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FUNDAMENTAL TRANSFORMATION IN EMBEDDED ARCHITECTURE

In day to day life, our needs become more dominant on embedded systems; mainly the emphasis is on digital technology that is embedded in most of the hardware and software systems. This has its application not only in automotive control, railways, aircraft, aerospace and Medical electronics, but also in communications, mobile devices and household appliances.

Technology drives innovation to the next level , having newer notions like electricity generating tire, 3D printing car known for its varied designs, Carbon Nano tubes used in producing electricity, altering-current motors, DC motors and many more. Electrically asserted hybrid models fusion the electric motor and conventional engine with simple installations and user friendly systems into the mechanism of the car.

Thus modernistic concepts are now being applied to get a unique structured and efficient electric car for easy mobility in day to day lives of people. To get PCB prototype or PCB fabrication service for your automobile needs, visit ALLPCB.com

Dose of applications:

All of these have wide-ranging effects on society, including security and privacy with modes of working and lifestyle of people. More than 80% of processors used today are in embedded systems. The enhancement in wired and wireless broadband connectivity empowered the growth of numerous intelligent embedded systems.

Health care sector shows a great transformation with using embedded system in small to large devices like X-ray , computed tomography, magnetic resonance imaging, ultrasound imaging, remote monitoring solutions, other fitness devices like Cardiovascular machine with easy navigation, virtual environments and many more.

Other technologies with embedded systems are backplane technology with RF and microwave backplane speed. This shows that the embedded system has its approach in every electronic field where the technology up-gradation is vital.

As electronic and computing technologies have moved forward since the transformation of the era, all the new and existing concepts are implementing the embedded systems to get a feature rich product with reduced power consumption, increasing reliability and cost of operations.

Demands following the transformations:

New up gradations in the areas of imaging, compression and multimedia, demand higher bandwidth, Enhanced Processing Capabilities, quicker response times and more efficient algorithms. The major requirement is for the processors with multiple integrated cores that would improve the throughput of the application.

The embedded systems used in today’s generation demand durability with high estimated life, as there are significant transformations in every sector of the world economy. For instance, the wires, cables and coaxial connectors are now transforming into wireless technologies.

Influencing dominance of embedded systems:

The best part of installing an intelligent embedded system is, it needs less investment for installation and maintenance mechanism. Also the software’s can be easily upgraded or replaced without disturbing the functionalities of the system.

An enhanced model driven approach is applied in the embedded systems to focus on unique design architecture that can suppress the complexities and appreciate the speed level of the systems. This type of approach focuses on Making a layout of an embedded system that can come up with the optimal solutions for challenges like complexities in the system due to integration of numerous features, lot of resources used to amend its performance execution, up gradations to be done in regular intervals of time and quality of services and rework needed for maintenance of the system.

Thus, one of the biggest challenges posed to the embedded engineers is to be well updated with the upcoming technology trends. The more and more new concepts and innovations introduced in the markets, forecasts the product based on an embedded architecture will be better positioned in coming years with optimal investments to derive a state-of-the-art solution.

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The Next Step To The Advancement In Security/Safety Devices With Smart PCB Manufacturing

Electronic Industry, in the last decade has witnessed that most of the disruptive innovation sprouts from small scale, dynamic and entrepreneurial organizations. With this, the PCB industry: include OEMS and PCB prototype, new startups and other electronic manufacturing units has marked a radical opportunity to focus on developing smarter game changing technologies to provide high end security and safety to the human life, corporate assets and even to protect the earth.

The trend in PCB market is forecasting an amplified graph of change in technologies with new innovations every other day. The world of security and surveillance rolls around the smart technologies, compact solutions and time saving funds. In order to be the name of the game in the market the OEMs and other players have started focusing on the key success factors to survive in the industry. Some focus on the specialization, some concentrate on rapid innovations with superior performance and low cost production is at the nucleus for everyone in the market.

One of the prime drivers to new discoveries is the hardware, PCB chips that will continue to evolve radically with more and more networked devices delivering ever increasing capability. This is due to the fad and fashion of Internet of Things that will make the machine to machine communication more stronger. To establish the communication between the device and real world, the advancement is showcased in the integration of PCB assembly and management software.

