vias3d - Tumblr blog

[vias3d]

Tosca - VIAS3D - 3DEngineering

The Tosca optimization suite creates optimized design concepts to achieve the highest performance, quality, and eco-efficiency in a shorter development time.As leading technologies for structural optimization and flow optimization, both Tosca Structure and Tosca Fluid offer efficient optimization based on industry standard FEA and CFD software.

The Tosca optimization suite creates optimized design concepts to achieve the highest performance, quality, and eco-efficiency in a shorter development time.

As leading technologies for structural optimization and flow optimization, both Tosca Structure and Tosca Fluid offer efficient optimization based on industry standard FEA and CFD software.

PRODUCTS

Tosca Structure

Tosca Fluid

TOSCA STRUCTURE

Tosca Structure is the market leading technology for structural optimization based on industry standard FEA packages (Abaqus, ANSYS, MSC Nastran). The result is designs with optimum relation between weight, stiffness and dynamic behavior.

Optimization Modules

* Tosca Structure.topology: Optimal design proposals during design concept

* Tosca Structure.sizing: Optimized sheet thicknesses

* Tosca Structure.shape: Specific detail improvements through shape optimization

* Tosca Structure.bead: Specific detail improvements through bead optimization

TOSCA FLUID

Tosca Fluid features unique design and non-parametric fluid flow topology optimization technology for components and systems. It has seamless integration with leading CFD solvers (Star-CCM+, ANSYS Fluent).

Key Benefits

* Automated design development (less physical testing and a reduction in the number of prototypes)

* Shorter development cycles in the design process

* Advanced designs with higher product performance and reduced energy consumption

* Faster time-to-market for innovative designs

Contact Us:

16000 Park Ten Place,

Suite 301,

Houston, TX 77084.

Phone: +1 (832) 301-0881

Email: info@vias3d.com

[vias3d]

MpCCI - VIAS3D - 3DEngineering

The MpCCI interface software is a vendor neutral solution for co-simulation and file based data transfer supporting commercial and research simulation tools in different engineering disciplines.

(1) Software Neutral Solution

The MpCCI interface software is a vendor/ software neutral solution for co-simulation and file-based data transfer.

(2) Best Platform

The MpCCI solution is the best platform for bi-directional co-simulation as well as uni-directional mapping of simulation results in process chains.

(3) Supports Simulation Tools

MpCCI supports a growing number of commercial as well as research simulation tools in different engineering disciplines.

MpCCI Coupling Environment

Bi-directional coupling of simulation codes

The MpCCI Coupling Environment provides an application independent interface for the direct coupling of different simulation codes. Within the MpCCI Coupling Environment, engineers can combine several ready to use models, define the application field and choose for the best-fit coupling method.

MpCCI Coupling Environment has already successfully been used in various application domains:

* Fluid-Structure-Interaction for Aero-Elasticity and flexible Components in Machinery Design

* Thermal Stress and Vibrations in Turbomachinery Applications

* Combined System and 3D Continuum Models for Vehicle and Machine Dynamics

* Coupled Fluid and Radiation for Automotive Thermal Management

* Thermal and Magneto-Hydrodynamic Effects in Electrical Components

* Fluid-Structure-Interactions in Bio-Medical Applications

(1) Structural Analysis

Abaqus [6.14, 2016, 2017]

ANSYS Mechanical [14.5, 15.0, 16.0 – 16.2, 17.0 – 17.2, 18.0]

MSC.Nastran [2013.0, 2014.0, 2014.1, 2016.0, 2016.1, 2017.0]

MSC.Marc [2013, 2013.1, 2014, 2014.1, 2014.2, 2015, 2016]

(2) System Modelling

MATLAB [R2013b, R2014b, R2015a, R2016b]

MSC.Adams [2013 – 2013.2, 2014, 2015 – 2015.1, 2016, 2017]

SIMPACK [9.7, 9.8.1]

FMI for co-simulation (under development)

(3) Electro-magnetics

ANSYS Emag [14.5, 15.0, 16.0 – 16.2, 17.0 – 17.2, 18.0]

