#flex pcb

[dqspcba]

Nice looking silver plated PCB board made of PET on display!

[marcialiu0929]

PCB layout--MakerPCB

PCB or PCB assembly quickly offer, feel free email to Marcia@makerpcb.com

https://www.linkedin.com/in/marcia-liu-0566a11b1/

[cherrieeeng]

PCB schematic/design/fabrication/assembly

MPN TECH Pte Ltd provides One-Stop PCBA Solutions in Singapore, which support from R&D prototype to mass production. We have built long-term collaborations with many local startups, SIMES, MNCS, etc. We also have lots of overseas PCBA projects in Europe and the US. If any questions feel free to let me know.

Our Solutions:

PCB Design;

PCB Fabrication;

Components souring;

PCB Assembly;(SG Local machine Assembly)

[fpcway-daisy]

For flexible printed boards with a large number of components and complex wiring relationships, consider the design of mounting retention positions to increase product reliability during structural design.

[amy-hitechpcb]

The five main functions of solder mask plug holes

1️⃣ Preventing solder from flowing through the vias and causing short circuits during #PCB wave soldering, especially when vias are placed on #BGA pads. It is necessary to plug the holes before gold plating to facilitate BGA soldering. 2️⃣ Avoiding flux residue inside the vias. 3️⃣ After surface mount assembly and component placement, the PCB needs to undergo vacuum suction on a testing machine to create negative pressure for completion. 4️⃣ Preventing solder paste from flowing into the holes and causing solder voids, which could affect the soldering during assembly. 5️⃣ Preventing solder balls from popping out during wave soldering, which could lead to short circuits.

[perlina-hitechcircuits]

What are the differences between Flex and Rigid boards?

Flexible printed circuit boards are quite different than rigid boards:

Material; Rigid boards are typically made out of FR4 (glass-epoxy compounds) while flexible circuits are made from polyimide. There are cases when rigid boards are built with polyimide, but it isn't as common.

Coverlay; Flex pcbs either have a flexible mask or coverlay while rigid boards typically just use a solder mask. When a coverlay is used, the openings are routed, or laser cut. Then an adhesive (typically 1 or 2 mils thick) is used to adhere the coverlay to the flex.

Stiffeners; Flexible printed circuit boards typically use FR4 or polyimide stiffeners to stiffen specific non-flexing regions. Stiffeners are either laminated to the flex or adhered using a PSA (pressure sensitive adhesive). Rigid boards do not need stiffeners.

Permittivity; There is a wide range of relative permittivity (dielectric constants) for rigid board materials while flexible polyimide material is typically 3.4.

As a leading prototype-to-production flexible PCB manufacturer, we have flex and rigid-flex PCB capabilities that other companies can't compete with. As your flexible circuit supplier, you will be able to manufacture boards smaller line trace spaces and micro-vias. Consult with our team to help you determine what the optimal technologies are for your project's application. We also offer extremely fast quick turn flex circuit prototyping services. Contact us to learn full flexible capabilities.

[hitechpcbmanufacturer]

Um guia completo de PCB flexível de dupla face

Este artigo apresentará de forma abrangente a definição de PCB flexível de dupla face e o empilhamento, as vantagens, os materiais, as aplicações de PCB flexível de duas camadas e a diferença entre PCB flexível de um lado, PCB flexível de dois lados e PCB flexível de várias camadas.

O que é uma PCB flexível de dupla face?

Uma PCB flexível é um tipo de placa de circuito impresso, também chamada de circuito impresso flexível, ou FPC. O FPC é feito de material adesivo ou não adesivo. O cobre usado no processo de produção de FPC é dividido em cobre eletrolítico e cobre laminado, e o cobre laminado antiaderente é mais flexível e dobrável.

Uma PCB flexível de camada dupla consiste em duas camadas condutoras com uma camada isolante entre elas. Uma PCB flexível de camada dupla é um produto ideal que requer densidade de circuito.

Material de PCB flexível de dupla face

Há muitas opções diferentes de materiais para a fabricação de PCB flexível de dupla face, como PI, PET, PEN, LCP, etc. De acordo com os diferentes requisitos de aplicação, podemos ajudá-lo a pesquisar quais opções são mais adequadas para você. Também fornecemos cobre em diferentes espessuras para atender a todas as suas expectativas e necessidades.

Você também pode escolher poliimida, FR-4, chapa de aço, chapa de alumínio, etc., para o reforço para PCB flexível de dupla face.

