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news24-amit · 13 days ago

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Powering the Future: Integrated Voltage Regulator Market to See Robust Growth Through 2031

The global Integrated Voltage Regulator (IVR) market was valued at US$ 5.6 billion in 2023 and is projected to expand at a compound annual growth rate (CAGR) of 6.6% between 2024 and 2031, reaching US$ 9.3 billion by the end of the forecast period. Integrated voltage regulators are critical power-management components that ensure stable and efficient voltage supply in modern electronic systems, from smartphones to electric vehicles.

Market Overview

Integrated Voltage Regulators (IVRs) combine semiconductor voltage regulation and pass components into a single integrated circuit (IC), reducing external components, improving efficiency, and minimizing PCB footprint. By streamlining power-management designs, IVRs replace complex PMIC solutions often dependent on discrete capacitors, resistors, and inductors offering manufacturers cost-effective, space-saving solutions for consumer electronics, automotive systems, industrial equipment, and more.

IVRs maintain constant output voltage amidst fluctuating input, supporting optimal device operation. Common applications range from laptop adapters and desktop motherboards to onboard automotive electronics and industrial automation controllers. As miniaturization accelerates and energy-efficiency requirements tighten, the adoption of IVRs is set to surge across multiple sectors.

Market Drivers & Trends

Miniaturization of Consumer Electronics: The consumer electronics market’s relentless push for thinner, lighter devices is driving demand for compact power-management ICs. IVRs, with minimal external components, enable portable electronics—smartphones, tablets, wearables—to shed bulk and reduce board complexity.

Automotive Electronics Proliferation: Electric and hybrid vehicles, advanced driver-assistance systems (ADAS), and infotainment platforms require stable, high-efficiency voltage regulation solutions. IVRs optimize battery management, reduce heat dissipation, and ensure consistent power delivery to critical safety and performance systems.

Power Efficiency and Thermal Management: Lower power consumption and improved thermal profiles are imperative for battery-powered devices. IVRs deliver high conversion efficiency, minimizing wasted energy and extending battery life in IoT endpoints, medical wearables, and handheld industrial instruments.

Industry 4.0 and IoT Expansion: The rise of smart factories and connected devices elevates the need for reliable power-supply modules. IVRs support distributed power architectures, providing precise voltage regulation across sensor networks, actuators, and edge-computing nodes.

Latest Market Trends

Hybrid Converter Designs: Manufacturers are blending inductive switching and switched-capacitor techniques to strike a balance between efficiency and size. Hybrid architectures leverage the low EMI of capacitive regulators and high efficiency of inductive designs for optimized performance.

Digital Control and Programmability: Digitally adjustable on-the-fly voltage scaling and fault-protection features are becoming standard. Programmable IVRs allow system designers to tailor voltage rails dynamically, improving transient response and system reliability.

Embedded Inductor Integration: Advanced packaging techniques now embed inductors directly within the IC substrate. Such Fully Integrated Voltage Regulators (FIVRs) reduce external BOM and improve power density, as demonstrated by recent 3D-stacked chiplet architectures.

Automotive-Grade Qualification: Stringent AEC-Q100 certification requirements are pushing IVR vendors to deliver parts qualified for extreme temperature, vibration, and reliability needs of automotive applications.

Key Players and Industry Leaders

The global IVR market is moderately consolidated, with leading semiconductor firms and specialized power-IC vendors competing on efficiency, integration level, and feature set. Prominent players profiled in the latest market report include:

Analog Devices, Inc.

Empower Semiconductor, Inc.

Globaltech Semiconductor Co., Ltd.

Infineon Technologies AG

Intel Corporation

Microchip Technology Inc.

Nisshinbo Micro Devices Inc.

NXP Semiconductors N.V.

Qualcomm Incorporated

Renesas Electronics Corporation

Semtech Corporation

STMicroelectronics N.V.

Texas Instruments Incorporated

Vishay Intertechnology, Inc.

Other Key Players

Recent Developments

January 2023: Nisshinbo Micro Devices launched the NR1600 series LDO regulators, supporting up to 500 mA output and 6.5 V input rating for consumer and industrial applications.

March 2022: Empower Semiconductor introduced the EP71xx quad-output step-down IVR series, offering up to 12 A per channel with digitally controlled dynamic voltage scaling, eliminating the need for external passives.

June 2022: Intel unveiled its FIVR architecture featuring embedded inductors and self-trimmed, digitally controlled ON-Time DCM approaches, achieving up to 37.6% higher efficiency than traditional LDOs in 22 nm 3D-TSV stacked packages.