FLUX [10.3 – on demand]

JMAG [13.0, 13.1, 14.0, 14.1, 15.0, 15.1]

(4) Fluid Dynamics

ANSYS ICEPAK [14.5, 15.0, 16.0 – 16.2, 17.0 – 17.2, 18.0]

ANSYS Fluent [14.5, 15.0, 16.0 – 16.2, 17.0 – 17.2, 18.0]

FINE/Open [4.1 – 4.3, 5.1, 5.2, 6.1]

FINE/Turbo [9.1-1 – 9.1-3, 10.1, 10.2, 11.1]

OpenFOAM [1.7, 2.0 – 2.4, 3.0, 1606+, 1612+]

STAR-CCM+ [9.02 – 9.06, 10.02 – 10.06, 11.02 – 11.06]

STAR-CD [4.16, 4.18, 4.20, 4.22]

(5) Radiation

RadTherm / TAITherm [11.0 – 11.3.2, 12.0 – 12.2]

Flowmaster [7.6, 7.7, 7.8, 8.0, 8.1, 9.0, 9.2]

(6) Programming Interface

Fully documented programming interface (C/C++, F77) to adapt further inhouse or research codes to MpCCI CouplingEnvironment.

MpCCI Fsimapper

Mapping of fluid results into structural analysis applications

The MpCCI FSIMapper reads various CFD export formats as well as input decks for Abaqus, Ansys, and Nastran.

Quantities that can be read and mapped include film temperature, wall heat transfer coefficient, the wall heat flux, standard and complex pressure, and force densities.

Mapped quantity values can be then simply imported into the Abaqus or Nastran models.

Furthermore, it is possible to compare two geometries with the MpCCI FSIMapper.

Major Features

* File-based mapping solution

* Robust and efficient algorithms

* Handling non-matching geometries

* Automated model positioning

* Fourier Transformation

* Handling cyclic symmetric geometries

* Volume based temperature fields

* Interactive visualization

* Batch capability

The MpCCI FSIMapper supports a growing number of CFD export file formats and input formats for CSM.

(1) CFD

* Source Formats

ANSYS Fluent (.cas, .dat)

ANSYS CFX (.csv)

EnSight Gold (.case)

FINE/Turbo (.cgns)

FloTHERM, FloTHERM XT

FloEFD

* Quantities

Pressure

Heat flux

Temperature

Film temperature, heat coeff.

(2) EM

* Source Formats

MagNet (.vtk)

JMAG (.bdf)

* Quantities

Force

(3) FEM

* Target Formats

Abaqus

ANSYS Mech.

MSC Nastran

* Target Analyses

Deformation

Stress

Heat transfer

NVH

Fatigue

MpCCI Mapper

Transfer of manufacturing history in metal forming applications

The MpCCI Mapper checks the geometric compliance of models by calculating the local distances between them. Automatic mesh alignment helps to adjust the positions of models if they are not in a non-conformal coordinate system.

A robust mapping algorithm enables the transfer of various physical quantities (with nodal-, element- or shell-layer based locations) for all standard shell element and mesh types. The mapping works for different integration types as well as for different number of integration points in thickness direction for source and target model.

Major Features

Automatic Model Positioning

Mapping

Validation

Analysis

Post Processing

The MpCCI Mapper supports most of the leading file formats for forming/stamping, structural analysis, and crash behaviour. The MpCCI Mapper also supports a growing number of formats for (photogrammetric) measurement tools.

(1) Forming

Supported Simulation Disciplines And Codes

LS-Dyna

PAMStamp

AutoForm

RADIOSS

Indeed

Forge

(2) Crash

LS-Dyna

PAMStamp

RADIOSS

Abaqus

ANSYS Mech.

MSC.Nastran

(3) Welding

Abaqus

ANSYS Mech.

Sysweld

(4) Mechanical

Supported Quantities

Thickness

Stress

Strain

Plastic strain

Pressure

Local material properties

(5) Thermal

Temperature

MpCCI Arclib

Model library for electric arc simulations using ansys emag and ansys fluent

The MpCCI ArcLib provides the capability to model the phenomenon of electric arc.

