#proprietary RF modules

[addohaislam2000]

Bluetooth modules, proprietary RF modules, Radio frequency modulator

DA14531MOD Series 3.6 V -93 dBm Sensitivity Surface Mount Bluetooth LE Module

[knth2xonn]

https://www.futureelectronics.com/p/passives--capacitors--aluminum-electrolytic-capacitors/eee-ftj681xap-panasonic-8057989

Aluminum oxide, multi section capacitor, Chip Aluminum Electrolytic Capacitors

EEE-FT Series 6.3 V 680 uF Ø6.3 x 7.7 mm 105° Low ESR Electrolytic Capacitor

[brdly2kenss]

https://www.futureelectronics.com/p/semiconductors--wireless-rf--rf-modules-solutions--80211-wlan/lbwa1uz1gc-958-murata-5143837

WI FI module manufacturers, RF Solutions, RF Modules, industrial remote controls

2.4/5 GHz 3.3V Shielded Ultra Small Dual Band WiFi 11a/b/g/n+Ethernet+MCU Module

[wllac2mns]

https://www.futureelectronics.com/p/semiconductors--wireless-rf--rf-modules-solutions--bluetooth/da14531mod-00f01002-dialog-semiconductor-8189021

Proprietary RF Module, wireless technology, Transceiver ICs, Bluetooth device

DA14531MOD Series 3.6 V -93 dBm Sensitivity Surface Mount Bluetooth LE Module

[dnld2rrera]

https://www.futureelectronics.com/p/semiconductors--wireless-rf--rf-modules-solutions--gps/max-8q-0-u-blox-3122418

RF Modules, Digital rf modulator, Proprietary RF Module, Radio frequency module

MAX-8 Series 3.6 V u-blox 8 GNSS TCXO ROM Green 9.7x10.1 mm LCC Module

[stvn2kess]

https://www.futureelectronics.com/p/semiconductors--wireless-rf--rf-modules-solutions--gps/zed-f9h-01b-u-blox-7168460

Bluetooth Module, UHF Module, F Modules, UHF Module, Bluetooth Accessories

ZED-F9P Series 3.6 V 159 dBm Surface Mount U-Blox F9 High Precision GNSS Module

[chipt2rezz]

https://www.futureelectronics.com/p/semiconductors--wireless-rf--rf-modules-solutions--rfid/mlx90109edc-aaa-000-re-melexis-4229597

RFID Module, UHF Module, Proprietary RF Module, Rfid proprietary modules

MLX90109 Series 3.1 to 5.5 V 3 mA 125 kHz RFID Transceiver - SOIC-8

[addohaislam2000]

Bluetooth Module, GPS Module, proprietary GPS module, Proprietary RF Module

Bluetooth, WiFi 802.11a/b/g/n/ac, Bluetooth v5.0 Transceiver Module 2.4GHz, 5GHz

[mrvin2icks]

https://www.futureelectronics.com/p/semiconductors--wireless-rf--rf-modules-solutions--bluetooth/lbee5xv1ym-574-murata-1138828

Eless & RF, RF Modules & Solutions, Bluetooth, LBEE5XV1YM-574, Murata

1YM Series Dual Band WiFi 11a/b/g/n/ac and Bluetooth 5.2 Module

[pivsaxonthesbcshowdown]

Why India’s Drone Industry Needs Periplex: The Hardware Tool Drones Didn’t Know They Needed

As drones fly deeper into critical roles — from agricultural intelligence to autonomous mapping, from disaster response to military ops — the hardware stack that powers them is undergoing a silent revolution.

At the center of that transformation is Periplex — a breakthrough tool from Vicharak’s Vaaman platform that redefines how drone builders can interface with the real world.

What is Periplex?

Periplex is a hardware-generation engine. It converts JSON descriptions like this:{ "uart": [ { "id": 0, "TX": "GPIOT_RXP28", "RX": "GPIOT_RXN28" } ], "i2c": [ { "id": 3, "SCL": "GPIOT_RXP27", "SDA": "GPIOT_RXP24" }, { "id": 4, "SCL": "GPIOL_63", "SDA": "GPIOT_RXN24" } ], "gpio": [], "pwm": [], "ws": [], "spi": [], "onewire": [], "can": [], "i2s": [] }

…into live hardware interfaces, directly embedded into Vaaman’s FPGA fabric. It auto-generates the FPGA logic, maps it to kernel-level drivers, and exposes them to Linux.

