#Semiconductor Intellectual Property (IP) Market

[semiconductorsandelectronics]

Semiconductor Intellectual Property (IP) Market Size, Share & Industry Growth Analysis Report by Design IP (Processor IP, Memory IP, Interface IP), IP Source (Royalty, Licensing), IP Core (Hard IP, Soft IP), Interface Type, End User, Vertical and Region - Global Forecast to 2029

[skyfallights]

FPGA Security Market Size Safeguarding Programmable Logic with Advanced Protection

The rising importance of cybersecurity in sectors like aerospace, defense, automotive, and telecommunications has amplified demand for the FPGA Security Market Size. Field‑Programmable Gate Arrays (FPGAs) are programmable hardware devices used in critical systems that require high performance and flexibility. As they are increasingly leveraged in secure systems—ranging from next‑generation radar to military communication platforms—ensuring the integrity, confidentiality, and availability of FPGA‑based designs has become paramount.

According to Market Size Research Future, the global FPGA security sector is projected to grow substantially through 2030, driven by concerns around IP theft, reverse engineering, side‑channel attacks, and invasive hardware probing. Manufacturers and integrators are adopting encryption, authentication, and tamper‑resistant techniques to protect FPGA configurations throughout the product lifecycle.

Market Size Overview

FPGA security encompasses methods and technologies that protect bitstream confidentiality, enforce device authentication, prevent unauthorized access, and secure operational environments. Key solutions include:

Bitstream encryption

Secure boot mechanisms

Hardware root of trust (RoT)

Side‑channel attack countermeasures

Tamper‑resistant packaging and sensors

These measures ensure that IP cannot be extracted, firmware can't be modified, and compromised devices are quickly identified—especially critical in military, medical imaging, and communication networks.

Key Growth Drivers

1. Escalating Cyber‑Physical Threat Landscape

From espionage to hardware tampering, vulnerabilities in FPGA systems can lead to critical failures. Sensitive applications in defense and infrastructure require robust protection.

2. Rise of Reconfigurable Platforms

With FPGAs now commonplace in satellites, UAVs, data centers (for AI inference), and edge devices, securing these programmable assets is essential.

3. Regulatory Requirements and Compliance

Standards like NIST 800-193, Common Criteria EAL, and defense guidelines mandate capability for secure boot, chain-of-trust, and real-time monitoring.

4. Continuous Intellectual Property Protection

FPGA bitstream developers need mechanisms to mitigate cloning, unauthorized replication, and side-channel-based IP theft.

Market Size Segmentation

By Security Solution:

Bitstream Encryption/Decryption

Secure Boot & Authentication

Hardware-Based Root of Trust

Anti-Tamper and Tamper Detection

Side-Channel Attack Protection

By FPGA Type:

Low-Cost Reconfigurable FPGAs

Mid-Range FPGAs with Moderate Security

High-End Secure FPGAs (Radiation-Hardened, Military-Grade)

By End-User:

Defense & Aerospace

Automotive & Transportation

Data Centers & AI

Communications & Networking

Industrial Automation

Medical Devices

Regional Insights

North America leads due to high adoption of FPGAs in defense, aerospace, and telecom, alongside strong IP privacy standards.

Europe focuses on industrial automation, automotive safety architectures, and GDPR-compliant data center solutions.

Asia-Pacific is growing, with secure FPGAs adopted in telecom, smart city rollouts, and industrial IoT—especially in China, South Korea, and Japan.

Competitive Landscape

Key players in the field are integrating encryption engines, secure enclaves, and real-time attestation in FPGA fabric:

Xilinx (AMD)

Intel (Altera)

Microchip (Microsemi)

Actel (Microchip)

Lattice Semiconductor

Achronix

Secured FPGA by AOSMD

Embedded Security by Rambus

These manufacturers are collaborating with security IP providers, offering hardened bitstream workflows, highly secure QSPI flash, and software toolchain support.

Market Size Trends

On-Chip Trusted Execution Environments: FPGA-embedded environments that isolate execution for critical functions.

Unified Hardware/Software Security: Combining JTAG lockout, IP obfuscation, and authentication methods.

Dynamic Reconfiguration in the Field: Upgrades with secure patches, version control, and rollback protection.

Cloud-Enabled Attestation & Monitoring: Remote verification of FPGA integrity in distributed deployments.

Challenges

Integration Complexity: Security often adds latency, power overhead, and design complexity.

Fragmented Hardware Standards: Vendors differ in security support, toolchains, and compatibility.

Scaling Across Generations: Ensuring upgrades remain secure over multi-generation product lines.

Future Outlook

As FPGAs become pervasive in edge computing, aerospace, IIoT, and autonomous vehicles, demand for integrated, certified security mechanisms will continue to rise. Future growth will be fueled by tools and ecosystems that ease security adoption while protecting next-gen programmable compute infrastructure.

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[semiconductorlogs]

Semiconductor IP Blocks Market Growth Analysis 2025-2032

Semiconductor Intellectual Property (IP) Blocks Market Analysis:

The global Semiconductor IP Blocks Market size was valued at US$ 6.5 billion in 2024 and is projected to reach US$ 12.8 billion by 2032, at a CAGR of 10.9% during the forecast period 2025-2032

Semiconductor Intellectual Property (IP) Blocks Market Overview

This report provides a deep insight into the global Semiconductor Intellectual Property (IP) Blocks market covering all its essential aspects. This ranges from a macro overview of the market to micro details of the market size, competitive landscape, development trend, niche market, key market drivers and challenges, SWOT analysis, value chain analysis, etc. The analysis helps the reader to shape the competition within the industries and strategies for the competitive environment to enhance the potential profit. Furthermore, it provides a simple framework for evaluating and accessing the position of the business organization. The report structure also focuses on the competitive landscape of the Global Semiconductor Intellectual Property (IP) Blocks Market, this report introduces in detail the market share, market performance, product situation, operation situation, etc. of the main players, which helps the readers in the industry to identify the main competitors and deeply understand the competition pattern of the market. In a word, this report is a must-read for industry players, investors, researchers, consultants, business strategists, and all those who have any kind of stake or are planning to foray into the Semiconductor Intellectual Property (IP) Blocks market in any manner.

Semiconductor Intellectual Property (IP) Blocks Key Market Trends  :

Rising Adoption in Automotive and Industrial Applications Semiconductor IP blocks are increasingly being used in advanced driver-assistance systems (ADAS), autonomous vehicles, and industrial automation.

Growing Demand for Customizable and Energy-Efficient IP There is a clear trend toward low-power, application-specific IP blocks to meet the demands of battery-operated and portable devices.