March 2020: ABLIC Inc. released the S-19310/S-19315/S-19316 automotive LDO regulator series with integrated voltage monitoring, targeting safety-critical in-vehicle systems.

Market Segmentation

By Component: LDO, Inductive Switching (buck-boost), Switched-Capacitor, Hybrid, Pure.

By Input Voltage: Low (<7 V), Mid (7–30 V), High (>30 V).

By Packaging: 2.5D, Flip Chip, WLCSP, 3D IC, FOWLP, Hybrid Bonding, SiP, Others.

By Application: Automotive (Infotainment, ADAS, Battery Management), Consumer Electronics (Wearables, Computing, Home Appliances), Energy & Utility (Energy Meters, Solar), Industrial (HMI, HVAC, Motor Drives), IT & Telecom (Base Stations, Data Centers), Aerospace & Defense, Others (Healthcare, Oil & Gas).

By Geography: North America, Europe, Asia Pacific, Central & South America, Middle East & Africa.

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Regional Insights

Asia Pacific (APAC): Dominant market with 42.2% share in 2023, driven by China’s consumer electronics manufacturing, expanding IoT deployment in Southeast Asia, and robust industrial automation investment in South Korea and Japan.

North America: Strong foothold with rapid adoption in automotive electronics and edge data-center power supplies. The U.S. market benefits from Intel, Texas Instruments, and Analog Devices’ R&D hubs.

Europe: Growth fueled by stringent energy-efficiency regulations and electrification of transport. Germany and France lead in automotive and industrial power-management uptake.

Central & South America, MEA: Emerging opportunities in telecom infrastructure, renewable-energy inverters, and mining automation projects.

Market Opportunities

Electric Vehicle (EV) Expansion: As EV penetration accelerates globally, the need for high-efficiency, automotive-grade IVRs for battery management and auxiliary systems grows exponentially.

5G Infrastructure Rollout: Telecom base stations and small cells require multi-rail power supplies with fast transient response—an apt use case for digitally controlled IVRs.

Wearable and Medical Electronics: Regulatory approval and miniaturization demands create niches for ultra-small, low-noise LDO and buck-boost IVRs in health-monitoring devices.

Renewable Energy Systems: Distributed solar inverters and microgrid controllers benefit from compact, high-current IVRs that can manage variable DC inputs from photovoltaic panels.

Future Outlook

The integrated voltage regulator market is poised for sustained growth through 2031, underpinned by continuing device miniaturization, rising automotive electrification, and the digital transformation of industrial systems. Continued R&D into new materials, monolithic magnetic integration, and AI-driven control algorithms will further boost regulator efficiency and functionality, unlocking fresh applications across emerging sectors.

Why Buy This Report?

Comprehensive Data: In-depth analysis of historical data (2017–2022) and forward-looking forecasts to 2031.

Strategic Insights: Detailed chapter on Porter’s Five Forces, value-chain mapping, and regulatory environment.

Competitive Intelligence: Profiles of 15+ key players, including market share analysis and strategic roadmaps.

Segmentation Analysis: Cross-segment and regional breakdowns highlight high-growth pockets.

Actionable Recommendations: Expert perspectives on technology trends, investment hotspots, and risk mitigation strategies.

Flexible Formats: Delivered in PDF and fully editable Excel formats for custom data querying.

Explore Latest Research Reports by Transparency Market Research: Photonic Integrated Circuits (PIC) Market: https://www.transparencymarketresearch.com/photonic-integrated-circuit.html

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About Transparency Market Research Transparency Market Research, a global market research company registered at Wilmington, Delaware, United States, provides custom research and consulting services. Our exclusive blend of quantitative forecasting and trends analysis provides forward-looking insights for thousands of decision makers. Our experienced team of Analysts, Researchers, and Consultants use proprietary data sources and various tools & techniques to gather and analyses information. Our data repository is continuously updated and revised by a team of research experts, so that it always reflects the latest trends and information. With a broad research and analysis capability, Transparency Market Research employs rigorous primary and secondary research techniques in developing distinctive data sets and research material for business reports. Contact: Transparency Market Research Inc. CORPORATE HEADQUARTER DOWNTOWN, 1000 N. West Street, Suite 1200, Wilmington, Delaware 19801 USA Tel: +1-518-618-1030 USA - Canada Toll Free: 866-552-3453 Website: https://www.transparencymarketresearch.com Email: [email protected]

#Integrated Voltage Regulator (IVR) market

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electronic22 · 2 months ago

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Why Do Electronic Devices Rely on Voltage Regulators? Discover Their Role in Reliable Power Management

In the complex world of electronics, maintaining consistent and precise voltage levels is essential for stable operation. Voltage regulators are the components tasked with this responsibility. They safeguard electronic circuits from power fluctuations, ensuring each part of a system functions correctly and efficiently. Whether in smartphones, medical devices, or industrial machines, voltage regulators form the foundation of dependable power delivery.

