#Multi-Band Wireless Communication Module

[g-nicerf]

LoRa1120:160mW Multi-Band Wireless Communication Module

LoRa1120 adopts Semtech's LR1120 chip, an ultra-low-power module designed specifically for global geolocation applications. It supports multi-band LoRa and long-range frequency hopping spread spectrum (LR-FHSS) communication, operating in the sub-GHz and 2.4GHz industrial, scientific, and medical (ISM) bands, as well as the S-band authorized for satellite communication. The module integrates a cloud-native multi-constellation Global Navigation Satellite System (GNSS) scanner and a passive WiFi MAC address scanner, both of which are serviced through Semtech’s LoRaCloud™. The LR1120 complies with the physical layer requirements of the LoRaWAN standard specification released by the LoRa Alliance while maintaining configurability to meet various application and proprietary protocol needs.

For details, please click：https://www.nicerf.com/products/ Or click：https://nicerf.en.alibaba.com/productlist.html?spm=a2700.shop_index.88.4.1fec2b006JKUsd For consultation, please contact NiceRF (Email: sales@nicerf.com).

[t2mip]

Accelerate Wireless Innovation with Wi-Fi 7 (802.11be) RF Transceiver IP Core

T2M IP, a global leader in semiconductor IP cores and advanced connectivity solutions, has announced the availability of its partner’s cutting-edge Dual-Band Wi-Fi 7 RF Transceiver IP Core. Featuring an integrated Front-End Module (FEM), this next-generation IP solution is optimized for both consumer and industrial applications and is now available for licensing in TSMC’s 22nm ULL process.

Designed to meet the growing demands of bandwidth-hungry and latency-sensitive applications, the new Wi-Fi 7 RF Transceiver IP core supports a broad range of high-performance use cases—from set-top boxes and smart TVs to AR/VR headsets, streaming devices, automotive infotainment systems, and industrial IoT applications. The integration of the FEM simplifies system design, reduces bill of materials (BoM), and enhances RF performance, making it a highly attractive solution for chipmakers developing the next wave of wireless SoCs.

Wi-Fi 7: The Future of Wireless Connectivity

As wireless data consumption continues to surge, Wi-Fi 7 (IEEE 802.11be) is set to become a game-changer in the world of connectivity. Offering data rates well into the multi-gigabit range, ultra-low latency, and significantly improved spectral efficiency, Wi-Fi 7 enables truly seamless connectivity across an array of smart devices.

The T2M IP partner’s transceiver IP fully complies with the Wi-Fi 7 standard and includes backward compatibility with Wi-Fi 6/6E. Supporting both 1024-QAM and 4096-QAM modulation schemes, this IP core delivers highly efficient and high-throughput wireless communications. The advanced modulation enables higher data rates within the same spectrum, resulting in better performance in environments crowded with competing wireless signals—such as smart homes, public venues, and industrial facilities.

Optimized for Performance and Efficiency

One of the core highlights of this IP solution is its compact design and power efficiency. Engineered for minimal die area, the transceiver operates with ultra-low power consumption, making it especially suitable for battery-powered and thermally constrained devices like wearables and AR/VR headsets.

In addition to superior RF performance, the IP core includes built-in features for robust interference mitigation, seamless roaming, and reliable data transmission in dynamic environments. These capabilities ensure high-quality connectivity for mobile and embedded systems that must operate in varying and often challenging RF conditions.

Tri-Band Support and Scalability

The transceiver IP supports operation across the 2.4GHz, 5GHz, and 6GHz bands, providing full tri-band coverage for maximum flexibility and network performance. This tri-band support enables a broader range of applications and ensures compatibility with existing Wi-Fi infrastructure, while also future-proofing devices for emerging Wi-Fi 7 deployments.

Currently, the IP supports bandwidths of up to 80MHz, which is suitable for a wide range of high-speed applications. Looking ahead, the roadmap includes support for 160MHz bandwidth by Q2 2025, which will further elevate the performance of multi-user MIMO and OFDMA (Orthogonal Frequency-Division Multiple Access) technologies. This scalability makes the IP ideal for building flexible, future-ready wireless SoCs that can evolve alongside the Wi-Fi standard.

Accelerating Next-Gen SoC Development

With the introduction of this highly integrated Wi-Fi 7 RF Transceiver IP core, T2M IP and its partner aim to accelerate innovation in the semiconductor industry. By providing a complete, production-ready IP solution that balances high performance, power efficiency, and small footprint, T2M IP enables SoC developers to meet tight design schedules and get their products to market faster.

This IP is particularly beneficial for Access Point applications, including home and enterprise routers, where enhanced range, bandwidth, and throughput are critical. Integrating this solution into next-generation SoCs will empower OEMs to deliver faster, smarter, and more reliable wireless experiences to users worldwide.

Availability and Licensing

The Dual-Band Wi-Fi 7 RF Transceiver IP Core is now available for immediate licensing. Interested parties can reach out to T2M IP for more information on licensing models, deliverables, and pricing details.

About T2M IP

T2M IP is a leading global technology provider specializing in the licensing of semiconductor IP cores. With a robust portfolio that includes wireless, cellular, analog, mixed-signal, and connectivity IP solutions, T2M IP serves semiconductor companies worldwide in developing innovative, next-generation products across consumer, automotive, and industrial markets.

[snehalshinde65799]

Antenna in Package AiP Market Opportunities Rising with Expansion of Millimeter Wave Technology Globally

The Antenna in Package (AiP) market is gaining significant traction as wireless communication technologies become increasingly integrated into compact, high-performance electronic devices. AiP technology incorporates antennas directly into semiconductor packages, enabling advanced radio frequency (RF) performance while saving space. This innovation is particularly relevant in 5G, millimeter-wave (mmWave), automotive radar, satellite communications, and IoT applications.

Market Drivers

One of the primary drivers of the AiP market is the global rollout of 5G technology, which operates at higher frequencies such as mmWave. These frequencies require advanced antenna solutions capable of handling high data rates and low latency. Traditional printed circuit board (PCB) antennas often fall short in terms of integration and performance. AiP offers a more efficient alternative by reducing interconnect losses and supporting beamforming technologies critical for 5G.

Another major factor is the increasing miniaturization of consumer electronics. Smartphones, wearables, and IoT devices demand compact components that deliver excellent performance. AiP technology meets this requirement by integrating the antenna and RF front-end into a single compact module, freeing up space and improving system-level efficiency.

Technological Advancements

Recent advancements in substrate materials, system-in-package (SiP) technologies, and 3D packaging are making AiP solutions more cost-effective and scalable. Low-temperature co-fired ceramic (LTCC) and organic substrates have enabled better thermal and electrical performance. Integration of multiple functions such as filters, power amplifiers, and transceivers within the package has allowed manufacturers to create multi-functional modules tailored for specific end-uses.

In addition, the evolution of advanced simulation tools and design automation has shortened development cycles and reduced costs, making AiP more accessible to a broader range of industries. These advancements have facilitated faster prototyping and more reliable testing environments.

Key Market Segments

The AiP market can be segmented based on frequency band, end-user application, and geography.

By frequency, the market includes sub-6 GHz and mmWave segments, with mmWave seeing higher growth due to its necessity in 5G and automotive radar applications.

By application, the market is divided into consumer electronics, automotive, telecommunications, aerospace and defense, and industrial IoT.

Geographically, North America and Asia-Pacific dominate the AiP landscape, thanks to the presence of major semiconductor companies and 5G infrastructure deployment.

Regional Insights

Asia-Pacific leads the AiP market due to robust electronics manufacturing ecosystems in countries like China, South Korea, Taiwan, and Japan. Government initiatives to boost 5G and smart city projects further support AiP growth in the region. North America, especially the United States, sees significant demand from telecom providers, defense contractors, and autonomous vehicle manufacturers. Europe is also emerging as a key region, driven by automotive and industrial automation applications.

Competitive Landscape

The AiP market is highly competitive, with key players including Qualcomm, ASE Group, Amkor Technology, Murata Manufacturing, TSMC, and MediaTek. These companies are investing in research and development to improve integration, reduce power consumption, and enhance RF performance. Collaborations, joint ventures, and strategic acquisitions are common strategies to gain market share and accelerate product development.

Startups and mid-sized players are also entering the space with niche AiP solutions for IoT and wearable devices, contributing to market dynamism and innovation.