There are few devices that garnered a lot of attention in the Security market. A surveillance camera is the most apt example. A recent innovation in the PCB Manufacturing has enabled the cameras to store the footages in terabytes at an affordable price. With the enablement of networking, electronic hardware along with management software we will soon be having analytic programs, guidingcameras to decide and filter the recordings required to be stored or deleted from the library.

Augmented Reality which is now garnering huge hype owes its credits to recent developments in PCB Layout which enables the communications between the Real World and Hardware helping us view the live version of the elements of environment augmented by sensors capturing sounds, visuals, graphics or GPS Data from embedded camera circuits that creates an augmented data which is flashed in front of your eyes.

The portable module that can be attached to any regular glasses to make it a smart technology device is one of the perks in the Security market. This is going to show enhancement in surveillance by Police and Security guards.

Recent Innovations have enabled humans to access control of security devices without ironmongery. The customized PCB Prototypes have facilitated assembling VPN, RFID, Mobile Phones, Tablets, Biometrics to the network connections and can be managed by access control systems. Authentications now may not require human interface, but will move to a self-managed control system model due to recent advances in security devices that will help in reducing the cost of employing personnel staff or security guards. This can be exemplified with the full HD camera that has the capability to view in a 130 degree arc and is equipped with an Infra Red Sensor which can effectively sense intruders in the night. It is integrated with the mobile devices that operates on iOS and Android, which appeals to the tech savvy consumers to have the security of their homes on their mobile screens.

In this era of the Internet, we may not be able to predict the future of technology innovation five years down the line. Hardware Chips and PCB Layout are changing substantially smarter and economical which will drive the technologies that can change the game and disrupt the security industry. With this, the spotlight to the vital drivers includes Technology and Compliance. Technology in terms of advancements and more research in design, more advanced and low cost PCBs/Hardware modules which can be integrated with PCB assemblies to capture more accurate and real time data processing it faster. Secondly Compliance, which complements the hardware technology with the software that enables the data management and data processing. The Software will manage the flow of data across systems to give consumers easily interpretable outputs.

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Why Bill Of Materials (BOM) Is Important In PCB

The importance of an efficient production plan cannot be overstated as it goes a long way in optimizing production as well as balancing production lines. The need of the hour therefore is a robust design data comprising of pcb layout data, Bill of Materials popularly known as BoM as well as product references.

In fact the entire SMT PCB manufacturer process is BoM driven. This is because the functioning of the PCB is dependent on the components listed in the BoM. The use of the right components in turn is critical to the functioning of the PCB. Any PCB Assembly order, therefore needs to be initiated with a bill of materials. Not only does the BoM carry the list of components but also their placement on the printed circuit board. The BoM, in turn, allows the procurement specialists to figure out the right distributor for the components as also look for cost effective price points. There is a chance that some components may not be available and therefore it gives the procurement specialists an opportunity to look for alternative distributors, so that work can proceed seamlessly.

A detailed BoM with specifications related to item number, description of the part, name of manufacturer, quantity and more, therefore comes in extremely handy. Not only does this ensure quality, it also ensures that the PCB manufacturer can follow the delivery deadlines without any hiccups. In case of turnkey assemblies, it is also essential to mention names and details of both the distributors and manufacturers. In fact multiple distributor names can help the procurement process and can ensure that no time is lost in case a specific distributor does not have the parts readily available.

An optimized component list allows the assembly to be well planned with clearly laid down scheduling steps. This in turn ensures that the PCB is produced with zero errors. On the other hand absence of an effective BoM could mean a whole lot of revisions culminating into delays in delivery.

It is common practice for the manufacturers to provide a template for a sample BoM so that all the necessary information is captured and so there is no room for any ambiguity. Often times support for both explosions and implosions is also included in the BoM. While explosions refers to displaying the components of the assembly, implosions help see where is specific part is used and to determine which sections are then linked to any part which is at risk. Hierarchical BoMs therefore come in handy to study the entire structure.

