#smtassembly

[ascompinc]

Revolutionizing Electronics Manufacturing with Robotic Soldering Station in India

The electronics manufacturing industry is witnessing a rapid transformation, with automation becoming a key factor in enhancing productivity, precision, and consistency. One of the most groundbreaking innovations driving this change is the Robotic Soldering Station in India. Designed for high-speed and high-precision soldering tasks, these stations are quickly becoming indispensable in modern production lines.

A Robotic Soldering Station in India offers unparalleled accuracy in soldering small electronic components, making it especially valuable for industries like automotive electronics, telecom, consumer devices, and medical equipment manufacturing. These systems are engineered to perform repetitive soldering tasks with minimal variation and human error, ensuring uniform quality across thousands of units.

The key advantage of robotic soldering stations lies in their automation capabilities. With programmable logic controllers (PLCs) and motion control systems, these machines follow exact soldering patterns and temperature profiles. This results in stronger, cleaner solder joints and drastically reduces the risk of issues like cold soldering or component overheating. For manufacturers aiming to meet international quality standards such as IPC-A-610 or ISO 9001, robotic soldering is a game-changer.

Indian industries are quickly recognizing the long-term benefits of adopting automation, and the demand for robotic soldering systems is on the rise. Companies like Ascomp Inc. are at the forefront of supplying cutting-edge Robotic Soldering Station in India that match global performance benchmarks while remaining cost-effective. Their solutions come equipped with intelligent features like temperature sensors, real-time monitoring, and easy programming interfaces, making them ideal for both high-volume production and R&D labs.

Moreover, robotic soldering stations contribute significantly to workplace safety and efficiency. By minimizing human involvement in high-heat operations, these machines reduce the chances of workplace accidents and exposure to harmful soldering fumes. Paired with fume extractors, they create a safer and healthier work environment for technicians.

Another compelling benefit of investing in robotic soldering is the consistency and scalability it offers. Whether you're working with through-hole or surface mount components, a robotic station ensures repeatable quality—something that’s nearly impossible to achieve manually on a large scale. This consistency directly translates to fewer product returns, higher customer satisfaction, and improved brand reputation.

As India continues to strengthen its position as a global electronics manufacturing hub, the role of robotic systems will only become more significant. Businesses that invest early in automation not only gain a competitive edge but also future-proof their production processes against rising labor costs and global quality demands.

[perlina-hitechcircuits]

Hitech Circuits—Your Reliable Supplier for Premium PCB Assembly

At Hitech Circuits, we specialize in high-efficiency, high-precision surface mount technology (SMT) assembly, delivering unmatched capacity and quality for your PCB projects. 

Our Capabilities:

1. Massive Daily Output

1 Million+ Components Placed Daily**: Powered by fully automated SMT lines (e.g., Fuji NXT, Siemens SIPLACE) and high-speed pick-and-place systems, we ensure rapid production scaling for both prototypes and bulk orders. 

2. Advanced Packaging Expertise

QFN/BGA Mastery: Our precision equipment handles ultra-fine-pitch components, including QFN (0.3mm pitch) and BGA (down to 0.2mm ball diameter), with 99.99% placement accuracy. 

X-Ray Inspection: 100% in-line X-ray verification for BGA solder joints, voids, and alignment defects, ensuring zero hidden faults. 

3. End-to-End Quality Control

AOI + SPI Integration: Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) at every stage.  

IPC-A-610/612 Compliance: Certified processes for mission-critical applications. 

Why Choose Us? 

Speed-to-Market: 48-hour prototype turnaround & 10-day mass production cycles. 

Flexible MOQs: Support for small-batch R&D to 100k+ volume orders. 

Global Material Sourcing: Access to a vetted network of component suppliers, reducing lead times. 

Contact Us Today!

Let’s optimize your PCB assembly with speed, precision, and reliability. 