This is provided as an add-on MpCCI CouplingEnvironment for the electric arc simulation based on ANSYS Emag and ANSYS Fluent solvers.

A best practice co-simulation algorithm is included in the package. The application framework supports different strategies to model the contact motion such as remeshing arcing area during the calculation, using a set of predefined meshes to guarantee a minimum cell quality over the simulation.

Beside co-simulation enhancement, the tool includes the standard approximations for arc modeling used in industry:

* Material properties computed in the LTE approximation

* Enhancement of standard radiation model implemented in flow solver

* Interaction of the arc with the electrodes (arc roots)

Contact Us:

16000 Park Ten Place,

Suite 301,

Houston, TX 77084.

Phone: +1 (832) 301-0881

Email: info@vias3d.com

[vias3d]

Endurica - Vias3D - 3DEngineering

Endurica offers fatigue life engineering solutions for rubber: durability simulation software, testing for FEA, fatigue test instruments, and training.

The Endurica Digital Twin (DT) Interface is a newly available option for Endurica CL, the industry-leading solution for rubber fatigue analysis.

Endurica DT™ enables you to analyze fatigue performance of your model within all major nonlinear finite element codes: Abaqus, ANSYS and MSC/MARC

Endurica DT™ includes features for:

Computing damage from a schedule or histogram with multiple load cases.

Stopping and restarting an analysis with incremental load history updates to obtain residual life and virtual damage state for Digital Twin applications.

In 2019 Endurica DT gained stiffness loss capability (note videos below)

Incremental formulation fatigue solver

Stop and restart fatigue analysis to recreate your exact duty cycle

Accumulate damage across multiple load cases

Compute residual life

Use co-simulation to compute stiffness loss

Endurica CL

Endurica CL™ is our original, full-featured solver for elastomer fatigue analysis. It is FE-code neutral, with a command line / text file interface that provides access to advanced capabilities for rubber and elastomer analysis. Endurica CL™ is sold and supported directly by Endurica LLC, the developer.

Endurica CL™ enables you to analyze fatigue performance of your model within all major nonlinear finite element codes: Abaqus, ANSYS and MSC/MARC.

Contact Us:

16000 Park Ten Place,

Suite 301,

Houston, TX 77084.

Phone: +1 (832) 301-0881

Email: info@vias3d.com

[vias3d]

PowerFLOW Suite - VIAS3D – 3DEngineering

PowerFLOW allows simulation engineers, experts and researchers to improve the product design and development process by accurately predicting real world conditions.

Unique, high fidelity inherently transient Lattice Boltzmann-based physics allows SIMULIA’s PowerFLOW® to perform simulations that accurately predict real-world conditions. Using the PowerFLOW suite, engineers evaluate product performance early in the design process prior to any prototype being built—when the impact of change is most significant for design and budgets.

(*) Key Features

> High fidelity CFD Solution

> No volume and boundary layer meshing

> Automated pre & post processing

> Highly parallelized and scalable solution

> Sophisticated physical modeling

> Coupled simulations

> Automated, multi-disciplinary simulation-based design

(*) Application Solution

> Aerodynamics: Aerodynamic efficiency, Vehicle handling, Soiling and water management, panel deformations, load simulations, etc.

> Aeroacoustics: Greenhouse wind noise, sunroof and window buffeting, Pass-By/Community noise, Underbody wind noise, propulsion noise, etc.

> Thermal Management: Cooling airflow, Avionics Cooling, Brake cooling, electronics and battery cooling, thermal protection, etc.

> Climate Control: Cabin comfort, HVAC unit and Distribution System Performance, HVAC System and fan noise, defrost and demist

> Powertrain: Drivetrain cooling, Exhaust Systems, Cooling Jacket, Engine Block, etc.

(*) PowerFLOW Product Suite

> PowerDELTA

> PowerCASE

> PowerCOOL

> PowerTHERM

> PowerVIZ

> PowerINSIGHT

> PowerACOUSTICS

> DigitalROCK

Contact Us:

16000 Park Ten Place,

Suite 301,

Houston, TX 77084.

