#High Reflow Electrolytic

[eldrgrrsw]

https://www.futureelectronics.com/p/passives--capacitors--aluminum-electrolytic-capacitors/eee-fpe101xap-panasonic-3029000

Aluminum oxide, electrolytic capacitors, Reforming electrolytic capacitors

EEE-FP Series 25 V 100 uF Ø 6.3 x 7.7 mm 105 °C Low ESR High Reflow Electrolytic

[gsvtvo2wod]

https://www.futureelectronics.com/p/passives--capacitors--aluminum-electrolytic-capacitors/eee-ft1e471ap-panasonic-4029126

Power supplies, low ESR High Reflow Electrolytic, Electrolytic capacitor voltage,

EEE-FT Series 25 V 470 uF Ø 8 x 10.2 mm 105 °C Low ESR High Reflow Electrolytic

[cynti2obb]

Low ESR High Reflow Electrolytic, Multi section capacitor

EEE-FT Series 25 V 470 uF Ø 8 x 10.2 mm 105 °C Low ESR High Reflow Electrolytic

[vess-electronics]

Uncovering the Secrets of Electronic Component Storage

Introduction

Electronic components are the key support for the development of modern science and technology, and their preservation is vital for engineers, electronics enthusiasts and technology enterprises. Nowadays, whether in the global or Chinese market, the rapid growth in the sales of new energy vehicles and intelligent vehicles will drive a new peak in the demand for chips. The actual situation of chip production now is that, on the one hand, chip manufacturers continue to enhance production capacity, and the production situation is gradually improving; on the other hand, the demand for chips is strong, and there will also be a shortage of supply.

Many consumers, however, are unaware that proper storage procedures and environmental conditions can increase the life of components and maintain their performance consistent. We will reveal the mysteries of electronic component storage and teach you how to scientifically preserve these valuable technological gems - electronic components - in this post.

Factors Affecting the Storage of Electronic Components

Each component has its own characteristics, in which the key factors affecting its storage time is the chemical reaction with moisture, oxygen, sulfur and other impurities in the air, as well as temperature, such as electrolytic capacitors in a high-temperature environment electrolyte will dry up and so on. If the vacuum packaging, in a constant temperature environment, electronic components storage time is quite long. Place: Ventilation, dry, no corrosive gas. Warehouse to maintain ventilation, light, ventilation, access to a smooth state, smoking is strictly prohibited, prohibit unauthorized use of fire, electricity and do a good job of fire prevention, fire signs clear.

Storage conditions and duration

A. No special requirements for qualified raw materials, semi-finished goods storage conditions: sunshade, room temperature, ventilation, dry.

B. Storage period

① The effective storage period of electronic components is 12 months;

② plastic parts of the effective storage period of 12 months;

③ The effective storage period of hardware is 6 months;

④ The effective storage period of packaging materials is 12 months;

⑤ The effective storage period of finished products is 12 months.

C. special requirements of the goods for special requirements of the materials stored in accordance with the storage requirements. Material category storage relative temperature storage relative humidity storage height, container storage period solder paste, glue class 2-10 ℃ constant temperature and humidity cabinet storage according to the shelf life of electronic components 20 ± 5 ℃ 40% ~ 70%.

The combination of storage temperature and humidity is the decisive factor. The combination of high humidity and high storage temperatures can cause components to absorb moisture or gases, even if stored for a short period of time. For SMDs (Surface Mount Devices), moisture sensitivity is measured by the Moisture Sensitivity Level (MSL) defined by JEDEC standard J-STD-020: MSL Rating Exposure Time Ambient Conditions Unlimited 30°C/85%RH 1 year 30°C/60%RH 4 weeks 30°C/60%RH 68 hours 30°C/60%RH 72 hours 30°C/60%RH 48 hours 30°C/60%RH 24 hours 30°C/60%RH TOL 30°C/60%RH The "exposure time" is the time available after the sealed moisture-proof bag is opened, i.e., components can be reflowed without the risk of "popcorn phenomenon". If the device absorbs moisture during the exposure time it will turn into vapor in the hot oven causing the device to crack, delaminate or even explode. If the exposure time of a component exceeds the specified time, it needs to be "pre-baked". In other words, the device is placed in a drying oven to evaporate the absorbed moisture before use.TOL refers to the "Time of Labeling" indicated by the reference manufacturer.

2.1 Environmental Requirements: Electronic components must be stored in a clean, ventilated, non-corrosive gases in the warehouse class indoor environment, the warehouse should be in the channel in a smooth state. Another storage of electronic components warehouse temperature and relative humidity must meet the following requirements: temperature: -5-30, relative humidity: 20%-75% RH, the warehouse environment temperature and humidity values will directly affect the storage life of electronic components and quality of quality. The storage of electronic components has strict requirements for environmental temperature and humidity parameters.

2.2 Special Requirements: 2.2.1. electrostatic sensitive devices (such as MOS field effect transistors, gallium arsenide field effect transistors, CMOS circuits, etc.), should be stored in the storage equipment with the role of shielding static electricity; 2.2.2. Sensitive to magnetic fields but no magnetic shielding of its own electronic components, should be stored in the role of shielding magnetic field storage equipment; 2.2.3. Electromechanical originals with oil seals shall keep the oil seals intact.

Determination of the limited storage period of electronic components: the limited storage period of electronic components in accordance with the Appendix

2.3  Limited Storage Period : Different grades of electronic components stored in the appropriate temperature and humidity parameters are not the same. class A device storage temperature and humidity values are: 15-25, 25%-60% RH; class B device storage temperature and humidity values are: -5-+30, 20%-75% RH; class C device storage temperature and humidity values are: -10-+40, 10%-80% RH.