Email:sales3@hitechcircuits.com 

Tel & Whatsapp: +86-180333061378 

Location: Building C, Suojia Technology Park, Hangcheng, Xixiang, Shenzhen, Guangdong, China

Authority certification: we're fully ISO9001:2015, ISO14001:2015 , UL (E354070) and RoHS certificated. You can reply on us for custom PCB production and Electronic assembly.

[rajendra314]

SMD PLATE AVAILABLE IN ALL RUNNING SIZES ( 42 , 84 , 126 & 168 )

STOCK AVAILABLE !!!

For any Query:

☎ : +91-9899391155, +91-9910772484

Know More: https://www.indiamart.com/rajendra-electronics-newdelhi/

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#smdplate #surfacemountdevice #pcbassembly #electronicsengineering #soldering #smtcomponents #ElectronicsDesign #PCBproduction #smdtechnology #solderingstation #circuitboard #electroniccomponents #techinnovation #smtassembly #electronicsmanufacturing #solderingtools #electronicprojects #smdassembly #smtsoldering #techprototyping

[pncinc]

Bill Of Materials Management In PCB Design Process

Managing the Bill of Materials in the PCB design process can be a complex and time-consuming endeavor. Luckily, there are ways to make this process easier and more efficient. So, we will explore how to streamline BOM management in design so that you can save time and money. You will learn the best practices for maintaining an accurate BOM, methods for keeping track of changes, and tips for improving the overall design process. With these strategies, you can produce high-quality products faster and more effectively.

For more details visit: Read more: https://bit.ly/3NvIz9X Website: https://pnconline.com Twitter: https://twitter.com/PNCINC Facebook: https://www.facebook.com/PNCONLINE Pinterest: https://www.pinterest.com.au/rrosh2014/ Bresdel: https://bresdel.com/pncinc Myspace: https://myspace.com/pncinc2020 Address: 115 East Centre St. Nutley, NJ, 07110 Call us: (973) 284-1600 Email us: sales@pnconline.com   

[eitplems-blog]

EITPL provides the best of the practices for #pcba /printed circuit board assembly /box build assembly with Cost-effective manufacturing and highly proficient PCB Testings.To know more visit - https://eitplems.com/Or Call us 

[cnelectronicpioneer]

When you are looking for substrates for electronic circuits with a high thermal conductivity and a low expansion coefficient, ceramic PCB will be your preferred choice of material. #kinglisheng is a very good provider of that! http://eng.jlspcba.com/

[agilecircuit]

#pcba #assembly #modules #manufacturer #makers #industrial #thtassembly #populated #factory #china #smtassembly #electronics #circuitboard #module #engineering #electronics #embedded #embeddedsystems #machine https://www.instagram.com/p/BnCnjA6AxbN/?utm_source=ig_tumblr_share&igshid=1muyxbyp6zgq8

[grandepcba]

Analysis Of Solder Beads Defects In SMT Assembly

SMTAssembly Solder Beads Defect Explanation

SMT Assembly solder beads defects not only affect the appearance but also cause bridging defects. Simply speaking, solder beads can be divided into two categories: One type appears on one side of the SMD component, often in the shape of an independent large ball (see Figure 1 below); The other type appears around the IC pins and which is in the shape of scattered beads.

Picture: Solder beads are located on the waist side of the component

Analysis of the Causes of Solder Beads Defect in SMT Assembly

Factor A: The temperature curve is incorrect▼

The reflow curve can be divided into 4 sections: Preheating, heat preservation, reflow and cooling. The purpose of preheating and heat preservation is to increase the surface temperature of the PCB to 150°C within 60-90s and keep it warm for about 90s so that it not only reduces the thermal shock of PCB and components, but also ensures that the solvent of the solder paste can be partially volatilized. Avoid splashing caused by too much solvent during reflow soldering, causing the solder paste to rush out of the pad and form tin beads.

