#Intel 18A process technology

[govindhtech]

At Intel Foundry Event, Secures Government Microelectronics

Event Intel Foundry

Intel is committed to defending the domestic chip supply chain and reclaiming semiconductor dominance as the sole American semiconductor developer and manufacturer. Working with the U.S. government, Intel seeks to boost U.S. technological systems with creative, secure solutions.

The State-of-the-Art Heterogeneous Integration Prototype (SHIP) and Rapid Assured Microelectronics Prototypes-Commercial (RAMP-C) with the U.S. Department of Defence (DoD) have accelerated the development of advanced semiconductor technologies and demonstrate how public and commercial interests can collaborate to innovate and improve national security.

Intel's devotion and Intel Foundry's vital role have led to amazing advancements.

Industry-leading Intel 18A process technology enters risk production

The cutting-edge Intel 18A process node from Intel Foundry has transformed defence. For the first time in decades, USG and DIB clients may use cutting-edge technology alongside commercial customers. DIB clients adopting Intel 18A technology for their latest microelectronics and mission platforms will enhance military SWaP-C requirements.

According to Intel Foundry SVP and GM Kevin O'Buckley, the final Intel 18A PDK 1.0.1GA was released in Q4 2024, and Intel 18A technology is in risk production.

Building Intel 18A ITAR-compliant test chip support

One of the more intriguing IPSS announcements was allowing ITAR access to Intel 18A test chips. This ensures DIB clients may employ cutting-edge technology while meeting program requirements. For early 2026 tape-outs, the Intel 18A ITAR test chip shuttle is accepting reservations.

Adding 12nm to Foundry's roadmap

For clients who need onshore access to established technologies, Intel Foundry will provide 12nm process technology in 2026. This FinFET-based technology will be built in Arizona. DIB clients can create tape-outs in late 2026.

Onshore advanced packaging scaling

In order to address mission system requirements, Intel Foundry offers its cutting-edge heterogeneous packaging technologies, including as Foveros 3D, EMIB 3.5D, and EMIB, onshore. Chiplet libraries and advanced semiconductor packaging help customers quickly conceive, develop, build, test, and integrate cutting-edge devices into field equipment. For autonomous systems and secure communications, Intel cutting-edge packaging technologies provide the performance and security needed for mission-critical operations and enable the latest military technology to be available in sophisticated system-level packaging for SHIP.

Adding Secure Enclave and DIB customers to USG cooperation

Intel won the Secure Enclave (SE) program last year, building on its programmatic engagement in SHIP and RAMP-C. SE aims to boost the U.S. government's dependable manufacture of cutting-edge semiconductors.

Intel Foundry added Reliable MicroSystems and Trusted Semiconductor Solutions to its DIB client list earlier this year as part of RAMP-C's third phase. Intel Foundry's cutting-edge Intel 18A process technology and advanced packaging for high-volume manufacture and prototypes will benefit more DIB clients with their integration.

Ready to Serve: Intel Foundry

The Intel Foundry can meet government application needs. Due to its cutting-edge Intel 18A process technology, advanced packaging choices, and safe manufacturing, Intel Foundry can deliver high-performance, reliable, and secure semiconductor products. Intel Foundry may be a trusted partner in developing microelectronics for critical government applications using SOTA technology and close collaboration with the USG and DoD.

Intel Foundry Direct Connect

Attend Intel Foundry Direct Connect, the premier annual event in San Jose, California, on April 29, 2025, to network with government, defence, and aerospace experts. Connect with clients, defence industry experts, and USMAG alliance ecosystem partners to learn how process technology, cutting-edge packaging, and testing may support your ideas. At 9 a.m. PDT, CEO Lip-Bu Tan will start the event. Join today to learn about future systems foundry design and production.

Intel technology may need hardware, software, or service activation. No part or product is absolutely safe. Your costs and results vary.

[pulsaris]

"A Intel revelou este mês que a tecnologia de processo Intel 18A está a progredir para a produção em grande volume no segundo semestre de 2025. A Intel 18A coloca os clientes de fundição na vanguarda da inovação, introduzindo dois avanços no fabrico de semicondutores para melhorar os produtos Intel e aqueles disponíveis para os clientes da Intel Foundry.