Challenges and Opportunities

Despite its promise, AiP adoption faces several challenges. High design complexity, thermal management issues, and initial manufacturing costs are significant barriers. Additionally, maintaining signal integrity in densely packed modules remains a technical hurdle.

However, opportunities abound. As mmWave adoption expands and edge computing grows in importance, AiP is poised to play a pivotal role in enabling low-latency, high-speed communication across various devices and systems. The trend toward smart cities, connected vehicles, and AR/VR applications also offers long-term growth potential.

Future Outlook

The AiP market is expected to grow at a CAGR exceeding 15% over the next five years, driven by surging demand across multiple industries. Technological advancements, cost optimization, and expanding 5G infrastructure will be key enablers. As device manufacturers strive to balance performance, size, and power efficiency, AiP is likely to become a standard in RF design and packaging.

[news24-amit]

Beyond Connectivity: Emerging Applications of Multi-Mode Chipsets

The global multi-mode chipset market, valued at USD 5.8 billion in 2022, is projected to surge to USD 17.2 billion by the end of 2031, advancing at a robust compound annual growth rate (CAGR) of 13.0% from 2023 through 2031. This comprehensive report examines market drivers, technological trends, leading players, and regional dynamics shaping the future of multi-mode chipsets, which integrate multiple wireless communication standards Wi-Fi, Bluetooth, 3G, 4G, and 5G into a single silicon solution.

Market Overview

Multi-mode chipsets serve as the backbone of modern connected devices, enabling seamless handoffs between various wireless networks to maintain uninterrupted high-speed data delivery. In 2022, increasing smartphone penetration and the rollout of early 5G networks propelled market value to US$ 5.8 billion. With network operators worldwide accelerating 5G deployments, chipset vendors are responding with advanced solutions optimized for power efficiency, spectral flexibility, and backward compatibility with legacy 2G–4G standards.

Market Drivers & Trends

Adoption of 5G Devices • The global uptake of 5G-capable devices is a primary growth engine. Consumers and enterprises demand faster download/upload speeds, ultra-low latency, and greater network capacity. Multi-mode chipsets that support both 5G and previous generations ensure broad device interoperability and extend product lifecycles.

R&D of New Products • Continuous investment in chipset innovation—across baseband units, RF front-ends, and integrated SoCs—fuels incremental improvements in throughput and energy consumption. Initiatives such as Samsung’s third-gen mmWave RFICs and second-gen 5G modems exemplify the push toward higher integration and performance.

Edge Computing & IoT Integration • The emergence of edge-computing architectures and proliferation of IoT endpoints (smart homes, industrial sensors, autonomous vehicles) require versatile connectivity modules. Multi-mode chipsets are becoming integral to IoT gateways and edge nodes, balancing cost, performance, and simultaneous multi-network access.

Regulatory & Spectrum Allocations • Governments in regions like North America and Europe are reopening legacy spectrum bands for private LTE and 5G deployments. This regulatory momentum encourages chipset suppliers to develop solutions tailored for industrial and enterprise private networks.

Latest Market Trends

Dual-Connectivity Solutions: Chipset architectures now natively support 5G NSA (Non-Standalone) and SA (Standalone) modes alongside LTE, enabling smoother network migrations.

Power-Optimized Designs: Low-power operation is critical for battery-constrained wearables and industrial sensors; advanced power-gating and dynamic clocking techniques are being integrated into new models.

Software-Defined Radio (SDR) Features: Some multi-mode chipsets incorporate programmable blocks, allowing firmware updates to support new spectrum bands and protocols without hardware revisions.

Miniaturization: More compact chip packages facilitate integration into ultra-small form factors, from wireless earbuds to drones.

Gain a preview of important insights from our Report in this sample - https://www.transparencymarketresearch.com/sample/sample.php?flag=S&rep_id=46704

Key Players and Industry Leaders

The competitive landscape is dominated by a handful of semiconductor giants and specialized communication chipset firms:

HiSilicon Technologies

Intel Corporation

Qualcomm Technologies Inc.

Samsung Group

MediaTek

Spreadtrum Communications

Marvell Technology Group

Altair Semiconductor, Inc.

Broadcom Corporation

GCT Semiconductor Inc.

Recent Developments

VeriSilicon & Innobase Partnership (Feb 2024): Launched a 5G RedCap/4G LTE dual-mode modem targeting cost-sensitive IoT segments.

Qualcomm Snapdragon Summit (Oct 2023): Announced two AI-enabled chips designed to offload generative AI workloads on mobile and PC platforms.

BSNL & Echelon Edge Collaboration (Jan 2023): Deployed private LTE/5G networks for enterprise customers in India, demonstrating growing demand for bespoke private networks.

Samsung 5G SoC Launch (June 2021): Introduced a line of baseband units, compact macro units, and massive MIMO with integrated third-gen mmWave RFIC.

Market Opportunities

Private Network Solutions – Enterprises across manufacturing, logistics, and mining seek private 5G/LTE networks for secure, low-latency connectivity, creating demand for specialized multi-mode modems.

Automotive & Transportation – Vehicle-to-everything (V2X) communication systems require multi-mode support for both cellular and dedicated short-range communication (DSRC).

Healthcare & Wearables – The telemedicine boom drives the need for wearable devices that seamlessly switch between Wi-Fi, Bluetooth, and cellular networks.

Rural Connectivity – Cost-effective 4G/5G solutions can bridge digital divides in emerging markets, where legacy networks remain prevalent.

Future Outlook

By 2031, the global multi-mode chipset market is forecast to reach US$ 17.2 billion. Key growth catalysts include the maturation of 5G SA networks, expansion of AI-driven edge-computing applications, and continued convergence of wireless standards. Chipset vendors that invest in highly integrated, software-upgradable designs will capture the largest share, while niche players focused on IoT and private network solutions will benefit from specialized verticals.

Market Segmentation

The report segments the global market by:

Application: Smartphones; Tablets; Wearable Devices; Others (automotive, industrial, healthcare)

End-User Vertical: Consumer Electronics; Automotive & Transportation; Industrial; Healthcare; Others

Component: Baseband Processors; RF Front-Ends; Antenna Switches; Others

Regional Insights

North America: Holds the largest market share (2022) driven by rapid urbanization, strong 5G rollout (e.g., U.S. National Telecommunications and Information Administration’s 5G strategy in 2020), and home to key chipset developers.

Asia Pacific: Fastest growing owing to high smartphone adoption in China and India, aggressive 5G infrastructure investments in South Korea and Japan, and burgeoning IoT deployments.

Europe: Steady growth supported by private 5G initiatives in Germany and U.K., and stringent automotive communication standards.

Rest of World: Latin America and Middle East & Africa present gradual uptake, with governments planning spectrum auctions and encouraging digital transformation.

Frequently Asked Questions

What is a multi-mode chipset? A multi-mode chipset is an integrated circuit that supports multiple wireless communication standards such as Wi-Fi, Bluetooth, 3G, 4G, and 5G on a single chip, enabling devices to switch seamlessly between networks.

Why is the CAGR projected at 13.0%? Strong 5G network rollouts, increasing smartphone penetration, and growing demand for IoT and industrial applications drive sustained market growth at a 13.0% CAGR from 2023 to 2031.

Which region leads the market? North America dominated in 2022, owing to early 5G deployments, presence of leading semiconductor companies, and government support for spectrum reallocation.

Who are the major players? Qualcomm, Intel, MediaTek, Samsung, and Broadcom lead the landscape, with several regional specialists competing in niche IoT and private network segments.

How does this report help enterprises? It equips businesses with actionable insights into market trends, growth opportunities, competitor strategies, and technological roadmaps, supporting informed decision-making for product development and investments.

