Strides

Market Strides is a leading provider of global market intelligence, specializing in research reports across various industries. Our expertise lies in market sizing, competitive analysis, and trend forecasting, empowering businesses to make data-driven decisions and stay ahead of market trends.

#Analog-to-Digital Converter Chips Market Size #Analog-to-Digital Converter Chips Market Share #Analog-to-Digital Converter Chips Market Growth #Analog-to-Digital Converter Chips Market Trends #Analog-to-Digital Converter Chips Market Players

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pravinpintos · 7 days ago

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semiconductor-hub · 8 months ago

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Analog Semiconductor Market Current Trends, Technology and Industry Analysis 2032

Analog semiconductors are critical components in the electronics landscape, enabling the processing of real-world signals such as sound, light, and temperature. Unlike digital semiconductors, which operate on discrete values, analog semiconductors process continuous signals, making them essential for applications requiring high fidelity and real-time response. These devices encompass a wide range of components, including operational amplifiers, voltage regulators, and analog-to-digital converters (ADCs).

The demand for analog semiconductors is driven by the proliferation of electronic devices and the increasing complexity of signal processing requirements. As industries embrace advancements in automation, IoT, and consumer electronics, the need for high-performance analog solutions is growing. Innovations in analog semiconductor technology are enabling more efficient power management, enhanced signal integrity, and improved performance in diverse applications.

The Analog Semiconductor Market is expanding due to the rising need for analog components in various applications, including automotive, telecommunications, and industrial electronics, driven by trends toward greater connectivity and automation.

Future Scope

The future of analog semiconductors is promising, with significant growth anticipated across various sectors. As the demand for connected devices continues to rise, the need for high-quality analog components will be paramount. Analog semiconductors will play a vital role in enabling the seamless integration of analog signals with digital processing systems, particularly in applications such as IoT devices, smart sensors, and automotive electronics.

Moreover, the transition to electric vehicles (EVs) and renewable energy systems will create new opportunities for analog semiconductor solutions. These applications require advanced power management and signal processing capabilities, driving innovation in analog device design and manufacturing. The ongoing evolution of technology will necessitate the development of analog components that can operate efficiently in diverse environments and handle complex signal processing tasks.

Trends

Several key trends are shaping the analog semiconductor market. One significant trend is the increasing integration of analog and digital functions within a single chip, known as mixed-signal integration. This approach simplifies circuit design, reduces board space, and enhances performance, making it particularly relevant for portable and compact electronic devices.

Another trend is the growing emphasis on energy efficiency and power management. As industries seek to reduce energy consumption and improve sustainability, analog semiconductors that offer low power consumption and high efficiency are becoming increasingly important. This trend is particularly evident in applications such as battery-powered devices and energy harvesting systems.

Application

Analog semiconductors find applications across various sectors, including consumer electronics, automotive, industrial automation, and telecommunications. In consumer electronics, they are essential for audio and video processing, enabling high-fidelity sound and image quality in devices such as smartphones, TVs, and home theater systems.

In the automotive sector, analog semiconductors play a vital role in power management, sensor interfaces, and advanced driver-assistance systems (ADAS). These devices ensure the reliability and performance of critical automotive systems, contributing to enhanced safety and efficiency.

In industrial automation, analog semiconductors are used in control systems, sensor interfaces, and power management solutions. Their ability to process real-world signals is crucial for monitoring and controlling industrial processes, enabling greater efficiency and productivity.

Key Points

Enable the processing of real-world signals in electronic devices.

Driven by the growing demand for high-performance and integrated solutions.

Promising future with growth opportunities in IoT, EVs, and renewable energy.

Trends include mixed-signal integration and energy efficiency.

Applied in consumer electronics, automotive, industrial automation, and telecommunications.

Read More Details: https://www.snsinsider.com/reports/analog-semiconductor-market-4538

Akash Anand — Head of Business Development & Strategy

Email: [email protected]

Phone: +1–415–230–0044 (US) | +91–7798602273 (IND)

#Analog Semiconductor Market

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electronalytics · 2 years ago

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High-speed DACs Chip Market Report Includes Dynamics, Products, and Application 2017 – 2032

High-speed Digital-to-Analog Converters (DACs) are used in various applications that require high-speed and high-precision analog signal generation. These applications include wireless communication, video and audio broadcasting, radar systems, test and measurement equipment, and more.

The report assists clients in forecasting investments in developing markets, market share growth, or the success of new products. This dependable marketing research simplifies the difficult market insights for High-speed DACs by utilizing tried-and-true strategies and procedures. To make facts and numbers easier to understand, data is portrayed using graphs and charts. This High-speed DACs market study was created using integrated approaches and cutting-edge technology. The High-speed DACs market research study analyses and assesses emerging trends, as well as important market drivers, restraints, challenges, and opportunities.

The High-speed DACs chip market is highly competitive, with several players offering a wide range of products with varying levels of performance and features. The products in this market include standalone DACs, SoC-based DACs, and FPGA-based DACs.

In terms of applications, the High-speed DACs chips are used in various industries, including telecommunications, aerospace and defense, healthcare, and automotive. The telecom industry is the largest consumer of High-speed DACs chips, followed by the aerospace and defense industry.

In conclusion, the High-speed DACs chip market is expected to grow steadily over the next few years, driven by the increasing demand for high-speed data transfer and high-resolution audio and video content. The major players in this market are investing heavily in R&D to develop high-performance and cost-effective solutions that meet the evolving needs of their customers.

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Market Segmentations: Global High-speed DACs Market: By Company • ADI • TI • Maxim • Microchip • Renesas Electronics • KT Micro • CoreBai Microelectronics • Suzhou Novosense Microelectronics • TitanMicro Electronics Global High-speed DACs Market: By Type • MSPS: 20-100 • MSPS: 100-1000 • MSPS: ≥1000 Global High-speed DACs Market: By Application • Consumer Electronics • Communications • Automotive • General Industrial • Others Global High-speed DACs Market: Regional Analysis All the regional segmentation has been studied based on recent and future trends, and the market is forecasted throughout the prediction period. The countries covered in the regional analysis of the Global High-speed DACs market report are U.S., Canada, and Mexico in North America, Germany, France, U.K., Russia, Italy, Spain, Turkey, Netherlands, Switzerland, Belgium, and Rest of Europe in Europe, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, China, Japan, India, South Korea, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), and Argentina, Brazil, and Rest of South America as part of South America.

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Objectives of High-speed DACs Market Study: The objectives of High-speed DACs market research report may vary depending on the specific needs and goals of the business or organization commissioning the report. However, some common objectives of market research reports include: • Understanding the market size and potential: One of the primary objectives of High-speed DACs market research is to understand the size and potential of a particular market. This includes analyzing market trends and dynamics, identifying key players and competitors, and assessing the demand for products or services. • Identifying target customers and segments: this market research reports can help businesses identify and understand their target customers and market segments, including their preferences, behaviors, and demographics. This information can be used to develop targeted marketing and advertising strategies. • Evaluating product or service performance: this market research reports can provide valuable insights into the performance of products or services, including customer satisfaction, product usage, and product quality. This information can be used to improve products or services and enhance customer satisfaction. • Assessing market opportunities and threats: this market research reports can help businesses identify potential market opportunities and threats, including emerging trends, competitive threats, and new market entrants. This information can be used to develop strategic plans and make informed business decisions. • Developing effective marketing and advertising strategies: this market research reports can help businesses develop effective marketing and advertising strategies by providing insights into customer preferences and behavior, competitive dynamics, and market trends. This can help businesses improve brand awareness, customer engagement, and overall marketing effectiveness. Overall, the objectives of High-speed DACs market research report are to provide businesses and organizations with valuable insights and data-driven recommendations that can help them make informed business decisions and stay competitive in their industry.

