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PCB Artist: PCB Design Software Backed By Industry Leading PCB Manufacturer
There are many choices for PCB design software online, but not all are created equal. PCB Artist is Advanced Circuits’ own PCB design software that was created with the sole purpose of making it easier for our customers to design and submit their custom printed circuit board files for manufacturing. The PCB design software streamlines the design process with its user-friendly interface and layout tools, including a components library of 500,000 parts.
Using the industry leader’s PCB design software comes with its perks. PCB Artist users enjoy live technical support and integrated PCB manufacturing quoting for instant pricing within the software.
Unrestricted & Free PCB Design Software
Advanced Circuits’ PCBA Artist is truly unrestricted and packed with powerful features. While some free software may limit features with options to purchase or with paid subscriptions, PCB Artist allows its users full access to all features, giving the user more freedom to create printed circuit boards to meet their requirements. Once the PCB design is completed, the software makes it easy to place an order for manufacturing with Advanced Circuits directly through the application; this takes away the uncertainties that come along with exporting the required files from EDA packages that manufacturers may not support.
PCB Artist Features
The professional-grade features that our free PCB design software offers include:
Free component library of over 500k parts
Create up to 28 layer boards
Part Creation Wizard (Easy custom symbol/part/footprint creation)
Multi-page Schematic
Controlled Autorouter
Native Eagle Import
Components/BOM/Positions CSV Export
Moved Component Tracks Stay Connected
Free Gerber files upon request after first order
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Printed Circuit Board Design Tips To Help Reduce Costs
Helping our customers reduce the cost of their printed circuit board projects is always a top priority. Advanced Circuits makes it easy to understand the pricing factors within our quoting structure to help printed circuit board design engineers stay within certain parameters from the start if they are looking for ways to reduce cost.
We offer three low-cost, quickturn prototyping options for 2 and 4 layer PCBs: BareBones, $33 Each, and $66 Each. These special pricing options are fabricated using the same state-of-the-art equipment as our Full-Service offering with few design restrictions.
Another way Advanced Circuits helps printed circuit board design engineers optimize their designs for cost reduction is our Standard Spec and Custom Spec options. When you request an Instant Quote from ALLPCB.com, you are able to compare both manufacturing options side-by-side and you are able to identify the circuit board design features or specifications that will make a difference in cost.
The partial chart above can help you compare the different circuit board design specifications that fall under our Standard Spec and Custom Spec quoting options. Click on the chart to view the complete list of specifications.
Optimize Your Circuit Board Design for Assembly
Advanced Circuits’ in-house PCBA services and our hands-on approach to customer service ensure a seamless transition from PCB fabrication to assembly. This helps you save shipping and transit time from one vendor to the next and helps you avoid communication issues for assembly. To learn more about Advanced Circuits’ Assembly services, click here.
Below, we have put together a list of printed circuit board design tips to help you optimize your design for PCB assembly:
Use PCB design software that easily identifies components and exports BOM/Positions.
Review your printed circuit board design using a separate Gerber viewer or use FreeDFM to find possible manufacturability issues in your design.
Communicate with your PCB assembly provider to ensure the PCB finish specified works best with their assembly process.
Place the components on your circuit board design that must have a specific location first.
Leave at least 100 mils between components and the printed circuit board edge.
Space out your components evenly horizontally and vertically, and orient like printed circuit board components the same direction whenever possible.
Make sure the orientation of your polarized parts is the same.
Avoid placing your components at angles other than 0 or 90 degrees.
When it is necessary to have components on both sides, keep sensitive, heavy, or through hole components on the primary side. Also, any components that need special attention should be kept on the primary side of the printed circuit board as well.
When possible, try to minimize trace lengths.
Consider the volume of the run. If you have a low volume then PCB assembly by hand is a viable option. If you have a high volume run, it is most cost efficient to use automated printed circuit board assembly. Also, the volume is not only determined by the number of printed circuit boards ordered but also by the number of components on each PCB.