Eis uma breve introdução ao Intel 18A, que combina transístores gate-all-around RibbonFET com PowerVia, a primeira implementação exclusiva da Intel no sector de fornecimento de energia traseira."

Saiba tudo em: https://newsroom.intel.com/intel-foundry/intel-18a-process-technology-simply-explained e em: https://www.youtube.com/watch?v=_FfoGzK4VEQ

______ Direitos de imagem: © Intel Corporation (via https://www.intel.com/content/www/us/en/newsroom/)

[electronicslife]

Intel’s $7.86 Billion Breakthrough in Semiconductor Innovation 💡

Big news in tech: Intel just secured $7.86 billion in CHIPS Act funding to revitalize U.S. semiconductor manufacturing. 🌟 This investment is part of Intel’s $100 billion plan to innovate, create jobs, and reduce reliance on foreign supply chains. 🇺🇸

Why this matters:

Tech Leadership: Supports cutting-edge chip technologies like AI and quantum computing.

Job Creation: Expected to create over 80,000 jobs across Arizona, New Mexico, Ohio, and Oregon.

National Security: Strengthens supply chain resilience amid global tensions.

✨ Highlights:

Developing Intel 18A, a game-changing process node for better energy efficiency.

Advancing 3D chip stacking for sleeker, smarter devices.

Intel isn’t just making chips—they’re redefining the future of technology. 🌐 What do you think this means for U.S. innovation? Read More. ⬇️

[cleverhottubmiracle]

[ad_1] Intel has published a paper about its 18A (1.8nm-class) fabrication process at the VLSI 2025 symposium, consolidating all its information about the manufacturing technology into a single document. The new 18A production node is expected to deliver significant improvements in power, performance, and area over its predecessor, increasing density by 30% while enhancing performance by 25% or reducing power consumption by 36%.But, perhaps more importantly, 18A will be Intel's first process technology in years that will compete head-to-head with TSMC's leading-edge technology when both enter mass production in the second half of this year.PPA advantagesIntel's 18A process node is designed for a wide range of range of products across both client and datacenter applications, and the first Intel's product to use it will be the Panther Lake CPU, which is due to be formally announced later this year. To address different applications, Intel 18A has two libraries: high-performance (HP) with 180nm cell height (180CH) and high-density (HD) with 160nm cell height (160CH) for lower-power applications.Swipe to scroll horizontallyHow 18A stacks up against previous nodesRow 0 - Cell 0 Intel 3 vs Intel 418A vs Intel 3 Power?36% (at 1.1V) - 38% (at 0.75V) Performance18% (?)18% (at 0.75V) - 25% (1.1V) Density-1.3X SRAM Cell Size0.024 µm² 0.021 µm² TransistorFinFETRibbonFET GAA Power DeliveryFront-sidePowerVia BSPDN HVMmid-2024H2 2025Intel says that compared to Intel 3, its 18A fabrication technology boosts performance by 25%. It manages to achieve this without increasing voltage or circuit complexity when running a typical Arm core sub-block, implemented using a 180CH HD library at 1.1. When operating at the same clocks and 1.1V voltage, it also cuts power usage by 36% compared to the same design on Intel 3. At a reduced voltage of 0.75V, 18A offers an 18% speed increase and uses 38% less energy. Furthermore, designs fabricated on 18A occupy roughly 28% less area than those built with Intel 3. You may like (Image credit: Intel)There is a major catch about comparison of voltages between Intel 3 and 18A. The former supports

[knowusa]

Intel details 18A process technology — takes on TSMC 2nm with 30% density gain and 25% faster generational performance

Intel has published a paper about its 18A (1.8nm-class) fabrication process at the VLSI 2025 symposium, consolidating all its information about the manufacturing technology into a single document. The new 18A production node is expected to deliver significant improvements in power, performance, and area over its predecessor, increasing density by 30% while enhancing performance by 25% or reducing…

[techpulsecanada]