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Syndicated market research reports, on the other hand, are pre-existing reports that are available for purchase by multiple clients. These reports are often produced on a regular basis, such as annually or quarterly, and cover a broad range of industries and market segments. Syndicated reports provide clients with insights into industry trends, market sizes, and competitive landscapes. By offering both custom and syndicated reports, Stringent Datalytics can provide clients with a range of market research solutions that can be customized to their specific needs.

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#High-speed DACs Chip Market #global market insights #global market report #global research market report #global High-speed DACs Chip Market

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usacounselingcredit · 2 years ago

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Houston Texas Appliance Parts: Wireless SoCs Solve Connectivity Challenges

Houston Texas Appliance Parts

Wireless SoCs Solve Connectivity Challenges

by Houston Texas Appliance Parts on Monday 30 January 2023 02:21 PM UTC-05

Wireless systems-on-chip (SoCs) are favored by IoT system designers for their high functionality, low power consumption and space savings. These devices are comprised of a number of key components, including the processors, radios, power management, memory, interfaces and peripherals.

One of the biggest drivers in wireless SoCs is the growing need for multi-protocol support to meet the requirements of different IoT devices. Chipmakers need to keep up with existing standards that continue to evolve as well as new wireless standards. These include Wi-Fi, Bluetooth LE, Bluetooth classic, 802.15.4, ZigBee, Thread, Z-Wave, Matter, cellular and other proprietary wireless protocols.

Through this integration and multi-protocol support, wireless SoCs are solving some of the biggest technical challenges around wireless design while simplifying development by providing all of the necessary functionality, along with the connectivity and security in one device. But designers aren't on their own; SoC makers also provide complete ecosystems and reference designs that can lower design risk and shorten the design cycle.

"A wireless SoC typically comprises the radio itself—one or more, depending on the application—a MAC/PHY for the Wi-Fi and PHY for Bluetooth, along with a power management unit, memory, various I/O ports, a debug port, possibly an analog-to-digital converter and bus management IP," said Brandon Bae, senior director of product marketing for wireless connectivity at Synaptics Incorporated. "Interfaces for external power amplifier and low-noise amplifier options, with associated switches, are also good to have."

Brandon Bae (Source: Synaptics Incorporated)

Depending on the protocols supported and the end applications, the components in a wireless SoC could be different, said Dhiraj Sogani, senior director of wireless product marketing at Silicon Labs. "Power optimization, longer range, robust connectivity, higher processing power, more peripherals and higher memory will continue to be the driving trends in wireless SoCs, and we will see continuous improvement in these."

Wireless SoCs are also packed with security features, making them suited for a range of embedded IoT systems, such as smart homes, smart metering, building automation and fitness devices.

"Security is increasingly a concern to protect personal data and to protect IP, and many SoCs are adding features to address security at multiple hardware and software levels," said Nathalie Vallespin, wireless product line marketing manager at STMicroelectronics.

Highly integrated wireless SoCs

As demand grows for wireless SoCs, chipmakers continue to meet requirements for better security and greater interoperability and are adding advanced features for sensors, graphics, artificial intelligence and machine learning. There is also a drive toward multi-protocol connectivity support with options for Wi-Fi, Bluetooth, LoRa, Zigbee, Matter and other protocols.

"There is always a requirement for a higher level of integration in the wireless SoCs to meet the application use cases, simplify IoT device development and reduce cost," Sogani said.

One of the key areas is a higher level of hardware and software integration, which includes the integrated applications processor, integrated networking stacks, cloud connectivity, digital and analog peripherals, additional GPIOs and higher memory, along with support for new protocols like Matter, Amazon Sidewalk and Wi-SUN, he added.

"Integration of multiple protocols is becoming critical," Sogani said. These include the combinations of Wi-Fi and BLE and 802.15.4 and BLE, as well as Wi-Fi, BLE, 802.15.4 and even sub-gigahertz integration.

"Bluetooth classic integration is also needed to support legacy headsets," he added. "These protocols need to operate concurrently, which needs significant hardware and software work."

Dhiraj Sogani (Source: Silicon Labs)

In addition, "Matter over Thread and Matter over Wi-Fi is gaining significant momentum, as it enables interoperability of different ecosystems, such as Google, Amazon and Samsung," Sogani said. "Wi-SUN is becoming more critical for smart-city deployments. Amazon Sidewalk shows significant promise to become a leading protocol for neighborhood connectivity."

Vallespin noted that the evolution in standards is also enabling new use cases: "In Bluetooth Low Energy, audio is creating many new use cases to manage new user experiences and is replacing the Bluetooth classic technology. Matter technology, just announced late last year, is a new standard for connected-home applications, and ultra-wideband is increasingly being used for car access control."

STMicroelectronics offers a wireless roadmap based on its popular STM32 family of microcontrollers and ecosystem. These include the STM32WB series for Bluetooth LE, Thread, Matter and Zigbee and the STM32WL for LoRa and other sub-gigahertz protocols. "STM32 wireless products add best-in-class IPs to smoothly migrate to wireless platforms," Vallespin said.

Sogani noted two other key trends, including the integration of machine learning for IoT edge devices for simple audio, vision and data applications like keyword spotting, motion detection and glass-break detection, as well as security integration at the hardware and software level for improving IoT device security.

Synaptics' Bae agreed that there is a higher degree of integration coming: "We're looking at advancing to finer nodes to not only shrink the die size, but it also frees up space to integrate more memory for more features for a given package size. The drivers tend to be functionality, size, power and cost, so if we can provide greater functionality for a given footprint while also improving power consumption, our customers like that.

"It's not always good to move to a smaller package, even when that's possible, as that requires board redesigns," Bae said. "More functionality is often preferred."

Similarly, Vallespin said the process node is a key factor in delivering new degrees of integration. "Smaller geometries allow greater integration."

Latest advances

Wireless SoC vendors agreed that new product development is driven by wireless standards and the need for higher functionality, more integration and lower power consumption.

For example, Silicon Labs' wireless SoC roadmap focuses on "intelligent wireless connectivity for IoT devices." The company offers a wide range of wireless solutions, including Wi-Fi, Bluetooth, 802.15.4, ZigBee, Thread, Z-Wave and proprietary wireless.