Ponne: +1 (832) 301-0881

Email: info@vias3d.com

[vias3d]

3dexperience certification center - Vias3D

Vias3D have Dassault Systèmes certified instructors who are also experts in various industry applications providing training for broad range of topics in software solutions and applications.

(*) Introductory – Getting started with the basic software features, meshing, solving linear problems, output visualization, post-processing, etc. Topics cover solutions like Abaqus, fe-safe, Isight, TOSCA, XFlow, CATIA, 3DEXPERIENCE.

(*) Expert-Level – This level features nonlinear problems involving material and geometric nonlinearity, contact and convergence, fracture & damage mechanics, scripting & GUI, etc.

(*) Industry Specific – Contents are designed for particular industries focusing on problems pertinent to respective industrial applications, i.e., Aerospace, Oil and Gas, Structural, Hi-Tech, Life Science, Marine & Offshore, Consumer Packaged Goods, etc. Also, courses like FEA for fitness-for-service analysis, FEA for Offshore are offered.

(*) Customized – Course content are modular and can be a combination of basic to advanced based on client-specific requirement. Typically designed in discussion with our client needs and contains customized examples.

All three modes of delivery are available to meet your needs and convenience.

(1) In-class At Houston & Other Vias3D Facilities Limited Seats Restrictive Schedule Heterogeneity in Student Interest – Difficult to Get Personalized Attention

(2) Onsite At Client’s facility Limited Seats Restrictive Schedule Heterogeneity in Student Interest – Difficult to Get Personalized Attention

(3) Online From Anywhere No Restriction on Attendee Numbers Flexible Schedule Can be Grouped with Homogeneous Student Interest

Also, Vias3D can help you to validate your skills and boost your professional profile with Dassault Systèmes Certification Program.

Dassault Systèmes certification program provides customers, users, and students with a globally valuable index for measuring their knowledge and skills against market norms and promoting their proved competency within the ecosystem.

The certification program also offers valuable feedback on training programs by providing a quantitative before-and-after measurement of trainees acquired skills. Dassault Systèmes certification is in continuously increasing demand as a skill differentiator required by the industry.

Professional Certifications

Our Professional Certifications attest to the capacity to perform in a job role in a professional environment.

Certifications are delivered online and proctored by Vias3D team. To book an exam contact us.

Our Course Completion Certificates attests the acquisition of knowledge and skills during learning activities.

Digital Badges to Boost your Employability

A new type of credential is now available on a selection of exams.

These new digital badges allow you to:

Access job postings and find a job related to skills assessed by your digital badge

Share your achievement on social networks

Be more visible

Promote yourself with a verifiable digital object

This new type of credential does not replace the certificate but comes in addition to it.

Certification Benefits

For Individuals

Certification is a key success factor for Students and Individuals to obtain better paid job opportunities and increased recognition.

By getting certified you demonstrate your expertise and prove your capability to differentiate yourself from the others in today’s increasingly competitive job market. Certification brings credibility to your Curriculum Vitae, leading to significant opportunities for career growth.

Key benefits are

Increased employability

Better paid job opportunities

Salary increase

Career recognition

For Students, Schools and Universities

It provides Talented Students and Individuals with the recognition of their skills in using our solutions to further increase their employability.

For Organizations

Industry Analysts and Experts agree that certifications are one of the most sought-after marques of credibility for expertise in the Information Technology marketplace.

Dassault Systèmes Certification program provides your organization with a valuable index to measure the skills and expertise of your employees, teams, partners, subcontractors, and potential hires.

Key benefits include:

Increased ability to deliver quality projects

Increased capacity to hire skilled people and new talents

Increased competitiveness within the industry market

Valuable indicator for organizations’ educational programs

Contact Us:

16000 Park Ten Place,

Suite 301,

Houston, TX 77084.

Phone: +1 (832) 301-0881

Email: info@vias3d.com

[vias3d]

XFlow - VIAS3D - 3DEngineering

XFlow is a high-fidelity Computational Fluid Dynamics (CFD) software part of SIMULIA’s Fluids Simulation portfolio that saves engineering time with easier to use GUI, automatic lattice creation, simplified set-up and offers value at all stages of the modeling process.