Here are some aspects to be especially mindful of, while creating a BoM:

#1. Be extremely thorough- Ideally a BoM should help the manufacturer create your PCB from scratch. If you have received a BoM template from the manufacturer ensure that you spend enough time completing it and providing all the requisite details.

#2 Indicate where you can allow flexibility- Odds are that there could be some parts that are critical where you would want the manufacturer to follow the approved vendor list strictly. While there could be others, which are non critical and therefore they can be optimized for cost. It is best to indicate this clearly in the BoM, so that no time is lost in unnecessary revisions or worse still you may land up with sourcing mistakes that could cost you dearly.

#3 Ensure that the parts are available- While listing the parts in a BoM, a quick check on whether the parts are readily available will go a long way in ensuring seamless production. This step, if ignored can often lead you to costly design decisions at a later stage.

#4 Decide how many levels the BoM requires- It is important to determine whether the BoM should be single level or multiple level. Typically single level BoMs work where you are looking at lean or pull based manufacturing. Also it is recommended in cases where the manufacturer does not need the overall structure of the product design. On the other hand, a multi level BoM is of relevance where you can share a portion of the BoM with your manufacturer and where sub assemblies can be copied to other products. You need to decide how detailed your multi level BoM needs to be and drill down accordingly.

#5 Document changes- There are likely to be changes in the BoM from the prototype stage to when it is actually produced and these changes need to be recorded. It is best to keep a history with all the change logs and the various versions so that everyone is in sync not just with the changes but also what led to them.

Consider the Bill of Materials as your shopping list, stepping out without which is likely to lead to inadvertent omissions and costly errors. The thumb rule clearly is to do a thorough assessment of your needs and build the BoM around it.

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Turnkey PCB Assembly – A Comprehensive Approach To Get Instant PCB Quote And Production

The traditional approach to PCB manufacturer assembly is riddled with many problems, foremost among them being the fact that it is high on cost besides being a long-drawn process. Also it typically supports large orders and isn’t suited for prototypes. Turnkey PCB Assembly therefore comes in handy as it serves as an antidote to all these issues faced with traditional PCB Assembly.

Essentially Turnkey PCB Assembly leverages cloud based software and makes the process of developing printed circuit boards hassle free. All you need to do is to upload a design. With Turnkey Assembly Services then the vendor deals with the entire assembly process including material procurement, PCB fabrication and assembly, testing, packaging and fulfillment.

Some of the advantages of Turnkey PCB Assembly include:

Prototyping

While traditionally creating a prototype is a lengthy process that involves dealing with multiple vendors, sometimes contending with out-of-stock-components and overall large lead times, Turnkey PCB Assembly allows for quick prototyping which in turn significantly reduces the time-to market. Needless to mention that it is a major source of competitive advantage.

Works for small orders

Traditional PCB Assemblies cater to large order batches and therefore aren’t conducive to prototypes as well as small orders. Turnkey PCB Assembly on the other hand, by virtue of being able to combine several small orders into a large run, can cater to any order quantity with ease. Irrespective of your order size you can therefore get exemplary service which otherwise can be a prerogative of large quantity orders alone.

Shorter Development Cycle

Turnkey assembly has a much shorter development cycle than traditional PCB fabrication, which in turn means that the PCB’s cycle from assembly line to market is much shorter. This is largely on account of the fact that time isn’t lost switching from phase to phase. Time saving is also on account of the fact that you deal with one vendor for your end-to-end requirement. With a shorter development cycle you tend to gain significant advantages when it comes to proactively responding to changing customer preferences.

No need to deal with multiple vendors

Turnkey PCB Assembly takes away the need to deal with multiple vendors, thereby reducing chances of miscommunication. With multiple vendors you often also face the issue of any delay causing a ripple effect. Also in case you need to make any changes, you need to find the right person who can execute it. It helps to have a single point of contact who can answer questions and implement any changes. Not to mention the fact that with one vendor assembling your final product, peace of mind is a given!

End-to-end services

Turnkey PCB Assembly typically offers end-to end services comprising of product assembly, inventory and shipping. This offers a number of advantages. Besides the logistical ease of a having one point contact, it also saves time as there are no cascading delays.