Think of it as the “React.js of peripherals” — make a change, and the hardware updates.

Real Drone Applications That Truly Need Periplex

Let’s break this down with actual field-grade drone use cases where traditional microcontrollers choke, and Periplex thrives.

1. Multi-Peripheral High-Speed Data Collection for Precision Agriculture

Scenario: A drone is scanning fields for crop health with:

2 multispectral cameras (I2C/SPI)

GPS + RTK module (2x UART)

Wind sensor (I2C)

Sprayer flow monitor (PWM feedback loop)

ESCs for 8 motors (PWM)

1 CAN-based fertilizer module

The Periplex Edge: Microcontrollers would require multiple chips or muxing tricks, causing delays and bottlenecks. With Periplex:

You just declare all interfaces in a JSON file.

It builds the required logic and exposes /dev/pwm0, /dev/can0, etc.

Zero code, zero hassle, zero hardware redesign.

2. Swarm Communication and Custom Protocol Stacks

Scenario: Swarm drones communicate over:

RF LoRa (custom SPI/UART)

UWB mesh (proprietary protocol)

Redundant backup over CAN

Periplex lets you:

Create hybrid protocol stacks

Embed real-time hardware timers, parity logic, and custom UART framing — none of which are feasible in most MCUs

Replacing Microcontrollers, Not Just Augmenting Them

| Feature | Microcontroller | Periplex on Vaaman | |---------------------------|----------------------------|------------------------------------| | Number of peripherals | Limited (4–6) | Virtually unlimited (30+ possible) | | Reconfiguration time | Flash + reboot | Real-time, dynamic reload | | Timing precision | Software-timer limited | FPGA-grade nanosecond-level timing | | AI compatibility | Not feasible | Integrated (Gati Engine) | | Sensor fusion performance | Bottlenecked | Parallel FPGA pipelines |

Developers Love JSON, Not Register Maps

No more:

Scouring 400-page datasheets

Bitmasking registers for I2C configs

Writing interrupt handlers from scratch

Just declare what you need. Let Periplex do the work. Peripherals become software-defined, but hardware-implemented.

Built in India, for India’s Drone Revolution

Vaaman + Periplex isn’t just about tech. It’s about self-reliance.

India’s defence, agriculture, and logistics sectors need secure, reconfigurable, audit-friendly hardware — not black-box SoCs from questionable supply chains.

Periplex is the hardware engine for Atmanirbhar Bharat in drones.

TL;DR

Periplex lets drones adapt hardware to the mission — instantly.

It replaces tangled microcontroller logic with clean, structured JSON.

It unlocks use cases microcontrollers can’t touch: AI at the edge, dynamic reconfiguration, secure protocol stacks, and more.

And it’s built into Vaaman, India’s first reconfigurable edge computer.

Ready to Get Started?

Explore Vaaman on Crowd Supply Reach out for Periplex SDK access: contact@vicharak.in

Raspberry Pi

Drones

Drones Technology

Jetson Orin Nano

Technology

[literaturereviewhelp]