Did you know Intel's 18A process node delivers incredible improvements? It offers 25% higher frequency at ISO and 36% lower power at the same speed compared to Intel 3. Plus, with over 30% density gains, this technology marks a major leap in performance and efficiency. This next-gen process features RibbonFET (GAA) transistors and PowerVia for better power delivery, enabling faster, more energy-efficient chips. These advancements support high-frequency gaming, professional workloads, and cutting-edge AI hardware. Imagine the potential for custom computers—higher speeds, lower power consumption, and more compact designs. If you're up for a future-ready build, GroovyComputers.ca offers custom PC builds tailored to leverage these breakthroughs. Are you excited about Intel's most innovative process yet? Want a powerful, energy-efficient custom computer built just for you? Visit GroovyComputers.ca to explore your options today! #CustomComputers #HighPerformance #Intel18A #NextGenTech #PCBuilds #TechInnovation #GamingPC #Workstation #EnergyEfficiency #Hardware #CustomBuilds

[groovy-computers]

Intel has confirmed that their next-generation Diamond Rapids and Clearwater Forest Xeon CPUs will launch in 2026, signaling a strong comeback for Team Blue in the data center market. These upcoming processors aim to compete fiercely against AMD’s EPYC Venice series, which uses TSMC’s 2nm process. Diamond Rapids will feature the massive LGA 9324 socket, nearly five times larger than the LGA 1700, and will include Panther Cove-X P-Cores, promising top-tier performance. Clearwater Forest is set to utilize the Darkmont Core architecture with up to 288 E-Cores and employ Intel’s 18A process technology for native resources development. This strategic roll-out is vital for Intel’s market share recovery, after losing ground to AMD's EPYC offerings in recent years. The CPUs are expected to incorporate advanced hybrid bonding technology with Foveros Direct, ensuring power and efficiency. As these powerful data center processors approach release, businesses should stay alert for what this means for cloud infrastructure, enterprise computing, and AI workloads. For custom-built, high-performance enterprise solutions, explore GroovyComputers.ca for tailored computer builds that keep you ahead. Are you excited about Intel’s comeback in the data center industry? Share your thoughts below! #DataCenter #XeonCPUs #IntelNextGen #ServerHardware #AIcomputing #HybridTechnology #GroovyComputers #CustomBuilds #TechnologyNews #CloudComputing #EnterpriseSolutions

[nocknocknock]

Nvidia, Broadcom, and Intel: Exploring the Future of Semiconductor Manufacturing with Intel’s 18A Process

Recent developments indicate that leading tech companies Nvidia (NVDA), Broadcom (AVGO), and Intel (INTC) are collaborating to test Intel’s cutting-edge semiconductor manufacturing process, 18A. This move signals growing confidence in the capabilities of Intel’s manufacturing technologies, despite the company facing challenges in its contract manufacturing business. These early-stage tests suggest that a decision could soon be made on whether to enter into production contracts worth hundreds of millions of dollars with Intel, a deal that could significantly impact Intel’s contract manufacturing division.

Intel’s 18A Process: A Game Changer for Semiconductor Manufacturing

Intel’s 18A process is a set of advanced technologies and techniques developed over years of research to create high-performance semiconductors. This technology is specifically designed for the production of processors used in artificial intelligence (AI), high-performance computing, and other complex microchips. The 18A process has been developed to compete with Taiwan’s TSMC (Taiwan Semiconductor Manufacturing Company), which currently dominates the global semiconductor manufacturing market.

Testing Phase: Nvidia and Broadcom’s Involvement

According to sources familiar with the matter, both Nvidia and Broadcom have conducted tests using Intel’s 18A process. These tests, which have not been previously reported, demonstrate that these companies are seriously considering Intel’s manufacturing capabilities for their future production needs. The results could lead to significant contracts, providing a much-needed boost to Intel’s contract manufacturing sector, which has been grappling with delays and a lack of major customers.

Nvidia, a leader in AI and GPU technologies, and Broadcom, a prominent player in semiconductors for networking and communication, are both testing Intel’s latest process for their own upcoming products. A successful partnership could have far-reaching implications for both Intel and its potential clients, potentially shifting some manufacturing power away from TSMC.

AMD’s Position: Assessing Intel’s 18A for Its Own Needs

Advanced Micro Devices (AMD) is also reportedly evaluating whether Intel’s 18A process meets its production requirements. However, it remains unclear whether AMD has already sent test chips to Intel’s factories. The company has declined to comment on the matter. Nonetheless, Intel’s spokesperson confirmed that there is still high interest and engagement in its 18A process across the industry.