Perfect for small businesses

On account of the fact that Turnkey PCB Assembly can offer limited quantities as well as quick turnaround time, it works well particularly for startups and small businesses.  With professional prototypes delivered in short time spans, it becomes far easier to pitch the idea to investors as startups have an effective proof of concept to showcase.

Turnkey PCB Assembly also works well for Kickstarter creators who aren’t sure of the volumes they would require and hence cannot commit to large numbers at one go. The flexibility in quantity offered by turnkey assembly services also work well for hobbyists who want to experiment with ideas. Besides being a boon to small organizations, they can also work well for larger set ups that are nimble.

Identifies Problems Early

A major advantage of Turnkey PCB Assembly is also that it can identify any manufacturing problems early on. The manufacturer can identify any errors in design that can be corrected early thus saving the manufacturer from paying a heavy cost on account of design issues. In turn, it also helps establish better design practices in the long run.

Consistency

With Turnkey PCB assembly, consistency of results is a given thereby ensuring stringent quality standards. The importance of quality cannot be overemphasized in today’s competitive environment where a single inconsistency can lead to loss of reputation especially with social media on an overdrive.

From Concept to Delivery

With PCB fabrication, procurement, assembly, testing, packaging etc being taken care by the manufacturer, it eliminates a whole lot of stress while the vendor takes care of everything. You can therefore focus on perfecting your design and bring high quality products to life, far faster. Essentially then, with turnkey services there is a significant freeing of time for your team, which can in turn be used in other areas that need the manufacturer’s attention.

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Guide to PCB Design: How to Generate Manufacturing Files for Custom Printed Circuit Boards

In this article, we'll go over the basics of generating manufacturing files for PCB design and manufacturing.When you’re working on a PCB layout, you are editing a file that is specific to your CAD software. It’s not a universal file format, and it uses information that the PCB manufacturer does not need. This is why you have to generate a different sort of file (with an exception we'll discuss at the end of the article) when you’re ready to convert the virtual layout into a physical circuit board.

Guide to Ordering and Assembling Printed Circuit Boards

This article is part of a series. Check out the first part below:

PCB Schematic and Board Layout​

How to Generate Manufacturing Files for Custom Printed Circuit Boards

What Is a Gerber File?

The most widely used file format for PCB manufacturing is called Gerber. When manufacturers request “Gerbers” or “Gerber files,” they are referring to ASCII files that contain Gerber-formatted data. A Gerber file knows nothing about design rules, net connectivity, or component libraries; it is simply two-dimensional artwork that indicates where the manufacturing equipment will place copper, solder mask, or silkscreen. One Gerber file provides information for one PCB feature on one layer. Thus, if you have a two-layer board and each side has copper, solder mask, and silkscreen, you will need six Gerber files. You may also need a separate Gerber file to identify the board outline. The following image shows a screen capture from my CAD tool and corresponding Gerber files.

Generating Gerber files can be somewhat complicated. The process involves various configuration details, and different manufacturers have different requirements. The following screen capture shows the options that you have to consider when generating Gerber files with DipTrace.

If you don’t have much experience with Gerber generation, I suggest the following approach: First, choose a manufacturer that provides specific instructions on how to generate Gerber files with specific CAD tools. Second, use one of these CAD tools to design your board. If you follow the instructions carefully, you will almost certainly avoid the two potential consequences of improper Gerber files: a delay in the manufacturing process (more likely), or a nonfunctional PCB (nowadays probably quite rare).

The Drill File

You will also need to generate a file that indicates the position and size of every hole that will be drilled through your board, i.e., both through-holes (for mounting components) and vias. This is called the NC (numeric control) drill file; you may also see “Excellon drill file” (which comes from Excellon Automation, a company that makes equipment used in PCB manufacturing). Again, the safest approach here is to follow specific instructions provided by a PCB manufacturer.