2.4  Storage Requirements: 2.4.1. The electronic warehouse requires an anti-static floor, personnel must be in accordance with the requirements of anti-static, dressed in anti-static clothing, wearing anti-static bracelets; 2.4.2. Requirements according to the category of items stored in zones, flammable and explosive products require appropriate isolation measures, for special requirements of the items should have a significant warning signs or safety signs; 2.4.3. The materials are neatly arranged, and the contents of the storage cards are standardized, so that the accounts, materials and cards are in line with each other; 2.4.4. Items can not be stored directly on the ground, need to have a tray or shelf protection; 2.4.5. Material stacking requirements on the small under the big, light under the heavy, a tray can only be placed on the same kind of material, stacking height has special requirements based on special requirements stacking, but the highest shall not exceed 160cm; 2.4.6. Bulk materials, tray materials and items with special requirements for storage specific reference to the relevant norms; 2.4.7. The items with anti-static requirements must be selected according to the actual situation of the following methods: loaded into anti-static bags and anti-static moisture-proof cabinet storage.

2.5  Raw Material Protection Requirements: 2.5.1. Electronic components should give full consideration to the requirements of dust and moisture resistance; 2.5.2. For vacuum-packed PCB light board, IC, etc. to be intact packaging, can not let the copper foil and pins directly exposed to the air to prevent product oxidation; 2.5.3. For the protection of special raw materials, please protect them according to their requirements; 2.5.4. For components with pins, especially IC and other components whose pins are easy to be deformed, we should use the original packaging form to avoid the deformation of the component pins, which may cause inconvenience or even prevent the operation.

2.6 Ambient Temperature and Humidity Requirement

Temperature is a factor we want to discuss in detail. The effects of temperature Cycling of ambient temperatures also causes microcracks and seal failures. If a device is manufactured in a warm and humid climate and then shipped in the cargo hold of an airplane at -40°C, any internal moisture will break the seal as the ice expands. Devices go through different flight or road traffic distribution centers, so they may go through several thaw/freeze cycles before reaching their final destination, causing the malady to continue to grow. If the device then undergoes several winter and summer rotations in a non-temperature-controlled warehouse, less intense but more prolonged thermal cycling stresses may occur. Assuming that the manufacturer states that the device can be stored in a temperature and humidity range of -40°C to +85°C and 50% RH, this does not mean that the device is safe from several temperature cycles within the storage temperature limits. The fact is that if the device is stored at low temperatures in order to minimize the aging process of the ions or atoms (Figure 3), it must be very slowly rewarmed before use. Continuous storage at low or high temperatures is more suitable for the storage of the components than several hot and cold cycles. What happens if the storage temperature is exceeded? SMD devices mounted on PCBs do not have the same thermal expansion or contraction as the substrate itself, so mechanical stresses at extreme temperatures can cause solder to break or devices to rupture. Packaged components (diodes, transistors, etc.) can usually withstand lower temperatures because the housing provides mechanical support for the pins, but they generally have metal leadframes, and copper has a high coefficient of thermal contraction, so failures can occur at temperatures below -40°C. At very low temperatures, the most difficult problems arise in devices that rely on ionic motion or liquid chemical processes, including electrolytic capacitors and some types of ceramic capacitors, because these activities are "frozen" at low temperatures. Other devices sensitive to very low temperatures are wire-wound inductors and transformers. The copper windings in these devices will shrink at low temperatures and exert mechanical strain on the ferrite core, which becomes more fragile at low temperatures because the adhesive of the ferrite grains loses its elasticity. If a product containing a ferrite device is accidentally dropped at low temperatures, even if it is "securely" encapsulated in an adhesive sealer, it can be easily ruptured by mechanical shock (Figure 4), so care should be taken in handling products and accessories taken out of cold storage.

In summary, if a device or accessory is stored in a good environment that is relatively stable or slow to change, the shelf life is very long indeed. Under ideal conditions, RECOM's encapsulated DC/DC or AC/DC power modules have a shelf life of ten years. However, if such a product is put into service after a long period of storage, it should first be allowed to slowly acclimatize to room temperature and visually inspected to ensure that the pins and connectors are free of corrosion. If the product contains electrolytic capacitors, a limited amount of current should be applied to slowly power up the product (a process known as "reconfiguration") and allow the dielectric insulation of the aluminum oxide to recover before subjecting it to full input voltage. Global supply chain issues nowadays have resulted in many distributors and suppliers needing to ship out old inventory to meet customer demand in a timely manner. With proper storage conditions and slow warming before power up, these components may still be in perfect condition for use.

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[sgpowerproductspvtltd]

UL listed copper bonded rod

Copper bonded steel grounding rods are made from low carbon Steel & are molecularly bonded with 99.9% pure electrolytic copper. This conductor is

high strength, excellent elasticity as steel but also good conductivity and corrosion resistance like copper. In Grounding rods , pure copper atom through molecular structure plated to the steel core. Copper Bonded Rods help in dissipating the leakage current to help any assets being damaged from hazards of the same.

These rods are manufactured according to international standards. Copper layer is very helpful in extreme soil conditions such as excessive salt/moisture content, where the copper provides superior corrosion resistance and extra ordinary long life. Earth Enhancing Compound is filled in the hole bored for the installation and that assists in substantially lowering the earth resistance and reduce impedance by increasing the contact area of Rod to the soil. we are one of the leading distributors and manufacturers of UL listed copper bonded rod. We developed this product to meet the needs of our customers. The rod is used in many places to protect people from the dangers that are built in

microwave antennas, communication towers, residential and industrial areas.

UL listed copper bonded rod provides low ground impedance in areas with high ground resistance. The system traps heat and other destructive electrical damage even in rocky or sandy ground conditions when used with Reflow Grounding Minerals.

[tms2plumr]

Panasonic EEE-FT1H470AP in Reel. EEE-FT Series 50 V 47 uF Ø 6.3 x 5.8 mm 105 °C Low ESR High Reflow Electrolytic.

[grandepcba]

PCB Design Requirements for SMT Assembly

1. PCB design should be designed according to the characteristics and requirements of SMT production equipment and technology;

Different processes, such as reflow soldering and wave soldering, have different component layouts. When double-sided reflow soldering, there are different requirements for the layout of the A side and the B side; Selective wave soldering and traditional wave soldering also have different requirements.