The Competitive Landscape: Intel vs. TSMC

Intel’s 18A process is now in direct competition with TSMC, the world’s largest semiconductor manufacturer. TSMC has long been the dominant force in chip production, particularly for advanced processes. However, Intel’s 18A technology promises to bring innovation and competition, potentially altering the dynamics of global semiconductor manufacturing.

Intel’s ability to attract companies like Nvidia and Broadcom is critical in the context of the company’s ongoing struggles to regain leadership in chip manufacturing. While Intel has historically been a leader in semiconductor development, it has faced significant challenges in keeping up with the rapid advancements of TSMC and other competitors.

Key Takeaways

Key Takeaways

Intel’s 18A Technology: A new, advanced semiconductor manufacturing process designed to create high-performance chips for AI and complex computing applications.

Nvidia and Broadcom’s Tests: Both companies are testing Intel’s 18A process as they assess the potential of entering into production contracts.

AMD’s Position: AMD is also evaluating Intel’s 18A process but has not confirmed sending test chips yet.

Competition with TSMC: Intel’s 18A process competes directly with TSMC, the current leader in semiconductor manufacturing.

Potential for Intel: Securing production contracts with companies like Nvidia and Broadcom could reinvigorate Intel’s contract manufacturing division and enhance its business prospects.

Potential Impact on Intel’s Business

A successful collaboration with Nvidia and Broadcom could provide Intel with a much-needed boost, allowing the company to secure lucrative production contracts and regain its position in the semiconductor industry. These partnerships would not only enhance Intel’s business but also strengthen its role in powering next-generation technologies such as artificial intelligence, autonomous systems, and high-performance computing.

In the ever-evolving tech industry, Intel’s ability to adapt and offer competitive manufacturing solutions will be critical for its long-term success.

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[govindhtech]

Intel And AWS Deepen Chip Manufacturing Partnership In U.S.

US-Based Chip Manufacturing Advances as Intel and AWS Deepen Their Strategic Partnership

Intel produces custom chips on Intel 18A for AI Fabric and custom Xeon 6 processors on Intel 3 for AWS in a multi-billion dollar deal to accelerate Ohio-based chip manufacturing.

AWS and Intel

Intel and Amazon Web Services(AWS), announced a custom chip design investment . The multi-year, multi-billion dollar deal covers Intel’s wafers and products. This move extends the two companies’ long-standing strategic cooperation, helping clients power practically any workload and improve AI applications.

AWS will receive an AI fabric chip from Intel made on the company’s most advanced process node, Intel 18A, as part of the expanded partnership. Expanding on their current collaboration whereby they manufacture Xeon Scalable processors for AWS, Intel will also create a customized Xeon 6 chip on Intel 3.

“As the CEO of AWS, Matt Garman stated that the company is dedicated to providing its customers with the most advanced and potent cloud infrastructure available.” Our relationship dates back to 2006 when we launched the first Amazon EC2 instance with their chips. Now, we are working together to co-develop next-generation AI fabric processors on Intel 18A. We can enable our joint customers to handle any workload and unlock new AI capabilities thanks to our ongoing partnership.

Through its increased cooperation, Intel and AWS reaffirm their dedication to growing Ohio’s AI ecosystem and driving semiconductor manufacturing in the United States. With its aspirations to establish state-of-the-art semiconductor production, Intel is committed to the New Albany region. AWS has invested $10.3 billion in Ohio since 2015; now, it plans to invest an additional $7.8 billion to expand its data center operations in Central Ohio.

In addition to supporting businesses of all sizes in reducing costs and complexity, enhancing security, speeding up business outcomes, and scaling to meet their present and future computing needs, Intel and AWS have been collaborating for more than 18 years to help organizations develop, build, and deploy their mission-critical workloads in the cloud. Moreover, Intel and AWS plan to investigate the possibility of producing additional designs based on Intel 18A and upcoming process nodes, such as Intel 18AP and Intel 14A, which are anticipated to be produced in Intel’s Ohio facilities, as well as the migration of current Intel designs to these platforms.

Forward-Looking Statements

This correspondence includes various predictions about what Intel anticipates from the parties’ co-investment framework, including claims about the framework’s timeliness, advantages, and effects on the parties’ business and strategy. These forward-looking statements are identified by terms like “expect,” “plan,” “intend,” and “will,” as well as by words that are similar to them and their variations.