Silicon Labs' latest advances include its 2.4-GHz wireless MG24 SoC for Bluetooth and multiple-protocol operations. The MG24 supports Matter over Thread as a single-chip solution—with a range of up to 200 meters indoors for OpenThread—while also enabling Bluetooth commissioning of new devices on the same chip, Sogani said. "The MG24, combined with the ultra-low–power Silicon Labs RS9116 or Silicon Labs WF200 Wi-Fi products, enables development of Matter over Wi-Fi 4."

Silicon Labs also offers the FG25, the company's new flagship SoC for Wi-SUN, which is one of the world's first open protocols for smart-city and smart-utility applications. "The EFF01 is the FG25's corresponding amplifier that boosts signal range by 2× when used together," Sogani said.

He said the FG25 "will be the world's most secure smart-city solution, with long range, the largest memory capacity of any SoC in the Silicon Labs portfolio and the ability to operate for up to 10 years on a coin-cell battery."

In addition, Silicon Labs' first Wi-Fi 6 and Bluetooth LE SoC, the fully integrated SiWx917, is designed to be the lowest-power Wi-Fi 6 and Bluetooth LE SoC in the industry, Sogani said. "The SiWx917 is a single-chip solution that is Matter-ready, includes an integrated applications processor and offers industry-leading energy efficiency, making it ideal for battery-powered or energy-efficient IoT devices with always-on cloud connectivity."

Synaptics is focusing on two major industry trends: connecting sensors that are gathering data to the AI systems or devices that are doing the analysis, and making wireless devices easier to use, Bae said.

"First, we're simplifying the integration of AI and wireless through KatanaConnect, which combines our Katana low-power edge AI SoC with our SYN430132 1 × 1 Wi-Fi/Bluetooth combo chip on a tiny module measuring 32 × 32 mm," he said. "Second, our mix of Bluetooth, ULE, Wi-Fi, 802.15.4 and GNSS solutions is unique in the industry. They are proven solutions that simplify the cost-effective and rapid development of IoT connectivity devices. This has clear single-source benefits of both product and design expertise, so we know how to connect IoT devices."

However, Bae said there is more to it than having the silicon and track record. "We're also either already Matter-compliant or are working on it across all our solution stacks so we can ensure users benefit from Matter's promise of a seamless user experience across platforms and interfaces."

A good example of Synaptics' Matter support and high integration is the SYN4381 Triple Combo SoC, which the company claims as the first to combine Wi-Fi 6/6E (802.11ax with extended 6-GHz operation), Bluetooth 5.2 (BT 5.2) with BLE audio and high-accuracy distance measurement, and IEEE 802.15.4 with built-in support for the Thread protocol and Matter application layer. The SoC and its SynFi software simplify product development by providing secure and scalable connectivity between devices across heterogeneous IoT networks, regardless of platform, OEM or brand, the company said. For end users, they get a simplified setup and seamless control across their smart-home devices.

Key differentiators for Synaptics include its robust connectivity and the ability to balance cost and performance, Bae said. "For example, while many offer Wi-Fi/Bluetooth combo solutions, they haven't fully controlled the signaling, and that shows up as glitches in both audio and video."

To solve the problem, Synaptics has developed a proprietary mechanism, which it calls Smart Coexistence, in the 2.45-GHz band. It "carefully manages the Wi-Fi and Bluetooth transmission and reception to avoid lost packets and the inefficiencies of retransmissions," Bae said.

Bae added it is baked into all of its combo chips, including the SYN4381 Triple Combo, as well as the SYN43756 Bluetooth/Wi-Fi combo chip and the SYN43756, a single-chip IEEE 802.11ax 2 × 2 MAC/baseband/radio with integrated Bluetooth 5.2 (with LE Audio).

The post Wireless SoCs Solve Connectivity Challenges appeared first on EE Times.

Pennsylvania Philadelphia PA Philadelphia January 30, 2023 at 09:30AM

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#Houston Texas Appliance Parts: Wireless SoCs Solve Connectivity Challenges

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analyticsmarket · 2 years ago

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marketinsight1234 · 2 years ago

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AI Audio and Video SoC Market Size, By Top Key Player, With Production, Price, Revenue & Region 2022 To 2028

Technological advancements over the last decade have made artificial intelligence (AI) one of the most fascinating technologies. Artificial intelligence growth necessitates that semiconductor companies redesign their system-on-chip (SoC) architectures to enable higher scalable levels of performance, flexibility, efficiency, and integration. SoC is a microchip that contains all of the electronic circuits and parts required for a specific system, such as a smartphone or wearable computer, on a single integrated circuit (IC). A single-chip SoC for a sound-detecting device might include an audio receiver, an analog-to-digital converter (ADC), a microprocessor, memory, and user input/output logic control. Furthermore, an ARM Cortex CPU, a DSP, video compression/decompression engines, a 3D graphics accelerator, and a massive video processing subsystem capable of handling several HD video streams simultaneously may be included in the video processing SoC.

Read More: - https://introspectivemarketresearch.com/reports/ai-audio-and-video-soc-market-global-size-share-industry-trends-2022-2028/

The research study includes an examination of many aspects that contribute to the market's expansion. Market trends, restrictions, and drivers that have a favourable or negative influence on the market are included. This section also discusses the many businesses and applications that may have an impact on the market in the future. The information is based on both recent and historical patterns. The cost structure, market size, AI Audio and Video SoC Sales, Gross Margin and Market Share, Price, Revenue, Size, Forecast, and Growth Rate are all calculated in the report.

#markets #research

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glitterytalerunaway · 4 years ago

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Digital Isolator Market Size And Scope, Product Estimate And Strategy Framework By Forecast 2027

Summary:

A new study title “Digital Isolator market size, status and forecast 2027” has been featured on market research future.

Market Overview:

The enterprises operating in the space of digital isolator constantly keep innovating. Enterprises like, Maxim introduces a game changing architecture for industrial PLC digital – input modules by reducing the isolated channel count. This allows the designers to have a way to reduce power, system cost and power for PLC digital input subsystem providing analog integration, lower power, lower cost and smaller size as the key advantages. The market of digital isolator is following certain trends like growth in noise free electronics, increased usage of renewable energy sources, growing demand to replace octocouplers, and usage of digital isolator in higher altitude. Additionally, the growing requirement of on-chip transformers and capacitors is boosting the market of digital isolator due to its high speed, timing accuracy, and ease of use.

Another company, Analog Devices claims that by integrating multiple functions such as overvoltage protection, output tracking, and light load mode, board space can be reduced to 35% and system can be improved as compared to the traditional approaches. However, the inability to transmit low-frequency signals without the use of modulators and their high costs of implementation are restraining the growth of this market. The market of digital isolator is segmented into type, data rate, channel, application and region. The market for giant magnetoresistive isolation type is expected to grow at a significant growth during the forecast period owing to its wide use in biosensors and micro-electromechanical systems (MEMS), among others.

Get Free Sample Report @ https://www.marketresearchfuture.com/sample_request/4988

Key Players:

Some of the prominent key players in the market include Advantech Co Ltd (Taiwan), Murata Manufacturing Company Ltd (Japan), NXP Semiconductors N.V. (the Netherland), Broadcom Ltd (U.S.), Texas Instruments, Inc (U.S.), ST Microelectronics N.V. (Switzerland), Infineon Technologies AG (Germany), ON Semiconductor (U.S.), Digi – Key Corporation among others.