ODB++ vs. Gerbers

Gerber files are universally accepted, and I recommend that you take the time to familiarize yourself with Gerber generation and gradually establish a Gerber routine that allows you to quickly and painlessly create your PCB manufacturing files. However, in some situations it may be better to use ODB++ files. I have to admit that managing multiple Gerber files can be a bit irksome, and this is one advantage of the ODB++ format: it is a single data structure that (in my experience) is generated without extensive input from the designer.

I successfully fabricated one board using ODB++ files, but I also noticed some strange problems that led me back to Gerbers. I’m not saying that the format itself is problematic, but in the end it doesn’t really matter—if my CAD software can’t correctly generate the files or the fab house can’t correctly interpret them, the format is useless to me. If you have had consistent success with ODB++, let us know in the comments section. Honestly, it would probably be beneficial if we all could gradually move away from Gerbers and toward a more straightforward and robust method of packaging and transferring PCB manufacturing data.

Project Files vs. Manufacturing Files

If you’d prefer to avoid generating any type of manufacturing file, you can look for a PCB manufacturer that accepts your CAD software’s project files. I assume that the manufacturer uses some sort of automated procedure to generate Gerbers from the project file; this is beneficial not only because it saves you time but also because the fab house technicians will (presumably) know exactly how to generate files that are compatible with their equipment. The list in the next section gives some information about one manufacturer that accepts project files.

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Four special plating methods for circuit boards

The PCB manufacturer has four special plating methods in the production of circuit boards, which are row plating equipment, through-hole plating, reel selective plating, and brush plating. The four plating methods have their own characteristics. Let's take a closer look at the four special methods.

1. Finger-type plating equipment In the electroplating, it is often necessary to plate rare metals on the board edge connectors, the board edge protruding contacts or the gold fingers to provide lower contact resistance and higher wear resistance. Row plating or protruding part plating. In electroplating, gold is also plated on the inner side of the plate-side connector protruding with nickel. The gold finger or the edge of the plate is manually or automatically plated. The gold plating on the contact plug or gold finger has been plated. Lead and plated buttons are replaced.

2. Through Hole Plating There are a number of ways in via plating to create a desirable layer of plating on the walls of the substrate bore, which is known in the industry as hole wall activation. Its commercial production process for printed circuits requires multiple intermediate tanks, each with its own control and maintenance requirements. Through-hole plating is a necessary manufacturing process for the drilling process. When the drill bit is drilled through the copper foil and the substrate below it, the heat generated causes the insulating synthetic resin constituting most of the substrate substrate to melt, the molten resin and other drilled fragments. It is deposited around the hole and coated on the newly exposed hole wall in the copper foil. In fact, this is detrimental to the subsequent plating surface. The molten resin also leaves a hot layer on the substrate wall, which exhibits poor adhesion to most activators, which requires the development of another A technique similar to stain removal and etchback chemistry: Ink! The ink is used to form a highly adherent, highly conductive coating on the inner wall of each via, eliminating the need for multiple chemical processes and requiring only one application. The step, followed by thermal curing, forms a continuous film on the inside of all the walls of the hole, which can be directly electroplated without further processing. This ink is a resin-based material that has a very strong adhesion and can be bonded to most thermally polished walls without any effort, thus eliminating the etch back step.

3. Reel-selective plating The pins and pins of electronic components, such as connectors, integrated circuits, transistors, and flexible printed circuits, are selectively plated to achieve good contact resistance and corrosion resistance. This plating method can be carried out by manual plating production line or automatic plating equipment. It is very expensive to select each of the pins separately. Therefore, batch welding must be used. In the electroplating production, the crucible is usually flattened to the required thickness of the metal foil. Both ends are die-cut, chemically or mechanically cleaned, and then selectively plated using nickel, gold, silver, rhodium, button or tin-nickel alloy, copper-nickel alloy, nickel-lead alloy, and the like.

4. Brush Plating The last method is called "brush plating": it is an electrodeposition technique in which not all parts are immersed in the electrolyte during the plating process. In this plating technique, only a limited area is plated without any effect on the rest. Typically, rare metals are plated on selected portions of the printed circuit board, such as areas such as edge connectors. Brush plating is used more often in the electronics assembly shop to repair waste boards. A special anode (chemically reactive anode, such as graphite) is wrapped in an absorbent material (cotton stick) that is used to bring the plating solution to where it is needed for electroplating.