The basic requirement of SMT Assembly for PCB design is that the distribution of components on the PCB should be as uniform as possible. The heat capacity of large-quality components during reflow soldering is large. In the meanwhile, too much concentration can easily cause local low temperatures and lead to false soldering; Furthermore, uniform layout is also beneficial The center of gravity is balanced, and it is not easy to damage the components, metallized holes and pads in the vibration and shock experiment.

2. The arrangement direction of the components on the PCB board. Similar components should be arranged in the same direction as much as possible, and the characteristic directions should be consistent to facilitate the mounting, welding and testing of the components;

For instance, the anode of the electrolytic capacitor, the anode of the diode, the single-pin end of the triode, and the first pin of the integrated circuit are arranged in the same direction as possible. All component numbers are printed in the same orientation. The size of the heating head of the SMD rework equipment that can be operated should be reserved around the large components. Heating components should be as far away from other components as possible, generally placed in the corners, ventilated positions in the chassis. The heating components should be supported by other leads or other supports (such as heat sinks can be added) to keep the heating components and the PCB surface at a certain distance, the minimum distance is 2mm. The heating components are connected to the PCB board in the multi-layer board, the metal pads are used in the design, and the solder connection is used during the processing to dissipate the heat through the PCB board. Keep temperature sensitive components away from heating components. For example, triodes, integrated circuits, electrolytic capacitors and some plastic shell components should be kept away from bridge stacks, high-power components, radiators and high-power resistors as much as possible.

The layout of components and parts that need to be adjusted or frequently replaced, such as potentiometers, adjustable inductance coils, variable capacitor micro switches, fuses, buttons, plugs and other components, should consider the structural requirements of the whole machine. Place it in a position that is easy to adjust and replace. If it is adjusted inside the machine, it should be placed on the PCB board where it is easy to adjust; If it is adjusted outside the machine, its position should be adapted to the position of the adjustment knob on the chassis panel to prevent conflicts between the three-dimensional space and the two-dimensional space. For example, the panel opening of the toggle switch and the empty position of the switch on the PCB should match. Fixing holes should be provided near the connection terminals, plug-in parts, the center of the long series of terminals and the parts that are often subjected to force, and there should be corresponding space around the fixing holes to prevent deformation due to thermal expansion. If the thermal expansion of the long series of terminals is more serious than that of the PCB board, it is prone to warping during wave soldering.

3. The electrolytic capacitor cannot touch the heating components, such as high-power resistance thermistor, transformer, radiator, etc.

The minimum distance between the electrolytic capacitor and the heat sink is 10mm, and the minimum distance between other components and the heat sink is 20mm. Do not place stress-sensitive components on the corners, edges, or near connectors, mounting holes, slots, cutouts, gaps, and corners of the PCB board. These locations are high stress areas of the PCB board, which are likely to cause solder joints. And the cracks or cracks of the components. PCB design should meet the process requirements and spacing requirements of reflow soldering and wave soldering. Reduce the shadow effect produced during wave soldering. The positioning holes of the PCB board and the position occupied by the fixing bracket should be reserved.

In the design of large-area PCB boards with an area of more than 500cm2, in order to prevent the PCB board from bending when passing through the tin furnace, a 5~10mm wide gap should be left in the middle of the PCB board without components (wires can be routed). When passing through the tin furnace, add a bead to prevent the PCB board from bending.

4. The arrangement direction of the components of the reflow soldering process: The layout direction of the components should consider the direction of the PCB board entering the reflow oven;

In order to make the welding ends of the two end SMD components and the pins on both sides of the SMD component be heated synchronously, to reduce the tombstone, displacement, and separation of the welding end from the pad due to the simultaneous heating of the welding ends on both sides of the component For soldering defects, the long axis of the two end SMD components on the PCB should be perpendicular to the conveyor belt direction of the reflow oven. The long axis of the SMD component should be parallel to the conveying direction of the reflow oven, and the long axis of the Chip component at the two ends and the long axis of the SMD component should be perpendicular to each other. In addition to the uniformity of heat capacity, a good PCB design must also consider the arrangement and order of components.

5. For large-size PCB boards, in order to keep the temperature on both sides of the PCB board as consistent as possible, the long side of the PCB board should be parallel to the conveyor belt direction of the reflow oven;

When the PCB board size is greater than 200mm, the long axis of SMD components at the two ends is required to be perpendicular to the long side of the PCB board, and the long axis of the SMD component is parallel to the long side of the PCB board. The PCB board assembled on both sides has two sides. The orientation of the components should be the same, the arrangement direction of the components on the PCB board, similar components should be arranged in the same direction as much as possible, and the characteristic directions should be consistent to facilitate the mounting, welding and testing of the components. For example, the anode of the electrolytic capacitor, the anode of the diode, the single-pin end of the triode, and the first pin of the integrated circuit are arranged in the same direction as possible.

6. In order to prevent short circuit between layers caused by touching the printed wires during PCB processing, the distance between the conductive patterns on the inner and outer edges of the PCB should be greater than 1.25mm;

When a ground wire has been laid on the edge of the PCB outer layer, the ground wire can occupy the edge position. For the position on the PCB board that has been occupied due to structural requirements, components and printed wires cannot be laid out. There should be no through holes in the bottom pad area of SMD/SMC to avoid the solder being heated and remelted in the wave soldering after reflow. Installation spacing of components: The minimum installation spacing of components must meet the manufacturability, testability, and maintainability requirements of SMT Assembly.

http://www.58pcba.com/index.php?id=1092

[sgpowerproductspvtltd]

UL listed copper bonded rod | SG Earthing

Copper bonded steel grounding rods are made from low carbon Steel & are molecularly bonded with 99.9% pure electrolytic copper. This conductor is high strength, excellent elasticity as steel but also good conductivity and corrosion resistance like copper. In Grounding rods , pure copper atom through molecular structure plated to the steel core. Copper Bonded Rods help in dissipating the leakage current to help any assets being damaged from hazards of the same. These rods are manufactured according to international standards. Copper layer is very helpful in extreme soil conditions such as excessive salt/moisture content, where the copper provides superior corrosion resistance and extra ordinary long life. Earth Enhancing Compound is filled in the hole bored for the installation and that assists in substantially lowering the earth resistance and reduce impedance by increasing the contact area of Rod to the soil. we are one of the leading distributors and manufacturers of UL listed copper bonded rod. We developed this product to meet the needs of our customers. The rod is used in many places to protect people from the dangers that are built in microwave antennas, communication towers, residential and industrial areas. UL listed copper bonded rod provides low ground impedance in areas with high ground resistance. The system traps heat and other destructive electrical damage even in rocky or sandy ground conditions when used with Reflow Grounding Minerals.