Integration with AI and Machine Learning Many companies are integrating AI accelerators into processor IP to support AI workloads, boosting demand for advanced IP blocks.

Increased Licensing Models and Flexible IP Delivery Vendors are offering flexible licensing models such as subscription-based and royalty-free models, making IP more accessible to small and mid-sized players.

Expansion of 5G and Edge Computing Devices The rollout of 5G and edge computing is creating demand for high-performance, low-latency IP blocks, especially in interface and processor categories.

Semiconductor Intellectual Property (IP) Blocks Market Regional Analysis :

North America:Strong demand driven by EVs, 5G infrastructure, and renewable energy, with the U.S. leading the market.

Europe:Growth fueled by automotive electrification, renewable energy, and strong regulatory support, with Germany as a key player.

Asia-Pacific:Dominates the market due to large-scale manufacturing in China and Japan, with growing demand from EVs, 5G, and semiconductors.

South America:Emerging market, driven by renewable energy and EV adoption, with Brazil leading growth.

Middle East & Africa:Gradual growth, mainly due to investments in renewable energy and EV infrastructure, with Saudi Arabia and UAE as key contributors.

Semiconductor Intellectual Property (IP) Blocks Market Segmentation :

The research report includes specific segments by region (country), manufacturers, Type, and Application. Market segmentation creates subsets of a market based on product type, end-user or application, Geographic, and other factors. By understanding the market segments, the decision-maker can leverage this targeting in the product, sales, and marketing strategies. Market segments can power your product development cycles by informing how you create product offerings for different segments. Key Company

ARM

Synopsys

Imagination Technologies

Cadence

Ceva

Verisillicon

eMemory Technology

Rambus

Lattice (Silicon Image)

Sonics

Market Segmentation (by Type)

Processor IP

Interface IP

Memory IP

Other IP

Market Segmentation (by Application)

Consumer Electronics

Telecom

Computer

Automotive

Military and Aviation

Healthcare

Industrial

Market Drivers

Booming Consumer Electronics and IoT Devices The rapid proliferation of smartphones, wearables, and IoT devices is fueling the demand for energy-efficient and compact IP blocks.

Accelerated Adoption of AI and Machine Learning Increasing use of AI in various applications such as automotive, healthcare, and telecom is driving the integration of specialized processor IP.

Need for Faster Time-to-Market Semiconductor companies are increasingly outsourcing IP to reduce development time and cost, which boosts demand for ready-to-integrate IP blocks.

Market Restraints

High Licensing and Integration Costs Although beneficial in the long run, the upfront costs of licensing IP blocks and integrating them into SoCs can be high for small-scale manufacturers.

Complexity of Design and Verification As chip designs grow more complex, ensuring the IP block works flawlessly with existing designs becomes a major challenge.

Intellectual Property Theft and Legal Disputes Concerns over IP security and potential legal battles deter some companies from investing heavily in third-party IP solutions.

Market Opportunities

Growth in Edge Computing and 5G Networks Emerging technologies like 5G and edge computing demand high-performance IP blocks, opening new revenue streams for vendors.

Expansion into Emerging Markets Regions like Southeast Asia, Latin America, and the Middle East offer untapped opportunities due to increasing digital infrastructure investments.

Rise of Chiplets and Modular Designs The trend toward modular chip design using chiplets is creating new avenues for the reuse and customization of IP blocks.

Market Challenges

Maintaining Compatibility Across Architectures Designing IP blocks that can seamlessly work across diverse chip architectures and foundry processes remains complex.

Shortage of Skilled Talent There is a global shortage of skilled semiconductor engineers, which limits the ability of companies to innovate and scale IP development.

Geopolitical and Trade Tensions Export restrictions and trade conflicts between major economies (e.g., US-China) can disrupt the supply and licensing of critical IP technologies.

Key Benefits of This Market Research:

Industry drivers, restraints, and opportunities covered in the study

Neutral perspective on the market performance

Recent industry trends and developments

Competitive landscape & strategies of key players

Potential & niche segments and regions exhibiting promising growth covered

Historical, current, and projected market size, in terms of value

In-depth analysis of the Semiconductor Intellectual Property (IP) Blocks Market

Overview of the regional outlook of the Semiconductor Intellectual Property (IP) Blocks Market:

Key Reasons to Buy this Report:

Access to date statistics compiled by our researchers. These provide you with historical and forecast data, which is analyzed to tell you why your market is set to change

This enables you to anticipate market changes to remain ahead of your competitors

You will be able to copy data from the Excel spreadsheet straight into your marketing plans, business presentations, or other strategic documents

The concise analysis, clear graph, and table format will enable you to pinpoint the information you require quickly

Provision of market value (USD Billion) data for each segment and sub-segment

Indicates the region and segment that is expected to witness the fastest growth as well as to dominate the market

Analysis by geography highlighting the consumption of the product/service in the region as well as indicating the factors that are affecting the market within each region

Provides insight into the market through Value Chain

Market dynamics scenario, along with growth opportunities of the market in the years to come

6-month post-sales analyst support

Related Report:

[bisresearch0]

Global Metalens Market: Trends, Applications, and Forecast (2024–2034)

What are metalens?

Metalenses, which are ultra-thin, planar optical components created using sub-wavelength nanostructures, are replacing traditional bulky, multi-element lenses with compact, high-performance metasurfaces. Their adoption is accelerating across multiple industries due to their ability to drastically reduce the size and weight of optical systems while maintaining or improving performance.

Frequently Asked Questions(FAQ’s):

What major trends are shaping the metalens market?

Rapid shift to wafer-level nano-imprint lithography (NIL) for mass production, demand for ultra-thin optics in smartphones and XR headsets, emergence of multifunctional metasurfaces (focusing + polarization/spectral control), and convergence with silicon-photonics and quantum-optics platforms.

Which regions will witness the fastest growth in global metalens market?

Asia-Pacific in shipment volume (driven by Chinese and Korean handset OEMs), while North America and Europe lead early adoption in automotive LiDAR and medical imaging thanks to strong R&D funding and supportive regulations.

What challenges could impede adoption of metalens?

High up-front CAPEX for NIL toolsets, yield losses at sub-50 nm features, fragmented IP/licensing landscape and export controls, plus stringent reliability qualifications for automotive and aerospace applications.

Where lie the biggest opportunities in global metalens market?

High-volume smartphone/XR camera design wins, compact automotive LiDAR modules, disposable medical endoscopes and OCT probes, and strategic partnerships linking metalens start-ups with large CMOS/MEMS foundries to scale production.