The other vendors in the digital isolator market are ADLINK Technology Inc, IXYS Corporation, Halo Electronics Inc, Vicor Corporation, NVE Corp, Silicon Labs among others.

Segments:

On the basis of type, the market is segmented into the capacitive coupling, giant magneto resistive (GMR), and magnetic coupling.

On the basis of data rate, the market is segmented into less than 25 Mbps, 25 Mbps to 75 Mbps, and above 75 Mbps.

On the basis of the channel, the market is segmented into two channel, four channel, six channel, and eight channel.

On the basis of application, the market is segmented into gate drivers, DC/DC converters, ADC, and USB and other communication ports.

Regional Analysis:

By geography, the market is segmented into North America, Europe, Asia Pacific and rest of the world. Asia Pacific accounted for the largest market share in 2016. Asia Pacific is expected to grow at a high rate during the forecast period owing to the presence of a large number of major electrical device and equipment manufacturers in this region. Additionally, many of the electronic & electrical component manufacturers are shifting from North America and Europe to Asia Pacific to capitalize on the low direct costs and lower cost of labor incurred in countries like China, India and South East Asia. The market growth can also be attributed to the increasing demand for isolated gate drivers, generated with the proliferation of electric and hybrid electric vehicles worldwide.

North America and Europe are predicted to inspire players with some powerful business prospects through their success in the market. The digital isolator are gaining huge demand due to its high reliability and efficiency which is best suited in healthcare sectors. Europe is to be estimated to be the second largest market for digital isolator during the forecast period.

Get Complete Report @ https://www.marketresearchfuture.com/reports/digital-isolator-market-4988

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#Digital Isolator Market Size Digital Isolator Market Share Digital Isolator Industry Digital Isolator Market Research Future

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akashs123 · 4 years ago

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Digital Isolator Market 2021: Share, Growth Rate, Services and Solutions- Forecast to 2023

Market Research Future published a research report on “Digital Isolator Market Research Report- Global Forecast 2023” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2023.

Market Highlights:

The enterprises operating in the space of digital isolator constantly keep innovating. Enterprises like, Maxim introduces a game changing architecture for industrial PLC digital – input modules by reducing the isolated channel count. This allows the designers to have a way to reduce power, system cost and power for PLC digital input subsystem providing analog integration, lower power, lower cost and smaller size as the key advantages. The digital isolator market is following certain trends like growth in noise free electronics, increased usage of renewable energy sources, growing demand to replace octocouplers, and usage of digital isolator in higher altitude. Additionally, the growing requirement of on-chip transformers and capacitors is boosting the market of digital isolator due to its high speed, timing accuracy, and ease of use.

Another company, Analog Devices claims that by integrating multiple functions such as overvoltage protection, output tracking, and light load mode, board space can be reduced to 35% and system can be improved as compared to the traditional approaches. However, the inability to transmit low-frequency signals without the use of modulators and their high costs of implementation are restraining the growth of this market. The digital isolator market is segmented into type, data rate, channel, application and region. The market for giant magnetoresistive isolation type is expected to grow at a significant growth during the forecast period owing to its wide use in biosensors and micro-electromechanical systems (MEMS), among others.

Get Free Sample Report @ https://www.marketresearchfuture.com/sample_request/4988

Key Players

The other vendors in the Digital Isolator Market are ADLINK Technology Inc, IXYS Corporation, Halo Electronics Inc, Vicor Corporation, NVE Corp, Silicon Labs among others.

Segments

On the basis of type, the market is segmented into the capacitive coupling, giant magneto resistive (GMR), and magnetic coupling.

On the basis of data rate, the market is segmented into less than 25 Mbps, 25 Mbps to 75 Mbps, and above 75 Mbps.

On the basis of the channel, the market is segmented into two channel, four channel, six channel, and eight channel.

On the basis of application, the market is segmented into gate drivers, DC/DC converters, ADC, and USB and other communication ports.

Regional Analysis

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onkardbmr-blog · 5 years ago

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Global Wireless Data Radio Modem Market Incredible Possibilities, Growth with Industry Study, Detailed Analysis | Global Forecast to 2026

Data Bridge Market Research has recently added a concise research on Global Wireless Data Radio Modem Market to depict valuable insights related to significant market trends driving the industry. The report features analysis based on key opportunities and challenges confronted by market leaders while highlighting their competitive setting and corporate strategies for the estimated timeline. Some are the key & emerging players that are part of coverage and have being profiled are Freewave Technologies, Inc., Microhard Systems, Inc., Digi International Inc., Simrex Corporation, MotoRola Solutions, Inc., SATEL Oy, Arada Systems Inc., JAVAD GNSS Inc., Schneider Electric SE, GE Grid Solutions, LLC, Harxon Corporation, ABB Ltd., and many more.

Analysis of Global Wireless Data Radio Modem Market report:

Global Wireless Data Radio Modem Market was valued at USD 540.8 million in 2017 and is expected to reach USD 710.9 million in 2025, growing at a healthy CAGR of 3.8% for the forecast period of 2018 to 2025. The upcoming market report contains data for historic year 2016, the base year of calculation is 2017 and the forecast period is 2018 to 2025.

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Definition:

The wireless data radio modem is used to modulate and demodulate the data received through wireless medium. This modem transfers the digital information in conventional FM radio broadcasts. It converts analog signal from a telephone or cable wire to a digital signal that a computer can recognize. This transfer of data is done across a range of upto 10 kilometres. The wireless data radio modems are used provide digital communication that notifies higher level managers and business owners during emergency situations. These modems transmit radio waves as serial data in a particular frequency according to a defined radio technique. These modems can be used freely i.e. they do not need any licence. It is mostly used in industrial, precision farming, transportation, scientific, and medical applications. These modems require low-bandwidth electronic devices for connecting with the wireless network and are less cost efficient. For instance consider the Base Radio HX-DU8602T product of Harxon Corporation. This wireless data radio modem offers reliable data communications for mission-critical application. It offers supreme performance with stable signal in long range.

Market Drivers:

· Cost-effectiveness and fidelity of wireless data radio modem

· Individualistic and privately owned networks and minimum infrastructure demands

· Robust long-range frequency hopping

· dominance of radio modems in SCADA and telemetry applications

Market Restraint:

· Reliant on wireless signal that may get lost or corrupted

· Maintaining the consistent speed

Top Manufacturers Profiles Operating in the Global Wireless Data Radio Modem Market:

The key players operating in the global wireless data radio modem market are –

· Adeunis RF

· Atim Radiocommunications

· Campbell Scientific, Inc.

· Cohda Wireless Pty Ltd

· Encom Wireless Data Solution, Inc.