XFlow offers particle-based Lattice-Boltzmann technology for high fidelity Computational Fluid Dynamics (CFD) applications as a part of SIMULIA’s Fluids Simulation portfolio. The state-of-the-art technology of XFlow enables users to address complex CFD workflows involving high frequency transient simulations with real moving geometries, complex multiphase flows, free surface flows and fluid-structure interactions.

Key Features

High Fidelity Single & Multiphase Solver

(*) Particle based Lattice Boltzmann transient solver

(*) LES Turbulence model

(*) High Resolution results for complex geometries with dynamic flows and heat transfer

Easy to use GUI

(*) Unified environment for pre-processor, solver and post-processor

(*) Easy model set-up with built-in Template Projects for external aerodynamics and Hydrodynamics, internal single phase, free-surface and multiphase flows and custom templates.

(*) Low Preprocessing effort with automatic lattice generation and Adaptive Wake Refinement Capability

Capable of handling motion naturally

(*) Handle complex motions easily

(*) 6 degree of freedom

(*) Simpack model re-use

FSI

(*) Very well suited to handle simulation with large deformations

(*) One or Two way Coupling with Abaqus & Simpack

GPU Enabled

(*) Saves computational time

Easy Licensing

(*) On-premise

(*) SIMULIA Cloud for easy scale-up and no hardware installation and maintenance

(*) XFlow can also be launched on the 3DEXPERIENCE platform as a Power’BY integration.

Contact Us:

16000 Park Ten Place,

Suite 301,

Houston, TX 77084.

Phone: +1 (832) 301-0881

Email: info@vias3d.com

[vias3d]

Fe-Safe - VIAS3D - 3DEngineering

Fe-safe is the technical leader in fatigue analysis software for Finite Element models

FATIGUE SOLUTIONS:

(*) Multiaxial strain based fatigue methods

(*) Non-metallic materials

(*) Metals

(*) Elastomers

(*) Thermo-mechanical and creep fatigue

(*) Structural stress method

(*) Welded joints

With fe-safe as an integrated part of the design process, customers have the ability to:

(*) Accurately identify fatigue hotspots

(*) Optimize designs to use less material

(*) Reduce product recalls and warranty costs

(*) Validate design and test programs

(*) Improve correlation between test and analysis within a single user interface

(*) Reduce prototype test timesspeed up analysis times, thereby reducing man-time hours

(*) Increase confidence that your product designs pass their test schedules as “right first time”

Contact Us:

16000 Park Ten Place,

Suite 301,

Houston, TX 77084.

Phone: +1 (832) 301-0881

Email: info@vias3d.com

[vias3d]

Simpack - VIAS3D - 3DEngineering

Simpack is a general purpose multibody simulation (MBS) software used to:

MULTI-BODY DYNAMICS

Simpack is multibody system simulation (MBS) software enabling analysts and engineers to simulate the non-linear dynamic motion of any mechanical or mechatronic system. It enables engineers to generate and solve virtual 3D models in order to predict and visualize dynamic motion, coupling forces and stresses.

From initial concept designs, through to production and redesigns, Simpack is used to help engineers fully comprehend and optimize systems, vastly reduce the need for physical prototyping, reduce time-to-market and improve product quality and lifespan.

Diversity and good connectivity to various multi-physics software (e.g. control, hydraulics and FEA) enable Simpack to be easily integrated into any manufacturer’s already-established development processes.

Simpack simulation software is particularly well-suited to high frequency transient analyses, even into the acoustic range. Simpack was primarily developed to handle complex non-linear models with flexible bodies and harsh shock contact.

(*) Simulate the non-linear dynamic motion of any mechanical or mechatronic system

(*) Predict and visualize motion, coupling forces and stresses

(*) Be easily integrated into any manufacturer’s already-established development processes

(*) Reduce time-to-market and to improve product quality and lifespan.