Modern devices are more compact and power-sensitive than ever. To accommodate these needs, Power Management ICs (PMICs) integrate voltage regulators into a single chip, streamlining energy distribution across various modules while optimizing board space and reducing heat.

What Makes Voltage Regulators Indispensable in Modern Technology?

Voltage regulators manage energy flow within an electronic circuit by keeping the output voltage at a steady level, regardless of variations in input voltage or current draw. This stability prevents component damage, data corruption, and overheating.

Two main approaches are used to regulate voltage:

Linear Regulation – In this method, excess input voltage is dissipated as heat. It’s simple, low-noise, and ideal for analog applications but less efficient.

Switching Regulation – This technique involves rapidly switching elements on and off to control energy transfer. It uses inductors and capacitors to maintain output voltage and offers high efficiency, especially for battery-powered systems.

Each approach suits different power requirements, with linear regulators preferred for simplicity and switching regulators chosen for efficiency.

What Are the Primary Types of Voltage Regulators?

Different electronic systems demand different power control techniques. To meet these demands, several types of voltage regulators have been developed:

Fixed Voltage Regulators Deliver a specific, constant output voltage. Commonly used in basic electronic projects and legacy systems.

Adjustable Voltage Regulators Provide a user-defined output voltage through external resistors, allowing more control for complex circuit needs.

Low Dropout (LDO) Regulators Efficient in low-voltage scenarios, these require only a minimal difference between input and output voltages and are favored in portable devices.

Buck (Step-Down) Converters Reduce input voltage to a lower output voltage with high efficiency, ideal for powering low-voltage microcontrollers from higher-voltage sources.

Boost (Step-Up) Converters Increase input voltage to a higher output voltage. Common in systems where a small power source, like a battery, must supply higher-voltage components.

Buck-Boost Converters Adaptively raise or lower voltage based on input conditions, offering flexibility for unstable power sources.

How Do Power Management ICs Improve Efficiency with Built-In Regulators?

Power Management ICs are comprehensive solutions that include multiple voltage regulators in a compact chip. These integrated circuits optimize how power is distributed across processors, memory, communication modules, and sensors.

Reduce the need for multiple discrete regulators on a board

Minimize power loss and heat generation

Simplify circuit design and reduce footprint

Allow programmable voltage settings for dynamic power demands

PMICs are widely used in mobile devices, embedded systems, and IoT applications where power efficiency and miniaturization are priorities.

Where Are Voltage Regulators Used Across Industries?

Voltage regulators are not confined to just one sector. Their versatility makes them a backbone in numerous applications:

Automotive Electronics Stabilize voltage for sensors, infotainment systems, LED lighting, and engine control units under constantly changing electrical conditions.

Consumer Electronics Ensure consistent power delivery to cameras, smartphones, gaming consoles, and laptops, improving battery performance and device lifespan.

Medical Equipment Deliver safe and steady power to critical instruments like heart monitors, diagnostic devices, and portable defibrillators.

Industrial Automation Manage power for programmable logic controllers (PLCs), motors, and robotic systems operating in high-demand, noisy environments.

Telecommunication Infrastructure Provide efficient power to signal processors, antennas, and routers, supporting high-speed data transmission.

What Should You Consider When Choosing a Voltage Regulator?

Selecting the right voltage regulator requires evaluating several technical factors that align with your application’s needs:

Input and Output Voltage Range Ensure compatibility between source and required device voltage.

Current Capacity Choose a regulator that can handle the peak current draw without overheating.

Efficiency Requirements For battery-powered or heat-sensitive designs, prioritize switching regulators or PMICs with high efficiency.

Noise Sensitivity For audio, RF, or precision analog systems, opt for linear regulators with minimal ripple and electromagnetic interference.

Thermal Management Consider regulators with built-in thermal protection or those requiring heat sinks for high-load operations.