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PCB repair method for PCB manufacturer.

The PCB manufacturer repairs PCB boards,The first step is to observe whether the circuit board has been damaged by humans. This is mainly from the following aspects: 1 See if the board is dropped, causing the board corner to be deformed, or the chip on the board being broken or broken. 2 Observe the socket of the chip to see if it is forced to be damaged because there is no special tool. 3 Observe the chip on the circuit board. If it is with a socket, first observe whether the chip is inserted incorrectly. This is mainly to prevent the operator from inserting the wrong position or direction of the chip when repairing the circuit board. If the error is not corrected in time, when the board is energized, the chip may be burned out, causing unnecessary losses. 4 If there is a shorting terminal on the board, observe if the shorting terminal is inserted incorrectly.

The maintenance of the circuit board requires a solid foundation in theory, careful work, and careful observation by the maintainer, sometimes at this step can determine the cause of the problem. The second step is to observe whether the components on the board are burned out. For example, resistors, capacitors, and diodes are not black or smeared. Under normal circumstances, even if the resistance is burnt, its resistance will not change, the performance will not change, and it will not affect the normal use. In this case, a multimeter is needed to assist the measurement. However, if the capacitors and diodes are burnt, their performance will change, and they will not play their due role in the circuit, which will affect the normal operation of the entire circuit. At this time, new components must be replaced. The third step is to observe the integrated circuit on the circuit board, such as 74 series, CPU, coprocessor, AD and other chips, there are no drums, cracks, burnt, black. If this happens, it is basically OK that the chip has been burned out and must be replaced. The fourth step is to observe whether the traces on the circuit board are peeled or burned. The copper hole is not separated from the pad. Step 5: Observe the fuses on the board (including the fuse and the thermistor) to see if the fuse is blown. Sometimes the fuse is too thin and can't be seen clearly. You can use the auxiliary tool-multimeter to judge whether the fuse is damaged. The above four cases are the method for the circuit board factory to repair the PCB board, which is basically due to the consequences of excessive current in the circuit. However, the specific cause of the current is too large, it is necessary to analyze the specific problem. But the general idea of ​​finding the problem is to first carefully analyze the schematic diagram of the board, and then find out its superior circuit according to the circuit where the burnt component is located, and derive it step by step, and then rely on some experience accumulated in the work to analyze the easiest. Where the problem occurred, find out the cause of the failure.

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PCB manufacturing knowledge

An excellent PCB manufacturer design engineer must first master these PCB manufacturing basics. PCB designers are a subdivision of hardware design. From the hardware development process, upstream customer docking hardware schematic design engineers, downstream customers docking PCB/PCBA Processing plants, so PCB designers need to understand the basics of upstream and downstream processes.

PCB manufacturing process single/double-sided PCB manufacturing process diagram Multi-layer PCB manufacturing process diagram. PCB sheet type 1, CCL classification C. Rigid CCL is divided into: paper substrate, ring fiber cloth substrate, composite material, material substrate, special type.

1. Substrate material (1) Mainly produces raw materials a. Usually, electronic grade non-alkali glass cloth is used. Commonly used models are 1080, 2116, 7826 and so on. b, impregnated fiber paper c, copper foil According to the method of copper foil classification: calendered copper foil and electrolytic copper foil The standard thickness of copper foil: 18um (HOZ), 35 um (1OZ) and 70 um (2OZ) Other specifications: 12 um (1/3OZ) and high-thickness copper foil (2) paper substrates commonly used FR-1, FR-2, FR-3 and other models (3) glass cloth base The most commonly used is FR-4 fiberglass cloth base CCL, its basic formula is low bromine epoxy resin (bisphenol A type) as the main resin, dicyandiamide as epoxy curing agent, and polyamine as the accelerator, which is the most used raw material in PCB production. . FR-4 commonly used reinforcement materials are E-type fiberglass cloth, commonly used grades are 7628, 2116, 1080, etc. Commonly used electrolytic roughened copper foil is 0.18 um, 0.35 um, 0.70 umFR-4 is generally divided into: FR-4 rigid board Common plate thickness is 0.8-3.2mm; FR-4 thin plate, common plate thickness is less than 0.78mm. The general technical specifications of FR-4 sheets are: flexural strength, peel strength, thermal shock resistance, flame retardancy, volume resistivity, surface resistance, dielectric constant, dielectric loss tangent, glass transition temperature Tg, dimensional stability , maximum use temperature, warpage, etc.