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About Transparency Market Research Transparency Market Research, a global market research company registered at Wilmington, Delaware, United States, provides custom research and consulting services. Our exclusive blend of quantitative forecasting and trends analysis provides forward-looking insights for thousands of decision makers. Our experienced team of Analysts, Researchers, and Consultants use proprietary data sources and various tools & techniques to gather and analyses information. Our data repository is continuously updated and revised by a team of research experts, so that it always reflects the latest trends and information. With a broad research and analysis capability, Transparency Market Research employs rigorous primary and secondary research techniques in developing distinctive data sets and research material for business reports. Contact: Transparency Market Research Inc. CORPORATE HEADQUARTER DOWNTOWN, 1000 N. West Street, Suite 1200, Wilmington, Delaware 19801 USA Tel: +1-518-618-1030 USA - Canada Toll Free: 866-552-3453 Website: https://www.transparencymarketresearch.com Email: sales@transparencymarketresearch.com

[hongjuelectronics]

Micro Tactile Switches in Wearables and Compact Portable Devices: Trends and Innovations

With the continuous advancement of wearable and compact portable electronic devices, there is an increasing demand for components that are smaller, lighter, and more reliable. Among these components, micro tactile switches play a crucial role in ensuring responsive user interaction and system reliability. This article explores the development trends of low-travel and high-density tactile switches, focusing on their applications in headphones, smartwatches, and beyond, while also discussing future challenges and innovations.

1. The Importance of Micro Tactile Switches in Wearable and Portable Devices

Micro tactile switches are widely used in devices that require precise user feedback, compact size, and low power consumption. As smartwatches, wireless earbuds, fitness trackers, and mini medical monitors become smaller, the tactile switch must meet high integration and space-saving requirements while maintaining tactile feel and reliability.

2. Development Trend 1: Low-Travel, High-Density Switches for Limited Space Applications

Low-travel micro tactile switches (e.g., stroke ≤ 0.25 mm) are ideal for applications with extreme thickness constraints such as TWS (True Wireless Stereo) earbuds and slim smartwatches. These switches are designed with compact profiles (typically under 1.0 mm in height) and high-precision internal contact structures to ensure reliable performance in ultra-thin designs.

Example: Wireless Earbuds In TWS earbuds, tactile switches are used in multifunction buttons for play/pause, call control, and voice assistant activation. The compact internal cavity leaves limited room for components, so ultra-thin, short-stroke switches that can withstand high pressing frequencies are necessary.

Example: Smartwatches The side buttons or crowns of smartwatches integrate micro tactile switches to provide subtle tactile feedback. These switches must endure frequent use, resist sweat, and maintain mechanical integrity over long-term wear.

3. Development Trend 2: High Reliability and Environmental Adaptability

To meet the demands of 24/7 use in dynamic environments, micro tactile switches are evolving to feature:

IP67 or higher dustproof and waterproof ratings

Corrosion-resistant contact materials such as gold-plated contacts to withstand sweat and moisture

Extended mechanical lifespan (typically over 1 million cycles)

These features are crucial in devices worn during workouts, in harsh weather, or while sleeping, where switches are exposed to repeated mechanical stress and environmental factors.

4. Development Trend 3: Multi-Functionality and Integration with Smart Modules

As wearable devices become smarter, micro tactile switches are increasingly combined with sensors and communication modules. Examples include:

Switch + Pressure Sensor: Used in smart bands to combine physical feedback with pressure sensing for gesture control.

Switch + LED or Backlight Module: Offers visual feedback in night use scenarios or low-light conditions.

Through modular integration, switches are no longer just mechanical parts but components that participate in intelligent interaction.

5. Future Outlook: Flexible, Ultra-Thin and Wearable Materials

Looking ahead, micro tactile switches will continue to move toward:

Flexible and printed switch technologies for use on flexible substrates and curved surfaces, enabling more versatile design layouts in wearables.

Advanced materials, such as conductive polymers or graphene-based contact films, to improve durability, tactile feel, and reduce environmental impact.

Smaller pitch and surface mount (SMT) packaging to allow for higher circuit density and full automation in assembly processes.

Conclusion

The rapid growth of the wearable and compact device market is driving the continued innovation of micro tactile switch design. From low-travel designs for ultra-thin form factors to high-reliability and smart integrated switches, these components are becoming indispensable for product performance and user experience. Manufacturers must continue to adapt switch designs to meet the evolving demands of miniaturization, integration, and usability in future consumer electronics.

en.dghongju.com

[howzitsa]

Acer Extensa 215 Core i7 1165G7 EX215-54-7843 Notebook Powerful productivity in a highly portable package for small businesses and entrepreneurs. Designed for businesspeople in need of everyday computing power and functionality. Get your work done quickly and efficiently while multitasking. Proudly on Acer Reliability Promise. SPECIFICATIONS Operating System: Windows 11 Pro 64-BIT Processor: Intel® Core™ i7 Quad Core 1165G7 2.4GHz - 4.2GHz Processor Cache: 8MB Memory Standard Memory: 8GB Maximum Memory: 16GB Number of Total Memory Slots: 1 Storage SSD Storage Capacity: 512GB PCIe NVMe SSD Display and Graphics Display Size: 15.6" (39.6 cm) Display Type: 1920 x 1080 Touchscreen: No Maximum Screen Resolution: 1920 x 1080 Display Screen Technology: Acer ComfyView™ LED-backlit TFT LCD Graphics Card: Intel® Iris® Xe Graphics Network and Communication Wireless Lan Standard: IEEE 802.11a/b/g/n/ac Wireless LAN Model: 802.11 wireless LAN, Dual Band (2.4 GHz and 5 GHz), 2x2 MU-MIMO technology Ethernet Technology: 10/100/1000 Gigabit Ethernet Bluetooth Standard: Bluetooth® 5.2 and later LTE: Yes Built In Devices Microphone: Yes Fingerprint Reader: No Webcam: Yes Speakers: Yes Number of Speakers: 2 Interface/Ports Number of HDMI Ports: 1 Number of USB 2.0 Ports: 1 Number of USB3.2 Gen 1 Type A Ports: 2 Number of USB3.2 Gen 2 Type C Ports: 0 Total Number of USB Ports: 3 USB Type-C Detail Network (RJ-45): Yes Input Devices Pointing Device Type: Multi-gesture secure touchpad, supporting two-finger scroll, pinch Keyboard: FineTip keyboard with independent numeric keypad|international language support and power button Battery Information Number of Cells: 2-cell Battery Chemistry: Li-ion battery Maximum Battery Run Time Battery life up to 8 hours Battery Energy: 37.5Wh Physical attributes Height: 20mm Width: 239 mm Depth: 364 mm Weight: 1.700000 Colour: Black Miscellaneous Package Contents: 1x Notebook | 1x Ac Adapter | 1x Manual Security: Firmware Trusted Platform Module (TPM) solution Warranty Warranty Period: 1 Year Carry in Warranty

[internetupdates]

WiFi 7 : The Latest WiFi Technology

We understand - Keeping up with every new technology can be difficult. But, the wireless big thing you've likely already heard about next is Wi-Fi 7.

Wi-Fi technology has developed a great deal since the day it was born. With us being at the threshold of yet another wireless technology leap, Wi-Fi 7 is going to change and redefine how we connect, communicate and do business. Wi-Fi 7 is going to be a game-changer, and its speeds will be mind-boggling in relation to our current connectivity.

Wi-Fi 7 is not just speed; it's a superior, more efficient way of networking all the stuff in our increasingly digital lives!

About Wi-Fi 7: The Basics

Wi-Fi 7, or 802.11be, is the wireless networking technology of the future. Building on the advancement of Wi-Fi 6 and 6E, Wi-Fi 7 has finally emerged out of certification with the Wi-Fi alliance and has vowed unprecedented speeds, lower latency, and greater reliability.

It introduces several important features such as 320 MHz channels and Multi-Link Operation (MLO) of next generation, both of which improve the utilization of available spectrum as well as overall performance.

Dramatic Technological Breakthroughs

Improved speed and bandwidth support Improved latency and stability Next Generation Modulation Scheme

1. Improved Speed & Bandwidth

Perhaps the most significant improvement of Wi-Fi 7 is its speed and bandwidth performance increase. Wi-Fi 7 is recording speeds of up to 46 Gbps – far exceeding Wi-Fi 6's maximum speed! Download a full movie in seconds, stream HD content with not a hitch, and online gaming turns into a game of lightning-fast reaction times with no lag in between.

Wi-Fi 7 operates with wider channels, up to 320 MHz, twice as much capacity as 160 MHz in Wi-Fi 6, allowing for more data per connection.

2. Improved Latency

Wi-Fi 7 solves latency with a technology called Multi-Link Operation (MLO). MLO Allows devices to connect to multiple Wi-Fi bands simultaneously, spreading traffic and optimizing performance. It's a clever trick that keeps data zipping along with minimal delay, applications like low ping rates in gaming, smooth and responsive video calling.