Quais são as aplicações da PCB flexível de dupla face?

A PCB flexível de dupla face tem sido amplamente utilizada devido ao seu excelente desempenho, como

Comunicações

Eletrônicos de consumo

Automotivo

Medicina

Industrial

Aeroespacial

Militar

Transporte, etc.

PCB flexível de um lado versus PCB flexível de dois lados. PCB flexível de dupla face versus PCB flexível multicamada.

O Flex PCB de um lado ou o Flex PCB de camada única instala o original em um lado da placa e há um padrão condutor no outro. Uma PCB flexível de camada única tem apenas uma camada de material condutor. A PCB flexível de camada única tem as vantagens de custo mais baixo, design mais fácil, produção, produção em massa e tempo de entrega.

A PCB flexível de dupla face tem mais camadas do que a PCB flexível de camada única, mas menos do que a PCB flexível de várias camadas; a PCB flexível de camada dupla tem uma camada de metal condutor em ambos os lados, o que aumenta a densidade da fiação por unidade de área e é mais adequada para roteamento.

Os circuitos e componentes em ambos os lados da PCB flexível de dupla face podem ser conectados eletricamente por meio de montagem através de orifícios e montagem em superfície.

Três ou mais PCBs flexíveis de dupla face são laminadas em uma PCB flexível de múltiplas camadas. Cada camada de substrato em uma PCB multicamada tem metal condutor em ambos os lados. Esses substratos são colados com um adesivo exclusivo, mas um material isolante separa cada substrato.

A conexão elétrica entre cada camada da PCB flexível multicamada é obtida por meio de orifícios, orifícios cegos ou orifícios enterrados.

As vantagens da PCB flexível multicamada são:

Mais adequada para projetos complexos;

Maior qualidade e confiabilidade;

A densidade dos circuitos de PCB flexível multicamadas é maior, com maior capacidade e velocidade de operação, e o desempenho geral do produto é aprimorado;

Maior durabilidade. Quanto maior o número de camadas da placa de circuito, maior a espessura, portanto, mais durável do que a PCB flexível de um lado ou a PCB flexível de dois lados;

Tamanho menor e peso mais leve: A placa de circuito impresso flexível multicamada apresenta um design de circuito mais compacto, que pode comprimir ainda mais o tamanho e o volume da placa de circuito, reduzindo assim o peso.

Capacidades de fabricação de PCB flexível

Hitech Circuits oferece serviços de fabricação de protótipos de PCB flexível de giro rápido: podemos entregar seu pedido de fabricação de PCB flexível em até 24 horas.

Se você estiver procurando por uma PCB flexível de um lado, um circuito flexível de dois lados ou um fabricante e parceiro de PCB flexível multicamada complexa, todos nós seremos sua escolha certa.

Há tamb��m muitas opções para o processo de tratamento de superfície de PCB flexível de dupla face:

Ouro de imersão

Estanho de imersão

Prata de imersão

ENEPIG

OSP

Nós Hitech Circuits estamos sempre dedicados a fornecer preços competitivos, boa qualidade e prazo de entrega rápido para nossos clientes. Se você tiver alguma necessidade de PCI, não hesite em contactar-me.

[cynthia-hitechpcba]

6 layers flex-rigid printed circuit board, Hitech Circuits from China

Flex-rigid printed circuit board for electronics is crafted using superior quality FR4 Tg170+PI material and boasts countersunk holes for increased efficiency in wiring. Email Cynthia: sales11@hitechpcb.com if you are looking for remarkable flexibility flex-rigid printed circuit board.

[viasiontechnology]

To directly analyze the Rogers 4350B, let us first discuss what we mean when citing high-performance RF/microwave laminate material. Prefabricated RF/microwave circuits work at frequencies generally in the range of MHz to GHz, when frequencies go high any little change in the dielectric properties of the substrate material causes signals to distort, get lossy, and degrade.

[techtrace]

Blood Glucose Meters – Precision in Diabetes Management

Blood glucose meters are essential devices for individuals with diabetes, enabling them to monitor their blood sugar levels regularly. These devices provide critical feedback, allowing users to adjust their insulin intake, diet, or physical activity levels. The key to effective diabetes management lies in the accuracy of these devices, and this accuracy is largely determined by the quality of the printed circuit board (PCB) used in the device. In this article, we will explore how blood glucose meters work, the components involved, and the role of PCBs in ensuring the device operates reliably.

