#pcb01

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PCB01 SSD for Artificial Intelligence PCs from SK Hynix

Today, SK Hynix Inc announced that it has created PCB01, an SSD product with the greatest specs in the industry, specifically for on-device AI PCs.

The device introduces innovation to performance, including data processing speed, and is the first in the industry to use the fifth generation of 8-channel PCIe technology.

A significant international client has validated the performance and dependability of PCB01, a PCIe fifth-generation SSD used in on-device AI PCs.

On-device AI: A system that integrates AI operations directly into the device, bypassing the need for a physically remote server to do computation. The direct information gathering and processing capabilities of smartphones enable quick responses from AI systems and offer enhanced, personalised AI services.

PCIe: A high-speed input/output interface with a serialization format used on digital device motherboards.

Designed with AI computers in mind, and able to load LLMs in under one second

Large language model (LLM): Language models that have been created via extensive data training are crucial for generative AI tasks including text creation, summarization, and translation.

PC makers provide a framework that swiftly moves data from internal PC storage to DRAMs for AI operations, storing an LLM in order to enable on-device AIs. The PC’s internal PCB01 allows the loading of LLMs effectively throughout this operation. SK Hynix anticipates that these features of their most recent SSD will significantly improve the quality and performance of on-device AIs.

Additionally, PCB01 provides a 30% boost in power efficiency over its predecessor, enabling it to efficiently manage power from complex AI calculations. Furthermore, SK Hynix has included single-level cell (SLC) caching technology into the device, allowing some NAND cells in the storage regions to function as SLCs with quick processing rates. The technology accelerates the operation of AI services and standard PC operations by enabling the fast reading and writing of specific data.

Single-level cell (SLC): Memory cell type utilized in NAND flash; each SLC may hold a single bit of data. A memory cell may become a multi-level cell (MLC), a triple-level cell (TLC), and so on depending on how much data it can store. Although more data may be stored in the same space, stability and performance suffer. SLC expedites the processing of chosen data.

Compute Express Link (CXL): An integrated interface that links RAM, CPUs, GPUs, and accelerators.

GDDR7: The seventh generation of graphics memory, which enhances the speed and efficiency of GPU operation.

A channel is a path via which data can be inputted or outputted from an SSD controller to a NAND flash. The PCIe advances to the following generations and data processing speed increases with an increase in the number of channels. Conventional PCs usually use an 8-channel SSD, whereas high-performance PCs use a 4-channel SSD.

3Peripheral Component Interconnect Express (PCle): a high-speed, serially organised input/output interface found on digital device motherboards

The business anticipates that the most recent development in NAND solutions will strengthen its leadership in the AI memory field overall and add to its list of achievements in the high-performance DRAM segment, which is headed by HBM.

SK Hynix intends to mass produce and begin distributing the goods to both corporate customers and general consumers within this year after completing a validation procedure with a global PC customer.

The PCB01 SSD raises the bar for SSD performance with its sequential read and write rates of 14GB and 12GB per second, respectively. A large language model, or LLM, for AI training and inference, may operate at these speeds in less than a second.

Additionally, compared to the previous generation, the product’s power efficiency has improved by over 30%, which improves the stability of large-scale AI computing activities.

SLC caching was also used by SK Hynix in the PCB01 production process. A PC user can enjoy faster performance for both AI services and traditional computing with the adoption of the technology that inserts the single-level cell, or SLC, in certain regions of the NAND cell to accelerate performance.

Additionally, the device has a feature designed to safeguard personal information. The Root of Trust6, or ROT, is a security solution that SK Hynix engineers incorporated into the PCB01 to guard against external cybersecurity threats as well as information forging and falsification. It also secures the password of the user.

NAND storage uses single-level cells (SLCs) to store one bit of data. Depending on its data storage capacity, a memory cell can be an MLC, TLC, or QLC. Increased data storage can fit more data, but speed and stability will decrease. SLCs make it possible to process chosen data more quickly. Root of Trust (RoT): a component of the hardware that, in terms of security, can always be relied upon, allowing for the prevention of information forgeries and falsification.

The PCB01 will be available from the firm in three capacities: 1TB, 2TB, and 512GB. Ahn Hyun, SK Hynix’s Head of the N-S Committee, stated that many international CPU manufacturers for on-device AI PCs are asking for cooperation in the compatibility assessment process. “SK Hynix intend to strengthen SK Hynix position as the leading AI memory provider in the world by effectively completing the customer validation and mass production of PCB01, which will be prominently displayed in the NAND solution space.”

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The SK Hynix PCB01: The Engine Powering Next-Gen SSDs

SK hynix introduced a consumer device based on its newest SSD, PCB01, with industry-leading performance at GPU Technology Conference (GTC) 2024. GTC, an AI development conference, is held in San Jose, California by NVIDIA from March 18–21.