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Why is RF PCB hard to design?
Because Radio frequency makes electrons behave differently than they do at lower frequencies or at DC. At lower frequencies, resistive effects dominate, but at higher frequencies, impedance and capacitance start to dominate. Also, at higher frequencies, electrons begin to be forced to the surface of a conductor, instead of traveling into the body of the conductor, and the "matching surface" of the dielectric insulator being used to support the conductor also has an effect on electron flow. The electron exhibits both electronic and magnetic properties as it moves in a conductor, and the magnetic forces can also induce current and noise in nearby adjacent conductors, causing noise, cross-talk, and eddy currents that disrupt desired operation of a complex circuit. These effects become more expressed at higher frequencies used. To alleviate this, miniature transmission lines are designed into PCB, PCBA with specific physical size and spacing characteristics to make sure these high speed signals are contained in the transmission lines, and also that the source impedance matches the load impedance as closely as possible. All of these characteristics require the skilled application of mathematics, not only the board design, but also the mounted components, including accommodations for voltages, currents, resistance, time constants, impedance, impedance matching, logic, and creativity, as well as an innate understanding of the interaction between these inter-related factors.
For low speed signals, certain physical behaviour can be ignored. There will be no phase difference between any two signals (doesn't matter which path they take). All the parasitics behaviour are neglectable. No parasitic capacitance. No parasitic inductance. No coupling between lines. This approximation is only valid when the lower wavelength present is order of magnitude higher than the physical size. RF signals are high frequency signals, with small wavelength. The size of the wavelength is in the same order of magnitude of the PCB. When this happen, the phase of the signal start to matter. There will be parasitic components. The conductors will present a parasitic capacitance and a parasitic inductance. There will be coupling between signals that are (apparently) unconnected. Shape will matter! A simple conductor in the right format can be used as a component! For an exemple: a signal of 10MHz has a wavelength of 30 meters (in the vacum - Er=1). a 1 GHz signal, on the other hand, has a wavelength of 30 cm (in the vacum). In an PCB, the wavelength will be smaller than 14 cm (depending on the material). A trace of 3.5 cm can easily act as an antenna!
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How is a PCB board made?
Manufacturing Process
Printed circuit board processing and assembly are done in an extremely clean environment where the air and components can be kept free of contamination. Most electronic manufacturers have their own proprietary processes, but the following steps might typically be used to make a two-sided printed circuit board.
Making the substrate
1 Woven glass fiber is unwound from a roll and fed through a process station The above illustrations show an enlarged section of a PCB & PCBA .where it is impregnated with epoxy resin either by dipping or spraying. The impregnated glass fiber then passes through rollers which roll the material to the desired thick-ness for the finished substrate and also remove any excess resin.
2 The substrate material passes through an oven where it is semicured. After the oven, the material is cut into large panels.
3 The panels are stacked in layers, alternating with layers of adhesive-backed copper foil. The stacks are placed in a press where they are subjected to temperatures of about 340°F (170°C) and pressures of 1500 psi for an hour or more. This fully cures the resin and tightly bonds the copper foil to the surface of the substrate material.
Drilling and plating the holes
4 Several panels of substrate, each large enough to make several printed circuit boards, are stacked on top of each other and pinned together to keep them from moving. The stacked panels are placed in a CNC machine, and the holes are drilled according to the pattern determined when the boards were laid out. The holes are deburred to remove any excess material clinging to the edges of the holes.
5 The inside surfaces of the holes designed to provide a conductive circuit from one side of the board to the other are plated with copper. Non-conducting holes are plugged to keep them from being plated or are drilled after the individual boards are cut from the larger panel.
Creating the printed circuit pattern on the substrate
The printed circuit pattern may be created by an "additive" process or a "subtractive" process. In the additive process, copper is plated, or added, onto the surface of the substrate in the desired pattern, leaving the rest of the surface unplated. In the subtractive process, the entire surface of the substrate is first plated, and then the areas that are not part of the desired pattern are etched away, or subtracted. We shall describe the additive process.