How Blood Glucose Meters Work Blood glucose meters work by measuring the concentration of glucose in a small sample of blood. The user pricks their finger with a lancet, places a drop of blood on a test strip, and inserts it into the meter. The test strip contains chemicals that react with glucose in the blood, producing a small electrical current. This current is measured by the meter’s PCB, which processes the signal and displays the blood glucose level on the screen.

The Components of a Blood Glucose Meter A typical blood glucose meter consists of several key components: the test strip, the sensor, the microprocessor, the display, and the battery. The test strip reacts with the blood, producing a small electrical signal. The sensor detects this signal and sends it to the microprocessor, which processes the data and calculates the glucose level. The display unit shows the result, while the battery ensures the device is powered.

PCBs in Blood Glucose Meters The PCB in a blood glucose meter is responsible for connecting and controlling the various components, including the sensor, microprocessor, and display. It ensures that the electrical signals generated by the test strip are accurately processed, providing a reliable reading of the glucose concentration. The PCB also helps manage power consumption, ensuring that the device remains efficient and ready for use when needed.

Why High-Quality PCBs Matter in Blood Glucose Meters Accuracy is essential in blood glucose meters, as inaccurate readings could lead to dangerous health consequences. A poorly designed PCB can result in faulty readings, miscalculations, or device malfunction. Therefore, the quality of the PCB is paramount in ensuring that these devices deliver precise and consistent results. High-quality PCBs also contribute to the overall reliability and longevity of the device.

Why HILElectronic.com/medical/ is the Best Choice for PCB Manufacturing in Blood Glucose Meters For anyone involved in the design or manufacturing of blood glucose meters, I highly recommend HILElectronic.com/medical/. Their expertise in producing high-quality, custom-designed PCBs for medical devices ensures that your blood glucose meters will operate accurately and reliably. HILElectronic’s commitment to quality control and precision makes them an excellent partner for any medical device project.

Conclusion Blood glucose meters are crucial for managing diabetes, and the PCB is a critical component in ensuring their accuracy and reliability. For those looking for top-quality PCBs for blood glucose meters or other medical devices, I highly recommend HILElectronic.com/medical/. Their professionalism and expertise in PCB manufacturing will ensure your medical devices meet the highest standards of performance.

[marcialiu0929]

Rigid Flex PCB PCB or PCBA quotation, please email to marcia@makerpcb.com Learn more: https://lnkd.in/gAhdxTUx

[fpcway-daisy]

Fixed area coating can also be used to protect the terminal area to deal with foreign matter and accidental interconnection problems, but it is necessary to understand the processing skills, cost and quality control.

[alcantapcb]

FCBGA Substrate: Understanding Its Importance in Electronic Manufacturing

What is an FCBGA Substrate?

FCBGA (Flip-Chip Ball Grid Array) is an advanced packaging technology used for encapsulating electronic chips. This packaging technique involves flipping the chip (flip-chip) and connecting it to the substrate through a grid of solder balls (Ball Grid Array). The FCBGA substrate is a critical component that provides support, thermal management, and electrical connections. It is typically used for high-performance microprocessors, graphics processing units (GPUs), and other chips that require high-speed signal transmission and high-density packaging.

How FCBGA Works

FCBGA packaging works by flipping the chip and connecting its pins to the substrate through tiny solder balls in a grid formation. This method differs from traditional packaging methods, such as QFP (Quad Flat Package) or BGA (Ball Grid Array), which use pins or pin arrays for connection, whereas FCBGA directly connects through solder balls.

The role of the FCBGA substrate is to provide mechanical support and electrical contact. The design of the substrate needs to ensure a high-density ball array layout and excellent thermal conductivity to handle the heat dissipation demands of high-power, high-frequency chips.

Structure of FCBGA Substrate

The design of an FCBGA substrate is complex and typically consists of multiple layers. The main layers include:

Chip Bonding Layer: This layer sits between the chip and the substrate, where solder balls are used to connect the chip’s pads to the substrate’s circuits. The solder balls are typically made from an alloy of tin and other metals, offering good electrical conductivity and thermal properties.

Circuit Layer: The circuit layer transmits electrical signals and is usually made of copper. These layers are created using multi-layer printed circuit board (PCB) technology. The layout and density of these layers are crucial for signal integrity and minimizing crosstalk.

Package Substrate: The package substrate serves as the foundation for the entire FCBGA package. It is typically made of materials like ceramics or glass fiber-reinforced epoxy resin (FR4). This layer provides structural support and ensures good connectivity between the solder balls and external circuit boards.