[mokotechnologyltd]

PCB assembly cost

The Printed circuit board is assembly refers to the process of attaching various electronic components to a printed circuit board to develop and complete a fully functional printed circuit assembly. Basically, there are different types of PCB assembly utilized in this process, one is the surface-mount construction, and the other is the through-hole construction. Both of these methods have different benefits when put to use, and the surface mount technique needn't take up much space. Nonetheless, both these methods have their own advantages and disadvantages in the integral process of assembly. So, what are the cost included in the PCB assembly?

Assembly

PCBs is used to connect and support various electronic components by using different conductive pathways, methods, tracks and traces. These electronic components are effectively etched from copper onto a non-conductive substrate. What's more, once the PCB process is completed.then the components will be attached to produce these assemblies, and the component leads will be carefully inserted through the holes in the PCB and the surface-mount construction, and then, the electronic components will be placed on the external pads of the printed circuit board. Lastly, the component leads in both types of this construction will be mechanically fixed to the PCB with the help of soft metal molten solder.

What is the Significance of the PCB Assembly?

These units are essential as they can upgrade the electronic device or gadget without any hassle.

Prototype PCB assembly refers to the process of attaching various electronic components to a PCB and completes a fully functional printed circuit assembly. Basically, there are two types of construction utilized in the process of PCB assembly, they are surface-mount construction and through-hole construction.

Difference Between PCB Assembly And PCB Manufacturing

You may have heard some manufacturers claim that they can "manufacture" printed circuit boards. Other manufacturers claim they can "assemble" circuit boards. So, are they saving the same thing, or is there any difference between printed circuit board manufacturing and printed circuit board assembly?

Actually. there is a difference. Printed circuit board assembly means that a manufacturer will assemble the PCB by soldering the electronic components onto the circuit board itself. Usually, such manufacturers will have a design that they work from.

Manufacturing printed circuit boards is a much more extensive process than circuit board assembly, it requires the manufacturer to design the printed circuit board and create a PCB prototype. And then, the manufacturer will be able to assemble the PCB.

PCB is the circuit board, and PCBA is the circuit board plug-in assembly, added SMT and DIP process.

PCB is a bare board while PCBA is a finished board. It is made of a glass epoxy resin material. According to the number of signal lavers, it is divided into 4, 6 and 8 lavers, and the most common are 4 laver and 6 laver PCBs. PCBA may be understood as a finished circuit board, and PCBA can only be counted after the assembly on the circuit board is completed.

PCBA=Printed Circuit Board +Assembly. In other words, the PCB blank board goes through the SMT and then goes through the entire process of the DIP plug-in, abbreviated as PCBA. Usually, a conductive pattern that provides an electrical connection between components on an insulating substrate is called a printed circuit. There are no components on the top of the PCB, which is often referred to as the "Printed Wiring Board (PWB)."

PCB assembly type1. Surface Mount AssemblyPros:

• SMT, which doesn't require drilling, is less mechanically stressful than the thru-hole assembly. • SMT is a faster and lower-cost manufacturing process than the through-hole assembly. SMT is the optimal assembly method for component-rich designs and allows for more connections per component than the thru-hole assembly.

Cons:

• SMT-assembled PCB prototypes and component repair would be more difficult than those on board assembled by through-hole soldering.

• Usually, SMT components do not as high-powered or high-voltage as thru-hole components.

2. Through-Hole AssemblyPros:

•Thru-hole soldering provides a stronger mechanical bond than any other technique. •Thru-hole soldering is the optimal technique for connectors, transformers, electrolytic capacitors, and other circuit board components. •Thru-hole soldering is considered to be the go-to process over SMIT for many military or aerospace products.

Cons:

Thru-hole soldering requires drilling into the bare circuit board, which makes it a more time-consuming process than SMT. Thru-hole soldering is more expensive than using SMT. Thru-hole mounting may not be allowed as high a component density as SMT does. Thru-hole mounting often requires hand-soldering, which is considered to be less reliable than the reflow ovens used in surface mount PCBA.

3. Mixed technology (SMT and thru-hole soldering together) Pros:

In general, this method is used for more complicated boards where some surface mounting combined with some drilling would best suit a unique PCB layout.

Cons:

Higher cost and longer assembly time than normal due to PTH components.

Printed Circuit Boards Assembly Process

Step 1: Solder Paste Stenciling

The first step of PCB assembly is to apply a solder paste to the board. This process is just like screen-printing a shirt, except instead of a mask, a thin and stainless-steel stencil is placed over the PCB. This enables assemblers to apply solder paste only to certain parts of the would-be PCB. These parts are where components will be placed in the finished PCB.

Step 2: Pick and Place

After applying the solder paste to the PCB board, the PCBA process will moves on to the pick and place machine a robotic device places surface mount components or SMDs on a prepared PCB. SMDs involve most non-connector components on PCBs today. These SMDs are then soldered on to the surface of the board in the next step of the PCBA process.

Step 3: Reflow Soldering

Once the solder paste and surface mount components are all in the place, they need to remain in there. This means the solder paste needs to solidify. adhering components to the board. PCB assembly finishes this through a process called "reflow". After the picking and placing process concludes, the PCB board would be transferred to a conveyor belt. This conveyor belt would then moves through a large reflow oven, which is somewhat like a commercial pizza oven. This oven is made up of a series of heaters which gradually heat the board to temperatures around 250 degrees Celsius. or 480 degrees Fahrenheit. This is hot enough to melt the solder in the solder paste.