· Harris Corporation

The other players in the market are Intuicom Inc., Pro4 Wireless AB, Advantech B+B Smartworx Inc., Freewave Technologies, Inc., Microhard Systems, Inc., Digi International Inc., Simrex Corporation, MotoRola Solutions

Global Wireless Data Radio Modem Market Segmentation:

By Product

· General-Purpose Data Modem

· UAV Drone Data Modem

By Operating Range

· Short Range

· Long Range

By Application

· SCADA & Telemetry

· Precision Farming

· Transportation

By Geography

· North America

· South America

· Europe

· Asia-Pacific

Competitive Landscape:

The global wireless data radio modem market is highly fragmented and the major players have used various strategies such as new product launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market. The report includes market shares of cybersecurity as a service market for global, Europe, North America, Asia Pacific, South America and Middle East & Africa.

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onkardbmr08 · 5 years ago

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Global Wireless Data Radio Modem Market : Emerging Technologies, Competition & Strategies of Key Players, Regional Analysis and Forecast By 2026

Definition:

Analysis of Global Wireless Data Radio Modem Market report:

A FREE sample of this report is available upon request @

https://www.databridgemarketresearch.com/request-a-sample/?dbmr=global-wireless-data-radio-modem-market

Market Drivers:

· Cost-effectiveness and fidelity of wireless data radio modem

· Individualistic and privately owned networks and minimum infrastructure demands

· Robust long-range frequency hopping

· dominance of radio modems in SCADA and telemetry applications

Market Restraint:

· Reliant on wireless signal that may get lost or corrupted

· Maintaining the consistent speed

Top Manufacturers Profiles Operating in the Global Wireless Data Radio Modem Market:

The key players operating in the global wireless data radio modem market are –

· Adeunis RF

· Atim Radiocommunications

· Campbell Scientific, Inc.

· Cohda Wireless Pty Ltd

· Encom Wireless Data Solution, Inc.

· Harris Corporation

Global Wireless Data Radio Modem Market Segmentation:

By Product

· General-Purpose Data Modem

· UAV Drone Data Modem

By Operating Range

· Short Range

· Long Range

By Application

· SCADA & Telemetry

· Precision Farming

· Transportation

By Geography

· North America

· South America

· Europe

· Asia-Pacific

Competitive Landscape:

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• The segment that is expected to dominate the market as well as the segment which holds highest CAGR in the forecast period

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• The latest developments, market shares, and strategies that are employed by the major market players

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kdmarketresearch · 5 years ago

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Semiconductor IP Market Predicts Favorable Growth and Forecast During 2018-2024

A fresh report titled “ Semiconductor IP Market” has been presented by KD market research. It evaluates the key market trends, advantages, and factors that are pushing the overall growth of the market. The report also analyzes the different segments along with major geographies that have more demand for Semiconductor IP Market. The competition analysis is also a major part of the report.

Semiconductor IP is a chip layout design, unit of logic, which is reusable. In addition, it is also the intellectual property of only one party. Such IP core can be either used by or owned by one party. These IP cores are used as the building blocks within FPGA logic designs or ASIC chip designs.

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Rise in demand for the modern system on chip (SoC) design and reduction in production and design cost majorly drive the market. Despite such advantages, fluctuations in the development or functionality of the chips impedes the growth of this market. In the near future, rise in demand for the consumer electronics, and new technological developments is expected to create lucrative opportunities for the key players operating in the semiconductor IP market.

The global semiconductor IP market is segmented based on design IP, IP source, application, and region. Based on design IP, the market is categorized into processor IP, interface IP, memory IP, and other IP. Processor IP is then further subdivided into microprocessor unit, microcontroller unit, and digital signal processor. Other IP is bifurcated into analog-to-digital (ADC) converters and digital-to-analog (DAC) converters. Depending on IP source, it is divided into licensing, royalty, and services. By application, it is classified into consumer electronics, telecom, automotive, aerospace, healthcare, agriculture, and others (government, hospitality, and more). Furthermore, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.

Key players profiled in the report include ARM, Synopsys, Imagination Technologies, Cadence, Ceva, Verisillicon, eMemory Technology, Rambus, Lattice (Silicon Image), and Sonics.

KEY BENEFITS FOR STAKEHOLDERS

-This study comprises analytical depiction of the global semiconductor IP market with current trends and future estimations to depict the imminent investment pockets.

-The overall market potential is determined to understand the profitable trends to gain a stronger coverage in the market.

-The report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.

-The current market is quantitatively analyzed from 2018 to 2024 to highlight the financial competency of the market.

-Porter?s Five Forces analysis illustrates the potency of the buyers and suppliers.

KEY MARKET SEGMENTS

BY DESIGN IP

-Processor IP -Interface IP -Memory IP -Other IP

BY IP SOURCE

-Licensing -Royalty -Servicing

BY APPLICATION

-Consumer Electronics -Telecom -Automotive -Aerospace -Healthcare -Agriculture -Others

BY REGION

-North America -U.S. -Canada -Mexico -Europe -UK -Germany -France -Spain -Italy -Rest of Europe -Asia-Pacific -China -Japan -India -Australia -South Korea -Rest of Asia-Pacific -LAMEA -Latin America -Middle East -Africa

KEY MARKET PLAYERS PROFILED

-ARM -Synopsys -Imagination Technologies -Cadence -Ceva -Verisillicon -eMemory Technology -Rambus -Lattice (Silicon Image) -Sonics

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Table of Content

CHAPTER 1: INTRODUCTION

1.1. REPORT DESCRIPTION 1.2. KEY BENEFITS FOR STAKEHOLDERS 1.3. KEY MARKET SEGMENTS 1.4. RESEARCH METHODOLOGY

1.4.1. Primary research 1.4.2. Secondary research 1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

CHAPTER 3: MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE 3.2. KEY FINDINGS

3.2.1. Top impacting factors 3.2.2. Top investment pockets 3.2.3. Top winning strategies

3.3. PORTERS FIVE FORCES ANALYSIS

3.3.1. Moderate-to-high bargaining power of suppliers 3.3.2. Moderate threat of new entrants 3.3.3. Moderate threat of substitutes 3.3.4. Moderate-to-high intensity of rivalry 3.3.5. Moderate bargaining power of buyers

3.4. MARKET SHARE ANALYSIS, 2017 3.5. MARKET DYNAMICS

3.5.1. Drivers

3.5.1.1. Rise in demand of the modern System on Chip (SoC) design 3.5.1.2. Reduction in manufacturing and design cost

3.5.2. Restraint

3.5.2.1. Fluctuations in the development or functionality of the chips.

3.5.3. Opportunity

3.5.3.1. Rise in demand for the consumer electronics 3.5.3.2. New technological developments

CHAPTER 4: SEMICONDUCTOR IP MARKET, BY DESIGN IP

4.1. OVERVIEW 4.2. PROCESSOR IP

4.2.1. Key market trends, growth factors, and opportunities 4.2.2. Market size and forecast, by region 4.2.3. Microprocessor unit 4.2.4. Microcontroller unit 4.2.5. Digital signal processor 4.2.6. Market analysis, by country

4.3. INTERFACE IP

4.3.1. Key market trends, growth factors, and opportunities 4.3.2. Market size and forecast, by region 4.3.3. Market analysis, by country

4.4. MEMORY IP

4.4.1. Key market trends, growth factors, and opportunities 4.4.2. Market size and forecast, by region 4.4.3. Market analysis, by country