These statements may result in a significant difference between its actual results and those stated or indicated in its forward-looking statements.

They are based on management’s estimates as of the date they were originally made and contain risks and uncertainties, many of which are outside of its control.

Among these risks and uncertainties are the possibility that the transactions covered by the framework won’t be executed at all or in a timely manner;

Failure to successfully develop, produce, or market goods under the framework;

Failure to reap anticipated benefits of the framework, notably financial ones;

Delays, hiccups, difficulties, or higher building expenses at Intel or manufacturing expansion of fabs, whether due to events within or outside of Intel’s control;

The complexities and uncertainties in developing and implementing new semiconductor products and manufacturing process technologies;

Implementing new business strategies and investing in new businesses and technologies;

Litigation or disputes related to the framework or otherwise;

Unanticipated costs may be incurred;

Potential adverse reactions or changes to commercial relationships including those with suppliers and customers resulting from the transaction’s announcement;

Macroeconomic factors, such as the overall state of the semiconductor industry’s economy;

Regulatory limitations, and the effect of competition products and pricing;

International conflict and other risks and uncertainties described in Intel’s Form 10-K and other filings with the SEC.

It warn readers not to rely unduly on these forward-looking statements because of these risks and uncertainties. The different disclosures made in the documents Intel occasionally files with the SEC that reveal risks and uncertainties that could affect its company are brought to the attention of readers, who are advised to analyze and weigh them carefully.

Read more on Govindhtech.com

[cleverhottubmiracle]