Solution

The factory should pay attention to the heating rate and adopt moderate preheating to make the solvent fully volatilize

Factor B:The quality of solder paste▼

①The metal content in the solder paste is usually (90±0.5)℅. Too low metal content will cause too much flux composition, and too much flux will cause flying beads due to the fact that it is not easy to volatilize during the preheating stage;

②The increase of water vapor and oxygen content in the solder paste will also cause flying beads. Since solder paste is usually refrigerated, when it is taken out of the refrigerator, if it is not fully warmed to thaw and stirred evenly, water vapor will enter; in addition, the lid of the solder paste bottle must be tightly closed after using every single time. If it is not tightly closed in time, which will definitely cause the entry of water vapor;

③After the solder paste printed on the stencil is completed, the remaining part should be treated separately. If it is put back in the original bottle, the solder paste in the bottle will deteriorate and tin beads will also be produced;

Solution

The factory is required to choose high-quality solder paste and pay attention to the storage and use requirements of the solder paste.

Other factors include ▼

①The printing is too thick, and the excess solder paste overflows after the component pressed down;

②The pressure of the patch is too high, and the downward pressure will cause the solder paste to collapse onto the solder mask;

③The shape of the pad opening is not good, and no anti-tin bead treatment has been done;

④The activity of the solder paste is not good, it dries too fast, or there are too many small tin powders;

⑤The printing is offset, so that part of the solder paste is stained on the PCB;

⑥The scraper speed is too fast, causing bad edge collapse, and solder balls after reflow.

http://www.58pcba.com/index.php?id=1085

[pncinc]

Our PCB assembly services include SMT assembly, mixed technology, and through-hole in a ESD protected, humidity controlled environment. Our high speed SMT lines are equipped with solder paste inspection, 40” high definition Inspection monitors with max magnification at 600X, 13 zone re-flow ovens and 3D AOI. Through-hole capabilities include an 18’ slide line with four high definition monitors, wave solder, or the use of the latest selective soldering technology equipment. PNC’s final inspection area includes (4) inspection stations with high definition monitors designed for employee ergonomic comfort.

Quantities range from small-number prototypes to large production orders. We serve the military/defense, medical, aerospace, automotive, industrial and consumer sectors. Since we have the capability to design and fabricate printed circuit boards in the same facility, we are able to turn concepts into prototypes in as little as 24 hours. Other PCB assembly services include functional testing, programming, conformal coating, 3D X-Ray, box builds, lead free and leaded rework stations.

The PNC Inc. quality system ensures that our employees are IPC-A-610 and IPC-J-STD Class III-qualified. Company certifications include, AS9100D, ISO 9001-2015, MIL-PRF-55110 and MIL-PRF-31032. Our SMT assembly area are ITAR-restricted per mil standards. We are ESD compliant to ANSI/ESD S20.20.

PRINTED CIRCUIT BOARD ASSEMBLY CAPABILITIES

Surface Mount Technology (SMT)

We utilize state of the art Universal and Juki Pick & Place equipment in our SMT assembly division. These machines are capable of placing 17,100CPH to 23,500CPH with capacity to accommodate 160 8mm Electronic tape feeder with placement accuracy of +/-.05mm. Our Heller 13 zone re-flow ovens have 26 Independent temperature-controlled heating zones to accommodate the right profile whether the printed circuit board assembly is for double sided or multi-layer PCB’s.

Components as small as 0201 package size

Package types: QFPs, uBGAs, QFN, and BGAs

Two-sided assembly for Rigid, Flex and Rigi-Flex PCBs

Ability to do IPC-A-610 Class 1, 2 and 3

RoHS and Leaded assembly

THRU HOLE TECHNOLOGY

PCB assembly services in the through-hole arena are many. Our expertise with Axial, Radial, DIP, Right Angle connectors, Header connectors, SIP sockets and pogo pins, to name a few that we work with daily. A majority of these components are soldered with the latest selective solder machine that is nitrogen assisted for hole fill consistency per IPC class standards. If the PCB assembly is 100% through-hole, we utilize an 18’ slide line equipped with 4 inline workstation high definition monitors to display each operators work tasks. This type of printed circuit board assembly would be passed through our wave soldering machine for mass production soldering.