Why Are Voltage Regulators Critical for Next-Generation Electronics?

As electronic systems continue to grow more powerful and compact, the importance of voltage regulation increases. Designers must strike a balance between performance, efficiency, and size. Voltage regulators, particularly those integrated into Power Management ICs, enable engineers to meet these demands by delivering reliable, adaptable, and energy-efficient power solutions.

Their role goes beyond simply powering circuits — they form the nerve center of power distribution, enabling innovation across industries.

#ecommerce #Voltage Regulators #Enrgtech #Electronic components #Electricalparts

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harsh24mr · 10 months ago

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govindhtech · 1 year ago

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HP Laptop SSD FX700: The Key to Blazing Fast Performance

HP Laptop SSD FX700 Spotlight

Speed, reliability, and low power consumption are improved by upgrading to HP FX700 SSD. HP FX700 PCIe SSD has 7200 MB/s read and 6200 MB/s write speeds with a 4-channel PCIe Gen4 controller with NVMe 2.0. Get quicker speeds, lower power usage, and increased dependability by upgrading your PC or laptop. Laptop batteries last longer with little power use.

PCIe 4 has double the transfer speed of PCIe 3. PCIe Gen4 technology lets HP Laptop SSD FX700 read and write sequentially at 7200 and 6200 MB/s. This HP Laptop SSD upgrade offers speed, simplicity, and minimal power usage.

Enjoy all the advantages that come with significantly improved performance

With its cutting-edge PCIe Gen4 x4 NVMe controller and NVMe 2.0 interface, HP Laptop SSD FX700 enhances responsiveness, application loading, game loading, and multitasking. Creators and avid gamers benefit from improved efficiency and performance.

4 TB, more space for what matter this latest generation of NAND Flash allows the HP Laptop SSD FX700 to have a longer lifetime and a greater capacity for storage. There is a capacity of up to 4 terabytes available for it. The amount of space available to you will be sufficient for storing your preferred music, films, videos, photographs, and games.

For improved heat dissipation for improved heat dissipation a Graphene Thermal Pad is recommended. When you are at the busiest peak of your work or play, the HP Laptop SSD FX700 comes with a graphene thermal pad that has a thickness of 0.5 millimetres.

This pad helps to reduce temperatures and ensures more dependable performance. Your content production will be able to punch through any hard task with more dependability and quicker speed once you upgrade to the HP Laptop SSD FX700 . This is true regardless of whether you are in the business of digital design, rendering in three dimensions, video blogging, or gaming that is more than casual.

Power-Saving Design that allows for an Extended Lifespan the FX700 PCIe Gen4 x4 SSD has a PMU and PMIC in the host controller, resulting in reduced power consumption and lower operating expenses. Laptops with minimal power needs have a longer battery life than those with higher power profiles.

Maintaining data integrity requires stability and reliability excellent stability and dependability are shown by HP FX700 4 TB’s 2,000,000 hours MTBF or 1600 TBW. A worry-free guarantee that lasts for five years is also included.

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semimediapress · 2 years ago

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STMicroelectronics releases automotive PMIC integrating CAN FD and LIN to enable simpler car-body controllers

October 3, 2023 /SemiMedia/ — STMicroElectronics recently released the SPSB081 automotive power management IC, which features a main fixed-voltage low-dropout regulator (LDO), a secondary programmable LDO, four high-side drivers, a CAN FD transceiver and an optional LIN transceiver. The ICs provide multiple standby modes with very low quiescent current and programmable local or remote wake-up to…

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lanshengic · 2 years ago

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Microchip SAM9X70 ultra-low power MPU for high-performance connectivity and user interface applications

【Lansheng Technology News】On September 15, Microchip Technology released the SAM9X70 series MPU, which combines high performance, low power consumption, low system cost and high value. With the support of the powerful 800MHz Arm Thumb® processor, it provides a range of impressive connectivity options, rich user interface features and outstanding security features.

Microchip Technology SAM9X70 MPU is equipped with the ARM926EJ-S core, the CPU operating frequency is up to 800 MHz, and the system processing frequency is up to 266 MHz. On-chip memory includes 176-KB internal ROM, 64-KB internal SRAM, DDR3(L)/DDR2 controller and external bus interface (EBI). This MPU also supports various non-volatile memory (NVM) interfaces, including NAND flash, Quad SPI and eMMC flash. The SAM9X70 MPU achieves ultra-low power consumption through a real-time clock (RTC), 32-bit GP register, clock generator, power management controller, and software-programmable ultra-low power modes and optimization features.