[ad_1] Intel's new CEO Lip Bu-Tan took to the stage at the company's Intel Foundry Direct 2025 event here in San Jose, California, to outline the company's progress on its foundry initiative. Tan announced that the company is now engaging lead customers for its upcoming 14A process node (1.4nm equivalent), the follow-on generation of its 18A process node. Intel already has several customers with plans to tape out 14A test chips, which now come with an enhanced version of the company's backside power delivery technology dubbed PowerDirect. Tan also revealed that the company's crucial 18A node is now in risk production with volume manufacturing on schedule for later this year.Intel also revealed that its new 18A-P extension, a high-performance variant of the 18A node, is now running through the fab with early wafers. Additionally, the company is developing a new 18A-PT variant that supports Foveros Direct 3D with hybrid bonding interconnects, enabling the company to stack dies vertically on top of its most advanced leading-edge node.The Foveros Direct 3D technology is a key development because it provides a capability that rival TSMC already uses in production, most famously in AMD's 3D V-Cache products. In fact, Intel's implementation matches TSMC's offering in critical interconnect density measurements.On the mature-node side of the operation, Intel Foundry has its first production 16nm tapeout in the fab now, and the company is also now engaging customers for the 12nm node it is developing in partnership with UMC.(Image credit: Tom's Hardware)Perhaps the most important developments at the show revolve around Intel's continued expansion with EDA and intellectual property (IP) partners that provide the critical tools and IP blocks that enable its customers to develop new designs with industry-standard design flows and tools. The company has also expanded its Intel Foundry Accelerator Alliance program to include the Chiplet Alliance and Value Chain Alliance programs.Intel Foundry's progress comes during turbulent times in the semiconductor industry as geopolitical divisions threaten to fracture the global chip supply chain. Intel is currently the only US-based domestic supplier of leading-edge process node technology and advanced packaging capacity, a key advantage as tensions between China and TSMC continue to escalate. Despite TSMC's expansion of production in the US, a recent law passed by Taiwan now prevents the company from producing its most cutting-edge tech in the United States, leaving Intel as the only domestic foundry with both leading-edge chip production and R&D.Naga Chandrasekaran, the Chief Technology and Operations Officer of Intel Foundry, and Kevin O’Buckley, the General Manager of Foundry Services, are also slated to deliver keynotes during the event, providing more details about the technology and roadmaps. We will update this article with additional information as it becomes available, but we have plenty to share to get started. Let's take a closer look at Intel's progress.Get Tom's Hardware's best news and in-depth reviews, straight to your inbox.Intel 14A Process NodeIntel 14A Process Node(Image credit: Intel)Intel's 14A, the next generation after 18A, is already in the works and scheduled for risk production in 2027. If all goes to plan, 14A will be the industry's first node to employ High-NA EUV lithography. TSMC's competing A14 (1.4nm-class) node is expected to arrive in 2028, but the Taiwanese company will not utilize High-NA for production.Intel has already shared early versions of the Process Design Kit (PDK), a set of data, documentation, and design rules that enables the design and validation of a processor design, with its lead 14A customers. Intel states that multiple customers have already indicated their intention to build chips using the 14A process node.Intel's 14A will have a second-generation version of its PowerVia backside power delivery technology. The new PowerDirect implementation is a more advanced and complex scheme that delivers power directly to each transistor's source and drain through specialized contacts, which minimizes resistance and maximizes power efficiency. This is a more direct and efficient connection than Intel's current PowerVia scheme, which connects to the contact level of the transistors with Nano TSVs.TSMC's N2 node does not include backside power delivery; however, with A16, the company will employ a direct-contact backside power delivery network, dubbed Super Power Rail (SPR). A16 is essentially a derivative of the N2P node with SPR. The A16 node is expected to enter production in late 2026. TSMC's A14 will not leverage a backside power design methodology.Intel's 18A-PT process node enables die stackingIntel's 18A-PT process node enables die stacking(Image credit: Intel)Intel's 18A node is the mainstream variant, but the company also has several 'line extensions' of the node, designated by different suffixes. These flavors of the underlying node are tailored for different use cases.Intel has a new 18A variant up its sleeve; the new 18A-PT node that will provide the same performance and efficiency benefits as the performance-oriented 18A-P, but adds in Foveros Direct 3D hybrid bonding. This bump-less copper-to-copper bonding technique (meaning it doesn't use microbumps or solder to connect the two dies) fuses chips together with through-silicon vias (TSVs). Intel's implementation will employ a pitch of less than 5 microns, a distinct improvement over its initial goal of a 10um pitch by 2023, to fuse chiplets on top of the 18A-PT die. The pitch is a measurement of the center-to-center spacing between the interconnects, and lower values indicate higher density, which is better.Notably, AMD uses TSMC's SoIC-X technology, a similar hybrid bonding approach, to fuse an L3 chiplet atop its X3D processors with a 9 micron bump pitch. TSMC's SOIC-X tech currently ranges from 4.5 to 9 microns, but the company has a 3-micron pitch offering on the roadmap for 2027. If productized effectively and on schedule, Intel's Foveros Direct 3D will dramatically improve its positioning against TSMC's packaging technology.Intel's Clearwater Forest will be its first to use Foveros Direct 3D packaging, but the company hasn't disclosed the pitch for that specific product yet. Notably, TSVs are typically only included in the base die, and Clearwater Forest uses Intel 3-T for the base die with the Intel 18A compute dies stacked on top. Enabling TSVs for 18A will thus allow it to also have dies stacked atop, and SRAM cache is a logical use case.Intel 18A process node updatesIntel 18A process node updatesImage 1 of 2(Image credit: Intel)(Image credit: Intel)As we reported last month, Intel's 18A (1.8 nm-equivalent) process node has entered risk production, marking the commencement of the first low-volume production runs of the node, with High Volume Manufacturing (HVM) scheduled for the end of the year. Intel did not specify which processors had begun production, but the timing generally aligns with expectations for its Panther Lake processors, which are expected to arrive at the end of the year. Intel's first 18A production will come from its Oregon fabs, but the company has already 'run the [18A] lot' through its Arizona fab, indicating it will soon begin production there as well.The 18A node is the first in the industry to be productized with both a PowerVia backside power delivery network (BSPDN) and RibbonFET gate-all-around (GAA) transistors. PowerVia provides optimized power routing on the back of the chip to improve performance and transistor density. RibbonFET also offers better transistor density, along with faster transistor switching, in a smaller area through the use of four vertical nanosheets surrounded entirely by the gate.The 18A node enters HVM in roughly the same timeframe as TSMC's competing 2nm N2 node. However, TSMC's N2 node does not come with a backside power delivery network, but it does have GAA technology with three vertical nanosheets. There have been some basic comparisons between the process nodes made based on presentations at a recent industry event. The general takeaway is that Intel's node is faster and lower-power than TSMC's, though TSMC retains the edge in density (and presumably cost). However, these distinctions could vary depending on the specific implementation in different chip designs.Intel divulged today that it has wafers of its high-performance 18A-P node in the fab. This 18A variant features an optimized power and frequency curve, providing an 8% improvement in performance per watt. This can be leveraged as either higher clock speeds or lower power consumption at the same performance, depending upon chip-specific tuning.The 18A-P node is design rule-compatible with the 18A node, easing the design process for customers. Intel is already collaborating with Electronic Design Automation (EDA) software vendors to enable broad support for industry-standard design tools, and it is also working with Intellectual Property (IP) designers to provide the necessary IP blocks, thereby simplifying implementation.Mature Nodes: 16nm and 12nm continue advancingMature Nodes: 16nm and 12nm continue advancingIntel Foundry not only addresses the leading edge of technology, but it is also working on several mature nodes. Intel's 16nm node, which is essentially a version of its 22FFL node that leverages industry standard design tools and PDKs, has a tapeout in the fab now.Intel is also continuing its work with partner UMC to develop a 12nm node that will be produced in three of Intel's Arizona fabs beginning in 2027. In fact, Intel is currently engaging lead customer for this node. 12nm will be used primarily for mobile communication infrastructure and networking applications.Takeaways, for nowTakeaways, for nowIntel canceled high volume manufacturing of the 20A node as a cost-cutting measure, but the company is now on the cusp of of production with with its18A node, marking a critical milestone as it looks to regain the manufacturing lead over TSMC. The addition of new line extensions, with the die-stacking-capable 18A-PT being a particularly strong advance, will help the company to further broaden its appeal to potential foundry customers.The development of the company's 14A node is also well underway, signifying that the company is on track to providing a steady cadence of new nodes and features to the roadmap. We haven't yet heard any new details about Intel's plans for its 10A (1nm-class) process node yet, which is expected to begin development in 2027. Intel's press release also doesn't mention any new progress on its Intel 3 node, but we expect more details to emerge throughout the day.Intel's event is focused heavily on displaying its broad portfolio of EDA, IP, and services driven by an ecosystem of indsutry stalwarts, like Synopsys and Cadence. The new Intel Foundry Chiplet Alliance is also an important development that will enable customers to mix-and-match chiplets into their design based upon interoperable and validated designs.Intel's advanced packaging services are also of particular importance as they provide the fastest on-ramp to meaningful revenue generation. Intel did mention that it will make its 3D stacking Foveros implementation available to foundry customers, and noted a new partnership with Amkor. However, details are slight for now. We'll update this article as more information becomes available. [ad_2] Source link