Simpack is used primarily within the following industry sectors:

(*) Automotive

(*) Engine

(*) Hardware-in-the-Loop (HIL) /Software-in-the-Loop (SIL)

(*) Power Transmission

(*) Railway

(*) Wind Energy

Contact Us:

16000 Park Ten Place,

Suite 301,

Houston, TX 77084.

Phone: +1 (832) 301-0881

Email: info@vias3d.com

[vias3d]

CST Studio - Vias3D - 3DEngineering

SIMULIA offers an advanced simulation product portfolio. It covers simulation disciplines such a structural mechanics, computational fluid dynamics, acoustics, plastic injection molding and electromagnetic field simulation, for a true multiphysics simulation approach.SIMULIA’s realistic simulation solutions accelerate the process of making highly-informed, mission-critical design and engineering decisions before committing to costly and time-consuming physical prototypes.

ELECTROMAGNETIC PRODUCTS

CST STUDIO SUITE

(*) High-performance 3D EM analysis software package for designing, analyzing and optimizing electromagnetic (EM) components and systems.

(*) Electromagnetic field solvers for applications across the EM spectrum are contained within a single user interface.

Coupled simulation: System-level, hybrid, multiphysics, EM/circuit cosimulation.

(*) All-in-one fully parametric design environment.

(*) Import/export wide variety of CAD and EDA files.

(*) Wide range of complex material models.

(*) Complementary tools for Filter Design: Filter Designer 2D (FD2D) and Filter Designer 3D (FD3D).

(*) Powerful post-processing and visualization tools with built-in optimizers.

(*) Common subjects of EM analysis include the performance and efficiency of antennas and filters, EMC/EMI, exposure of the human body to EM fields, electro-mechanical effects in motors and generators, and thermal effects in high-power devices.

ANTENNA MAGUS

(*) Is the most extensive antenna synthesis tool available on the market today.

(*) Its large database of over 350 antennas, transitions and feed structures can be explored to choose the optimal topology.

(*) Validated antenna models can be exported to CST STUDIO SUITE.

(*) Has proven to be an invaluable aid to antenna design engineers and to anyone who requires antenna models for antenna placement and/or electromagnetic interference studies.

SPARK3D

MULTIPACTORAND CORONA ANALYSIS

Spark3D is a unique simulation tool for determining the RF breakdown power level in a wide variety of passive devices, including cavities, waveguides, microstrip and antennas.

(*) Spark3D is a unique simulation tool for determining the RF breakdown power level in a wide variety of passive devices, including cavities, waveguides, microstrip and antennas.

(*) Spark3D is an optional part of CST STUDIO SUITE and is also available as a standalone offering.

(*) Field results from CST STUDIO SUITE simulations can be imported directly into Spark3D to analyze vacuum breakdown (multipactor) and gas discharge.

The main Spark3D features are:

(*) Import the electromagnetic (EM) fields from EM solvers.

(*) Automatic determination of the breakdown power threshold.

(*) Analysis boxes can be defined in order to choose the critical regions to be analyzed.

(*) Real-time output interface with rich simulation data, in table, plot and 3D view forms.

FEST3D

MICROWAVE FILTER DESIGN SOFTWARE

(*) Capable of analyzing complex passive microwave components based on waveguide and coaxial cavity technology.

(*) Fest3D is an optional part of CST STUDIO SUITE and is also available as a stand-alone offering.

Some of the components that can be analyzed with Fest3D are:

(*) Filters (Comb-line, Inter-digital, waffle-iron, dual-mode, bandstop, etc.)

(*) Multiplexers (Diplexers, OMUXs, etc.)

(*) Couplers

(*) Polarizers

(*) OMTs

IDEM

ELECTRONIC DEVICE CHARACTERIZATION

(*) Best-in-class tool for generation of broadband macromodels of linear lumped multi-port structures (via fields, connectors, packages, discontinuities, etc.), known from their input-output port responses.

(*) The raw characterization of the structure can come from measurement or simulation, either in frequency domain or in time domain.

(*) Enables SPICE model extraction and processing for any kind of linear structure, component, interconnect, package, whatever your native characterization and application area.