Highly Skilled Staff IPC J-Std-001 trained and certified

Manual Through Hole Assembly

Custom Slide line for larger volume

Press fit connectors

Wave soldering

Select solder machine for Lead and Lead-free (RoHS) products

MIXED TECHNOLOGY

Most PCB assembly will require some type of through hole devices. Since this type of printed circuit board assembly has SMT components previously installed, the through-hole devices will be selectively soldered. Our ERSA selective soldering machine is nitrogen assisted to achieve the highest quality solder joints to meet IPC hole requirements.

PCBA CLEANING

Paste used in our SMT assembly lines is a no clean paste, but we clean 100% the PCBA’s providing there are no components on the printed circuit board assembly that cannot be aqueously cleaned, such as displays, switches, etc. Our Nano Jet Inline cleaning system is capable of both water and aqueous chemical cleaning applications based on customer requirements.

BOX BUILD ASSEMBLY

PNC not only offers full turnkey PCB assembly, but also integrating the printed circuit board assembly into enclosures. Our experience in box builds come in many different sizes, shapes and enclosure materials. Our capability of enclosure assemblies is from snap together plastic housing to metal form factors that require torque specifications.

Plastic/Metal enclosures

Mechanical assemblies

Kitting, labelling and packaging of finished product with all components and documentation

Direct ship to distributors or end customers

[pncinc]

Printed circuit boards come up in different colors of which a green solder mask is the most common one. You will see most circuit boards with green solder masks. But, the industry is getting innovative due to changing technologies, so designers try new colors to make printed circuit boards.

PCB Solder Mask

Before getting into PCB colors, you should know what the solder mask is? The printed circuit board has different layers, and the top layer is the solder mask, whereas the bottom layer is the copper foil. The purpose of the solder mask is to cover the bottom layer from getting polluted or oxidized. The main material of solder masks is often the insulating resin which is printed on the circuit board’s unsoldered areas. The resin protects the board from heat, moisture, and any kind of damage.

Website: https://pnconline.com/ Facebook: https://www.facebook.com/PNCONLINE Twitter: https://twitter.com/PNCINC Instagram: https://www.instagram.com/pnc_pcb/ Tumblr: https://www.tumblr.com/blog/view/pncinc Myspace: https://myspace.com/pncinc2020 Bresdel: https://bresdel.com/pncinc Call us: (973) 284-1600 Email us: sales@pnconline.com Location: PNC INC, 115 East Centre St.Nutley, NJ, 07110

[pncinc]

Printed circuit boards come up in different colors of which a green solder mask is the most common one. You will see most circuit boards with green solder masks. But, the industry is getting innovative due to changing technologies, so designers try new colors to make printed circuit boards.

PCB Solder Mask

Before getting into PCB colors, you should know what the solder mask is? The printed circuit board has different layers, and the top layer is the solder mask, whereas the bottom layer is the copper foil. The purpose of the solder mask is to cover the bottom layer from getting polluted or oxidized. The main material of solder masks is often the insulating resin which is printed on the circuit board’s unsoldered areas. The resin protects the board from heat, moisture, and any kind of damage.

Website: https://pnconline.com/ Facebook: https://www.facebook.com/PNCONLINE Twitter: https://twitter.com/PNCINC Instagram: https://www.instagram.com/pnc_pcb/ Tumblr: https://www.tumblr.com/blog/view/pncinc Myspace: https://myspace.com/pncinc2020 Bresdel: https://bresdel.com/pncinc Call us: (973) 284-1600 Email us: sales@pnconline.com Location: PNC INC, 115 East Centre St.Nutley, NJ, 07110

[pncinc]

PCB is a printed circuit board that helps connect different electrical components. The board is a combination of laminated material, and the copper foil laid on a non-conductive substrate.

A PCB is the main part of any electronic device, so it has to be perfect. It should have functional components and microelectronics circuits to perform well. Development of PCB goes through different processes that you should know well. PCB manufacturing has 4 stages, including design, manufacturing, PCB assembly, and PCB testing.