4.5. OTHER IP

4.5.1. Key market trends, growth factors, and opportunities 4.5.2. Market size and forecast, by region 4.5.3. Analog-to-digital converter (ADC) 4.5.4. Digital-to-analog converter (DAC) 4.5.5. Market analysis, by country

CHAPTER 5: SEMICONDUCTOR IP MARKET, BY IP SOURCE

5.1. OVERVIEW 5.2. LICENSING

5.2.1. Key market trends, growth factors, and opportunities 5.2.2. Market size and forecast, by region 5.2.3. Market analysis, by country

5.3. ROYALTY

5.3.1. Key market trends, growth factors, and opportunities 5.3.2. Market size and forecast, by region 5.3.3. Market analysis, by country

5.4. SERVICING

5.4.1. Key market trends, growth factors, and opportunities 5.4.2. Market size and forecast, by region 5.4.3. Market analysis, by country

CHAPTER 6: SEMICONDUCTOR IP MARKET, BY APPLICATION

6.1. OVERVIEW 6.2. CONSUMER ELECTRONICS

6.2.1. Key market trends, growth factors, and opportunities 6.2.2. Market size and forecast, by region 6.2.3. Market analysis, by country

6.3. TELECOM

6.3.1. Key market trends, growth factors, and opportunities 6.3.2. Market size and forecast, by region 6.3.3. Market analysis, by country

6.4. AUTOMOTIVE

6.4.1. Key market trends, growth factors, and opportunities 6.4.2. Market size and forecast, by region 6.4.3. Market analysis, by country

6.5. AEROSPACE

6.5.1. Key market trends, growth factors, and opportunities 6.5.2. Market size and forecast, by region 6.5.3. Market analysis, by country

6.6. HEALTHCARE

6.6.1. Key market trends, growth factors, and opportunities 6.6.2. Market size and forecast, by region 6.6.3. Market analysis, by country

6.7. AGRICULTURE

6.7.1. Key market trends, growth factors, and opportunities 6.7.2. Market size and forecast, by region 6.7.3. Market analysis, by country

6.8. OTHERS

6.8.1. Key market trends, growth factors, and opportunities 6.8.2. Market size and forecast, by region 6.8.3. Market analysis, by country

CHAPTER 7: SEMICONDUCTOR IP MARKET, BY REGION

7.1. OVERVIEW 7.2. NORTH AMERICA

7.2.1. Key market trends, growth factors, and opportunities 7.2.2. Market size and forecast, by design IP 7.2.3. Market size and forecast, by IP source 7.2.4. Market size and forecast, by Application 7.2.5. Market analysis, by country 7.2.6. U.S.

7.2.6.1. Market size and forecast, by design IP 7.2.6.2. Market size and forecast, by IP source 7.2.6.3. Market size and forecast, by Application

7.2.7. Canada

7.2.7.1. Market size and forecast, by design IP 7.2.7.2. Market size and forecast, by IP source 7.2.7.3. Market size and forecast, by Application

7.2.8. Mexico

7.2.8.1. Market size and forecast, by design IP 7.2.8.2. Market size and forecast, by IP source 7.2.8.3. Market size and forecast, by Application

7.3. EUROPE

7.3.1. Key market trends, growth factors, and opportunities 7.3.2. Market size and forecast, by design IP 7.3.3. Market size and forecast, by IP source 7.3.4. Market size and forecast, by Application 7.3.5. Market analysis, by country 7.3.6. U.K.

7.3.6.1. Market size and forecast, by design IP 7.3.6.2. Market size and forecast, by IP source 7.3.6.3. Market size and forecast, by Application

7.3.7. Germany

7.3.7.1. Market size and forecast, by design IP 7.3.7.2. Market size and forecast, by IP source 7.3.7.3. Market size and forecast, by Application

7.3.8. France

7.3.8.1. Market size and forecast, by design IP 7.3.8.2. Market size and forecast, by IP source 7.3.8.3. Market size and forecast, by Application

7.3.9. Spain

7.3.9.1. Market size and forecast, by design IP 7.3.9.2. Market size and forecast, by IP source 7.3.9.3. Market size and forecast, by Application

7.3.10. Italy

7.3.10.1. Market size and forecast, by design IP 7.3.10.2. Market size and forecast, by IP source 7.3.10.3. Market size and forecast, by Application

7.3.11. Rest of Europe

7.3.11.1. Market size and forecast, by design IP 7.3.11.2. Market size and forecast, by IP source 7.3.11.3. Market size and forecast, by Application

7.4. ASIA-PACIFIC

7.4.1. Key market trends, growth factors, and opportunities 7.4.2. Market size and forecast, by design IP 7.4.3. Market size and forecast, by IP source 7.4.4. Market size and forecast, by Application 7.4.5. Market analysis, by country 7.4.6. China

7.4.6.1. Market size and forecast, by design IP 7.4.6.2. Market size and forecast, by IP source 7.4.6.3. Market size and forecast, by Application

7.4.7. Japan

7.4.7.1. Market size and forecast, by design IP 7.4.7.2. Market size and forecast, by IP source 7.4.7.3. Market size and forecast, by Application

7.4.8. India

7.4.8.1. Market size and forecast, by design IP 7.4.8.2. Market size and forecast, by IP source 7.4.8.3. Market size and forecast, by Application

7.4.9. Australia

7.4.9.1. Market size and forecast, by design IP 7.4.9.2. Market size and forecast, by IP source 7.4.9.3. Market size and forecast, by Application

7.4.10. South Korea

7.4.10.1. Market size and forecast, by design IP 7.4.10.2. Market size and forecast, by IP source 7.4.10.3. Market size and forecast, by Application

7.4.11. Rest of Asia-Pacific

7.4.11.1. Market size and forecast, by design IP 7.4.11.2. Market size and forecast, by IP source 7.4.11.3. Market size and forecast, by Application

7.5. LAMEA

7.5.1. Key market trends, growth factors, and opportunities 7.5.2. Market size and forecast, by design IP 7.5.3. Market size and forecast, by IP source 7.5.4. Market size and forecast, by Application 7.5.5. Market analysis, by country 7.5.6. Latin America

7.5.6.1. Market size and forecast, by design IP 7.5.6.2. Market size and forecast, by IP source 7.5.6.3. Market size and forecast, by Application

7.5.7. Middle East

7.5.7.1. Market size and forecast, by design IP 7.5.7.2. Market size and forecast, by IP source 7.5.7.3. Market size and forecast, by Application

7.5.8. Africa

7.5.8.1. Market size and forecast, by design IP 7.5.8.2. Market size and forecast, by IP source 7.5.8.3. Market size and forecast, by Application

CHAPTER 8: COMPANY PROFILES

8.1. ARM HOLDINGS PLC

8.1.1. Company overview 8.1.2. Company snapshot 8.1.3. Operating business segments 8.1.4. Business performance 8.1.5. Key strategic moves and developments

8.2. SYNOPSYS, INC.

8.2.1. Company overview 8.2.2. Company snapshot 8.2.3. Operating business segments 8.2.4. Business performance 8.2.5. Key strategic moves and developments