Step 4: Inspection and Quality Control

You know, once the surface mount components are soldered after reflow, the assembled board needs to be tested for functionality. Usually, movement during the reflow process will result in; poor connection quality or a complete lack of a connection. What's more, shorts are also a common side effect of this movement, as misplaced components can sometimes connect portions of the circuit that should not connect.

Step 5: Through-Hole Component Insertion

Depending on the type of board under PCBA. the board is possible to include a variety of components beyond the usual SMDs. These include plated through-hole components. or PTH components. A plated through-hole is a hole in the PCB that is plated through the board. PCB components use these holes to signal from one side of the board to the other. In this case, soldering paste would not do any good, as the paste will run straight through the hole without a chance to adhere.

Step 6: Final Inspection and Functional Test

After the soldering step of the PCBA process is finished, a final inspection will test the PCB for its functionality. This inspection is known as a "functional test". The test gets the PCB through its paces, simulating the normal circumstances in which the PCB will operate. And finally, power and simulated signals run through the PCB in this test while testers monitor the PCB's electrical characteristics.

What Affect PCB Assembly Cost

Every electronic engineer or designer wants to know how do you get the best PCB Assembly quote, and how do you what price will affect PCB assembly cost. Here are some tips to guide you on how to control PCB assembly price. PCB Assembly quote. First, a clear understanding of attributes to the cost of PCB assembly (PCBA). Some of the biggest cost drivers include: 1. Assembly Type 2. Components Placet 3. Total numbers of components (SMD+ DIP) 4. Package Size of components 5. Components Package6) Processes Required 6. Quantity and Batch Size(s) 8. Special Part Preparation Requirements (i.e. lead length, height min/max, spacing) 9. Total Cost of BOM 10. Bare Board (PCB) Layer and Material 11. Coating 12. Potting 13. Assembly Compliance 14. Test Requirements (RayMing prefer to test all PCBA boards before ship. We would like you can show us how to test 15. Shipping 16. Delivery ( MOKO Technology provide quick turn PCB assembly services ) All of these 16 tips will affect the PCB assembly price, so you can choose the best one to save the cost, When you source parts, You can provide multiple component sources for each component so you can easily control some cost, not only from Digikey, some agent also have strong price support one someone components.

How to Decrease the PCB Assembly Cost

With improving technologies, the cost of every production is increasing. Profit margins are being raised. When you look for quality products for your application, the costs are likely to be even higher. But, you obviously want to reduce spending on your expenses, without compromising on the quality. Is that even possible?

Electronics companies are always facing issues while attempting to cut down costs as the technology is constantly changing. Electronic devices are always evolving into more and more complex products, in order to meet consumer demands. This is why technology companies are evolving to find new processes for developing products that the end-users demand.

In this blog, you'll learn about the most common electronic product -the PCB assembly -which is seen as a vital component in almost all kinds of electronics. Even though such a common component, PCB assemblies are very expensive, as the manufacturing process involved to build them is very intricate and complex requiring lots of components and labor. Affording such expensive PCBs may become a problem when there are innumerous PCBs involved in your applications. But, neither can you compromise on the quality to reduce their costs. So then, what are you supposed to do? You must approach a PCB assembly manufacturer from China whose goal is to reduce PCB assembly costs without compromising on quality. One such manufacturer is MOKO Technology.

Here are several tips that PCB assembly manufacturers may use to reduce the costs of PCB layout manufacturing.

Understanding that size can result in a more efficient panelization of the board. where more board per panel results in a lesser cost per board, they may use square or rectangular shaped boards in a standard 18-inch x 24-inch manufacturing panel.

They may use standard Fr4 material-% or 1 oz. copper, and 1/16 inch PCB thickness.

They may aim to use .010 inch or larger holes to keep the costs down, as the size of the holes on the board really makes a difference.

They may keep the schematic and parts list changes to the minimum to further reduce costs. Quicker turnaround time is more expensive: thus they may allow enough time for a turnaround.

They include all necessary information regarding the layout guidelines, schematic files, reference layout designs, and mechanical requirements while submitting the files for pricing to minimize the costs.

How does

MOKO Technology

decrease the PCB assembly cost

MOKO Technology has developed its pricing schedule based on various factors that determine PCB assembly costs. Some of our customers call us to better understand the factors involved assembly pricing In general, the factors that cause pricing differences to include PCB dimensions, part types and quantities.soldering methodology, type of inspections, etc.

MOKO Technology can help you reduce costs with such ideas, and make sure to involve them early in the process so that all kinds of decisions can be taken care of beforehand that can help keep the costs down MOKO Technology offers a variety of services with EMS capabilities of product designing, system architecture. value engineering, manufacturing, logistics along with all kinds of required tests done to provide the best quality PCB assemblies to clients.

MOKO Technology offers lead-free assembly based upon the customer's specifications. We own two additional production lines dedicated to lead-free assembly. We employ RoHS-compliant, state-of-the-art soldering methods. The lead-free assembly may result in price changes. however. You can obtain the actual costs by contacting one of our sales representatives. The type and size of the parts that you select will also determine the final PCB assembly cost. Charges may also change if you specify lead-less parts, such as BGA, OFN, etc. In addition, costs may vary with package sizes (e.g.. 0201, 1206, etc.) as well as the inspection methods you specify.

MOKO Technology has a variety of inspection methods, including in-circuit and functional tests, available to ensure high-quality PCBs. We are capable of the following tests: visual inspection for basic quality verifications, x-ray testing for lead-less devices and blank PCBs. Of course, we also have AOI inspections to test solder paste applications, missing components, and polarity. Our inspections are completed without additional charges.

[engineercity]

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New Post has been published on http://engineer.city/chip-capacitor-launch/

Chip capacitor launch

These RoHS Compliant, High Capacitance value BME MLC chip capacitors are manufactured by Knowles in stable Class II dielectrics X7R and X5R. The range is offered with a spread of capacitance values starting at 6.8nF and topping out at 100μF. Because of the extremely low ESR characteristics they are ideal to replace Tantalum and Low ESR Electrolytic Capacitors without polarity concerns. 