3. Next-Level Modulation Technique

Wi-Fi 7 uses an advanced modulation technique called 4K QAM (Quadrature Amplitude Modulation). Wi-Fi 7 accelerates peak data rates, throughput, and overall capacity much higher than the old 1024 QAM mark. Utilizing 4K QAM, Wi-Fi 7 can handle increased data at higher speeds, making it ideal for applications with high requirements and densely populated network environments. This improvement offers a better and more stable wireless communication experience.

How Does it Fit in the Real World?

The benefits of Wi-Fi 7 extend far beyond fast downloads and flawless streaming.

1. Potential to revolutionize many industries:

Remote collaboration and work: With uninterrupted connections, remote employees can collaborate in real-time with minimal lag, making distributed offices even more productive. The Internet of Things (IoT) and smart homes: Wi-Fi 7's ability to handle hundreds of devices with ease will be crucial for the ever-expanding world of smart home appliances and the Internet of Things.

Cloud computing and data transfer: Businesses and individuals relying on cloud storage and data transfer will experience tremendous improvements in speed and dependability using Wi-Fi 7. Virtual Reality (VR) and Augmented Reality (AR) experiences: Wi-Fi 7's high-speed bandwidth and low latency will provide more immersive and lag-free VR and AR experiences.

2. Enterprise-Level Connectivity

Big businesses are going to significantly gain from Wi-Fi 7's improvements. The improved capacity and more efficient management capabilities will allow firms to better control their networks on a bigger scale, providing them with excellent coverage in huge areas. More security features and advanced network management possibilities will also allow for enhanced protection from cyberattacks as well as greater control.

Industry leaders emphasize the importance of future-proofing IT infrastructure. Wi-Fi 7 is a scalable technology that can adapt to evolving business needs, hence making it an essential for forward-thinking companies.

3. Sector-Specific Applications

Different sectors are going to have special benefits with the adoption of Wi-Fi 7. Let's discuss the cases!

Healthcare: In the healthcare sector, Wi-Fi 7 will offer more secure telemedicine services and remote patient monitoring in real-time. The high-speed, low-latency connections ensure that critical health data is transmitted accurately and in a timely fashion. Education: Students in schools will have better online learning experiences.

Wi-Fi 7 supports high-definition video streaming and interactive virtual classrooms, enhancing remote learning and making it more interactive. Retail: The retail sector can leverage Wi-Fi 7 to enhance customer engagement using AR and VR applications. For example, virtual try-ons and virtual shopping can be more responsive and seamless.

4. Technology Advances

Wi-Fi 7 introduces some technological advances that separate it from earlier versions. Below is a comparison and what we can look forward to next:

Comparison with Wi-Fi 6 and 6E: Even though Wi-Fi 6 and 6E introduced tremendous development in speed and efficiency, Wi-Fi 7 takes these leaps further. The addition of the 6 GHz band with Wi-Fi 6E was a breakthrough, but Wi-Fi 7's MLO and higher speed possibilities take it up a notch.Application of the 6 GHz Band: Wi-Fi 7 is making the most of the 6 GHz band, which is offering more channels and less interference compared to the 2.4 GHz and 5 GHz bands.

This results in more data transmission and enhanced performance where high population concentrations are involved.

Future Prospects :

As technology improves, the ground laid by Wi-Fi 7 will pave the way for development. As technology progresses and even more devices become compatible, we can expect Wi-Fi 7 to be the new standard, delivering scorching-fast, secure, and seamless connectivity.

Factors to Watch Out For

While Wi-Fi 7 is full of promise, there are some things to consider.

Infrastructure Requirements: The installation of Wi-Fi 7 will require widespread infrastructure upgrades. Companies will need to invest in new access points and routers as well as compatible hardware in order to be able to fully utilize the features of Wi-Fi 7.Potential Cost Impacts: Wi-Fi 7 upgrades have a high price tag, mostly for big businesses.

But these initial costs may be worth it in the end for long-term productivity and efficiency improvements. Average Adoption Timeline: Prior to the arrival of Wi-Fi 7, mass adoption will be an incremental process. Businesses need to plan their upgrading carefully so they are ready when the new tech is released.

The Future: Upgrading for Wi-Fi 7

Wi-Fi 7 is a leap forward in wireless technology in terms of enhanced speed, dependability, and security. Its impact on business operations, sector-specific applications, and technology developments is substantial with the potential to revolutionize how we connect and communicate. However, before this new wave comes in, we must overcome infrastructure challenges and keep costs in check.

As we gear up to this new exciting wave, businesses must strategize their upgrade in order to reap the full benefit of the WiFi 7.

[techtease]

USB to LoRa Dongle: A Solution for Wireless Communications Device

In the remote sensor networks or any other IoT projects which are used to communicate over large distances with minimal power consumption, USB to LoRa Dongle can be a game changer device. The dongle offers an affordable, efficient and powerful solution for establishing seamless communication. This is a powerful and versatile  device that acts as a bridge between your computer or microcontroller and LoRa based wireless. 

The dongle comes with SX1268 next generation LoRa technology and is able to communicate up to 5km distance with license free frequency bands(433MHz/868MHz/915MHz). The dongle can connect Raspberry Pi, LoRa and any other microcontroller. The features and specifications of the dongle is given below: 

Features and Specifications:

Communication: This module is enabled to communicate over long distances up to 5km range. 

Frequency Support: Supports license free ISM frequency bands 433MHz, 868MHz and 915MHz with these features you can use it in different regions across the world. 

Transmission Power: Comes with maximum transmission power of 160mW that ensures your data can be transmitted over long distances and it has a multi-level adjustable setting that helps you to optimize the device for your specific needs. 

Next Generation LoRa technology: Comes with new generation LoRa technology based on SX1268 chip. Makes it highly reliable for applications. The air data rates for this module range from 0.3Kbps~ 62.5kbps. This range provides a good balance between communication range and data rate, allowing you to choose the best configuration for your specific needs.

Power Supply: can operate with a wide range of power inputs, supports 2.1V - 5.5V or 3.3V~5.5V power supply for the best performance. 

Low Power Consumption: This device is energy efficient. It reduced 40% power consumption and 35% power consumption for hardware and software respectively. 

Industrial Grade Durability: The industrial grade standard of the dongle ensures it operates in different temperatures from -40°C to 85°C for a long time. 

Development Friendly Features: Dongle supports IPEX and stamp holes. This feature provides flexibility for developers and engineers looking to customize the dongle for specialized projects.

Easy Integration With Existing System: Can connect to any computer, Raspberry Pi, Rock, Beagle Bone or other microcontroller to integrate easily with your existing system. 

Applications: USB to LoRa dongle can be used in various applications that require long range wireless connectivity, low power consumption and many IoT applications.

IoT Applications

Smart Home Automation

Asset Tracking

Emergency Services

Remote Monitoring

The USB to LoRa by SB Components is a combination of long-range communication, low power consumption, software adjustable transmission power and flexible power supply options. With these great features it provides a reliable and adjustable solution for various applications. 

Whether you are building IoT networks, remote sensing systems, or smart agriculture solutions, the USB to LoRa device ensures you can communicate over long distances, reduce energy costs, and deploy solutions that are both reliable and efficient. With its industrial-grade durability, low power consumption, and development-friendly features, the USB to LoRa device is truly a game-changer in the world of wireless communication.

[govindhtech]

ASUS ROG Strix X870-A Gaming WiFi  Motherboard Features

Dive deep: Discover the ROG Strix X870-A Gaming WiFi, a powerful and attractive motherboard in the ROG X870E/X870 range. Its outstanding looks may be the first thing you notice. Its cobble-gray PCB is offset by striking white and silver embellishments. Combine it with other white-themed PC DIY components from the comprehensive portfolio, such the ROG Hyperion chassis in white, to create a striking first impression. However, this motherboard is more than cosmetic. It’s a premium option for gaming-focused PCs using AMD Ryzen CPUs.