8.3. IMAGINATION TECHNOLOGIES GROUP PLC

8.3.1. Company overview 8.3.2. Company snapshot 8.3.3. Operating business segments 8.3.4. Product portfolio 8.3.5. Business performance

8.4. CADENCE DESIGN SYSTEMS, INC.

8.4.1. Company overview 8.4.2. Company snapshot 8.4.3. Operating business segments 8.4.4. Product portfolio 8.4.5. Business performance 8.4.6. Key strategic moves and developments

8.5. CEVA, INC.

8.5.1. Company overview 8.5.2. Company snapshot 8.5.3. Product portfolio 8.5.4. Business performance 8.5.5. Key strategic moves and developments

8.6. VERISILICON HOLDINGS CO., LTD.

8.6.1. Company overview 8.6.2. Company snapshot 8.6.3. Operating business segments 8.6.4. Key strategic moves and developments

8.7. EMEMORY TECHNOLOGY INC.

8.7.1. Company overview 8.7.2. Company snapshot 8.7.3. Operating business segments 8.7.4. Product portfolio 8.7.5. Business performance 8.7.6. Key strategic moves and developments

8.8. RAMBUS INC.

8.8.1. Company overview 8.8.2. Company snapshot 8.8.3. Operating business segments 8.8.4. Product portfolio 8.8.5. Business performance 8.8.6. Key strategic moves and developments

8.9. LATTICE SEMICONDUCTOR CORPORATION

8.9.1. Company overview 8.9.2. Company snapshot 8.9.3. Operating business segments 8.9.4. Product portfolio 8.9.5. Business performance 8.9.6. Key strategic moves and developments

8.10. SONICS, INC.

8.10.1. Company overview 8.10.2. Company snapshot 8.10.3. Operating business segments 8.10.4. Key strategic moves and developments

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Our Services include market intelligence, competitive intelligence, and customized research. These research reports help the organizations to make quick and powerful decisions that make out highest growth in revenue.

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electronalytics · 2 years ago

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Audio SoC Chip Market Analysis, Trends and Dynamic Demand by Forecast 2017 to 2032

The Audio System on Chip (SoC) market refers to the semiconductor chips that integrate multiple components of an audio system, such as analog-to-digital converters, digital signal processors, amplifiers, and codecs, into a single chip. This market has been growing steadily due to the increasing demand for high-quality audio in consumer electronics, such as smartphones, laptops, tablets, and smart speakers.

An Audio System on Chip (SoC) refers to a single integrated circuit that contains all the necessary components of an audio system, such as analog-to-digital converters (ADCs), digital-to-analog converters (DACs), amplifiers, codecs, and other signal processing modules. These chips are designed to provide a complete audio solution for electronic devices such as smartphones, tablets, laptops, smart speakers, and other consumer electronics.

Audio SoC chips offer several advantages over traditional discrete audio components, including lower power consumption, smaller form factor, and improved system performance. They also simplify the design process for electronic device manufacturers, enabling faster time-to-market for new products. The Global System on a Chip (SoC) Market was valued for US$ 1,40,985.6 Mn in 2021 is expected to exhibit a CAGR of 8.0% during the forecast period.

In this Market research report is the ideal starting point for anyone seeking a thorough examination and analysis of the market. This report includes a wide range of research and data that will aid users in comprehending specific market segments and concentrating on important market channels in the regional and worldwide Audio SoC Chip market. For the goal of understanding competition, the research provides details about the market, such as market size, share, present and future trends, supply chain information, trading issues, competitive analysis, prices, and vendor information.

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Market Segmentations: Global Audio SoC Chip Market: By Company • Bestechnic • Qualcomm • MediaTek • Beken Corporation • KT Micro • REALTEK • Shenzhen Bluetrum Technology • Zhuhai Jieli Technology • Actions Technology • Wu Qi Global Audio SoC Chip Market: By Type • Ordinary Bluetooth Audio Chip • Smart Bluetooth Audio Chip • Type-C Audio Chip Global Audio SoC Chip Market: By Application • Smart Bluetooth Headset • Type-C Earphones • Smart Speakers • Others Global Audio SoC Chip Market: Regional Analysis All the regional segmentation has been studied based on recent and future trends, and the market is forecasted throughout the prediction period. The countries covered in the regional analysis of the Global Audio SoC Chip market report are U.S., Canada, and Mexico in North America, Germany, France, U.K., Russia, Italy, Spain, Turkey, Netherlands, Switzerland, Belgium, and Rest of Europe in Europe, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, China, Japan, India, South Korea, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), and Argentina, Brazil, and Rest of South America as part of South America.

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william92judkin-blog · 6 years ago

Text

TWS

In the next few years, True Wireless Stereo, TWS will stage a more future story than smart speakers.

Apple's AirPods will reach 260 million to 28 million in 2018, and this number will increase to 5,000-55 million next year and is expected to exceed 100 million by 2021. As far as the industry is concerned, it is moving towards the goal of “150 million units of shipments and 40 billion US dollars (2020)”.

In this market dominated by Apple, other manufacturers may not have such eye-catching results. We got this news from the AirPods supply chain: AirPods II has an order quantity of 100 million. Once launched, AirPods I is bound to cut prices, which will affect the sales of TWS of other brands.

Most practitioners also understand that doing AirPods is not as simple as cutting a line. In fact, all the way is difficult, sound delay, binaural audio is out of sync, signal instability is disconnected, and so on. Common.

In a previous article on the technical challenges of wireless headset Bluetooth technology, we also mentioned that in the past two years, the solution providers represented by Qualcomm, NXP, etc., provided a single-chip solution for Bluetooth wireless connection, which is a TWS headset. The equipment manufacturer successfully cut off the last ten centimeters of the headphone cable and killed the 3.5mm headphone jack to truly realize the wireless nation of the headset.

What are the new development directions of wireless headsets, or when the experience of wireless headsets can be equated with wired headsets, or even beyond wired headsets, is an important direction for the next industry development.

The following are some of the major trends we have developed in the coming years:

Trend 1: Noise reduction, permanent topic

As we all know, noise reduction technology needs to be realized through the cooperation of hardware end (chip, sensor, microphone array, etc.) and software-side algorithms.

Let's take a look at Apple's approach: AirPods uses a voice acceleration sensor in conjunction with a microphone with beamforming technology to filter out background noise for sound locking and detect user-generated vibrations for near-monitoring.

Sony's solution is chip-level: the custom HD noise reduction processor QN1 is used on the headset WH-1000MX3, which was launched in August this year, which makes the product 4 times stronger than the previous generation. The chip's integrated digital-to-analog converter and analog power amplifier deliver excellent signal quality with excellent signal-to-noise ratio and low distortion.

As for whether Sony or other manufacturers will continue to customize the dedicated noise reduction chip for TWS headsets, we don't know, but at least Sony has expressed the importance of the noise reduction performance of the headset products through this signal.

For Apple and Sony, Apple is doing noise reduction in a semi-enclosed environment such as a semi-ear earphone. Although this problem has not been completely overcome, this direction is awesome, and Apple's greatness is also here. Sony is doing noise reduction while paying attention to music characteristics, which is also in line with Sony's music gene.