In addition to its powerful processing capabilities and ultra-low power consumption features, what further enhances the performance of the SAM9X70 series is its rich on-chip peripheral interfaces. This series of MPUs feature 10/100/1000 Mbps Ethernet interfaces and support Time Sensitive Networking (TSN) connections, providing stable message delivery over standard Ethernet networks. The devices also offer MIPI-DSI, LVDS, RGB and 2D graphics interfaces, MIPI-CSI-2, Gigabit Ethernet with TSN and CAN-FD support for connectivity and user interface applications. Other connectivity options include an LCD controller, an image sensor controller, 13 FLEXCOMs, an ADC, a PWM controller, a Hi-Speed USB device/three Hi-Speed USB hosts, and more.

In addition to connecting peripherals, the SAM9X70 series also has powerful security features, such as secure boot using on-chip secure key storage (OTP), which can effectively prevent unauthorized users from stealing keys; high-performance encryption accelerators (SHA, AES and TDES) to protect confidential information and encrypt sensitive data. Additional security features include tamper protection and a Physical Unclonable Function (PUF) that generates keys on demand and clears them immediately after use.

Microchip Technology SAM9X70 MPU is available in a 240-ball BGA package. These MPUs are ideal for Internet of Things (IoT) applications, automotive, connected devices and user interfaces.

The SAM9X70 family is supported by Microchip MPLAB®-X development tools, Harmony, Linux® distributions and Ensemble Graphics Toolkit. When used with power management integrated circuits (PMICs) such as the MCP16501 and MCP16502, the SAM9X70's power-sequencing capabilities provide a fully tested power management solution.

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#electronic components #semiconductor #chip model #chip manufacturing #electronic #lanshengic

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andapt-pmic · 2 years ago

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AnDAPT provides ideal power supply solutions for Xilinx FPGAs, SoCs, and MPSoCs including Zynq, Virtex, Kintex, Versal, Artix-7 and Spartan. These power solutions are characterized by high performance, unprecedented consolidation, unparalleled flexibility, and cost-effectiveness. AnDAPT technology and product support makes powering FPGAs easier than ever

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alliedcomponentsinternational · 5 years ago

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#programmable pmic #Google’s Coral AI Ecosystem

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marketinsightshare · 3 years ago

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Panel Level Packaging Market Size Forecast to Reach $3.5 Billion by 2026

Panel Level Packaging Market Size is forecast to reach $3.5 billion by 2026, at a CAGR of 18.5% during 2021-2026. Panel Level packaging (PLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration, larger substrates formats also are targeted. In addition, manufacturers are increasingly driving their suppliers to provide panel -processing tools and materials to allow them to bring wafer-level precision to package processed on panel substrates. This packaging is used in the packaging of field programmable gate array (FPGA), CPU/GPU, power management IC module, baseband, and others. Cost-effective packaging solution and flexible circuit designs are some of the major influencing factors for the growth of panel level packaging industry. Especially, the smaller form factor with enhanced thermal performance has generated huge demand for panel-level packaging technology among several industrial applications such as consumer electronics, automotive, aerospace & defense, telecommunication, and others. Additionally, Panel Level Packaging have been observing several advancements in technology over the past few years, owing to which Panel Level Packaging Market is gaining traction in the forecast period 2021-2026.

Panel Level Packaging Market Segment Analysis - By integration type

Fan-out Panel Level Packaging segment is expected to hold significant share of 51% in 2020. Several packaging houses are implementing panel-level fan-out, a low-density technology that promises to lower the cost of fan-out. Fan-out Panel Level Packaging segment is expected to be essential for future applications on 5G, AI, Biotech, Advanced Driver- Assistance System (ADAS), smart city, and IoT related products. In addition ability to develop advanced packing and testing services and secure customer relations serve as major factors which are diving the market growth in the forecast period. Fan-out Panel Level Packaging segment finds large-scale applications in the consumer electronics sector to design ultra-thin portable devices such as smartphones, smart watches, and laptops as they offer high-performing, energy-efficient, thin, and small form factor packages. Surge in demand for high-power, miniaturized packaged ICs due to rise in popularity of IoT and technologically improved compact electronic devices such as smartphones, smart watches, tablet, TVs among others primarily drives the packaging technology fan-out wafer level market growth.