ROG Strix X870-A Gaming WiFi Features

ROG Strix X870-A Gaming WiFi builds a full next-gen PC as an X870 motherboard. The AM5 socket supports the newest AMD Ryzen 9000 Series CPUs. Your PC is equipped for the fastest graphics cards and M.2 SSDs of today and future since the main M.2 slot and PCIe x16 slot are wired for PCIe 5.0 bandwidth. This board has it PCIe Q-Release Slim mechanism for quick graphics card installation. Removing a card requires no latch release or button pressing.

DDR5 memory kits with high bandwidth and capacity are supported. This board can overclock compatible kits to 8000 MT/s or more. You may tweak your RAM for maximum performance or stability with this motherboard. AEMP memory profiles optimize settings with a click, even for PMIC-restricted components. AMD’s new processors include several benefits, including quicker baseline memory support for a wonderful out-of-the-box experience.

Durable VRM architecture

Gaming, AI operations, and content production all have higher computational needs. Modern CPUs with large core counts are meeting user needs, but powering them is difficult. These processors need high power output and advanced control circuitry to dynamically alter power in microseconds to ensure a steady and clean supply under fluctuating workloads.

ROG Strix X870-A Gaming WiFi has a powerful VRM design with a paired arrangement to address these problems. Its 16 Vcore power stages and two Vsoc voltage power stages, each with an SPS design rated for up to 90A, ensuring the power module can meet CPU needs.

Dual 8-pin ProCool II power connections with solid pins provide reliable power supply, heat dissipation, and current capacity for overclocking and high-wattage workloads on the ROG Strix X870-A Gaming WiFi. Damage-resistant metal shields protect connections. We add an LED signaling system to the connections to verify good connection.

Next-gen WiFi 7 networking

The ROG Strix X870-A Gaming WiFi supports WiFi 7, a networking revolution. WiFi 7 is 4.8X quicker than WiFi 6 due to the 6GHz band and 4K QAM. Devices may connect on various bands using Multi-Link Operation (MLO) for quicker speeds and dependability. Wireless communication is improved with Bluetooth 5.4 and 2.9Gbps on the ROG Strix X870-A Gaming WiFi.

The ASUS WiFi Q-Antenna simplifies networking optimization. The WiFi Q-Antenna boosts 5GHz and 6GHz signal throughput with PCB improvements and improved inner pin connections.

Plus, Armoury Crate optimizes this directional antenna. Direction Finder quickly detects signal strength and locates the optimal antenna placement, while Fast Check checks signal strength and ensures the best connection. The new Traffic Monitor function tracks WiFi channel use across 2.4GHz, 5GHz, and 6GHz bands. Channel Switch lets you switch to a less crowded channel for better network performance.

Flexible And abundant USB Ports

ROG Strix X870-A Gaming WiFi motherboards include two high-speed USB4 ports, allowing for endless possibilities. USB4’s 40 Gbps bi-directional bandwidth makes it ideal for speedy external storage device connections.

A DisplayPort 1.4 monitor with 8K@30Hz may be connected to USB4 ports. Daisy-chaining numerous screens and gadgets to one USB4 port is another option. You may connect two monitors and three devices, such a mouse, keyboard, or USB headset, with one wire, creating a neater configuration.

Dual USB4 ports are the ROG Strix X870-A Gaming WiFi‘s main rear I/O ports, however there are more. There’s also a USB 10Gbps Type-C port with 30W Power Delivery 3.0. It delivers fast, dependable power to almost everything you plug in by delivering several voltage levels based on the device’s specs.

ROG Strix X870-A Gaming WiFi lets you connect a high-speed, multipurpose USB port to your case’s front panel. The header has a USB 20Gbps connection for fast communication.

The back panel has five USB 10Gbps and four USB 5Gbps Type-A connections for connecting your battle station. One has USB BIOS Flashback to upgrade UEFI without a CPU or RAM. Standby power, a USB flash drive, and the update filename are enough. BIOS Flashback may never be needed, but having it provides you piece of mind.

Build that large storage array

PC users nowadays require speedy storage everywhere. AAA games’ installation sizes aren’t shrinking. AI procedures start with enormous datasets, and camera operators need a place to store high-resolution objects.

All these situations need plenty of M.2 slots. The ROG Strix X870-A Gaming WiFi does that. It has four M.2 slots, two of which are CPU-direct. One is wired for PCIe 5.0, allowing you to install a fast main drive for application loading.

The new motherboards make SSD installation simpler than ever. The ROG Strix X870-A Gaming WiFi‘s M.2 Q-Latch moves down a track to securely accommodate M.2 drives of various lengths. The M.2 Q-Latch technology makes drive installation easy and tool-free, so you never have to worry about dropping a tiny screw into your chassis.

It also making M.2 heatsink installation as simple as drive installation. The main drive slot has an M.2 Q-Release heatsink on the ROG Strix X870-A. One side button releases the heatsink. Snap the heatsink back on after inserting your drive.

Easily Configured And Optimized

It’s easy to concentrate on the ROG Strix X870-A Gaming WiFi‘s hardware enhancements, but the software is as exciting. It begins with major BIOS interface modifications. It are increasing the BIOS interface resolution to 1920×1080. This modification will let you view more material at once, making it simpler to discover the options you need.

The new BIOS Q-Dashboard interface connects BIOS settings to motherboard layout, which may be even more useful to beginner PC builders. It shows your motherboard model in BIOS with all the important components and connections identified. New PC builders learn their hardware and motherboard operation via these visual correlations.

Keeping your device drivers updated helps your new PC run smoothly. However, you may miss an update unless you regularly check for updated drivers. ASUS introducing ASUS DriverHub to fix this. This one-stop solution simplifies ASUS driver and utility management to keep your system optimum. ASUS DriverHub is accessible in the Armoury Crate app and after OS installation for convenience.

Conclusion

The Powerful ROG Strix X870-A Gaming WiFi is white. For your next PC, the ROG Strix X870-A Gaming WiFi is ideal. It supports a next-gen AMD Ryzen 9000 Series CPU, DDR5 RAM, and fast storage. The newest features ease PC building and optimization. The white-and-silver hue makes it stand out.

Read more on Govindhtech.com

[oceantrust01]

