semimediapress

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Nexperia introduces MJPE BJT series in compact CFP15B package for automotive and industrial use

July 17, 2025 /SemiMedia/ — Nexperia has expanded its discrete semiconductor portfolio with the release of 12 new MJD-style bipolar junction transistors (BJTs) in clip-bonded FlatPower (CFP15B) packages. Targeted at automotive and industrial power applications, the new MJPE series supports efficient thermal management and system miniaturization, responding to growing industry demand for…

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SK Keyfoundry and LB Semicon co-develop 8-inch Direct RDL for power and automotive chips

July 17, 2025 /SemiMedia/ — SK Keyfoundry has jointly developed an 8-inch Direct RDL (Redistribution Layer) packaging technology with LB Semicon, a semiconductor backend process specialist, and has completed reliability evaluations. The new wafer-level process targets high-current power semiconductors and automotive-grade applications. Direct RDL builds metal wiring and insulating layers…

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WT Microelectronics and NICHIDENBO form strategic alliance through share swap

July 17, 2025 /SemiMedia/ — WT Microelectronics and NICHIDENBO Corporation announced a strategic share swap agreement on July 15 to strengthen collaboration in the electronic components distribution sector. Both companies will subscribe to newly issued shares from each other. After the transaction, WT Microelectronics will hold a 36% stake in NICHIDENBO, while NICHIDENBO will own 5% of WT…

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STMicroelectronics expands Metalenz licensing to scale metasurface optics production

July 16, 2025 /SemiMedia/ — STMicroelectronics has expanded its partnership with Metalenz through a new licensing agreement, aiming to accelerate production of metasurface optics by leveraging its 300mm semiconductor manufacturing platform. The agreement enhances ST’s ability to integrate advanced optics and semiconductor processes for large-scale, high-precision, and cost-effective applications…

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Semiconductor firms gain from U.S.–China policy shift on AI chips and rare earths

July 16, 2025 /SemiMedia/ — U.S. policy adjustments on AI chip exports and rare earth supplies are beginning to ease trade tensions with China, prompting responses from major semiconductor players including Nvidia, AMD and Apple. Nvidia said on July 14 it has filed a request with the U.S. government to resume sales of its H20 AI GPUs to Chinese customers and expects approval soon. The move marks…

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Vishay launches new Gen 3 SiC Schottky diodes for efficient high-voltage power systems

July 16, 2025 /SemiMedia/ —Vishay Intertechnology has introduced three new 650 V and 1200 V Gen 3 silicon carbide (SiC) Schottky diodes in a compact SlimSMA HV (DO-221AC) package, designed to enhance energy efficiency in high-frequency and high-voltage power applications. The devices—VS-3C01EJ12-M3, VS-3C02EJ07-M3, and VS-3C02EJ12-M3—leverage a merged PIN Schottky (MPS) architecture and deliver…

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Texas Instruments recognized by Volkswagen for automotive semiconductor supply excellence

July 15, 2025 /Semimedia/ — Texas Instruments (TI) has received the “Operational Excellence” award at the Volkswagen Group Award 2025, held in Wolfsburg, Germany. The award recognizes TI’s resilient automotive semiconductor supply strategy and continued investment in production capabilities. As modern vehicles increasingly rely on thousands of semiconductors for safety, powertrain, and…

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Broadcom scraps chip facility investment in Spain amid government talks collapse

July 15, 2025 /SemiMedia/ — Broadcom has reportedly abandoned its plan to build a semiconductor back-end facility in Spain after negotiations with the Spanish government broke down, according to people familiar with the matter. The canceled project casts doubt on Spain’s ambitions to become a key player in Europe’s semiconductor landscape. The Spanish government had previously announced plans to…

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Japan’s JS Foundry files for bankruptcy amid sales collapse and rising Chinese competition

July 15, 2025 /SemiMedia/ — Japanese contract chip manufacturer JS Foundry has filed for bankruptcy protection with the Tokyo District Court, carrying an outstanding debt of ¥16.1 billion (approximately $110 million), according to people familiar with the matter. The Tokyo-based company specializes in power semiconductors used in electric vehicles, appliances, and industrial systems. It has…

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Semiconductor supply chain strained by US 50% copper duty

July 14, 2025 /SemiMedia/ — The U.S. government will impose a 50% tariff on all imported copper starting August 1, triggering alarm within the global semiconductor sector due to copper’s critical role in chip production and advanced packaging. Though the tariffs do not directly target semiconductor products, they are expected to significantly raise costs for components such as copper wiring and…

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Sony cuts over 100 jobs at Israel chip R&D center amid IoT strategy shift

July 14, 2025 /SemiMedia/ — Sony has laid off more than 100 employees at its semiconductor R&D center in Hod HaSharon, Israel, marking one of the company’s most significant cuts outside of its gaming division. The move is part of a broader global restructuring strategy targeting non-core operations. The affected site, led by Nohik Semel, employs around 400 staff, meaning over a quarter of its…

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Intel cuts nearly 4,000 jobs across US sites as restructuring deepens

July 14, 2025 /SemiMedia/ — Intel has expanded workforce reductions across multiple U.S. locations and its Israel operations, as part of a broader cost-cutting effort aimed at refocusing on core semiconductor engineering. In the United States, Intel is set to eliminate nearly 4,000 jobs, including up to 2,392 roles at its Oregon facilities. The revised figure marks one of the largest layoffs in…

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TSMC to begin construction of two US advanced packaging plants in 2028

July 11, 2025 /SemiMedia/ — Taiwan Semiconductor Manufacturing Co. (TSMC) is accelerating its advanced packaging investments in the United States, with two new facilities expected to begin construction in 2028. The planned sites will focus on SoIC and CoPoS technologies to support growing demand for local AI and HPC chip packaging. According to industry sources, these packaging plants will be…

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China’s chip demand surge drives Korean 8-inch foundry utilization to new highs

July 11, 2025 /SemiMedia/ — A spike in China’s demand for mature-node semiconductors, driven by state-led “trade-in” subsidies and rising domestic chip production, is fueling record-high utilization rates at Korean 8-inch foundries such as DB HiTek and SK Key Foundry. Amid ongoing U.S.-China tech tensions, Chinese customers have increasingly shifted orders to Korean fabs known for their…

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NXP strengthens China strategy to drive global rollout of system-level semiconductors

July 11, 2025 /SemiMedia/ — NXP Semiconductors is accelerating its global expansion by enhancing its system-level semiconductor capabilities in strategic markets, with China playing a central role in this vision. As a rare semiconductor company with integrated solutions across microprocessors, sensors, connectivity, analog, and security chips, NXP is positioning itself as a core enabler of…

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Intel lays off hundreds in Israel, considers shutting down Fab 28

July 10, 2025 /SemiMedia/ — Intel has begun a new round of global layoffs this week, with its Israel operations significantly affected. Several hundred employees across departments are being dismissed, including approximately 200 staff at its Fab 28 facility in Kiryat Gat. More critically, internal discussions now include the potential full shutdown of the site. Fab 28 currently manufactures…

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GlobalFoundries to Acquire MIPS, Bolstering Semiconductor IP Strategy

July 10, 2025 /SemiMedia/ — GlobalFoundries has announced its intent to acquire processor IP provider MIPS in a strategic move that highlights the current consolidation within the RISC‑V ecosystem. The agreement, pending regulatory approval, is expected to close in the second half of 2025. The acquisition strengthens GlobalFoundries’ portfolio of customizable IP cores and aligns with its…