2. Composite CCL is mainly divided into CEM-1 (epoxy paper base material) and CEM-3 (epoxy glass fiber non-woven core). The main difference from FR-4 is that the specific core material is sandwiched between the substrates. The various performances are similar to those of FR-4. Each has its own advantages and disadvantages, mainly in terms of CEM in terms of processability and heat resistance. -4 strong. The general technical specifications of CEM materials are roughly the same as those of FR-4. Prepreg or PP PP is a prepreg composed of a resin and a reinforcing material. Among them, the resin is a “B-stage” resin which is in a semi-cured state. The commonly used PP for circuit boards generally uses FR-4 prepreg. FR-4 type PP is a polymer which is made of an alkali-free glass cloth as a reinforcing material, impregnated with an epoxy resin, and has a resin structure as a branch. The commonly used FR-4 type PP is divided into 106, 1080, 2116, 1500 and 7628 according to the reinforcing materials, which correspond to different fiberglass cloth characteristics, resin content and PP thickness. The technical indicators of PP are as follows: New varieties with PP, fluidity, gel time, volatile content PP: Tg PP, low dielectric constant PP, high resistance to CAF PP, high dimensional stability PP, low CTE PP , no bubble PP, green PP, resin copper foil (RCC), etc.

3, Flexible CCL (FCCL) classification according to the media substrate: PI and PET according to flame retardant properties: flame retardant and non-flame retardant according to the manufacturing process: two-layer and three-layer raw materials a, dielectric substrate : PI, PET film film, generally required to have good flexibility; b, metal conductor foil: ordinary ED, high elongation ED, RA, copper-bismuth alloy foil and aluminum foil, generally required to have good ductility, commonly used High elongation ED and RA. Commonly used thickness is 18um, 35um and 70um; c. Adhesive: PET, EP/modified EP, acrylic, phenolic/butyral, PI, generally required to have good resin adhesion and Low Z-axis thermal expansion coefficient, commonly used for acrylic and EP/modified PP adhesives. PCB sheet type list PCB sheet type list

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PCB manufacturing knowledge

An excellent PCB manufacturer design engineer must first master these PCB manufacturing basics. PCB designers are a subdivision of hardware design. From the hardware development process, upstream customer docking hardware schematic design engineers, downstream customers docking PCB/PCBA Processing plants, so PCB designers need to understand the basics of upstream and downstream processes.

PCB manufacturing process single/double-sided PCB manufacturing process diagram Multi-layer PCB manufacturing process diagram. PCB sheet type 1, CCL classification C. Rigid CCL is divided into: paper substrate, ring fiber cloth substrate, composite material, material substrate, special type.

1. Substrate material (1) Mainly produces raw materials a. Usually, electronic grade non-alkali glass cloth is used. Commonly used models are 1080, 2116, 7826 and so on. b, impregnated fiber paper c, copper foil According to the method of copper foil classification: calendered copper foil and electrolytic copper foil The standard thickness of copper foil: 18um (HOZ), 35 um (1OZ) and 70 um (2OZ) Other specifications: 12 um (1/3OZ) and high-thickness copper foil (2) paper substrates commonly used FR-1, FR-2, FR-3 and other models (3) glass cloth base The most commonly used is FR-4 fiberglass cloth base CCL, its basic formula is low bromine epoxy resin (bisphenol A type) as the main resin, dicyandiamide as epoxy curing agent, and polyamine as the accelerator, which is the most used raw material in PCB production. . FR-4 commonly used reinforcement materials are E-type fiberglass cloth, commonly used grades are 7628, 2116, 1080, etc. Commonly used electrolytic roughened copper foil is 0.18 um, 0.35 um, 0.70 umFR-4 is generally divided into: FR-4 rigid board Common plate thickness is 0.8-3.2mm; FR-4 thin plate, common plate thickness is less than 0.78mm. The general technical specifications of FR-4 sheets are: flexural strength, peel strength, thermal shock resistance, flame retardancy, volume resistivity, surface resistance, dielectric constant, dielectric loss tangent, glass transition temperature Tg, dimensional stability , maximum use temperature, warpage, etc.