Best Dive Computers of 2024 | Chosen By A Expert Diver

Ask most divers the one piece of equipment that they will never dive without, and it is likely to be their trusty ol’ dive computer. The dive comp is often the diver’s best friend, containing crucial information that will make the dive safe and enjoyable. However, not all dive computers are created equal! From the basic comps that give you standard information like NDL and depth to the fancy comps that technical divers use, your choice should reflect on the type of diving you do, your budget, and personal preferences. Also, many dive computers are worn watch-style, but console-type comps will be used as part of your SPG.  Fret not, we’re here to help you out! Here are all of the dive comps that are popular with the diving community that we are proud to be a part of!  1. 🌟 Best Dive Computers of 2024 Mares Genius Air Integrated Computer with LED Transmitter Our Rating★★★★★ The Mares Genius Air Integrated Computer is great for technical divers who use Trimix and Nitrox mixtures with multiple changes and want to optimize decompression and bottom times depending on gas supply.  The interface is easy to use, with an intuitive design and large buttons. It also has a Bluetooth connection for your smartphone, and the battery is rechargeable. The kit comes with the Mares LED tank module that allows you to transmit pressure measured from the tanks directly to your dive computer, letting you know the level of gas using a color code system.  Specifications Included Components: Dive computer, LED transmitter Battery Life: 40 hours Weight: 1.9 pounds Price: US$1,527.90 Suggested users: Technical divers  Garmin Descent Mk3i  Our Rating★★★★★ A dive computer is a watch-style tool with an AMOLED display, scratch-resistant sapphire lens, and titanium bezel. With a 200-meter dive-rated case, this watch can satisfy both technical and free divers.  The enhanced SubWave sonar technology allows diver-to-diver messaging for up to 30 meters and monitors the tank pressures and depth for up to 8 divers. The LED flashlight has variable intensities and strobe modes.  There are also DiveView maps that offer bathymetric depth contours and more than 4,000 dive sites. Lastly, the multi-band GPS technology helps you gain positional accuracy while out of water, while its built-in ABC sensors help navigate every part of your dive when you’re underwater.   Specifications Included Components: Dive computer, silicone band, adjustment strap, USB-C, documentation  Material: silicone Weight: 3.72 ounces Price: US$1,443.75 Suggested users: Experienced divers Oceanic Pro Plus X Dive Computer with QD Hose Our Rating★★★★★ Simple and to the point, this dive computer gives you all the necessary information without being complicated. The display is bright and easy to read, adaptable in both sunlight and night diving.  It has a dual algorithm system where you can choose the best method of measuring your NDL. There’s also a push button ocean glow backlight, a smart glow backlight sensor, and an audible alarm when you get close to any of your limits.  Specifications Included Components: Dive computer Material: Plastic Weight: 2 pounds Price: US$1,199.95 Suggested users: All levels Shearwater Research Peregrine TX Air Integrated Color Dive Computer Our Rating★★★★★ With a full-color, large, and easy-to-read LCD screen, the upgraded Peregrine TX is designed for the recreational sport diver. There’s also an option of wireless air integration with a transmitter that allows real-time gas pressure data and accurate time remaining.  It also has a tilt-compensated digital compass, which the original Peregrine doesn’t. The Bluetooth wireless connection will make dive data tracking easier through the Shearwater Cloud.   Specifications Included Components: Dive computer, wireless charger Material: Plastic Battery Life: 30 hours of diving Weight: 16 ounces Price: US$1,000 Suggested users: Sport divers Aqua Lung i550C Dive Computer Our Rating★★★★★ This is an easy-to-use and versatile dive computer that’s suitable for both experienced and new divers. It comes with a pre-dive planning feature that allows you to preview planned dives. The i550C is equipped with gas integration, Nitrox and Gauge modes, backlight technology, and gas time remaining.  There are audible alarms and additional high-visibility LED warning lights. You can access History Mode, which includes your dive data like the total number of dives, max depth, total dive hours, and lowest temperature.   Specifications Included Components: Dive computer Weight: 1.3 pounds Price: US$699 Suggested users: All levels  Shearwater Tern Color Wrist Dive Computer Our Rating★★★★★ Small and compact, the Tern is flexible and can be used whether you’re snorkeling in sunny tropical areas or diving into much deeper explorations. The dive computer will adjust its brightness and sharpness accordingly, making it easy for you to check your status and focus on your dive.  The dive computer also has a Bluetooth integration that can sync effortlessly with your tablet or smartphone, keeping your dive log accessible.  Specifications Included Components: Dive computer Material: Aluminum Weight: 0.6 pounds Price: US$650 Suggested users: All levels Garmin Descent G1 Our Rating★★★★★ The rugged, watch-style dive computer comes with a sapphire lens and silicone bands for maximum durability. It has GPS/GLONASS/Galileo support, so you can mark your entry and exit for your dive log.  It tracks your activities with 30 built-in sports apps and you can use advanced training features like the VO2 Max to see how your body is responding to diving or training. You can also monitor your heart rate, pulse, and sleep score to give you more insights into your health, in and out of the water.  You can also pair this with your smartphone to give you notifications and access to up to 200 dive logs.    Specifications Included Components: Dive computer, charging/data cable, documentation  Material: Silicone Battery Life: 25 hours of diving Price: US$549.99 Suggested users: All levels  Cressi Leonardo Our Rating★★★★★ This is the second generation of Cressi’s original dive computer, Cressi Leonardo. It comes with better readability and a more audible sound alarm compared to the previous version. The single-button dive computer is an effortless model for divers who only want simple data.  It’s equipped with comprehensive Nitrox management, depth gauge mode, RGBM Algorithm, and Deep Stop feature for safety. You can also get the additional BT Interface to download the dive log to your smartphone via the Cressi app.  Specifications Included Components: Dive computer   Material: Various Weight: 0.4 gr Price: US$239.95 Suggested users: Budget-conscious divers 2. 🤔 Final Thoughts Whether you want something basic and affordable or treat yourself to something with all the bells and whistles, there’s a perfect dive comp for you out there. Have fun and stay safe diving!  Read the full article

[g-nicerf]

Comprehensive Coverage:  LoRa1120 Module Supports Satellite Communication and Multi-Band Transmission

LoRa1120 adopts Semtech's LR1120 chip, an ultra-low-power module designed specifically for global geolocation applications. It supports multi-band LoRa and long-range frequency hopping spread spectrum (LR-FHSS) communication, operating in the sub-GHz and 2.4GHz industrial, scientific, and medical (ISM) bands, as well as the S-band authorized for satellite communication. The module integrates a cloud-native multi-constellation Global Navigation Satellite System (GNSS) scanner and a passive WiFi MAC address scanner, both of which are serviced through Semtech’s LoRaCloud™. The LR1120 complies with the physical layer requirements of the LoRaWAN standard specification released by the LoRa Alliance while maintaining configurability to meet various application and proprietary protocol needs.

Key Features of the LoRa1120 Communication Module Multi-Band Support and Positioning Technology Multi-Band Capability: Supports sub-GHz bands (433/470/868/915MHz), 2.4GHz, and the licensed S-band (1.9GHz–2.2GHz) for satellite communication. Low-Power Positioning Technology: The LoRa1120 integrates both GNSS scanning and Wi-Fi scanning as low-power positioning methods, enabling accurate location tracking in various environments while maintaining low power consumption.

Positioning System Support LoRa1120 not only supports GPS and BeiDou systems but also provides a hybrid low-power positioning solution by combining GNSS and Wi-Fi scanning, enhancing positioning accuracy and energy efficiency in IoT applications.

Terrestrial and Satellite Communication A key advantage of the LoRa1120 is its seamless connectivity with both terrestrial and satellite communication networks. Leveraging LoRa’s ultra-low power technology, the module can operate for several years without frequent charging, and the positioning computation is performed in the cloud.

Data Transmission and Combination Modes The LoRa1120 module offers flexible data transmission options, allowing users to choose different combinations based on actual needs:

Sub-GHz + 2.4GHz Combination: Ideal for hybrid applications requiring both long-range and short-range communication.

Wi-Fi + 2.4GHz Combination: Suitable for short-range applications that demand quick response.

Sub-GHz + GNSS Combination: Delivers optimal performance in scenarios requiring remote positioning and data transmission.

After receiving satellite or Wi-Fi data, the LoRa1120 module can transmit the information via the 2.4GHz wireless channel or the S-band.

Selection of Different Wireless Connection Methods Based on Communication Distance and Data Volume LoRa1120 supports multiple wireless connection options, and the choice depends on factors such as communication range, data volume, and response speed:

Sub-GHz Band: Suitable for applications requiring long-distance communication, wide coverage, and low data throughput. In such scenarios, the Sub-GHz band offers strong signal penetration, making it ideal for long-range transmission.

2.4GHz Band: Best suited for scenarios that demand real-time response, fast sensing, or quick control. It offers higher data rates and lower latency, making it ideal for short-range, high-frequency communication needs.

How to Select LoRa1120 Functional Combinations Across Different Application Fields The choice of LoRa1120's functional combinations primarily depends on positioning needs and the characteristics of the application environment:

Remote Areas such as Oceans and Deserts: When satellite communication is required, the S-band is the optimal choice. It supports global positioning and is well-suited for environments with no network coverage.

Ports, Vessels, and Global Logistics: The 2.4GHz band is recommended due to its global compatibility, making it suitable for various regions and avoiding compatibility issues associated with regional Sub-GHz standards.

Low-Power Positioning Requirements: Retaining GNSS and Wi-Fi scanning technologies is ideal for IoT applications that are sensitive to power consumption.

The LoRa1120 wireless communication module features a multi-protocol, low-power RF chip integrating multiple modulation schemes including LoRa, FSK, and LR-FHSS. It supports global Sub-GHz bands, the 2.4GHz ISM band, and the 1.9–2.2 GHz satellite S-band, offering the combined advantages of wide-area coverage and high reliability.

Other Features of the LoRa1120 Module LoRa1120 is a multi-protocol, low-power wireless RF chip that integrates LoRa, FSK, and LR-FHSS modulation schemes. It supports global Sub-GHz bands, the 2.4GHz ISM band, and the 1.9–2.2GHz satellite S-band, offering both wide-area coverage and high reliability.

Sub-GHz Band: Supports 433/470/868/915MHz; ideal for long-distance transmission and complex environments due to strong signal penetration.

2.4GHz Band: Covers 2400–2500MHz; suitable for short-range, high-speed data transmission, commonly used in smart home applications.