6 The foil surface of the substrate is degreased. The panels pass through a vacuum chamber where a layer of positive photoresist material is pressed firmly onto the entire surface of the foil. A positive photoresist material is a polymer that has the property of becoming more soluble when exposed to ultraviolet light. The vacuum ensures that no air bubbles are trapped between the foil and the photoresist. The printed circuit pattern mask is laid on top of the photoresist and the panels are exposed to an intense ultraviolet light. Because the mask is clear in the areas of the printed circuit pattern, the photoresist in those areas is irradiated and becomes very soluble.
7 The mask is removed, and the surface of the panels is sprayed with an alkaline developer that dissolves the irradiated photoresist in the areas of the printed circuit pattern, leaving the copper foil exposed on the surface of the substrate.
8 The panels are then electroplated with copper. The foil on the surface of the substrate acts as the cathode in this process, and the copper is plated in the exposed foil areas to a thickness of about 0.001-0.002 inches (0.025-0.050 mm). The areas still covered with photo resist cannot act as a cathode and are not plated. Tin-lead or another protective coating is plated on top of the copper plating to prevent the copper from oxidising and as a resist for the next manufacturing step.
9 The photo resist is stripped from the boards with a solvent to expose the substrate's copper foil between the plated printed circuit pattern. The boards are sprayed with an acid solution which eats away the copper foil. The copper plating on the printed circuit pattern is protected by the tin-lead coating and is unaffected by the acid.
Attaching the contact fingers
10 The contact fingers are attached to the edge of the substrate to connect with the printed circuit. The contact fingers are masked off from the rest of the board and then plated. Plating is done with three metals: first tin-lead, next nickel, then gold.
Fusing the tin-lead coating
11 The tin-lead coating on the surface of the copper printed circuit pattern is very porous and is easily oxidized. To protect it, the panels are passed through a "reflow" oven or hot oil bath which causes the tin-lead to melt, or reflow, into a shiny surface.
Sealing, stenciling, and cutting the panels
12 Each panel is sealed with epoxy to protect the circuits from being damaged while components are being attached. Instructions and other markings are stenciled onto the boards.
13 The panels are then cut into individual boards and the edges are smoothed.
Mounting the components
14 Individual boards pass through several machines which place the electronic components in their proper location in the circuit. If surface mount technology is going to be used to mount the components, the boards first pass through an automatic solder paster, which places a dab of solder paste at each component contact point. Very small components may be placed by a "chip shooter" which rapidly places, or shoots, the components onto the board. Larger components may be robotically placed. Some components may be too large or odd-sized for robotic placement and must be manually placed and soldered later.
15 The components are then soldered to the circuits. With surface mount technology, the soldering is done by passing the boards through another reflow process, which causes the solder paste to melt and make the connection.
16 The flux residue from the solder is cleaned with water or solvents depending on the type of solder used.
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Text
How is a PCB board made?
Manufacturing Process
Printed circuit board processing and assembly are done in an extremely clean environment where the air and components can be kept free of contamination. Most electronic manufacturers have their own proprietary processes, but the following steps might typically be used to make a two-sided printed circuit board.
Making the substrate
1 Woven glass fiber is unwound from a roll and fed through a process station The above illustrations show an enlarged section of a PCB & PCBA.where it is impregnated with epoxy resin either by dipping or spraying. The impregnated glass fiber then passes through rollers which roll the material to the desired thick-ness for the finished substrate and also remove any excess resin.
2 The substrate material passes through an oven where it is semicured. After the oven, the material is cut into large panels.
3 The panels are stacked in layers, alternating with layers of adhesive-backed copper foil. The stacks are placed in a press where they are subjected to temperatures of about 340°F (170°C) and pressures of 1500 psi for an hour or more. This fully cures the resin and tightly bonds the copper foil to the surface of the substrate material.