They find application as power supply bypass capacitors, smoothing capacitors, input/output filters in DC-DC Converters and in digital circuits and LCD modules. Capacitance tolerances of ±10% and ±20% are available. All parts are available with high reliability screening.  Nickel Barrier termination options include tin, tin/lead or gold flash — all suitable for reflow soldering process. The Gold Flash option is of particular interest to eliminate the problem of tin ‘whiskering’. This issue has become prevalent because pure tin-plated terminations, brought in to comply with RoHS directives, allow tin whiskers to grow from surfaces and can cause electrical short-circuits and failures. This sort of failure can represent a clear and present danger especially to Hi-Rel applications such as medical implantable devices and military equipment.

Novacaps’ gold flash termination has been developed for conductive epoxy or gold/indium solder attachment and consists of a 5 micro-inch minimum gold flash over a nickel barrier.   

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Source: engineerlive.com

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PCB Assembly No Further A Mystery

A PCB (printed circuit board) mechanically supports electronic parts that happen to be electrically associated with the help of conductive pathways, traces etched from copper sheets that are laminated onto a non-conductive substrate. Much from the electronic industry's assembly, PCB design and quality control needs are set by standards that happen to be set with the IPC organization. The main generic standard to the design of your printed circuit is IPC-2221A, whatever the material used to make the board. Circuit boards contain an insulator which includes one or numerous layers of cloth glued in a single entity. The additional layers be grounding towards the board. The copper traces may be created by setting up individual lines mechanically or by coating the complete board in copper and stripping away the surplus. By stripping away the, the needed printed circuits are still which connect electronic parts. Many printed circuit board shops can encourage the design process and gives high end features including an auto router and trace optimizer which could drastically limit the layout time. However, the greatest results for installation of it are achieved by a minimum of some manual routing. Custom PCB These days, there are numerous kinds of circuit boards accessible in variety of materials and finishes, including FR4, FR4 High Temperature, Polyimide, GeTek, Rogers, Arlon, Nelco, Alumina, Ceramic, Bakelite, FR1, CEM1, and CEM5. The thickness of an circuit board varies in accordance with the number of layers and may be as thin as 1.0mm (0.0394"). They could be single sided or multi-layered with cooper clad of 1-oz or better. Although these are typically standard PCBs obtainable in the market, yet you can aquire a customized it to meet your requirements. The key is to search for the right PCB manufacturer for making the boards on your specifications. A custom PCB can be produced in several ways. For instance, flex circuit boards can be very flexible. This allows so that it is placed in positions that happen to be otherwise difficult or to be utilized in wire systems. A PCB can also be taken in satellites, spaceships as well as other machines in outer space. Rigid copper cores are intended in a way that conduct heat from the sensitive parts and protect them within the extreme temperatures they experience. Some circuit boards are made with an interior conductive layer to transfer capability to various parts without making use of extra traces. These customized needs are circuit boards that happen to be ordered by companies to satisfy specific requirements with only a little space. In addition, PCBs are used by students and electronic hobbyists because of their custom projects and applications. Advantages * Are cost-effective and highly reliable. * Economical for high-volume production. * Have color codes for various connections and are also therefore simple to install. * Mention the rating in the device that helps in their maintenance. Disadvantages * More layout effort. * Higher initial cost in comparison with point-to-point constructed circuits or wire-wrapped. * Etching of circuit boards generates chemicals which might be dangerous with the environment. * Cannot be updated once it gets printed. PCB prototypes and low volume PCBs are easily obtainable in the market which can be inexpensive and satisfy the majority of needs. Free PCB software can easily be aquired online these days. It is simple to make use of by a novice and efficient to get a professional. PCB circuit boards are made especially for each circuit and earn construction quite simple.7pcb.co.uk/ Paul Eisle invented the primary PCB in 1936. However, it removed only inside the 1950s if your US military started while using technology in bomb detonators. Today, PCB Circuit Boards are an important part of almost all equipment, like cars, mobiles, computers plus more. How Is A Printed Circuit Board Manufactured? To generate a custom PCB, first the electronic diagram on the required circuit is prepared using Computer Aided Design (CAD) software. After that the PCB prototype is developed using Computer Aided Manufacturing Software technology. The common materials employed for manufacturing PCBs are: FR4, FR4 High Temperature, Polyimide, GeTek, Rogers, Arlon, Nelco, Alumina, Ceramic, Bakelite, FR1, CEM1, and CEM5. The size and thickness from the board will depend on the requirements on the circuit. The substrate is coated that has a layer of copper. Then, using photosensitive coating, the circuit diagram is printed within the board. The undesired copper is etched out of the board to create copper "tracks", called traces. This process is recognized as Photoengraving. There are two other common methods used by developing connecting traces. PCB milling can be a mechanical system where undesired copper is taken away with CNC machines. Another process is Silk-Screen printing, where special ink that may be etch-resistant is needed to cover other parts where the copper traces must be made.Details Once the board is ready with copper traces, holes are drilled in to the board to collect leaded electrical and electronic components. For drilling, special Tungsten Carbide drill bits or laser can be used. The holes made are stuffed with hollow rivets or coated through utilizing an electroplating process, thus forming a power connection one of several various layers. The next step is coating of the whole board, except holes and pads, with masking material. Materials commonly used by this purpose are: lead solder, lead free solder, OSP (Entek), deep/hard gold (electrolytic nickel gold), immersion gold (electroless nickel gold - ENIG), wire bondable gold (99.99% pure gold), immersion silver, flash gold, immersion tin (white tin), carbon ink, and SN 100CL, an alloy of tin, copper, and nickel. The last step is screen-printing, the spot that the legend and text are printed about the PCB. Testing Of PCB Before assembly of components or delivery of Printed Circuit Boards, the board really should be tested to get any possible "shorts" and "opens" that might lead to some non-functioning board. A "short" indicates a good an undesired connection as well as an "open" suggests that two points which should have been connected are unconnected. All such errors needs to be fixed before PCB assembly. It is important to remember that not all PCB Manufacturing shops test the boards before shipping, it is usually considered an extra cost but a significant one to supply a fully functioning board before adding components. PCB Assembly Once the board is ready, components are assembled and added to your surface much like the circuit diagram. Some on the common assembly techniques used are surface-mount construction and through-hole construction. Sometimes, a mixture of these two techniques is also used by assembly. Types of Printed Circuit Boards Single Sided Board This could be the least complex in the Printed Circuit Boards, while there is only a single layer of substrate. All electrical parts and components are fixed somewhere and copper traces are within the other side. Double Sided Board This will be the most common type of board, where parts and components are affixed to both sides on the substrate. In such cases, double-sided PCBs which may have connecting traces on both the edges are used. Double-sided Printed Circuit Boards usually use through-hole construction for assembly of components. Multi Layered Board Multi layered PCB is made of several layers of substrate separated by insulation. Most common multilayer boards are: four layers, six layers, eight layers, and 10 layers. However, the total amount of layers which can be manufactured can exceed over 42 layers. These sorts of boards are employed in extremely complex electronic circuits. PCB Assembly refers towards the attaching of electronic components to your printed circuit board. PCBs are employed to mechanically connect and support electronic components using conductive pathways, traces or tracks that are etched from copper sheets laminated onto a non-conductive substrate. Once the PCB is done then electronic components could be attached to develop a printed circuit assembly. The leads in the components are inserted through holes within the PCB, as well as in surface mount construction, the electronic components are positioned on lands or pads for the outer surfaces with the printed circuit board. The component leads both in types of this construction are then mechanically fixed towards the PCB with soft metal molten solder. There are all sorts of various methods for attaching components to printed circuit boards, and many very high volume production is mostly produced by machine placement and bulk wave soldering or reflow ovens. Sometimes very skilled technicians are widely used to solder really small parts manually , under a microscope. This is achieved by making use of tweezers along with a very fine soldering tip. Some parts for instance ball grid array packages are impossible to solder personally. Very often, surface mount and from the hole construction need to be combined for a passing fancy printed circuit board, as some from the required electronic components are only easily obtainable in surface mount packages, although some are only obtainable in through hole packages.Here One reason to make use of both with the above methods is the fact surface mount techniques occupy less space be going largely unstressed, while over the hole mounting can supply needed strength for almost any components that happen to be likely to endure any physical stress. When the printed circuit board or PCB is built or populated with all the desired components, it might be tested in a volume of different ways that may include: Power on; functional test, checking if your PCB is progressing what it is designed for Power on; in circuit test, physical measurements Power off; visual inspection & automated optical inspection Power off; analogue signature analysis, power off testing Some printed circuit boards could have a conformal coating applied by dipping or spraying after the components are actually soldered. This coating comes with a protective layer which will help prevent corrosion and leaking current on account of condensation. Assembled PCBs are understanding of static and are also often put into antistatic plastic bags for handling and transport purposes. Turnkey refers to some product which is ready-to-go which is sold as being a package deal. Printed circuit board manufacturers take advantage of this concept when developing or Follow-up production (Add a Scope of application, This range could be defined as, Design in USA, produced in China, like Iphone) products for clients. Companies offering full turnkey services take care with the whole process from ordering of merchandise to quality inspection and final delivery. On the contrary, when casually partial turnkey, the various are provided with the clients on the company and the rest is taken care of because of the company itself. Here's why full turnkey PCB assembly is preferred:  Broad Scope and Follow-Through  If that you are intending for making use of full Turnkey PCB assembly service, you'll be guaranteed having a thorough follow-through.While the method is being developed, it is possible to follow up with all the manufacturer and enquire about your product's manufacturing status. In addition to this, having its broad scope, the producer makes sure that all facets are dealt being a whole rather than in parts. This not merely avoids hassle, but in addition helps in manufacturing something which the clients can implement immediately.  Rapid Development  A full turnkey means that the producer is responsible for everything, from acquisition of parts to delivery from the product. PCB Assembly website blog electronics blog Motherboard PCB blog Eduction site