Market Opportunities

Integration with AR/VR & Holographic Displays: Metalenses offer compact, high-performance optics ideal for AR/VR and holographic displays. By replacing bulky multi-element lenses with flat metasurfaces, metalenses enable smaller, lighter devices with improved image quality and clarity, enhancing user experience in immersive technologies.

Partnerships between Start-ups and Semiconductor Giants: Collaborations between start-ups and established semiconductor companies are accelerating metalens adoption. These partnerships combine innovative metasurface technology with manufacturing expertise, allowing for scaled production and expansion into industries like consumer electronics, automotive, and healthcare.

Emerging Use in Photonic Computing & Quantum Optics: Metalenses have strong potential in photonic computing and quantum optics by enabling efficient light manipulation. In photonic computing, metalenses can improve speed and energy efficiency, while in quantum optics, they can enhance the performance of sensors and other quantum devices, opening doors to new applications.

What are the main technical challenges in metalenses?

Complex Fabrication: Metalenses require highly precise nanostructuring, which is difficult and costly to maintain at scale. Low production yields can also drive up costs.

High Capital Investment: Advanced fabrication tools like nanoimprint lithography (NIL) require significant capital, making it challenging for smaller companies to enter the market.

Material and Integration Issues: Limited material options and challenges in integrating metalenses into existing optical systems can slow adoption. Compatibility with CMOS processes is a key hurdle.

Regulatory and IP Barriers: Intellectual property complexities and regulatory restrictions, especially in defense applications, may hinder the widespread use and commercialization of metalenses.

Excited to learn more about Metalens Market, Click Here!

Learn more about Automotive Vertical by clicking here!

Conclusion

The Metalens Market is experiencing rapid growth, driven by advancements in nanoimprint lithography (NIL) and increasing demand for miniaturized, high-performance optics across industries such as consumer electronics, automotive, healthcare, and aerospace. Metalenses are replacing traditional bulky lenses with compact, efficient alternatives, enhancing applications in smartphone cameras, AR/VR headsets, LiDAR systems, and medical imaging. While challenges like fabrication complexity and high capital investment exist, ongoing innovations and industry collaborations are overcoming these obstacles. With emerging opportunities in AR/VR displays, photonic computing, and quantum optics, metalenses are poised to play a key role in the future of optical systems.

[dineshblogsimr]

Global Semiconductor Intellectual Property (IP) Blocks Market : Forecast to 2032

Global Semiconductor IP Blocks Market size was valued at US$ 6.5 billion in 2024 and is projected to reach US$ 12.8 billion by 2032, at a CAGR of 10.9% during the forecast period 2025-2032

Semiconductor Intellectual Property (IP) Blocks Market Overview

This report provides a deep insight into the global Semiconductor Intellectual Property (IP) Blocks market covering all its essential aspects. This ranges from a macro overview of the market to micro details of the market size, competitive landscape, development trend, niche market, key market drivers and challenges, SWOT analysis, value chain analysis, etc. The analysis helps the reader to shape the competition within the industries and strategies for the competitive environment to enhance the potential profit. Furthermore, it provides a simple framework for evaluating and accessing the position of the business organization. The report structure also focuses on the competitive landscape of the Global Semiconductor Intellectual Property (IP) Blocks Market, this report introduces in detail the market share, market performance, product situation, operation situation, etc. of the main players, which helps the readers in the industry to identify the main competitors and deeply understand the competition pattern of the market. In a word, this report is a must-read for industry players, investors, researchers, consultants, business strategists, and all those who have any kind of stake or are planning to foray into the Semiconductor Intellectual Property (IP) Blocks market in any manner.

Get A Full Report:

Semiconductor Intellectual Property (IP) Blocks Key Market Trends  :

Rising Adoption in Automotive and Industrial Applications Semiconductor IP blocks are increasingly being used in advanced driver-assistance systems (ADAS), autonomous vehicles, and industrial automation.

Growing Demand for Customizable and Energy-Efficient IP There is a clear trend toward low-power, application-specific IP blocks to meet the demands of battery-operated and portable devices.

Integration with AI and Machine Learning Many companies are integrating AI accelerators into processor IP to support AI workloads, boosting demand for advanced IP blocks.

Increased Licensing Models and Flexible IP Delivery Vendors are offering flexible licensing models such as subscription-based and royalty-free models, making IP more accessible to small and mid-sized players.

Expansion of 5G and Edge Computing Devices The rollout of 5G and edge computing is creating demand for high-performance, low-latency IP blocks, especially in interface and processor categories.

Semiconductor Intellectual Property (IP) Blocks Market Regional Analysis :

North America:Strong demand driven by EVs, 5G infrastructure, and renewable energy, with the U.S. leading the market.

Europe:Growth fueled by automotive electrification, renewable energy, and strong regulatory support, with Germany as a key player.

Asia-Pacific:Dominates the market due to large-scale manufacturing in China and Japan, with growing demand from EVs, 5G, and semiconductors.

South America:Emerging market, driven by renewable energy and EV adoption, with Brazil leading growth.

Middle East & Africa:Gradual growth, mainly due to investments in renewable energy and EV infrastructure, with Saudi Arabia and UAE as key contributors.

Semiconductor Intellectual Property (IP) Blocks Market Segmentation :

The research report includes specific segments by region (country), manufacturers, Type, and Application. Market segmentation creates subsets of a market based on product type, end-user or application, Geographic, and other factors. By understanding the market segments, the decision-maker can leverage this targeting in the product, sales, and marketing strategies. Market segments can power your product development cycles by informing how you create product offerings for different segments. Key Company

ARM

Synopsys

Imagination Technologies

Cadence

Ceva

Verisillicon

eMemory Technology

Rambus

Lattice (Silicon Image)

Sonics

Market Segmentation (by Type)

Processor IP

Interface IP

Memory IP

Other IP

Market Segmentation (by Application)

Consumer Electronics

Telecom

Computer

Automotive

Military and Aviation

Healthcare

Industrial

Market Drivers

Booming Consumer Electronics and IoT Devices The rapid proliferation of smartphones, wearables, and IoT devices is fueling the demand for energy-efficient and compact IP blocks.

Accelerated Adoption of AI and Machine Learning Increasing use of AI in various applications such as automotive, healthcare, and telecom is driving the integration of specialized processor IP.

Need for Faster Time-to-Market Semiconductor companies are increasingly outsourcing IP to reduce development time and cost, which boosts demand for ready-to-integrate IP blocks.