A significant international client has validated the performance and dependability of PCB01, a PCIe fifth-generation SSD used in on-device AI PCs. SK hynix aims to introduce two PCB01 models for key technology businesses and customers by the end of 2024 after finishing product development in the first half.

1. On-device AI: AI computation and inference on devices like smartphones and PCs, unlike cloud-based AI services.

2. PCIe: A high-speed input/output interface with a serialization format used on digital device motherboards.

Designed with AI computers in mind, and able to load LLMs in under one second

With a sequential read speed of 14 gigabytes per second (GB/s) and a sequential write speed of 12 GB/s, PCB01 surpasses its predecessor’s speed standards by twice. This allows the LLMs needed for AI learning and inference to be loaded in less than a second.

3. Large language model (LLM): Language models that have been created via extensive data training are crucial for generative AI tasks including text creation, summarization, and translation.

PC makers provide a framework that swiftly moves data from internal PC storage to DRAMs for AI operations, storing an LLM in order to enable on-device AIs. The PC’s internal PCB01 allows the loading of LLMs effectively throughout this operation. SK Hynix anticipates that these features of their most recent SSD will significantly improve the quality and performance of on-device AIs.

Additionally, PCB01 provides a 30% boost in power efficiency over its predecessor, enabling it to efficiently manage power from complex AI calculations. Furthermore, SK Hynix has included single-level cell (SLC) caching technology into the device, allowing some NAND cells in the storage regions to function as SLCs with quick processing rates. The technology accelerates the operation of AI services and standard PC operations by enabling the fast reading and writing of specific data.

4. Single-level cell (SLC): Memory cell type utilized in NAND flash; each SLC may hold a single bit of data. A memory cell may become a multi-level cell (MLC), a triple-level cell (TLC), and so on depending on how much data it can store. Although more data may be stored in the same space, stability and performance suffer. SLC expedites the processing of chosen data.

Chief of NAND Product Planning and Enablement at SK Hynix, Jae-yeun Yun, said: “This high-performing product will receive significant attention in the gaming and high-end PC markets, in addition to being highlighted for its use in AI PCs.” “They will be able to maintain their position as the world’s leading supplier of AI memory, not just in the HBM space, thanks to their eagerly awaited product.”

At GTC 2024, SK Hynix unveiled its PCB01-based product in addition to its next-generation flagship technologies and solutions, which include its 36 GB 12-layer HBM3E, CXL, and GDDR7. After announcing volume production, and HBM3E, the industry’s first fifth-generation HBM solution, was shown. The GDDR7 was also lauded for double bandwidth and 40% power efficiency over GDDR6.

5. Compute Express Link (CXL): An integrated interface that links RAM, CPUs, GPUs, and accelerators.

6. GDDR7: The seventh generation of graphics memory, which enhances the speed and efficiency of GPU operation.

SK Hynix hosted presentation sessions at GTC 2024 in addition to showcasing its elite portfolio. HBM Marketing Technical Leader Seoyeong Jeong discussed the significance of AI memory and its fundamental technologies in a session titled “The Outlook of the HBM Market.”

FAQS

What does PCB01 stand for?

With performance levels for on-device AI PCs that dominate the market, SK Hynix has released a new PCIe Gen 5 SSD called the PCB01.

What advantages does the PCB01 offer?

With the fastest sequential read and write speeds in the industry (14 GB/s and 12 GB/s, respectively), the PCB01 makes it possible for large language models (LLMs) to be loaded more quickly for AI workloads.

When is the PCB01 going to be accessible?

By the end of 2024, SK Hynix intends to release two iterations of PCB01, aiming to please both mainstream consumers and significant IT businesses.

What applications will the PCB01 be used for?

The PCB01 is designed with AI PCs in mind, and it should be useful for activities like AI learning and inference that need for quick data processing.

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SK Hynix Platinum P41 SSD Sparks Up COMPUTEX Taipei 2024

SK Hynix Platinum P41 SSD

Beginning in June, SK Hynix showcased its cutting-edge AI memory solutions at COMPUTEX Taipei 2024. Under the topic “Connecting AI,” COMPUTEX Taipei 2024, one of Asia’s leading IT exhibitions, drew in about 1,500 international attendees, including tech firms, venture capitalists, and accelerators. SK Hynix made its debut at the event and highlighted with its array of next-generation products that it is a leader in AI memory and a first mover.

“Connecting AI” with top AI memory solutions

“Linking Artificial Intelligence” SK Hynix’s booth showcased its cutting-edge AI server solutions, innovative technologies for on-device AI PCs, and exceptional consumer SSD goods, all under the theme “Memory, The Power of AI.”

High bandwidth and capacity memory solutions from SK Hynix are tailored for AI systems.

Among the AI server solutions on show was HBM3E, the fifth version of HBM. With its enormous capacity, superior heat dissipation capability, and industry-leading 1.18 terabytes (TB) per second data processing performance, HBM3E is designed to satisfy the demands of AI servers and other applications.