[pinkmiracledefendor]

SMP Model And What It Means To Science And Industry

By Dorothy Brooks

Chemicals need good regulation whenever they are used in industrial processes or the making of products. Industries are now accessing a new system of fulfilling all chemical requirements for these processes, whether for composition, combinatory process and amounts used. This system is based on programmatical matrices that are nonlinear for precision. The science of chemometrics enables technical specialists to solve for aerosol sourcing and composition and the right amount of flow for these. The SMP model or Solver for Mixture Problem set seeks to make the precise calculations for integrated creations of products that have this problem. You can access the data available for this field at relevant online sites, but this is still a somewhat new process that still has some classified content pending pilot testing. After the development of a factoring scale for nonnegative matrices was discovered, the SMP followed. This has made the manufacture of aerosol products safer and more environment friendly. Scientists and mathematicians have contributed to the creation of matrix programming for physical mechanics that automatically correct loading, source, composition and distribution for these products. This kind of model can be integrated for many kinds of industrial or product use. For example, the program is usable for creating data sets for ion or lithium battery chemicals. The concern is always to set the limits on physical attributes when and where a product is used, and make this applicable on all phases of the work sets. This programmed matrix was created from huge databases for ambient and connected facts. The creators think that more uses will be found for it in the future, whenever the electrochemical process is involved, in fields like metal milling, nuclear systems, and some basic processes like reflow soldering. Some pilots are ongoing for industries like electronics, medicine, biotechnology, utilities, robotics, manufacturing, transportation, automotive and aerospace. Ideally the simulation systems create predictive sets for all the materials processed. This means that they can adjust flow, current, temperature and loads in such a way as to distribute and compose the correct material needed at precise times. The possibilities of conquering flow control problems across a number of disciplines have been broadened infinitely by this one item. Voltage, electrolyte gradients and overpotential is now entirely measurable and predictable because of the model. Other elements that can be predicted are Ohmic overpotential, phase distribution, and pore wall flux for all kinds of liquid phases in manufacture and product usage. This entirely new predictive system is now being accessed by literally everyone. The model may become the standard for industrial, chemical and material production use over time. It is already a reliable method for one significant industry that had ISO standard problems in terms of usability and the possibility of harm to the environment. Thus, much safer products for this industry are now being manufactured, marketed and used by consumers. Laboratories are now testing the potential limits of this model. Whatever will be found will definitely be improvements on older methods and the potential is really high for its creating more impetus for the discovery of even better methods. The corrective function has long been a lack that needed to be filled for scientific and technological processes.