Market Restraints

High Licensing and Integration Costs Although beneficial in the long run, the upfront costs of licensing IP blocks and integrating them into SoCs can be high for small-scale manufacturers.

Complexity of Design and Verification As chip designs grow more complex, ensuring the IP block works flawlessly with existing designs becomes a major challenge.

Intellectual Property Theft and Legal Disputes Concerns over IP security and potential legal battles deter some companies from investing heavily in third-party IP solutions.

Market Opportunities

Growth in Edge Computing and 5G Networks Emerging technologies like 5G and edge computing demand high-performance IP blocks, opening new revenue streams for vendors.

Expansion into Emerging Markets Regions like Southeast Asia, Latin America, and the Middle East offer untapped opportunities due to increasing digital infrastructure investments.

Rise of Chiplets and Modular Designs The trend toward modular chip design using chiplets is creating new avenues for the reuse and customization of IP blocks.

Market Challenges

Maintaining Compatibility Across Architectures Designing IP blocks that can seamlessly work across diverse chip architectures and foundry processes remains complex.

Shortage of Skilled Talent There is a global shortage of skilled semiconductor engineers, which limits the ability of companies to innovate and scale IP development.

Geopolitical and Trade Tensions Export restrictions and trade conflicts between major economies (e.g., US-China) can disrupt the supply and licensing of critical IP technologies.

Get a Sample Report: https://semiconductorinsight.com/download-sample-report/?product_id=95930

Key Benefits of This Market Research:

Industry drivers, restraints, and opportunities covered in the study

Neutral perspective on the market performance

Recent industry trends and developments

Competitive landscape & strategies of key players

Potential & niche segments and regions exhibiting promising growth covered

Historical, current, and projected market size, in terms of value

In-depth analysis of the Semiconductor Intellectual Property (IP) Blocks Market

Overview of the regional outlook of the Semiconductor Intellectual Property (IP) Blocks Market:

Key Reasons to Buy this Report:

Access to date statistics compiled by our researchers. These provide you with historical and forecast data, which is analyzed to tell you why your market is set to change

This enables you to anticipate market changes to remain ahead of your competitors

You will be able to copy data from the Excel spreadsheet straight into your marketing plans, business presentations, or other strategic documents

The concise analysis, clear graph, and table format will enable you to pinpoint the information you require quickly

Provision of market value (USD Billion) data for each segment and sub-segment

Indicates the region and segment that is expected to witness the fastest growth as well as to dominate the market

Analysis by geography highlighting the consumption of the product/service in the region as well as indicating the factors that are affecting the market within each region

Provides insight into the market through Value Chain

Market dynamics scenario, along with growth opportunities of the market in the years to come

6-month post-sales analyst support

Customization of the Report In case of any queries or customization requirements, please connect with our sales team, who will ensure that your requirements are met.

Related Research Reports:

Contact us:

help@semiconductorinsight.com

[globalresearchinsights]

The global Semiconductor Intellectual Property (IP) Market is undergoing a significant transformation. With a market value of $6.5 billion in 2024, it is projected to more than double, reaching $14.8 billion by 2034, growing at an impressive CAGR of 8.6%. This market revolves around the licensing and development of pre-designed circuit components, known as IP cores, essential for modern chip design. These IPs enable faster time-to-market, reduce design complexity, and drive cost efficiency—particularly vital in sectors like consumer electronics, automotive, telecommunications, and industrial applications.

[forbiddenhoardtreasure]

South Korea Semiconductor IP Market is driven by AI device demand

Semiconductor intellectual property (IP) cores serve as pre-designed building blocks for complex system-on-chip (SoC) architectures, enabling chip designers to integrate high-performance processor, memory, interface, and encryption modules without investing in ground-up development. These cores accelerate time-to-market, reduce design costs, and enhance power efficiency, making them essential in consumer electronics, automotive systems, and industrial IoT applications.

As chip geometries shrink and functional integration grows, the need for robust verification environments and standardized IP becomes paramount. The market research highlights that adoption of RISC-V, ARM, and custom IP solutions drives product differentiation and competitiveness. Ongoing developments in low-power design, secure processing, and AI accelerators further expand South Korea Semiconductor IP Market­­­ opportunities by enabling edge computing and 5G device support. Continuous innovation in packaging and heterogeneous integration underscores evolving market trends, while strategic alliances and licensing agreements shape market dynamics.

The South Korea Semiconductor IP Market is estimated to be valued at USD 2.16 Bn in 2025 and is expected to reach USD 6.68 Bn by 2032, growing at a compound annual growth rate (CAGR) of 17.5% from 2025 to 2032. Key Takeaways

Key players operating in the South Korea Semiconductor IP Market are:

-Arm Holdings

-Synopsys, Inc.

-Cadence Design Systems, Inc.

-Imagination Technologies Limited

-Lattice Semiconductor These market companies hold significant industry share through extensive IP libraries spanning CPUs, GPUs, interconnects, and security modules. Arm Holdings continues to lead with versatile Cortex-series cores, while Synopsys and Cadence bolster their portfolios with advanced verification and custom IP tooling. Imagination Technologies focuses on graphics and neural processing IP, and Lattice Semiconductor addresses low-power FPGA-integrated IP. Collaborative research and licensing agreements among these players foster innovation and help maintain competitive market positions.

‣ Get More Insights On: South Korea Semiconductor IP Market­­­

‣ Get this Report in Japanese Language: 韓国の半導体IP市場

‣ Get this Report in Korean Language: 한국반도체IP시장

[jcmarchi]

Andy Nightingale, VP of Product Marketing at Arteris – Interview Series

New Post has been published on https://thedigitalinsider.com/andy-nightingale-vp-of-product-marketing-at-arteris-interview-series/

Andy Nightingale, VP of Product Marketing at Arteris – Interview Series

Andy Nightingale, VP of Product Marketing at Arteris is a seasoned global business leader with a diverse background in engineering and product marketing. He’s a Chartered Member of the British Computer Society and the Chartered Institute of Marketing, and has over 35 years of experience in the high-tech industry.

Throughout his career, Andy has held a range of roles, including engineering and product management positions at Arm, where he spent 23 years. In his current role as VP of product marketing at Arteris, Andy oversees the Magillem system-on-chip deployment tooling and FlexNoC and Ncore network-on-chip products.

Arteris is a catalyst for system-on-chip (SoC) innovation as the leading provider of semiconductor system IP for the acceleration of SoC development. Arteris Network-on-Chip (NoC) interconnect intellectual property (IP) and SoC integration technology enable higher product performance with lower power consumption and faster time to market, delivering proven flexibility and better economics for system and semiconductor companies, so innovative brands are free to dream up what comes next.