S-Band: Ranges from 1900MHz to 2200MHz; specifically designed for satellite communication, enabling global connectivity in remote areas such as oceans, deserts, and mountains.

Reception Sensitivity:

S-Band: Up to -132dBm @ BW=125KHz, SF=12 — ideal for efficient satellite communication on a global scale.

2.4GHz: Up to -129dBm @ BW=406KHz, SF=7 — suitable for short-range, fast-response scenarios.

Sub-GHz: Up to -144dBm @ BW=62.5KHz, SF=12 — excellent for long-range transmission and signal reception in challenging environments.

In open areas, the Sub-GHz transmission range exceeds 5,000 meters. The LoRa1120 module has an ultra-low sleep current of less than 1μA and a receive current below 7mA, making it especially suitable for remote and low-frequency charging applications such as smart agriculture, asset tracking, and environmental monitoring.

For details, please click：https://www.nicerf.com/products/ Or click：https://nicerf.en.alibaba.com/productlist.html?spm=a2700.shop_index.88.4.1fec2b006JKUsd For consultation, please contact NiceRF (Email: sales@nicerf.com).

[t2mip]

Wi-Fi 7 RF Transceiver IP Core for Wireless Applications

T2M IP,a leading provider of semiconductor IP cores and advanced connectivity solutions, today announced the availability of its partner’s next-generation Dual-Band Wi-Fi 7 RF Transceiver IP Core with an integrated Front-End Module (FEM). Designed for high-performance consumer and industrial applications—including set-top boxes, Augmented Reality (AR) & Virtual Reality (VR) headsets, and streaming media devices—this cutting-edge IP solution is now available for immediate licensing.

Wi-Fi 7 is set to redefine the future of wireless connectivity by delivering unprecedented data rates, ultra-low latency, and enhanced spectral efficiency. This highly integrated RF transceiver IP core fully supports the latest IEEE 802.11be (Wi-Fi 7) standard, offering 4096-QAM modulation, multi-gigabit data throughput, and advanced interference mitigation. With support for both 1024-QAM (Wi-Fi 6/6E) and 4096-QAM (Wi-Fi 7), the solution ensures seamless, high-speed communication even in congested environments, making it ideal for next-generation wearables, automotive infotainment, smart home ecosystems, and industrial IoT.

Engineered for minimal die area and ultra-low power consumption, the transceiver IP core incorporates seamless roaming capabilities, superior RF performance, and robust interference handling, ensuring highly reliable connectivity in dynamic wireless conditions. With full compliance across the 2.4GHz, 5GHz, and 6GHz bands, this solution empowers access points (APs) and routers with extended range, optimized signal integrity, and high-speed connectivity. The current design supports bandwidths of up to 80MHz, with a roadmap for 160MHz bandwidth expansion in Q2 2025, enabling scalable MIMO architectures and future-ready multi-gigabit performance.

By integrating this state-of-the-art Wi-Fi 7 RF IP solution, T2M IP and its partner are enabling semiconductor companies to accelerate the development of next-generation, high-performance wireless SoCs.

Availability The Wi-Fi 7 / Wi-Fi 6 RF IP core is now available for licensing for Access Point applications. For more details on licensing options, deliverables, and pricing, please contact us at contact.

About T2M IP:

T2M IP is a leading global technology company specializing in licensing Semiconductor IP Cores, providing a comprehensive portfolio of wireless, cellular, and connectivity IPs for chipsets that enable the development of next-generation products.

[roamnook]

THE INSTALLED BASE OF GNSS-BASED ON-BOARD UNITS FOR ROAD USER CHARGING SURPASSES 7 MILLION WORLDWIDE._DYNAMIC NUMERICAL DATA AND INDUSTRY INSIGHTS UNVEILED.

Home General IoT News IoT Market IoT Solutions & Innovations Industrial IoT – IIoT Monitoring & Tracking Smart Cities & Smart Homes Auto & Telematics Fleet Management Consumer IoT & Wearables Digital Healthcare Smart Retail & Payment

New Information That Drives Digital Growth

Welcome to the IoT Business News blog! We are excited to share with you the latest and most insightful information in the world of technology. In this article, we will focus on highlighting key facts, hard data, numbers, and concrete information that will provide you with a deeper understanding of the IoT landscape. Our goal is to bring new, polarizing, numerical, objective, informative hard facts to the table. We will present you with technical, professional, and scientific terms to provide practical insight that matters to you. At the end of this article, we will introduce you to RoamNook, a technology company specialized in IT consultation, custom software development, and digital marketing that aims to fuel digital growth.

The Installed Base of GNSS-Based On-Board Units Deployed for Road User Charging Exceeds 7 Million Units Worldwide

According to a recent report, the installed base of GNSS-based on-board units deployed for road user charging has exceeded 7 million units worldwide. This is a significant milestone that showcases the widespread adoption of this technology in the transportation industry. Road user charging systems rely on satellite navigation and positioning technology to accurately track and charge vehicles for their usage of road infrastructure. With over 7 million units in operation, it is clear that this technology is here to stay.

The Installed Base of Wireless IIoT Devices in the Oil and Gas Industry to Reach 18.8 Million by 2028

Another remarkable statistic is the projected growth of the installed base of wireless IIoT devices in the oil and gas industry. It is estimated that by the year 2028, this number will reach an impressive 18.8 million. The oil and gas industry heavily relies on IoT devices to monitor and optimize their operations, leading to increased efficiency and cost savings. With such a vast number of devices deployed, it is evident that the industry recognizes the benefits and value brought by IoT solutions.

Bytesnap Releases IoT Standards and Protocols Guide for World IoT Day 2024

In celebration of World IoT Day 2024, Bytesnap, a leading IoT development company, has released an extensive guide on IoT standards and protocols. This guide aims to provide developers and industry professionals with a comprehensive overview of the different standards and protocols used in IoT systems. By standardizing communication and data exchange, IoT devices can seamlessly integrate and work together, maximizing their potential and enabling more sophisticated applications.

LoRa Alliance® Returns to Europe with LoRaWAN® Live Munich

The LoRa Alliance®, an open, nonprofit association, is returning to Europe with LoRaWAN® Live Munich. This event will bring together industry experts, innovators, and thought leaders to discuss the latest advancements in LoRaWAN® technology. LoRaWAN® is a low-power, wide-area network (LPWAN) protocol that enables long-range communication between IoT devices. With LoRaWAN® Live Munich, the LoRa Alliance® aims to foster collaboration and drive innovation in the European IoT ecosystem.

Murata's Multi-Band LoRa® Radio Module Simplifies Wireless Design and Supply-Chain Management for IoT Device Developers

Murata, a global leader in electronic components and solutions, has developed a multi-band LoRa® radio module that simplifies wireless design and supply-chain management for IoT device developers. This module supports multiple frequency bands, allowing IoT devices to operate worldwide without the need for separate hardware versions. By offering a flexible and cost-effective solution, Murata enables developers to bring their IoT devices to market faster and more efficiently.

Next-Level Learning: Unlocking Potential with State-of-the-Art Educational Technologies

The field of education is undergoing a rapid transformation with the emergence of state-of-the-art educational technologies. These technologies, such as augmented reality, artificial intelligence, and IoT devices, have the potential to revolutionize the way we learn and teach. By creating immersive and interactive learning experiences, students can engage in personalized education, unlocking their full potential. The integration of IoT devices in classrooms enables real-time data collection and analysis, allowing educators to tailor their teaching methods to individual students' needs.

Bringing New Information to the Table: RoamNook, Fueling Digital Growth

Now, let's shift our focus to RoamNook, an innovative technology company dedicated to fueling digital growth. RoamNook specializes in IT consultation, custom software development, and digital marketing. With a team of experienced professionals, RoamNook helps businesses leverage the power of technology to achieve their digital goals. Whether it's optimizing business processes, developing custom software solutions, or implementing effective digital marketing strategies, RoamNook is committed to delivering exceptional results.

By partnering with RoamNook, businesses can unlock new opportunities and stay ahead of their competition. The expertise and technical know-how of the RoamNook team ensure that clients receive the best possible solutions tailored to their specific needs. From developing IoT applications to implementing data-driven marketing campaigns, RoamNook is the partner you need to drive digital growth.