(*) Is an optional part of CST STUDIO SUITE and is also available as a stand-alone offering.

Contact Us:

16000 Park Ten Place,

Suite 301,

Houston, TX 77084.

Phone: +1 (832) 301-0881

Email: info@vias3d.com

[vias3d]

Plastic Injection Engineer - Continuous digital thread Plastics solution in the 3DEXPERIENCEplatform

Plastics Injection Molding is used to validate and optimize plastic part and mold tooling designs by simulating filling, packing, warpage & mold cooling early in the product development process.

Key Features

Validate plastic part and mold tooling designs for manufacturability and quality

Predict common molding defects

Evaluate the effectiveness of mold cooling system designs

Apply advanced structural capabilities available in the 3DEXPERIENCE Platform

Links to Process Apps (DOE) and Structures Apps (multiscale modeling)

Contact Us:

16000 Park Ten Place,

Suite 301,

Houston, TX 77084.

Phone: +1 (832) 301-0881

Email: info@vias3d.com

[vias3d]

3DVIA Composer - VIAS3D - 3DEngineering - 3DExperience

3DVIA Composer allows you to repurpose existing 3D design data to more rapidly create and update high quality product deliverables including documentation, technical illustrations, animations, and interactive 3D experiences.

By leveraging the power of 3D, you can provide your customers, partners, and stakeholders with more clear, easily understandable product communications that significantly improve their ability to understand and retain complex information.

3DVIA Composer also helps product deliverables to be created earlier in the design process, improving time to market and minimizing costs associated with rework when designs change.

Easy to learn and use, 3DVIA Composer is an ideal complement to Microsoft Office, PDF, and HTML content delivery tools that you are already familiar with. Download your free trial of 3DVIA Composer today and revolutionize the way you communicate technical product information.

Contact Us:

16000 Park Ten Place,

Suite 301,

Houston, TX 77084.

Phone: +1 (832) 301-0881

Email: info@vias3d.com

[vias3d]

ENOVIA - VIAS3D- 3DEngineering

ENOVIA enables you to securely collaborate and innovate together to build and execute a successful plan. Powered by 3DEXPERIENCE®, ENOVIA, a PLM Business Solution by DASSAULT SYSTÈMES, enables sustainable innovation by stakeholders across the enterprise, with a broad portfolio of technical and business applications. ENOVIA empowers you to plan your definition of success.

[vias3d]

BIOVIA – 3DEngineering- Virtual Engineering

BIOVIA Provides scientific innovation lifecycle management support to research, development, QA/QC and manufacturing phases of development. VIAS' BIOVIA solutions offer a wealth of advancement in the worlds of academic and commercial applications. Solutions such as Pipeline Pilot and Materials Studio give clients an end-to-end experience when developing products – without the usual disjointed communication that often accompanies passing through several departments.

[vias3d]

BIOVIA - VIAS3D – 3DEngineering

BIOVIA

Provides scientific innovation lifecycle management support to research, development, QA/QC and manufacturing phases of development.

VIAS’ BIOVIA solutions offer a wealth of advancement in the worlds of academic and commercial applications. Solutions such as Pipeline Pilot and Materials Studio give clients an end-to-end experience when developing products – without the usual disjointed communication that often accompanies passing through several departments.

Pipeline Pilot

It automates the scientific analysis of data, enabling users across the enterprise to rapidly explore, visualize and report research results.

Materials Studio

Materials Studio is modeling and simulation for next-generation materials.

Pipeline Pilot - BIOVIA

Pipeline Pilot is a graphical scientific authoring application that optimizes the research innovation process, increases operational efficiency and reduces costs for both research and IT. It automates the scientific analysis of data, enabling users across the enterprise to rapidly explore, visualize and report research results.It was designed for data scientists, allowing you to train models in a few clicks, compare performance of model types, and save these models for use in the future. Further, you can also embed custom scripts from Python, Perl, or R to maximize its use across the organization.