With your extensive experience at Arm and now leading product management at Arteris, how has your perspective on the evolution of semiconductor IP and interconnect technologies changed over the years? What key trends excite you the most today?

It’s been an extraordinary journey—from my early days writing test benches for ASICs at Arm to helping shape product strategy at Arteris, where we’re at the forefront of interconnect IP innovation. Back in 1999, system complexity rapidly accelerated, but the focus was still primarily on processor performance and essential SoC integration. Verification methodologies were evolving, but interconnect was often seen as a fixed infrastructure—necessary but not strategic.

Fast-forward to today and interconnect IP has become a critical enabler of SoC (System-on-Chip) scalability, power efficiency, and AI/ML performance. The rise of chiplets, domain-specific accelerators, and multi-die architectures has placed immense pressure on interconnect technologies to become more adaptive, innovative, physically, and software-aware.

One of the most exciting trends I see is the convergence of AI and interconnect design. At Arteris, we’re exploring how machine learning can optimize NoC (Network-on-Chip) topologies, intelligently route data traffic, and even anticipate congestion to improve real-time performance. This is not just about speed—it’s about making systems more innovative and responsive.

What excites me is how semiconductor IP is becoming more accessible to AI innovators. With high-level SoC configuration IP and abstraction layers, startups in automotive, robotics, and edge AI can now leverage advanced interconnect architectures without needing a deep background in RTL design. That democratization of capability is enormous.

Another key shift is the role of virtual prototyping and system-level modeling. Having worked on ESL (Electronic System Level) tools early in my career, it’s rewarding to see those methodologies now enabling early AI workload evaluation, performance prediction, and architectural trade-offs long before silicon is taped out.

Ultimately, the future of AI depends on how efficiently we move data—not just how fast we process it. That’s why I believe the evolution of interconnect IP is central to the next generation of intelligent systems. Arteris’ FlexGen leverages AI driven automation and machine learning to automate NoC (Network-on-Chip) topology generation. How do you see AI’s role evolving in chip design over the next five years?

AI is fundamentally transforming chip design, and over the next five years, its role will only deepen—from productivity aid to intelligent design partner. At Arteris, we’re already living that future with FlexGen, where AI, formal methods, and machine learning are central to automating Network-on-Chip (NoC) topology optimization and SoC integration workflows.

What sets FlexGen apart is its blend of ML algorithms—all combined to initialize floorplans from images, generate topologies, configure clocks, reduce Clock Domain Crossings, and optimize the connectivity topology and its placement and routing bandwidth, streamlining communication between IP blocks. Moreover, this is all done deterministically, meaning that results can be replicated and incremental adjustments made, enabling predictable best-in-class results for use cases ranging from AI assistance for an expert SoC designer to creating the right NoC for a novice.

Over the next five years, AI’s role in chip design will shift from assisting human designers to co-designing and co-optimizing with them—learning from every iteration, navigating design complexity in real-time, and ultimately accelerating the delivery of AI-ready chips. We see AI not just making chips faster but making faster chips smarter.

The semiconductor industry is witnessing rapid innovation with AI, HPC, and multi-die architectures. What are the biggest challenges that NoC design needs to solve to keep up with these advancements?

As AI, HPC, and multi-die architectures drive unprecedented complexity, the biggest challenge for NoC design is scalability without sacrificing power, performance, or time to market. Today’s chips feature tens to hundreds of IP blocks, each with different bandwidth, latency, and power needs. Managing this diversity—across multiple dies, voltage domains, and clock domains—requires NoC solutions that go far beyond manual methods.

NoC solution technologies such as FlexGen help address key bottlenecks: minimizing wire length, maximizing bandwidth, aligning with physical constraints, and doing everything with speed and repeatability.

The future of NoC must also be automation-first and AI-enabled, with tools that can adapt to evolving floorplans, chipset-based architectures, and late-stage changes without requiring complete rework. This is the only way to keep pace with modern SoCs’ massive design cycles and heterogeneous demands and ensure efficient, scalable connectivity at the heart of next-gen semiconductors.

The AI chipset market is projected to grow significantly. How does Arteris position itself to support the increasing demands of AI workloads, and what unique advantages does FlexGen offer in this space?

Arteris is not only uniquely positioned to support the AI chiplet market but has been doing this already for years by delivering automated, scalable Network-on-Chip (NoC) IP solutions purpose-built for the demands of AI workloads including Generative AI and Large Language Models (LLM) compute —supporting high bandwidth, low latency, and power efficiency across increasingly complex architectures.  FlexGen, as the newest addition to the Arteris NoC IP lineup, will play an even more significant role in rapidly creating optimal topologies best suited for different large-scale, heterogeneous SoCs.

FlexGen offers incremental design, partial completion mode, and advanced pathfinding to dynamically optimize NoC configurations without complete redesigns—critical for AI chips that evolve throughout development.

Our customers are already building Arteris technology into multi-die and chiplet-based systems, efficiently routing traffic while respecting floorplan and clock domain constraints on each chiplet. Non-coherent multi-die connectivity is supported over industry-standard interfaces provided by third- party controllers.

As AI chip complexity grows, so does the need for automation, adaptability, and speed. FlexGen delivers all three, helping teams build smarter interconnects—faster—so they can focus on what matters: advancing AI performance at scale.

With the rise of RISC-V and custom silicon for AI, how does Arteris’ approach to NoC design differ from traditional interconnect architectures?

Traditional interconnect architectures were primarily built for fixed-function designs, but today’s RISC-V and custom AI silicon demand a more configurable, scalable, and automated approach than a modified one-size-fits-all solution. That’s where Arteris stands apart. Our NoC IP, especially with FlexGen, is designed to adapt to the diversity and modularity of modern SoCs, including custom cores, accelerators, and chiplets, as mentioned above.

FlexGen enables designers to generate and optimize topologies that reflect unique workload characteristics, whether low-latency paths for AI inference or high-bandwidth routes for shared memory across RISC-V clusters. Unlike static interconnects, FlexGen’s algorithms tailor each NoC to the chip’s architecture across clock domains, voltage islands, and floorplan constraints.

As a result, Arteris enables teams building custom silicon to move faster, reduce risk, and get the most from their highly differentiated designs—something traditional interconnects weren’t built to handle.

FlexGen claims a 10x improvement in design iteration speed. Can you walk us through how this automation reduces complexity and accelerates time-to-market for System-on-Chip (SoC) designers?