Trend 2: High sound quality, unified standards, more meaningful

For audio equipment, people's pursuit of good sound is stubborn and timeless.

HD audio is transmitted to the wireless headset via Bluetooth on the transmitter side of the mobile phone. Due to Bluetooth bandwidth limitations, audio files are often compressed. In the case of Bluetooth 5.0 technology being used on a large scale in the market, it can provide greater communication capacity for audio. Prior to this, companies represented by Sony, Qualcomm and others have launched a set of high-definition audio codec technology.

Sony LDAC

Sony, which has been working hard in this area, officially launched LDAC high-resolution audio technology during CES 2015, which can transmit 3 times the amount of information of ordinary Bluetooth audio, and bring better sound quality performance to its earphone equipment. Until 2017, this "Sony-only" technology was officially opened to Android 8.0.

The premise of the encoder to achieve high-definition audio transmission is the two-way support of the sender and the receiver, while the Android 8.0 supporting LDAC only solves the problem of the transmitter, but the popularity of the LDAC in the receiver device (headphone, speaker, etc.) may take some time. In addition, Sony also needs to solve the problem of LDAC's power consumption and transmission stability (in the 990Kbps high-quality transmission mode, LDAC is susceptible to wireless signal interference, and its power consumption is higher than that of ordinary Bluetooth).

At present, in addition to Sony's own brand products, the brands that support LDAC are only a few such as RADIUS (Japan), and the supported TWS headsets are rare.

Qualcomm aptX HD

Compared to Sony LDAC, Qualcomm introduced the aptX HD HD Bluetooth audio codec technology in 2016 (supporting 24-bit/48 kHz audio) because of the aptX padding (currently about 4 billion devices are supported) and Qualcomm itself in the chip. Advantages in the fields of communication, communication, etc., have wider application potential.

For smart Bluetooth headsets, Qualcomm introduced an end-to-end Bluetooth smart headset reference design that fits the Alexa Mobile Accessory Kit (AMA) protocol in October. The solution is based on Qualcomm's low-power Bluetooth audio chip QCC5100 series and integrates aptX HD HD audio and dual-mike CVC noise reduction technology.

Trend 3: Low power consumption, the solution provider has tried hard

Although the charging box can charge the earphone, the TWS earphone wirelessly connects to the mobile phone and the device is independently charged. The main application is in the mobile scene and other attributes, which determines its low power consumption requirements.

For miniaturized equipment, Qualcomm has launched three series of single-chip solutions, QCC5100, QCC302X and QCC303X, this year, focusing on ultra-low power consumption. Take the first release of the QCC5100 as an example, it reduces power consumption by 65% compared to previous generations, making the life of headphones up to three times the current.

Trend 4: Low latency, looks a bit high-end

In addition to music and conversation, TWS headsets that are moving toward high-quality sound quality will also need to balance user needs and application scenarios such as games and VR. How to ensure the low latency of audio transmission is especially important for games that are responsive and efficient.

In addition to CD and HD audio, Qualcomm introduced aptX Adaptive audio codec technology for game and video scenarios this year. aptX Adaptive can control the sound delay to a transmission delay of 50 to 80 milliseconds, thus improving the user experience.

In addition, aptX Adaptive is backward compatible with aptX and aptX HD products on the market, with adaptive, dynamic audio performance.

Trend 5: Wake up voice local wake-up, Internet vendor AI capability landing

Adding voice intelligence to TWS headsets is a clear trend, and Google, Microsoft, and Amazon all see headphones as a battleground for voice AI.

The time required for the voice to be awakened, the efficiency of the back-and-forth interaction process, and the quality of the voice giving feedback all affect the user's experience in each voice interaction session on the headset. Whether voice assistants can respond in a timely manner poses new challenges for solution providers and equipment vendors.

For example, Google Assistant, whose voice recognition ability is close to the human level, takes 6 seconds for the user to wake up the voice assistant on the Bluetooth headset. The time interval between the user asking questions and getting feedback is 2s.

We know that because we don't have the ability to perform independent computing, the headset is only used as an audio microphone, and the voice service is implemented by the mobile APP or the cloud service that the system calls for voice. If the network is interrupted, the basic voice functions are not realized, and the network signal difference directly leads to the response delay.

Therefore, similar to the local control in the smart home field, the voice local wake-up solution has become a major trend in the development of TWS headsets. The basic functions such as music control (cut song, pause) implemented by local voice wake-up have already met most of the user's basic needs.

From the headset vendors, neither AirPods nor the upcoming AirPods II has emphasized Siri applications, which is quite different from AI vendors.

Trend 6: Answer, call, enjoy hand-free

With the addition of the voice assistant TWS headset, how to further explore the corresponding intelligent service functions, bringing practical application value to users, is also the focus of equipment vendors, solution providers, and voice service providers.

In August of this year, a wireless audio consumer survey report released by Qualcomm showed that the respondents' top requirements for the "smart" function of the headset were as follows:

• Answer, call

• Call weather inquiry, news broadcast, and other services directly by voice, instead of taking out the phone/watch to operate

• Health data monitoring (such as heart rate, number of steps, etc.), receiving data feedback via voice

• GPS positioning function

It is not difficult to see in this survey that the first feature of smart headphones is still to answer and make calls.

In the future, the combination of TWS and VIOP may be more popular. Google has used VOIP headsets for employees to let employees enjoy the hand-free Internet.

Trend 7: Health Tracking, AI incarnation of "AI Coach", deep excavation of sports scenes

One of the trends we have seen in TWS is the ability to carry biometric sensors for health data monitoring and voice announcements.

The rumors that the next generation of AirPods will increase the health tracking function are endless. Apple's recent patent document on headphones also mentions the details of adding a biosensor to the earphone, allowing the headset to perform functions including heart rate and body temperature measurement.

In the field of sports headphones, at the end of last year, 1MORE, Demon, Tencent, and Tencent jointly created a sports smart headset 1×1MORE iBFree 2, whose biggest feature is to build the built-in voice assistant based on big data and AI algorithms. An "AI Sports Coach".

Trend 8: Translation, come on!

In October of this year, Google officially stated that the unique translation feature on Pixel Buds is open to all headsets that support Google Assistant. This means that other third-party brands, including LG, Sony, Bose, etc., can also use this feature in the original and future headset products.

Google Assistant's real-time translation feature is an extended version of Google's Google Translate feature that supports translation in 40 languages. For those who are interested in translating headphones, this authoritative platform is currently the best choice.

The heat of the translator in the past two years may have a chance to continue on the TWS.

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letsharish12345us-blog · 6 years ago

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akashs123 · 4 years ago

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Another company, Analog Devices claims that by integrating multiple functions such as overvoltage protection, output tracking, and light load mode, board space can be reduced to 35% and system can be improved as compared to the traditional approaches. However, the inability to transmit low-frequency signals without the use of modulators and their high costs of implementation are restraining the growth of this market. The digital isolator market is segmented into type, data rate, channel, application and region. The market for giant magnetoresistive isolation type is expected to grow at a significant growth during the forecast period owing to its wide use in biosensors and micro-electromechanical systems (MEMS), among others.

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