2. Composite CCL is mainly divided into CEM-1 (epoxy paper base material) and CEM-3 (epoxy glass fiber non-woven core). The main difference from FR-4 is that the specific core material is sandwiched between the substrates. The various performances are similar to those of FR-4. Each has its own advantages and disadvantages, mainly in terms of CEM in terms of processability and heat resistance. -4 strong. The general technical specifications of CEM materials are roughly the same as those of FR-4. Prepreg or PP PP is a prepreg composed of a resin and a reinforcing material. Among them, the resin is a "B-stage" resin which is in a semi-cured state. The commonly used PP for circuit boards generally uses FR-4 prepreg. FR-4 type PP is a polymer which is made of an alkali-free glass cloth as a reinforcing material, impregnated with an epoxy resin, and has a resin structure as a branch. The commonly used FR-4 type PP is divided into 106, 1080, 2116, 1500 and 7628 according to the reinforcing materials, which correspond to different fiberglass cloth characteristics, resin content and PP thickness. The technical indicators of PP are as follows: New varieties with PP, fluidity, gel time, volatile content PP: Tg PP, low dielectric constant PP, high resistance to CAF PP, high dimensional stability PP, low CTE PP , no bubble PP, green PP, resin copper foil (RCC), etc.

3, Flexible CCL (FCCL) classification according to the media substrate: PI and PET according to flame retardant properties: flame retardant and non-flame retardant according to the manufacturing process: two-layer and three-layer raw materials a, dielectric substrate : PI, PET film film, generally required to have good flexibility; b, metal conductor foil: ordinary ED, high elongation ED, RA, copper-bismuth alloy foil and aluminum foil, generally required to have good ductility, commonly used High elongation ED and RA. Commonly used thickness is 18um, 35um and 70um; c. Adhesive: PET, EP/modified EP, acrylic, phenolic/butyral, PI, generally required to have good resin adhesion and Low Z-axis thermal expansion coefficient, commonly used for acrylic and EP/modified PP adhesives. PCB sheet type list PCB sheet type list

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How to choose a good PCB prototype  factory

What are the conditions for a good PCB manufacturer? What should be used to consider the PCB proofing factory? Below we briefly introduce how to choose the PCB manufacturer.

1, should pay attention to whether the factory information is true

In the Internet age, there are a lot of information about PCB prototype  factory on the Internet. When looking for PCB prototype  factory , we must pay attention to distinguishing the true and false information. There are many small workshops on the Internet that boast their strengths into large-scale and high-tech. The strength of the manufacturers, but in fact, there are no workshops, so, if you want to know whether the strength of the factory is true, in addition to searching for information on the Internet, it is best to visit the factory on site, view the environment of the factory and the assembly line, etc., according to their own eyes See the right manufacturer.

 2, be careful of the price trap.The price is PCB proofing processing is a problem that most customers are concerned about. Due to geographical problems, many customers are doing online PCB pricing on the merchant website. Regular manufacturers will have a professional online quotation system. When customers customize PCB proofing, Don't be tempted to make small and cheap, so that the quality of the customized products will not be worth the loss.

3, service

A good PCB manufacturer , of course, needs good service. The PCB proofing factory purchase needs to involve many aspects, such as product technology, product use, product warranty period, etc., and a perfect service system is required. For pre-sales service, we can communicate with the manufacturer to see if we can give customers detailed product introduction, whether we can patiently and quickly solve customer problems. After-sales service is to see if the manufacturer can provide solutions for problems such as package return, warranty, technical guidance and so on.