FlexGen delivers a 10x improvement in design iteration speed by automating some of the most complex and time-consuming tasks in NoC design. Instead of manually configuring topologies, resolving clock domains, or optimizing routes, designers use FlexGen’s physically aware, AI-powered engine to handle these in hours (or less)—tasks that traditionally took weeks.

As mentioned above, partial completion mode can automatically finish even partially completed designs, preserving manual intent while accelerating timing closure.

The result is a faster, more accurate, and easier-to-iterate design flow, enabling SoC teams to explore more architectural options, respond to late-stage changes, and get to market faster—with higher-quality results and less risk of costly rework.

One of FlexGen’s standout features is wire length reduction, which improves power efficiency. How does this impact overall chip performance, particularly in power-sensitive applications like edge AI and mobile computing?

Wire length directly impacts power consumption, latency, and overall chip efficiency—both in cloud AI / HPC applications that use the more advanced nodes and edge AI inference applications where every milliwatt matters. FlexGen’s ability to automatically minimize wire length—often up to 30%—means shorter data paths, reduced capacitance, and less dynamic power draw.

In real-world terms, this translates to lower heat generation, longer battery life, and better performance-per-watt, all of which are critical for AI workloads at the edge or in mobile environments and the cloud by directly impacting the total cost of ownership (TCO). By optimizing the NoC topology with AI-guided placement and routing, FlexGen ensures that performance targets are met without sacrificing power efficiency—making it an ideal fit for today and tomorrow’s energy-sensitive designs.

Arteris has partnered with leading semiconductor companies in AI data centers, automotive, consumer, communications, and industrial electronics. Can you share insights on how FlexGen is being adopted across these industries?

Arteris NoC IP sees strong adoption across all markets, particularly for high-end, more advanced chiplets and SoCs. That is because it addresses each sector’s top challenges: performance, power efficiency, and design complexity while preserving the core functionality and area constraints.

In automotive, for example, companies like Dream Chip use FlexGen to speed up the intersection of AI and Safety for autonomous driving by leveraging Arteris for their ADAS SoC design while meeting strict power and safety constraints. FlexGen’s smart NoC optimization and generation in data centers help manage massive bandwidth demands and scalability, especially for AI training and overall acceleration workloads.

FlexGen provides a fast, repeatable path to optimized NoC architectures for industrial electronics, where design cycles are tight and product longevity is key. Customers value its incremental design flow, AI-based optimization, and ability to adapt quickly to evolving requirements, making FlexGen a cornerstone for next-generation SoC development.

The semiconductor supply chain has faced significant disruptions in recent years. How is Arteris adapting its strategy to ensure Network-on-Chip (NoC) solutions remain accessible and scalable despite these challenges?

Arteris responds to supply chain disruptions by doubling down on what makes our NoC solutions resilient and scalable: automation, flexibility, and ecosystem compatibility.

FlexGen helps customers design faster and remain more agile to adjust to changing silicon availability, node shifts, or packaging strategies. Whether they are doing derivative designs or creating new interconnects from scratch.

We also support customers with different process nodes, IP vendors, and design environments, ensuring customers can deploy Arteris solutions regardless of their foundry, EDA tools, or SoC architecture.

By reducing dependency on any one part of the supply chain and enabling faster, iterative design, we’re helping customers derisk their designs and stay on schedule —even in uncertain times.

Looking ahead, what are the biggest shifts you anticipate in SoC development, and how is Arteris preparing for them?

One of the most significant shifts in SoC development is the move toward heterogeneous architectures, chiplet-based designs, and AI-centric workloads. These trends demand far more flexible, scalable, and intelligent interconnects—something traditional methods can’t keep up with.

Arteris is preparing by investing in AI-driven automation, as seen in FlexGen, and expanding support for multi-die systems, complex clock/power domains, and late-stage floorplan changes. We’re also focused on enabling incremental design, faster iteration, and seamless IP integration—so our customers can keep pace with shrinking development cycles and rising complexity.

Our goal is to ensure SoC (and chiplet) teams stay agile, whether they’re building for edge AI, cloud AI, or anything in between, all while providing the best power, performance, and area (PPA) no matter the complexity of the design, XPU architecture, and foundry node used.

Thank you for the great interview, readers who wish to learn more should visit Arteris. 

[skyfallights]

FPGA Security Industry Safeguarding the Future of Reconfigurable Computing

The FPGA Security Industry is rapidly evolving, fueled by the rising integration of Field-Programmable Gate Arrays (FPGAs) in mission-critical sectors such as defense, telecommunications, automotive, and industrial automation. As the market is forecast to grow from USD 1.2 billion in 2023 to USD 3.7 billion by 2032, it demonstrates a strong CAGR of 12.4%, underscoring the urgent need for robust security in reprogrammable hardware.

Overview

FPGAs are valued for their reconfigurability and parallel processing power. However, this adaptability also introduces unique security risks—including unauthorized access, hardware Trojans, and reverse engineering. As digital systems become more interconnected, the FPGA security industry is responding with advanced cryptographic techniques, secure boot mechanisms, and anti-tamper features.

Key Drivers of Industry Growth

Expanding Use in Defense & Aerospace: Mission-critical systems require resilient and hack-proof programmable logic.

Automotive Transformation: Advanced Driver-Assistance Systems (ADAS) and autonomous vehicles need real-time, secure computing.

5G & Telecom Expansion: FPGA-based infrastructure demands encrypted communications and secure authentication.

Cloud & Edge Computing: Secure FPGAs are foundational to protecting edge AI models and hyperscale cloud deployments.

Global Regulatory Pressure: Compliance with NIST, GDPR, and national cybersecurity mandates propels the industry forward.

Segment Insights

By Security Type:

Encryption & Decryption Modules: Widely adopted in defense and cloud systems.

Secure Boot & Configuration: Essential for preventing unauthorized programming and bitstream manipulation.

Runtime Monitoring: Used to detect malicious behaviors during FPGA operation.

By Application:

Telecom: FPGAs with embedded encryption enhance network resiliency.

Military & Aerospace: Tamper-resistant architectures dominate this high-security vertical.

Consumer Electronics: Security features are becoming essential in smart home and IoT devices.

End-User Insights

Government & Defense: Leading adoption of secure FPGAs for classified systems and drones.

Automotive OEMs: Prioritizing security in next-gen vehicle computing platforms.

Cloud Providers: Deploying secure programmable logic for custom AI accelerators and data isolation.

Industry Challenges

IP Theft Risks: Protecting design intellectual property is crucial amid rising global chip manufacturing.