Drilling and plating the holes
4 Several panels of substrate, each large enough to make several printed circuit boards, are stacked on top of each other and pinned together to keep them from moving. The stacked panels are placed in a CNC machine, and the holes are drilled according to the pattern determined when the boards were laid out. The holes are deburred to remove any excess material clinging to the edges of the holes.
5 The inside surfaces of the holes designed to provide a conductive circuit from one side of the board to the other are plated with copper. Non-conducting holes are plugged to keep them from being plated or are drilled after the individual boards are cut from the larger panel.
Creating the printed circuit pattern on the substrate
The printed circuit pattern may be created by an "additive" process or a "subtractive" process. In the additive process, copper is plated, or added, onto the surface of the substrate in the desired pattern, leaving the rest of the surface unplated. In the subtractive process, the entire surface of the substrate is first plated, and then the areas that are not part of the desired pattern are etched away, or subtracted. We shall describe the additive process.
6 The foil surface of the substrate is degreased. The panels pass through a vacuum chamber where a layer of positive photoresist material is pressed firmly onto the entire surface of the foil. A positive photoresist material is a polymer that has the property of becoming more soluble when exposed to ultraviolet light. The vacuum ensures that no air bubbles are trapped between the foil and the photoresist. The printed circuit pattern mask is laid on top of the photoresist and the panels are exposed to an intense ultraviolet light. Because the mask is clear in the areas of the printed circuit pattern, the photoresist in those areas is irradiated and becomes very soluble.
7 The mask is removed, and the surface of the panels is sprayed with an alkaline developer that dissolves the irradiated photoresist in the areas of the printed circuit pattern, leaving the copper foil exposed on the surface of the substrate.
8 The panels are then electroplated with copper. The foil on the surface of the substrate acts as the cathode in this process, and the copper is plated in the exposed foil areas to a thickness of about 0.001-0.002 inches (0.025-0.050 mm). The areas still covered with photo resist cannot act as a cathode and are not plated. Tin-lead or another protective coating is plated on top of the copper plating to prevent the copper from oxidising and as a resist for the next manufacturing step.
9 The photo resist is stripped from the boards with a solvent to expose the substrate's copper foil between the plated printed circuit pattern. The boards are sprayed with an acid solution which eats away the copper foil. The copper plating on the printed circuit pattern is protected by the tin-lead coating and is unaffected by the acid.
Attaching the contact fingers
10 The contact fingers are attached to the edge of the substrate to connect with the printed circuit. The contact fingers are masked off from the rest of the board and then plated. Plating is done with three metals: first tin-lead, next nickel, then gold.
Fusing the tin-lead coating
11 The tin-lead coating on the surface of the copper printed circuit pattern is very porous and is easily oxidized. To protect it, the panels are passed through a "reflow" oven or hot oil bath which causes the tin-lead to melt, or reflow, into a shiny surface.
Sealing, stenciling, and cutting the panels
12 Each panel is sealed with epoxy to protect the circuits from being damaged while components are being attached. Instructions and other markings are stenciled onto the boards.
13 The panels are then cut into individual boards and the edges are smoothed.
Mounting the components
14 Individual boards pass through several machines which place the electronic components in their proper location in the circuit. If surface mount technology is going to be used to mount the components, the boards first pass through an automatic solder paster, which places a dab of solder paste at each component contact point. Very small components may be placed by a "chip shooter" which rapidly places, or shoots, the components onto the board. Larger components may be robotically placed. Some components may be too large or odd-sized for robotic placement and must be manually placed and soldered later.
15 The components are then soldered to the circuits. With surface mount technology, the soldering is done by passing the boards through another reflow process, which causes the solder paste to melt and make the connection.
16 The flux residue from the solder is cleaned with water or solvents depending on the type of solder used.
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