High Bandwidth Memory

A high-performance, high-value product that connects numerous DRAMs vertically using through-silicon via (TSV) to achieve substantially faster data processing speeds than current DRAMs.

CXL is another technology that has proven essential for AI servers since it may boost processing power and system bandwidth. By introducing its CXL Memory Module-DDR5 (CMM-DDR5), which dramatically increases system bandwidth and capacity in comparison to systems that are merely outfitted with DDR5, SK Hynix demonstrated the strength of its CXL portfolio. The server DRAM products DDR5 RDIMM and MCR DIMM were among the other AI server solutions on exhibit. SK Hynix, in instance, debuted their towering 128-gigabyte (GB) MCR DIMM at an exhibition.

Compute Express Link

High-performance computing systems are built using this next-generation PCIe-based interconnect technology.

Double Data Rate 5

A server DRAM that provides improved bandwidth and power efficiency over the previous generation, DDR4, to successfully manage the growing needs of larger and more complex data workloads.

Registered Dual In-line Memory Module

The Registered Dual In-line Memory Module (RDIMM) is a high-density memory module designed to connect DRAM dies vertically in servers and other applications.

Multiplexer Combined Ranks Dual In-line Memory Module

All-Time Multiplexer Ranks The Dual In-line Memory Module (MCR DIMM) is a motherboard-bonded module product that combines multiple DRAMs to operate two rank-one basic information processing units at the same time, improving speed.

Additionally, several of the company’s business SSDs (eSSD), such as the PS1010 and PE9010, were on display for visitors to the stand. Specifically, the fast sequential read speed of the PCIe Gen5-based PS1010 makes it perfect for AI, big data, and machine learning applications. Furthermore, by introducing its flagship devices, the D5-P5430 and D5-P5336, which have ultrahigh capacities of up to 30.72 TB and 61.44 TB, respectively, SK Hynix’s U.S. subsidiary Solidigm enhanced the eSSD range.

Peripheral Component Interconnect Express 

Digital device motherboards employ PCIe, or peripheral component interconnect express, a high-speed input/output interface with a serialisation format.

SK Hynix demonstrated its ground-breaking memory solutions for on-device AI PCs, in keeping with the expanding on-device AI trend. Among them was PCB01, a PCIe Gen5 client SSD for on-device AI that has the fastest sequential read and write speeds in the business at 14 gigabytes per second (GB/s) and 12 GB/s, respectively. In addition to PCB01, SK Hynix showcased other products designed for on-device AI PCs, such as GDDR7, the next generation graphic DRAM, and LPCAMM2, a module solution that can replace two DDR5 SODIMMs with the same performance.

On-device AI

Unlike cloud-based AI services, which depend on a distant cloud server, on-device AI does AI computation and inference directly within devices like PCs or smartphones.

Low Power Compression Attached Memory Module 2

Minimal Power Compression The LPDDR5X-based Attached Memory Module 2 (LPCAMM2) module solution provides great performance, power efficiency, and space reductions.

Small Outline Dual In-line Memory Module

The server DRAM known as a Small Outline Dual In-line Memory Module (SODIMM) is smaller than the standard DIMM found in desktop computers.

Platinum P41 SSD

Additionally, attendees might get a look at consumer SSDs from SK Hynix. The incredibly dependable consumer SSD Platinum P51 and Platinum P41, which provide great speed to improve PC performance, were on exhibit at the event. The Platinum P51, which is scheduled for mass production later in 2024, makes use of SK Hynix’s “Aries,” the first high-performance internal controller in the industry. With sequential read and write speeds of up to 14 GB/s and 12 GB/s, respectively, Platinum P51 roughly doubles the speed capabilities of Platinum P41, the previous version. This loads AI training and inference LLMs in under a second.

Large language model

Generative AI problems require LLMs to construct, summarise, and translate texts using massive data sets.

At the presentation, a revised version of the portable SSD Beetle X31 was also revealed. With a USB 3.2 Gen 2 interface, this small and fashionable SSD can operate at a speedy 10 gigabits per second (Gbps). In the third quarter of 2024, SK Hynix intends to release the higher-capacity 2 TB version in addition to the current 512 GB and 1 TB variants.

SK Hynix Platinum P41

A prominent 2024 Red Dot Design Award was given to SK Hynix’s stick-type SSD Tube T31 and heat sink for Platinum P41, Haechi H02, earlier in May, highlighting the SSD lineup’s exceptional design.

Finally, SK Hynix’s ESG strategy which included enhancing the energy efficiency of its products was showcased at the show. The company’s selection of energy-efficient products is especially well-suited for enhancing the sustainability of AI applications, which have high power requirements.

Maintaining the Advancement of AI Memory

In keeping with the COMPUTEX Taipei 2024 theme, SK Hynix is working to develop its technology in order to contribute to the realisation of a day when “Connecting AI” is a common occurrence. To advance its AI memory capabilities, the company will keep taking part in international conferences that showcase the newest developments in the sector.

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