Performance vs. Security Trade-offs: Designers must balance latency and throughput with cryptographic overhead.

Supply Chain Vulnerabilities: Ensuring secure FPGA sourcing and validation during manufacturing stages.

Regional Insights

North America: Strongest industry presence due to defense funding and tech innovation.

Europe: Emphasizes data privacy and hardware-level security across industries.

Asia-Pacific: Fastest-growing region due to semiconductor manufacturing and smart infrastructure projects.

Leading Industry Players

Xilinx (AMD) – Integrates hardened security features in its adaptive compute platforms.

Intel (Altera) – Provides end-to-end security lifecycle tools for FPGA developers.

Microchip Technology – Known for military-grade anti-tamper solutions.

Lattice Semiconductor – Offers low-power FPGAs with advanced encryption support.

Achronix Semiconductor – Specializes in high-speed, secure embedded FPGAs for AI acceleration.

Conclusion

The FPGA Security Industry is central to the safe deployment of programmable hardware across increasingly complex digital ecosystems. By incorporating next-gen security standards and tamper-resistant technologies, the industry is laying the groundwork for secure, reconfigurable computing at scale.

Trending Report Highlights

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[walkingghotst]

North America Electronic Design Automation Market Analysis by Business Methodologies 2027

North America Electronic Design Automation Market is expected to grow from US$ 4.10 Bn in 2018 to US$ 9.70 Bn by the year 2027 with a CAGR of 10.2% from the year 2019 to 2027.

Market Overview

The significant growth impetus emanating from the semiconductor industry is a primary driver fueling the substantial expansion of the North America Electronic Design Automation Market. Furthermore, the increasing focus on the reduction in size of electronic devices is widely anticipated to stimulate the progress of the North America Electronic Design Automation Market throughout the forecast period. Moreover, the growing number of significant collaborations and strategic partnerships among key players within the electronic design automation (EDA) sector is a crucial factor fostering market expansion. The North America Electronic Design Automation Market is characterized by the strong presence of numerous well-established global companies, alongside a considerable number of smaller, tier-two enterprises. These EDA companies are playing a vital role in enabling semiconductor manufacturers to effectively meet the continuously increasing demand for sophisticated semiconductor products from their diverse customer base within the North America Electronic Design Automation Market.

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In the year 2018, the Semiconductor Intellectual Property (SIP) segment held a dominant position within the Electronic Design Automation market, commanding the largest share of the market. However, industry forecasts indicate an anticipated shift in dominance, with the Computer-Aided Engineering (CAE) segment projected to surpass SIP over the forecast period within the North America Electronic Design Automation Market. Semiconductor IP is fundamental to the creation of large-scale and highly intricate Integrated Circuits (ICs), which are essential building blocks in a vast array of electronic devices. Notably, the automotive industry has experienced a remarkable surge in its demand for semiconductors, fueled by the continuous advancements in automotive electronics, including sophisticated driver-assistance systems and advanced infotainment platforms, impacting the North America Electronic Design Automation Market. Furthermore, the IT & Telecommunications sector has witnessed a dynamic and sustained increase in the demand for semiconductors, particularly for processor IP, which, in turn, is prompting memory semiconductor IP manufacturers to actively invest in expanding their production capacities to cater to the growing needs of the North America Electronic Design Automation Market. This proactive investment is projected to contribute to a favorable outlook for the semiconductor IP market throughout the forecast period. The escalating demand for advanced System-on-Chip (SoC) designs has significantly propelled the growth of this market segment within the North America Electronic Design Automation Market. Further contributing to this trend is the increasing adoption of consumer electronics within the North America region, which is specifically driving the greater utilization of semiconductor IP.

The United States held a leading position in the electronic design automation market in 2018 and is projected to maintain its dominance within the market across the North American region throughout the forecast period. The semiconductor industry has consistently been a critical pillar of national security, economic prosperity, and global technological leadership for North America. The US, within the context of the semiconductor industry, is not only the foremost economy in North America but also a substantial contributor to the global market. Furthermore, as a technologically advanced nation, the adoption and implementation of EDA software are anticipated to remain at a high level within the North America Electronic Design Automation Market. However, it is anticipated that the North America Electronic Design Automation Market may gradually approach a state of maturity in the coming years, primarily due to the projected moderation in the growth rate of the semiconductor industry. Nevertheless, ongoing innovation and the persistent demand for advanced electronic products will ensure the continued significance and dynamism of the North America Electronic Design Automation Market.

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Business Market Insights is a market research platform that provides subscription service for industry and company reports. Our research team has extensive professional expertise in domains such as Electronics & Semiconductor; Aerospace & Defense; Automotive & Transportation; Energy & Power; Healthcare; Manufacturing & Construction; Food & Beverages; Chemicals & Materials; and Technology, Media, & Telecommunications

[news24-amit]

How AI and Defense Initiatives Are Shaping the Semiconductor IP Market

The global semiconductor intellectual property (IP) market was valued at US$ 7.1 billion in 2023 and is expected to grow at a compound annual growth rate (CAGR) of 5.9%, reaching US$ 13.5 billion by 2034. The market is being propelled by the rising demand for AI-based applications, government initiatives to modernize defense technologies, and advancements in semiconductor IP commercialization strategies.

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Top Market Trends

AI-Driven Growth: AI-based applications, particularly deep learning (DL) neural networks, are significantly influencing the demand for robust semiconductor IP solutions. AI systems rely on highly efficient and customizable IP cores to enhance processing power, reduce latency, and improve energy efficiency.

Security and Encryption Technologies: As digital threats grow, Hardware Root of Trust (HRoT) and encryption/decryption solutions are becoming critical in semiconductor IP, particularly in defense, IoT, automotive, and industrial applications.

Commercialization of Captive Semiconductor IP: Key players in the industry are developing new business models to commercialize in-house semiconductor IP. This trend is driving innovation and enabling companies to unlock additional revenue streams.

Regional Market Expansion: While North America leads in semiconductor IP due to investments in semiconductor manufacturing and security measures, Asia Pacific is rapidly expanding, with China dominating global semiconductor production and consumption.

Government Investments in Semiconductor Manufacturing: Policies such as the U.S. CHIPS and Science Act are catalyzing semiconductor manufacturing and IP development, ensuring a steady market growth trajectory.

Analysis of Key Players

Key players operating in the global Semiconductor IP market are focusing on licensing ASIC and FPGA semiconductor IP solutions and patent licensing. They are licensing their broad portfolio of memory interface patents to semiconductor and systems companies.