Jamming a Network: Jamming a network is a crucial problem occurs in the wireless networks. The air in the region of offices is probable stopped up with wireless networks and devices like mobile phones and microwaves. That undetectable traffic jam can cause interference troubles with the Wi-Fi system. Large number of consumer use devices such as microwave ovens, baby monitors, and cordless phones operate on the unregulated 2.4GHz radio frequency. An attacker takes advantage of this and unleash large amount of noise by using these devices and jam the airwaves so that the signal to noise go down, in the result wireless network stop to function. The best solution to this problem is RF proofing the nearby atmosphere.Unauthorized Access:The use of Wireless technologies is increasing rapidly and Wireless technology is much admired. So companies are exchanging their usual wired networks with wireless - even for non-mobile functions. There have been several warnings from security advisors regarding wireless protocols, Especially for WEP, being disgustingly insecure. Unauthorized access to wireless network can occur from different ways for example, when a user turns on a computer and it latches on to a wireless admittance point from a neighboring company’s overlapping network, the user may not even know that this has occurred. But, it is a security violate in that proprietary company information is exposed and now there could exist a link from one company to the other. Denial of Service:A denial-of-service attack is an effort to make computer resources unavailable to its intended users. It is the malicious efforts of a persons or number of persons to stop a web site or service from carrying out proficiently or at all. One general way of attack involves saturating the target machine with external communications requests, such that it cannot react to legitimate traffic, or responds so slowly as to be rendered effectively unavailable. It normally slows down the network performance. For example speed of opening files and closing files slow down. System will also be unable to access any web site. The bandwidth of a router linking the Internet and a local area network may be consumed by DoS. There are also other types of attack that may include a denial of service as a module, but the denial of service may be a part of a larger attack. Illegal utilization of resources may also result in denial of service. For instance, an interloper can use someone’s secret ftp area as a place to store illegal copies of commercial software, overwhelming disk space and generating network traffic. Man in the Middle:In the man in the middle attack an attacker sits between the client and the server with a packet analyzer. This is the disparity that most people think of when they hear the term man in the middle. There are also many other forms of the man in the middle attacks that exploit the fact that most networks communications do not use a strong form of authentication. Unless both ends of the session frequently verify whom they are talking to, they may very well be communicating with an attacker, not the intended system. References:1. Brenton, C. & Hunt, C. 2003. Network Security. 2nd Ed. New Delhi: BPB Publications.2. Hossein, B., 2005. The Handbook of Information Security. John Wiley & Sons, Inc.3. L. Blunk & J. Vollbrecht., 1998. PPP Extensible Authentication Protocol (EAP). Tech. Internet Engineering Task Force (IETF).4. Matthew, S. Gast., 2002. 802.11 Wireless Networks: The Definitive Guide: O’Reilly & Associates.5. Vikram, G. Srikanth, K. & Michalis, F., 2002. Denial of Service Attacks at the MAC Layer in Wireless Ad Hoc Networks. Anaheim, CA: Proceedings of 2002 MILCOM Conference. Read the full article

[spookysaladchaos]

Global Top 3 Companies Accounted for 93% of total Soft Tissue Dissection Device market (QYResearch, 2021)

The Soft Tissue Dissection Device precisely concentrate and deliver radiofrequency energy to cut and coagulate soft tissue.

Proprietary insulation technology and steady thermal control enable surgeons to cut with the precision of a scalpel and the bleeding control of traditional electrosurgery — while producing minimal thermal damage to surrounding tissue.

According to the new market research report “Global Soft Tissue Dissection Device Market Report 2023-2029”, published by QYResearch, the global Soft Tissue Dissection Device market size is projected to reach USD 0.2 billion by 2029, at a CAGR of 5.0% during the forecast period.

Figure.   Global Soft Tissue Dissection Device Market Size (US$ Million), 2018-2029

Based on or includes research from QYResearch: Global Soft Tissue Dissection Device Market Report 2023-2029.

Figure.   Global Soft Tissue Dissection Device Top 3 Players Ranking and Market Share（Based on data of 2021, Continually updated）

Based on or includes research from QYResearch: 2021 data information of Global Soft Tissue Dissection Device Market Report 2023-2029.

The global key manufacturers of Soft Tissue Dissection Device include Medtronic, J & J , etc. In 2020, the global top three players had a share approximately 93.0% in terms of revenue.

About QYResearch

QYResearch founded in California, USA in 2007.It is a leading global market research and consulting company. With over 16 years’ experience and professional research team in various cities over the world QY Research focuses on management consulting, database and seminar services, IPO consulting, industry chain research and customized research to help our clients in providing non-linear revenue model and make them successful. We are globally recognized for our expansive portfolio of services, good corporate citizenship, and our strong commitment to sustainability. Up to now, we have cooperated with more than 60,000 clients across five continents. Let’s work closely with you and build a bold and better future.