And because each model is tied to a protocol, organizations are able to see where the data comes from, how it is cleaned and what models generate the results – thus eliminating the problems of a “black box” scenario. Predictions can be trusted to augment scientific work with the latest machine learning techniques.Pipeline Pilot wraps complex functions in simple drag-and-drop components that can then be strung into a workflow. The protocols can be shared between users and groups for reuse, ensuring that solutions are developed faster and standardized across the organization.The materials modeling and simulation capabilities within Materials Studio are accessible within the Pipeline Pilot data pipelining environment. This allows you to access analytical capabilities such as Reflex and Reflex QPA, key functionality of the QSAR Plus package and a utility to integrate scripting applications developed within Materials Studio’s scripting API into Pipeline Pilot Protocols. Materials Studio - BIOVIA A complete modeling and simulation environment designed to allow researchers in materials science and chemistry to predict and understand the relationships of a material’s atomic and molecular structure with its properties and behavior. Materials Studio is modeling and simulation for next-generation materials. By using Materials Studio, researchers in a host of industries are able to engineer high performing materials of all types including:Catalysts Polymers Composites Metals Alloys Pharmaceuticals Batteries And more… The “in silico first” approach allows researchers to optimize materials’ performance in a low cost environment before physical testing. This results in:Accelerating the innovation process Reducing R&D costs Improving R&D efficiency Fostering data-driven decisions Contact Us: 1400 Broadfield Blvd #325 Houston, TX 77084 Phone: +1 (832) 301-0881 E-mail: info@vias3d.com

[vias3d]

BIOVIA - VIAS3D – 3DEngineering

BIOVIA Provides scientific innovation lifecycle management support to research, development, QA/QC and manufacturing phases of development. VIAS' BIOVIA solutions offer a wealth of advancement in the worlds of academic and commercial applications. Solutions such as Pipeline Pilot and Materials Studio give clients an end-to-end experience when developing products – without the usual disjointed communication that often accompanies passing through several departments.

[vias3d]

Tosca Optimization- VIAS3D- 3DEngineering

The Tosca optimization suite creates optimized design concepts to achieve the highest performance, quality, and eco-efficiency in a shorter development time.As leading technologies for structural optimization and flow optimization, both Tosca Structure and Tosca Fluid offer efficient optimization based on industry standard FEA and CFD software.

The Tosca optimization suite creates optimized design concepts to achieve the highest performance, quality, and eco-efficiency in a shorter development time.

As leading technologies for structural optimization and flow optimization, both Tosca Structure and Tosca Fluid offer efficient optimization based on industry standard FEA and CFD software.

PRODUCTS:

Tosca Structure

Tosca Fluid

TOSCA STRUCTURE

Tosca Structure is the market leading technology for structural optimization based on industry standard FEA packages (Abaqus, ANSYS, MSC Nastran). The result is designs with optimum relation between weight, stiffness and dynamic behavior.

Optimization Modules:

Tosca Structure.topology: Optimal design proposals during design concept

Tosca Structure.sizing: Optimized sheet thicknesses

Tosca Structure.shape: Specific detail improvements through shape optimization

Tosca Structure.bead: Specific detail improvements through bead optimization

TOSCA FLUID

Tosca Fluid features unique design and non-parametric fluid flow topology optimization technology for components and systems. It has seamless integration with leading CFD solvers (Star-CCM+, ANSYS Fluent).

Key Benefits

Automated design development (less physical testing and a reduction in the number of prototypes)

Shorter development cycles in the design process

Advanced designs with higher product performance and reduced energy consumption

Faster time-to-market for innovative designs

Contact Us: 1400 Broadfield Blvd #325 Houston, TX 77084 Phone: +1 (832) 301-0881 E-mail: info@vias3d.com

[vias3d]

Tosca - VIAS3D

Tosca The Tosca optimization suite creates optimized design concepts to achieve the highest performance, quality, and eco-efficiency in a shorter development time. As leading technologies for structural optimization and flow optimization, both Tosca Structure and Tosca Fluid offer efficient optimization based on industry standard FEA and CFD software. The Tosca optimization suite creates optimized design concepts to achieve the highest performance, quality, and eco-efficiency in a shorter development time.