Arm Limited, Rambus, Synopsys, Inc., CEVA, Inc., Maven Silicon, Cadence Design Systems, Inc., Microchip Technology Inc., Achronix Semiconductor Corporation, Marvell, Imagination Technologies, Lattice Semiconductor, Menta, Taiwan Semiconductor Manufacturing Company Limited, Movellus, and Allegro DVT are key players operating in the semiconductor IP industry.

Key Market Drivers

Demand for AI-based Applications: AI, DL, and machine learning (ML) applications are accelerating the demand for high-performance semiconductor IP solutions.

Government Initiatives in Defense Technologies: Defense organizations globally are integrating semiconductor IP to enhance security and performance in military-grade applications.

Increase in Semiconductor Manufacturing Investments: Significant investments in semiconductor fabs and advanced chip manufacturing, particularly in North America and Asia Pacific, are driving market expansion.

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Market Challenges

Intellectual Property Theft and Security Risks: As semiconductor IP gains more prominence, issues related to unauthorized access and IP theft are increasing, posing challenges for industry players.

High R&D Costs: Developing new semiconductor IP solutions requires significant investments in research and development, which can be a barrier for new entrants.

Regulatory and Compliance Issues: The semiconductor IP industry is subject to stringent regulations, especially concerning data security and export controls, which can affect market growth.

Market Segmentation

By Type

Processor IP

Memory IP

Interface IP

ASIC

Verification IP

By Architecture Design

Hard IP Core

Soft IP Core

By IP Source

Licensing

Royalty

By End-user

Integrated Device Manufacturer (IDM)

Foundry

Others

By Industry Vertical

Consumer Electronics

Telecommunications & Data Center

Industrial

Automotive

Commercial

Healthcare

Others

Future Outlook The semiconductor IP market is expected to witness steady growth due to the increasing integration of AI into consumer electronics, automotive, and industrial applications. Furthermore, as AI-driven systems require more advanced SoC architectures, semiconductor IP providers will continue innovating to meet market demands. Investments in security solutions, particularly encryption and HRoT, will remain a focal point for market growth.

Future Prospects: What’s Next for the Industry?

Advancements in Neural Network Processing (NNP): AI-driven processing requirements will continue to shape semiconductor IP, leading to more sophisticated and efficient chip architectures.

Integration of Physical Unclonable Functions (PUF): Security technologies such as PUF are expected to play a significant role in ensuring semiconductor IP integrity.

Expansion of IP Licensing and Royalty Models: Companies will increasingly focus on licensing and royalty-based revenue models to optimize IP monetization.

Strategic Collaborations and Acquisitions: Key players will engage in partnerships and acquisitions to strengthen their semiconductor IP portfolios.

About Transparency Market Research

Transparency Market Research, a global market research company registered at Wilmington, Delaware, United States, provides custom research and consulting services. Our exclusive blend of quantitative forecasting and trends analysis provides forward-looking insights for thousands of decision makers. Our experienced team of Analysts, Researchers, and Consultants use proprietary data sources and various tools & techniques to gather and analyses information. Our data repository is continuously updated and revised by a team of research experts, so that it always reflects the latest trends and information. With a broad research and analysis capability, Transparency Market Research employs rigorous primary and secondary research techniques in developing distinctive data sets and research material for business reports. Contact:

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[cryptokid3]

Deeptech Funding Sees A Dramatic 77% Drop In 2023 Compared To 2022

In 2023, India ranked sixth among the world's top 9 deep tech ecosystems, with over 3,600 startups, according to a Nasscom report. However, a weak supporting ecosystem limited its growth potential and first-mover advantages. In the past five years, Indian deep tech startups raised USD 10 billion, but only USD 850 million in 2023— a dramatic 77 per cent drop from USD 3.7 billion in 2022. This decline reflected investor concerns about potential returns.Deeptech startups, focused on early-stage technologies driven by scientific advancements, aimed at creating their intellectual property (IP). These startups face significant technical uncertainty, presenting risks and opportunities. Many innovations falter due to a lack of funding beyond initial grants.

High Risk And Long-term ROI Technological advancements require time for research and may not always achieve the intended success. Often, they need further development to address problems and become commercially viable. While deep tech founders understand their innovations and their economic potential, they often lack knowledge of the venture capital ecosystem and how funding works. Venture capitalists typically seek returns within three to five years, which all founders must recognise.Navin Honagudi, Managing Partner at Elev8 Venture Partners, said, “Deeptech requires a significant period as well as considerable amounts of resources to mature. Due to this, the investors are more hesitant and thus find it less appealing, since their focus is on waiting for quick returns in this fast-paced market.”

The invention of semiconductors initially fueled the rise of venture capital, but the focus quickly shifted to internet and software ventures due to their lower risk and higher returns in shorter timeframes. Honagudi added, “The decline in deep tech investments, besides AI, is largely because of the high risks involved.”Apart from that, a significant knowledge gap exists between deep tech founders and investors. Although many investors have backgrounds in software, banking, or finance, few can accurately assess the potential of groundbreaking deep tech. This leads them to seek external expertise.

Additionally, the medium to high risk-to-return ratio makes many venture capitalists hesitant to invest in unproven technologies, resulting in numerous innovative ideas being sidelined during the fundraising process rather than evolving into viable products or services.Himanshu Maradiya, Founder and Chairman, CIFDAQ, said, “Founders, who typically possess deep technical expertise, may struggle to effectively communicate the potential value and return on investment of their innovations. This disconnect can hinder the establishment of trust and lead to misaligned expectations, impacting the willingness of investors to engage.”

Strengthening India’s Deeptech Landscape Startups face significant challenges, including the need for growth capital, talent acquisition, and international expansion. They often deal with lengthy development timelines, collaboration requirements, and investor concerns about exit strategies. Additionally, issues related to intellectual property and data management are common, while academic institutions struggle with securing long-term funding and establishing strong collaborative networks.To address the issue, Chairman Maradiya gave the idea of corporate partnerships and project financing. He stated, “Establishing alliances with large corporations can validate a startup’s technology and provide crucial resources, bridging the credibility gap and aligning development with market needs. While for later-stage deep tech companies, project finance can be instrumental in aligning funding with specific milestones, offering targeted support as the company progresses.”Besides, India's deep tech startup ecosystem requires a more strategic approach that includes industry-academia collaboration, tax incentives, robust intellectual property rights, and government support. Even, developing innovative credit strategies, such as venture debt, can provide flexible financing options tailored to the unique needs of deep tech startups.

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