[knowusa]

Intel teases huge leaps for 18A, the tech behind its next-gen CPUs

Intel is almost literally betting its future on its upcoming “Panther Lake” CPU architecture, as well as the 18A manufacturing process it will be built upon. While we don’t have any concrete details of how Panther Lake will perform, Intel has publicly revealed some impressive numbers about the process technology itself. German publication Hardwareluxx reported on Intel’s 18A presentation at a…

[techpulsecanada]

Intel has confirmed that their next-generation Diamond Rapids and Clearwater Forest Xeon CPUs will launch in 2026, signaling a strong comeback for Team Blue in the data center market. These upcoming processors aim to compete fiercely against AMD’s EPYC Venice series, which uses TSMC’s 2nm process. Diamond Rapids will feature the massive LGA 9324 socket, nearly five times larger than the LGA 1700, and will include Panther Cove-X P-Cores, promising top-tier performance. Clearwater Forest is set to utilize the Darkmont Core architecture with up to 288 E-Cores and employ Intel’s 18A process technology for native resources development. This strategic roll-out is vital for Intel’s market share recovery, after losing ground to AMD's EPYC offerings in recent years. The CPUs are expected to incorporate advanced hybrid bonding technology with Foveros Direct, ensuring power and efficiency. As these powerful data center processors approach release, businesses should stay alert for what this means for cloud infrastructure, enterprise computing, and AI workloads. For custom-built, high-performance enterprise solutions, explore GroovyComputers.ca for tailored computer builds that keep you ahead. Are you excited about Intel’s comeback in the data center industry? Share your thoughts below! #DataCenter #XeonCPUs #IntelNextGen #ServerHardware #AIcomputing #HybridTechnology #GroovyComputers #CustomBuilds #TechnologyNews #CloudComputing #EnterpriseSolutions