About the Author:

If you are looking for the facts about SMP model, come to our web pages online today. More details are available at http://ift.tt/2mazeaB now.

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[ahlam-rania]

The Potential Uses Of The Brilliant SMP Model

By Dorothy Brooks

Chemicals need good regulation whenever they are used in industrial processes or the making of products. Industries are now accessing a new system of fulfilling all chemical requirements for these processes, whether for composition, combinatory process and amounts used. This system is based on programmatical matrices that are nonlinear for precision. The science of chemometrics enables technical specialists to solve for aerosol sourcing and composition and the right amount of flow for these. The SMP model or Solver for Mixture Problem set seeks to make the precise calculations for integrated creations of products that have this problem. You can access the data available for this field at relevant online sites, but this is still a somewhat new process that still has some classified content pending pilot testing. The SMP followed the nonnegative matrix factoring scales, whose discovery was a milestone. The model has very conveniently addressed the problem of being more environmentally friendly for aerosol companies. Math and science are in this kind matrix program that automatically solves for values in sourcing, composition, corrective loads, and distribution. This kind of model can be integrated for many kinds of industrial or product use. For example, the program is usable for creating data sets for ion or lithium battery chemicals. The concern is always to set the limits on physical attributes when and where a product is used, and make this applicable on all phases of the work sets. This programmed matrix was created from huge databases for ambient and connected facts. The creators think that more uses will be found for it in the future, whenever the electrochemical process is involved, in fields like metal milling, nuclear systems, and some basic processes like reflow soldering. Some pilots are ongoing for industries like electronics, medicine, biotechnology, utilities, robotics, manufacturing, transportation, automotive and aerospace. Ideally the simulation systems create predictive sets for all the materials processed. This means that they can adjust flow, current, temperature and loads in such a way as to distribute and compose the correct material needed at precise times. The possibilities of conquering flow control problems across a number of disciplines have been broadened infinitely by this one item. Voltage, electrolyte gradients and overpotential is now entirely measurable and predictable because of the model. Other elements that can be predicted are Ohmic overpotential, phase distribution, and pore wall flux for all kinds of liquid phases in manufacture and product usage. This entirely new predictive system is now being accessed by literally everyone. This model can grow to be the main item for chemical, material production and industrial use in the future. An industry mentioned earlier has found its reliability is very feasible for practical usage, where ISO and environmental problems are concerned. Much safer products may now be expected over time for the industry, even as their current products have become safer, too. Laboratories are now testing the potential limits of this model. Whatever will be found will definitely be improvements on older methods and the potential is really high for its creating more impetus for the discovery of even better methods. The corrective function has long been a lack that needed to be filled for scientific and technological processes.

About the Author:

If you are looking for the facts about SMP model, come to our web pages online today. More details are available at http://ift.tt/2mazeaB now.

The Potential Uses Of The Brilliant SMP Model via B numbr1 site=tumblr">IFTTT

[ahlam-rania]

The Potential Uses Of The Brilliant SMP Model

By Dorothy Brooks

Chemicals need good regulation whenever they are used in industrial processes or the making of products. Industries are now accessing a new system of fulfilling all chemical requirements for these processes, whether for composition, combinatory process and amounts used. This system is based on programmatical matrices that are nonlinear for precision. The science of chemometrics enables technical specialists to solve for aerosol sourcing and composition and the right amount of flow for these. The SMP model or Solver for Mixture Problem set seeks to make the precise calculations for integrated creations of products that have this problem. You can access the data available for this field at relevant online sites, but this is still a somewhat new process that still has some classified content pending pilot testing. The SMP followed the nonnegative matrix factoring scales, whose discovery was a milestone. The model has very conveniently addressed the problem of being more environmentally friendly for aerosol companies. Math and science are in this kind matrix program that automatically solves for values in sourcing, composition, corrective loads, and distribution. This kind of model can be integrated for many kinds of industrial or product use. For example, the program is usable for creating data sets for ion or lithium battery chemicals. The concern is always to set the limits on physical attributes when and where a product is used, and make this applicable on all phases of the work sets. This programmed matrix was created from huge databases for ambient and connected facts. The creators think that more uses will be found for it in the future, whenever the electrochemical process is involved, in fields like metal milling, nuclear systems, and some basic processes like reflow soldering. Some pilots are ongoing for industries like electronics, medicine, biotechnology, utilities, robotics, manufacturing, transportation, automotive and aerospace. Ideally the simulation systems create predictive sets for all the materials processed. This means that they can adjust flow, current, temperature and loads in such a way as to distribute and compose the correct material needed at precise times. The possibilities of conquering flow control problems across a number of disciplines have been broadened infinitely by this one item. Voltage, electrolyte gradients and overpotential is now entirely measurable and predictable because of the model. Other elements that can be predicted are Ohmic overpotential, phase distribution, and pore wall flux for all kinds of liquid phases in manufacture and product usage. This entirely new predictive system is now being accessed by literally everyone. This model can grow to be the main item for chemical, material production and industrial use in the future. An industry mentioned earlier has found its reliability is very feasible for practical usage, where ISO and environmental problems are concerned. Much safer products may now be expected over time for the industry, even as their current products have become safer, too. Laboratories are now testing the potential limits of this model. Whatever will be found will definitely be improvements on older methods and the potential is really high for its creating more impetus for the discovery of even better methods. The corrective function has long been a lack that needed to be filled for scientific and technological processes.

About the Author:

If you are looking for the facts about SMP model, come to our web pages online today. More details are available at http://ift.tt/2mazeaB now.

from B numbr1 http://ift.tt/2lNbC9t via B numbr1 site=tumblr">IFTTT