First Stage- Design

PCB design involves different steps, such as schematic design, layout planning, the placement of the components, routing, and manufacturing files.

PCB schematic design: It is a blueprint of PC design that shows all PCB components with symbols. The schematic design is always according to the technical requirements of the user.

Layout planning: After the schematic design, you have to develop the layout of a PCB that includes physical components’ models, the shape of the PCB, and the structure of a PCB.

Placement of components: It involves planning the placement of various components. You decide on the PCB layers according to your requirements. The right placement of the components ensures a flawless board, decreasing the production cost.

First of all, the designer places the fixed components in the layout, including switches and connectors.

Then, the critical components are placed, such as memory chips, microprocessors, as well as power supplies.

Then the supporting components of the PCB are placed, like inductors, capacitors,  and resistors.

In the end, the decoupling capacitors and terminating resistors are placed.

Routing: Once the components are placed, you have to connect all components through trace routing. There are four ways to do so, such as manual routing, auto-interactive routing, semi-automatic, and batch-auto routing. You can choose any method according to your Printed Circuit Board and budget.

Design: In this stage, you have to plan for the number of board layers, dimension of the board, and types of components. You can use a special app in this case, such as EDA or electronic design automation. The designer often adopts the SMT instead of a through-hole technology, depending on your requirements.Once the design is over, you can export the design files to CAD or Gerber format.

Preparation of manufacturing files: This is the last stage of design where the designer exports the Gerber files for manufacturing. The manufacturer needs these files to develop a printed circuit board.

Website: https://pnconline.com/ Facebook: https://www.facebook.com/PNCONLINE Twitter: https://twitter.com/PNCINC Instagram: https://www.instagram.com/pnc_pcb/ Tumblr: https://www.tumblr.com/blog/view/pncinc Myspace :https://myspace.com/pncinc2020 Bresdel: https://bresdel.com/pncinc Call us: (973) 284-1600 Email us: sales@pnconline.com Location: PNC INC, 115 East Centre St.Nutley, NJ, 07110

[pncinc]

MicroCare SMT Assembly Stencil Cleaners are high-performance, high-yield cleaners that include stencil-wiping rolls, lint-free wipes, and presaturated alcohol wipes. MicroCare SMT Stencil Rolls are engineered for lead-free and fine-pitch applications. These rolls use a highly specialized fabric that is exceptionally strong and absorbent. MicroCare Presaturated Wipes from MicroCare are ideal for cleaning SMT stencils, PCBs, tools, plastic parts, metal cabinets and housings, work benches, and test equipment. They remove flux residues, solder paste, fingerprints, oils, grime, lint, and dust. All MicroCare presaturated wipes have an unlimited shelf life because a slam shut lid keeps the wipes from drying out.

smt assembly

Know more: https://www.pnconline.com/

Call us: (973) 284-1600 Visit us: sales@pnconline.com Location: PNC INC, 115 East Centre St. Nutley, NJ, 07110

[pncinc]

smt assembly service

We are leading provider of complete SMT Assembly Service ranging from Printed Circuit Assembly to Complete System Integration and Box Build. Our customers are satisfied with our high-standards of electronic manufacturing services. We specialize in quick-turn services for highly complex and advanced SMT assembly and systems manufacturing in meeting dynamic business needs. We have a competent engineering and manufacturing team to help many customers to give complete solutions to all kinds of SMT manufacturing requirements. East India Technologies is providing best services in SMT prototyping. After many tests, validation and with the help of our top quality assurance model, we provide the best version of the product and serves the client to analyze the functional design of their desired product.

Call us: (973) 284-1600 Visit us: sales@pnconline.com Location: PNC INC, 115 East Centre St. Nutley, NJ, 07110

[pncinc]

BGA SMT assembly process

BGA is an abbreviation for Balls Grid Arrays is a greater surface mounted packaging technique. 

Readmore: https://bit.ly/3I4lViy