Heat Dissipation Layer: For high-power chips, heat management is crucial. FCBGA substrates often incorporate heat dissipation layers made of copper or other high thermal conductivity materials. These layers help transfer heat from the chip to the external environment, preventing overheating and chip damage.

Testing and Encapsulation Layer: During the manufacturing process, the FCBGA package undergoes extensive testing to ensure each package works as expected. The encapsulation layer is usually made of polymer materials and serves to protect the chip while adding mechanical strength to the package.

Advantages of FCBGA Substrate

FCBGA substrates offer many advantages due to their unique design and material choices. These benefits are especially apparent in high-performance and high-density electronic devices. Here are some of the key advantages:

High-Density Interconnects (HDI): The flip-chip design and ball grid array layout support extremely high interconnect densities. The circuit lines on the substrate can be packed more tightly, reducing the package size while enhancing electrical performance.

Excellent Thermal Management: FCBGA substrates excel in thermal management, effectively transferring heat from the chip. Since high-power chips generate a lot of heat, effective thermal design is essential to ensure reliable chip performance and longevity.

Smaller Package Size: FCBGA packages are typically smaller than traditional packages, making them ideal for applications where space is limited. This compact design allows for the integration of more functions into devices like high-end smartphones, servers, and portable electronics without increasing their size.

High-Speed Signal Transmission: The flip-chip design reduces the signal transmission path length, allowing for faster data transfer speeds. This feature is crucial for applications that require high-speed computation, such as processors and graphics chips.

Improved Reliability: The solder ball connection method used in FCBGA packages is more reliable than traditional pin-based connections. It can withstand higher mechanical stresses and temperature fluctuations, making it ideal for high-reliability applications.

Applications of FCBGA Substrate

FCBGA substrates are used across a wide range of electronic products, particularly in industries where high performance, high density, and high reliability are required. Some of the key applications include:

Central Processing Units (CPUs) and Graphics Processing Units (GPUs): FCBGA packaging is commonly used for high-performance computing chips like CPUs and GPUs, which require high processing power and effective heat management. The FCBGA substrate provides the necessary high-density connections and thermal dissipation needed for these chips to run efficiently at higher speeds and lower temperatures.

Servers and Data Centers: Processors used in servers and data centers need to handle large amounts of data, making their packaging requirements extremely demanding. FCBGA substrates' high-density interconnects and excellent thermal performance make them ideal for data center processors.

Mobile Devices: Processors and graphics chips in smartphones, tablets, and other mobile devices also utilize FCBGA packaging. The compact nature and efficient thermal management of FCBGA substrates are particularly suited for mobile devices that face size constraints.

Automotive Electronics: FCBGA substrates are also used in automotive electronics, such as self-driving, in-car entertainment systems, and electric vehicle control units. Automotive electronics must perform reliably in harsh environments, making the high durability and thermal management capabilities of FCBGA packaging a perfect fit.

Challenges and Future of FCBGA

While FCBGA substrates offer significant advantages, they also face some challenges:

Manufacturing Cost: The manufacturing process for FCBGA substrates is complex, involving precise fabrication and material selection, which increases the cost compared to traditional packaging methods. This could limit its use in lower-end products.

Thermal Issues: Although FCBGA substrates have good thermal management, as chip power increases, managing heat dissipation remains a challenge. Finding the balance between high-power density and effective cooling continues to be a key focus of packaging research.

Signal Integrity: High-speed signal transmission presents a challenge for FCBGA packaging. As chip frequencies increase, ensuring signal integrity and minimizing signal interference become critical issues in the design process.

FCBGA substrates are a crucial component in modern electronic packaging, offering high density, performance, and reliability. They are widely used in processors, GPUs, servers, mobile devices, and automotive electronics. As electronic devices continue to evolve and demand higher performance, FCBGA packaging will remain an essential technology.

The future of FCBGA substrates lies in overcoming challenges such as cost, thermal management, and signal integrity while pushing the boundaries of chip performance and miniaturization. With continuous advancements in packaging technology, FCBGA substrates will play a vital role in the next generation of high-performance electronic devices.

[perlina-hitechcircuits]

Transparent PCBs: Flexible and Ceramic Circuit Boards with High Transmissivity

Transparent PCBs are an emerging technology that offers new possibilities in electronics design. By allowing for the integration of light-emitting and optical components, transparent PCBs enable innovative applications across various industries, such as medical devices, automotive lighting, and military systems. Their high optical transmissivity, allowing more light to pass through compared to traditional copper-clad PCBs, makes them a versatile solution for a range of use cases.