QYResearch is a world-renowned large-scale consulting company. The industry covers various high-tech industry chain market segments, spanning the semiconductor industry chain (semiconductor equipment and parts, semiconductor materials, ICs, Foundry, packaging and testing, discrete devices, sensors, optoelectronic devices), photovoltaic industry chain (equipment, cells, modules, auxiliary material brackets, inverters, power station terminals), new energy automobile industry chain (batteries and materials, auto parts, batteries, motors, electronic control, automotive semiconductors, etc.), communication industry chain (communication system equipment, terminal equipment, electronic components, RF front-end, optical modules, 4G/5G/6G, broadband, IoT, digital economy, AI), advanced materials industry Chain (metal materials, polymer materials, ceramic materials, nano materials, etc.), machinery manufacturing industry chain (CNC machine tools, construction machinery, electrical machinery, 3C automation, industrial robots, lasers, industrial control, drones), food, beverages and pharmaceuticals, medical equipment, agriculture, etc.

[govindhtech]

Intel Unveiling the OCI Chiplet Co-packaged with CPU

Intel OCI Chiplet In order to give the industry a glimpse into the future of high-bandwidth compute interconnect, Intel plans to showcase their cutting-edge Optical Compute Interconnect (OCI) chiplet co-packaged with a prototype of a next-generation Intel CPU running live error-free traffic at the Optical Fiber Conference in San Diego on March 26–28, 2024.

They also intend to showcase their most recent Silicon Photonics Tx and Rx ICs, which are made to enable new pluggable connectivity applications in hyperscale data centers at 1.6 Tbps.

Optical I/O as a Facilitator for AI Pervasiveness More people are using AI-powered apps, which will drive the global economy and shape society. This trend has been accelerated by recent advances in generative AI and LLM.

The development of larger and more effective Machine Learning (ML) models will be essential to meeting the growing demands of workloads involving AI acceleration. Exponentially increasing I/O bandwidth and longer reach in connectivity are required to support larger xPU clusters and more resource-efficient architectures like memory pooling and GPU disaggregation, which are made possible by the need to dramatically scale future compute fabrics.

High bandwidth density and low power consumption are supported by electrical I/O, or copper trace connectivity, but only at very short ranges of one meter or less. While early AI clusters and modern data centers use pluggable optical transceiver modules to extend their reach, these modules come at a cost and power that cannot keep up with the demands of AI workloads, which will require exponential growth in the near future.

AI/ML infrastructure scaling requires higher bandwidths with high power efficiency, low latency, and longer reach, all of which can be supported by a co-packaged xPU (CPU, GPU, and IPU) optical I/O solution.

Optical I/O Solution Based on Intel Silicon Photonics Based on its proprietary Silicon Photonics technology, Intel has created a 4 Tbps bidirectional fully integrated OCI chiplet to meet the massive bandwidth requirements of the AI infrastructure and facilitate future scalability. A single Silicon Photonics Integrated Circuit (PIC) with integrated lasers, an electrical IC with RF Through-Silicon-Vias (TSV), and a path to integrate a detachable/reusable optical connector are all present in this OCI chiplet or tile.

Next-generation CPU, GPU, IPU, and other System-on-a-Chip (SOC) applications with high bandwidth demands can be co-packaged with the OCI chiplet. With its first implementation, multi-Terabit optical connectivity is now possible with a reach of more than 100 meters, a <10ns (+TOF) latency, an energy efficiency of pJ/bit, and a shoreline density improvement of >4x over PCIe Gen6.

At OFC 2024 in San Diego on March 26–28 (Intel booth #1501), they intend to showcase their first-generation OCI chiplet co-packaged with a concept Intel CPU running live error-free traffic over fiber. This first OCI implementation, which is a 4 Tbps bidirectional OCI Chiplet compatible with PCIe Gen5, is realized as eight fiber pairs carrying eight DWDM wavelengths each. It supports 64 lanes of 32 Gbps data in each direction over tens of meters. Beyond this initial implementation, 32 Tbps chiplets are in line of sight for the platform.

Thanks to Intel’s unique ability to integrate DWDM laser arrays and optical amplifiers on the PIC, a single PIC in the current die-stack can support up to 8 Tbps bidirectional applications and has a complete optical sub-system, offering orders of magnitude higher reliability than conventional InP lasers. One of their high-volume fabrication facilities in the United States produces these integrated Silicon Photonics chips.

It has shipped over 8 million PICs with over 32 million on-chip lasers embedded in pluggable optical transceivers for data center networking, all with industry-leading reliability. In addition to its demonstrated dependability and improved performance, on-chip laser technology allows for true wafer-scale manufacturing, burn-in, and testing. This results in highly reliable and simple subsystems (e.g., the ELS and PIC are not connected by fibers) as well as efficient manufacturing processes.