So, whether you're a small startup or an established enterprise, consider partnering with RoamNook to unlock the full potential of digital transformation. Get in touch with RoamNook today by visiting their website at www.roamnook.com. Together, let's fuel digital growth!

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[techbyrish]

Raspberry Pi RP2040 MCU featuring the Quectel EG25-G 4G LTE cellular module in PicoCell 4g

Introducing the revolutionary PicoCell 4G device, powered by the Raspberry Pi RP2040 MCU and featuring the Quectel EG25-G 4G LTE cellular module. In today’s world, where connectivity and innovation are key, this cutting-edge technology seamlessly combines the power of the RP2040 chip with the connectivity prowess of the Quectel EG25-G 4G LTE module. The PicoCell 4G is not your ordinary device; it transcends boundaries and redefines the way we connect, create, and communicate.

With its Multi-Constellation GNSS support, the PicoCell 4G can quickly and accurately determine your location, regardless of where you are. It acts like a bridge connecting people worldwide with call and messaging coverage that knows no borders. The EG25-G variant is like a world traveller, supporting a wide range of LTE FDD and TDD frequencies, UMTS options, and GSM. In simple terms, it keeps you connected no matter where you go. Are you seeking a dependable and swift wireless connection while on the move? Consider the PicoCell 4G as your solution. This adaptable device functions not only as a communication tool but also as a high-speed data server that supports technical features such as HTTP and TCP/IP. With the convenience of its dongle feature, you can enjoy lightning-fast LTE speeds of up to 150Mbps (DL) and 50Mbps (UL) while on the go. Essentially, it’s like having your high-speed internet connection that can be easily carried in your pocket. Perfect for the Tech-Enthusiast Attention tech enthusiasts!

The PicoCell 4G is specifically designed for M2M and IoT applications and acts like a superhero for connected devices, guaranteeing their optimal performance. It comes with a diverse antenna that provides a strong signal even in challenging situations. You can customize it to meet your specific needs with additional GPIO options. It is also energy-efficient, ensuring that it won’t run out of power when you need it the most. Furthermore, it features a status LED that offers real-time updates on network and satellite connections, making it easy to stay informed. It supports Quectel Enhanced AT Commands, which makes controlling your devices a breeze, ensuring that everything is effortless. Hello, the PicoCell 4G is a powerful device that caters to M2M and IoT applications with its exceptional features. It is powered by the plate number 1 chip with a 32-bit dual ARM Cortex-M0+ microcontroller and 8MB flash, and equipped with the Quectel EG25-G 4G LTE cellular module, supporting nano SIM cards. The device features dual Type C interfaces for programming and accessing the 4G module, a 3.2” Touch Display with a resolution of 320x240 pixels, driven by the plate number 2 Display Driver and plate number 3 capacitive touch controller. It comes in a range of vibrant RGB colours and offers additional GPIO options for peripheral connections. Furthermore, the device includes boot buttons for Pico, a power button for manually turning the 4G module on/off, an onboard microSD card for data logging, a battery connector with a charging circuit for portable use, a 3.5mm Audio Jack for headphones, and even includes speaker support for attaching a speaker. Additionally, the device provides indicator LEDs for board supply, module power, network status, and system status. The PicoCell 4G is an exceptional device optimized for M2M and IoT applications. It offers worldwide coverage and supports MIMO and DFOTA. With a multi-constellation GNSS receiver, you can track precise locations with ease. The 4G module supports various network bands and different speech codec modes. It has low power consumption for efficient operation and delivers LTE Max. 150Mbps DL/50Mbps UL data speeds. The PicoCell 4G is a game-changer that’s here to redefine the way we connect and create. Check out the Product Page and join the journey to experience connectivity without limits.

TO KNOW MORE : bit.ly/3RalKua

[ark3750]

Cool and Fun to Know Acronyms

                                                                                                 Feb 18, 2021 Useful Information 🕸🕸🕸🕸🕸🕸🕸 1. PAN - Permanent Account Number 2. PDF - Portable Document Format 3. SIM - Subscriber Identity Module 4. ATM - Automated Teller Machine 5. IFSC - Indian Financial System Code 6. FSSAI - Food Safety & Standards Authority of India 7. DELL - Digital Electronic Link Library 8. VIRUS - Vital Information Resources Under Siege 9. UMTS - Universal Mobile Telecommunications System 10. AMOLED - Active-Matrix Organic Light-Emitting Diode 11. OLED - Organic Light-Emitting Diode 12. IMEI - International Mobile Equipment Identity 13. ESN - Electronic Serial Number 14. UPS - Uninterruptible Power Supply 15. HDMI - High-Definition Multimedia Interface 16. VPN - Virtual Private Network 17. APN - Access Point Name 18. VGA - Video Graphics Array 19. QVGA - Quarter Video Graphics Array 20. WVGA - Wide Video Graphics Array 21. WXGA - Widescreen Extended Graphics Array 22. USB - Universal Serial Bus 23. WLAN - Wireless Local Area Network 24. PPI - Pixels Per Inch 25. HSDPA - High Speed Down-link Packet Access 26. HSUPA - High-Speed Uplink Packet Access 27. HSPA - High Speed Packet Access 28. GPRS - General Packet Radio Service 29. EDGE - Enhanced Data rates for Global Evolution 30. NFC - Near Field Communication 31. OTG - On-The-Go 32. S-LCD - Super Liquid Crystal Display 33. O.S - Operating System 34. SNS - Social Network Service 35. H.S - HOTSPOT 36. P.O.I - Point Of Interest 37. GPS - Global Positioning System 38. DVD - Digital Video Disk 39. DTP - Desk Top Publishing 40. DNSE - Digital Natural Sound Engine 41. OVI - Ohio Video Intranet 42. CDMA - Code Division Multiple Access 43. WCDMA - Wide-band Code Division Multiple Access 44. GSM - Global System for Mobile Communications 45. DIVX - Digital Internet Video Access 46. APK - Authenticated Public Key 47. J2ME - Java 2 Micro Edition 48. SIS – Symbian Installation Source 49. RSS - Really Simple Syndication 50. TFT - Thin Film Transistor 51. AMR- Adaptive Multi-Rate 52. MPEG - Moving Pictures Experts Group 53. IVRS - Interactive Voice Response System 54. ACER - Acquisition Collaboration Experimentation Reflection 55. HP - Hewlett Packard 56. LED - Light Emitting Diode 57. LCD - Liquid Crystal Display 58. DLNA - Digital Living Network Alliance 59. ROM - Read Only Memory 60. *JAI* - Just An Idea 🙏���� 61. *SHRI*  - Support Human Rights in India 🙏🏾 62. *RAM* - Random Access Memory 🙏🏾

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Choosing The Best Transistor Circuit And GPRS/Gsm Module In The Market?

The very first question you must ask is – what is a transistor and then what is the GPRS/gsm module? A transistor acts as a switch and signal amplifier. Although they come now in integrated circuits there are still some places where discreet arrays and elements are required. A GPRS/gsm module is a device or chip that facilitates wireless communication with the gsm/GPRS network, meaning – it allows internet connectivity which is like the most essential need of today’s world.

Now choosing among the best manufacturer of transistor and GPRS/gsm module can be a tough battle. But no worries, we are here. We recommend using the STA401A transistor. Developed by Sanken Electric, a Japan-based company, STA401A is a silicon NPN triple diffused Darlington transistor array with sink driver arrays. It has built-in avalanche diodes, high DC gain, and can be used in relay driver, solenoid driver, lamp driver, LED driver, and stepping motor driver.

For GPRS/GSM module chip, use CINTERION MC37iR3. Having dual frequency bands of GSM 900 and GSM 1800 MHz these are small MS module chips which are just state of the art tech. Using power supply between 3.3V to 4.8V they allow ambient operating temperatures thus giving better functionality at varying temperatures in the range -20° C to +55° C. Weighing exactly 6g these modules are fully compliant with EU RoHS Directive. USSD, SMS, Cell broadcast text, PDU Mode, sim card storage, fax, adaptive multi-rate AMR are some of the main features of this particular model. It also enables one to use handsfree operations, echo cancellations, noise reduction and gives 7 different tones to the user.

Choosing the best circuit allows one to developed the best tech thus giving the perfect functionality and as Bill Gates has famously quoted – “Tomorrow's Leaders Will be Those That Empower Others” – use these circuits to empower your tech.