Transparent PCB Substrate Options

Transparent PCBs can be made using two main types of substrates: ceramic and glass. Each substrate offers unique characteristics:

Ceramic Transparent PCBs: These provide better heat conductivity than glass, making them ideal for heat-sensitive applications. However, their optical transmissivity is lower than glass, typically around 75% to 85%.

Glass Transparent PCBs: Composed of quartz and borosilicate glass, these substrates have the highest transmissivity, ranging from 99.5% to 99.99%. While glass excels in optical clarity, it has poorer thermal conductivity, which limits its use in heat-intensive environments.

Advantages of Transparent PCBs

Transparent PCBs offer several advantages over traditional PCBs:

Lightweight and Thin: These PCBs are lighter and thinner, making them suitable for applications where space and weight are critical factors.

Superior Optical Transmissivity: Their ability to allow light to pass through makes them ideal for use in light-emitting components and displays.

High Temperature Resistance: Glass can endure temperatures of up to approximately 1000°C, ensuring reliable performance even in harsh environments.

Troubleshooting Ease: The transparency of these PCBs allows engineers to easily inspect the components and trace lines, simplifying troubleshooting and maintenance.

Aesthetic Appeal: Transparent PCBs create a sleek, modern look, making them ideal for consumer electronics that require both functionality and style.

The Manufacturing Process for Transparent PCBs

The manufacturing process for transparent PCBs differs from traditional copper-clad boards. Instead of using copper layers, transparent PCBs are made using special polymer materials that are etched with conductive pathways. These materials are then laminated onto the board and coated with a protective layer. This method allows for the integration of components with varying optical properties. Furthermore, it is a more cost-effective and efficient process than traditional PCB manufacturing.

Types of Transparent PCBs

1. Transparent Flexible PCBs

Transparent flexible PCBs are produced using thin PET sheets that can be transparent or tinted in colors like light green, blue, or white. These flexible boards are particularly useful in applications where bending and folding are required, offering both flexibility and transparency.

Advantages:

High Reliability: Excellent electrical and mechanical performance ensures durability.

Space Saving: Flexible design allows for compact configurations.

Lightweight: Easy to handle and transport.

Cost-Efficient: Reduced material usage lowers production costs.

Versatility: Ideal for LED displays, wearable tech, automotive electronics, and more.

Better Signal Quality: Superior electrical characteristics enhance signal integrity.

Applications: Transparent flexible PCBs are used in a wide range of applications such as LED lighting displays, wearable technology, automotive electronics, smart contact lenses, and even electronic skins.

2. Transparent Ceramic Circuit Boards

Transparent ceramic circuit boards are made from materials such as alumina, magnesium oxide, or aluminum-magnesium spinel. These boards typically feature a transparent glass-based solder mask that allows the substrate to maintain its clarity, generally between 75% and 85%. While their conductive traces are not transparent, these boards offer excellent electrical insulation and thermal resistance.

Advantages:

Electrical Insulation: High electrical resistance makes them suitable for various applications.

Temperature Resistance: Capable of withstanding extreme temperatures.

Moisture and Chemical Resistance: Ideal for harsh environments.

Lightweight and Strong: Easy to handle and durable.

Cost-Effective: Less expensive than traditional circuit boards.

Applications: These transparent ceramic boards are used in optical sensors, high-power LEDs, infrared windows for missiles and airplanes, and other specialized industrial devices.

Hitech Circuits: Leading the Way in Transparent PCB Manufacturing

At Hitech Circuits, we specialize in the production of transparent flexible and ceramic circuit boards. Our cutting-edge manufacturing processes ensure that each PCB is not only visually impressive but also meets the rigorous demands of high-performance applications. Whether you're in need of flexible PCBs for wearable tech or ceramic PCBs for high-power applications, Hitech Circuits offers reliable, high-quality solutions that cater to a wide array of industries.

With expertise in both transparent flexible and ceramic PCBs, we provide customized PCB solutions that are lightweight, durable, and thermally efficient, making us your trusted partner of electronic manufacturing.

If you have such transparent PCB manufacturing needs, please don’t hesitate to contact us.(Email: Perlina Tang<sales3@hitechpcb.com>) For more information, you can enter this webpage: https://hitechcircuits.com/ 

[pcbamake]

China PCB Fabrication & SMT Assembly one stop PCB manufacturer