Another unique selling point of OCI is that, unlike other technical approaches on the market, it does not require Polarization Maintaining Fiber (PMF) and can use standard, widely-deployed single-mode fiber (SMF-28). Due to the potential harm that system vibration and fiber wiggle can do to PMF’s performance and related link budget, it has not been used much.

As a crucial component enabling optical I/O technology, OCI is being developed and implemented by multiple groups within Intel. It demonstrates how Intel’s superior silicon, optical, packaging, and platform integration capabilities enable us to provide a comprehensive next-generation compute solution.

In order to enable ubiquitous AI, Intel’s field-proven Silicon Photonics technology and platform can offer the best optical connectivity options in terms of both performance and dependability.

FAQS What is Intel OCI? Optical Compute Interconnect is referred to as OCI. This is a new chiplet technology that transmits data via light rather than electricity.

What are the benefits of OCI for AI? When it comes to bandwidth, OCI Chiplet is far more generous than conventional electrical connections such as PCIe Gen 6. For AI applications that need to move large amounts of data, this is essential. With a lower power consumption per bit transferred (measured in picoJoules per bit), OCI is more energy-efficient. With less than 10 nanoseconds of delay, data travels thanks to its lower latency. OCI Chiplet is more capable of transmitting data than electrical interconnects over longer distances more than 100 meters

How does OCI work? OCI chiplet, a tiny chip made specifically to be integrated straight with other chips, such as GPUs and CPUs. Faster data transfer is made possible by this co-packaging, which enables a very short physical distance between OCI Chiplet and the main processor.

When will OCI be available? Intel is showcasing OCI Chiplet at the Optical Fiber Conference (OFC), which takes place from March 26–28, 2024, even though there isn’t an official release date yet. This implies that although the technology is still in development, a possible launch is getting closer.

Read more on Govindhtech.com

[lanshengic]

NXP introduces new top-cooled packaging technology for RF power devices to further reduce the size of 5G wireless products

NXP Semiconductors has announced a family of top-cooled RF amplifier modules featuring innovative packaging technologies that help create thinner and lighter wireless products for 5G infrastructure. Smaller base stations can improve the ease and economy of installation while allowing for a more decentralized integration into the environment. NXP’s family of GaN multi-chip modules combined with a new RF power device top cooling solution not only helps reduce the thickness and weight of radio products by more than 20%, but also reduces the carbon footprint of 5G base station manufacturing and deployment.

Pierre Piel said: "Top cooling technology presents a major opportunity for the wireless infrastructure industry. With this technology, we can combine high power capabilities with excellent thermal performance to create smaller RF subsystems. Based on this Innovative technological solutions allow us to deploy greener base stations while maintaining the network density required to realize the full performance benefits of 5G."

NXP's new top-cooled devices offer significant design and manufacturing advantages, such as eliminating the need for dedicated RF shielding, enabling the use of cost-effective and thinner printed circuit boards, and separating thermal management and RF design. These features help network solution providers create thinner and lighter 5G wireless products for mobile network operators, while shortening the overall product design cycle.

NXP's first family of top-cooled RF power modules is designed for 32T32R, 200W RF, covering the 3.3GHz to 3.8GHz frequency range. Combining NXP's proprietary LDMOS and GaN semiconductor technologies, the device combines high gain, high efficiency and wideband performance, delivering 31 dB gain and 46% efficiency at 400MHz instantaneous bandwidth.

Lansheng Technology Limited, which is a spot stock distributor of many well-known brands, we have price advantage of the first-hand spot channel, our main brands are STMicroelectronics, Toshiba, Microchip, Vishay, Marvell, ON Semiconductor, ect.

To learn more about our products, services, and capabilities, please visit our website at http://www.lanshengic.com

[hnry2elerr]

https://www.futureelectronics.com/p/semiconductors--wireless-rf--rf-modules-solutions--rfid/m24lr16e-rmc6t-2-stmicroelectronics-2067745

M24LR16E-R Series 5.5 V 400 kHz Read Surface Mount RFID - UDFN-8

[erw2oses]

GL7500-1103348, 4G 3G Fallback Modem, Small Form Factor for Easy Product Integration, Low-Power