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Panel Level Packaging Market Segment Analysis - By Industry Vertical

Consumer Electronics sector is expected to witness a highest CAGR of 19.9% the forecast period, as this segment is powering a new wave of developments in electronic packaging. According to Consumer Technology Association, Consumer Electronic retail sales are expected to grow 4.3% in this year to $461 billion. With increasing consumer electronic sales year on year, the demand for panel-level packaging significantly rises. Further, Berlin’s Fraunhofer IZM is the place to be for leading industry players wishing in developing the fundamental processes for the new panel-level packaging and creates viable first demonstrators on large-scale organic substrate formats in the consumer electronics. After the successful venture for two years, the consortium is focused on embracing new members with new research avenues, In 2020, Systems Engineering & Management Company (SEMCO) achieved a new milestone by rolling out APE-PMIC devices with FO (Fan-Out) embedded panel-level packaging (ePLP) PoP technology for Samsung Galaxy Watch. Similarly in 2020, SEMCO announced to continue to innovate for a cost-effective HDFO market space to compete with TSMC for Apple’s packaging and FE business again. In addition, SEMCO’s HDFO is anticipated to be utilized first in Samsung’s cellphones. Besides, a restructure between SEMCO, and Samsung Electronics could be favorable for Samsung’s position as the full turnkey provider for a FE+BE bundle. In June 2020, Samsung Electronics Co Ltd announced that they began construction of a new domestic production line for NAND flash memory chips, betting on demand for personal computers and servers as the coronavirus prompts more people to work from home. Samsung mentioned that the additional capacity would also help meet the demand for 5G smartphones and other devices despite recent delays in deployments of 5G networks in Europe and other countries due to pandemic. The production line for NAND memory significantly raises the demand for panel level packaging market.

Panel Level Packaging Market Segment Analysis - By Geography

Panel Level Packaging market in Asia-Pacific region held significant market share of 35.5% in 2020. With the presence of several significant vendors in the power electronics market, which are actively investing for the development of advanced panel-level packaging technology. According to the Semiconductor Industry Association (SIA), Asia-Pacific generates more than 50% revenue in the global semiconductor sales. As Panel level packaging technology is used for the packaging of various semiconductor products, including a field-programmable gate array (FPGA), CPU/GPU, and power management IC module, baseband, WiFi devices, RF devices, transducers, and networking & servers, hence growth of semiconductor industry will drive the market growth. In the Smart phone application, PLP is primarily used for fingerprint sensor with its packaged thickness of < 0.2T. In this regard, APAC is considered as a hot spot for sensor chip manufacturing as most of the smartphone companies including Apple Inc., Samsung Electronics, Xiaomi Corporation, and others have their manufacturing units in the Asia-Pacific region. In addition, the growing penetration of 5G wireless communication and high performance computing has enabled the manufacturers to come up with newer technologies. For instance, Taiwan Semiconductor Manufacturing Company Limited (TSMC) is planning to extend its panel level packing segment into technologies like in Fan Out-Antenna-in-Package (AiP) and inFO-on-Substrate (oS). Hence these factors drive the Panel Level Packaging market industry outlook in the forecast period 2021-2026.

Panel Level Packaging Market Drivers

High Growth in Processing Technologies for Semiconductor Industry

Semiconductor components such as memory chips, logic, analog components, micro processing unit (MPU), discrete, sensors and others have seen a surge in demand due to increased sales of the consumer as well as industrial electronics products. Sophisticated electronics components in wearable electronics and IoT based products demand fast processing of electronic devices circuits which in turn has created potential space for highly flexible ICs withstanding greater thermal resistance and physical performance. To cater to the need of enhanced ICs for high-end industrial applications in automotive, electronics, aerospace, telecommunication and others, level packing technology providers are moving from traditional wafer-based packaging to new packaging technologies like FOWLP. According to Semiconductor Industry Association (SIA), memory, logic, analog, and MPU related semiconductor products accounts for more than 80% of the total sales in the semiconductor industry; hence providing a surged opportunity for market leaders to focus on packaging process for these particular products.

Growing R&D activities

Manufacturers are continuously focusing on R&D to develop new and effective Panel Level Packaging solutions to meet consumer demand. In 2019, TDK America showcased AFM 15 Flip Chip GGI Die Bonder and PLP Load Port at SEMICON West 2019. AFM 15 for GGI flip-chip back end assembly packaging allows for die-sized capability 80?m2 ~ 20mm2, low energy dies bonding, a clean, lead-free process, and high productivity. This type of development will enhance the production process. Furthermore, in November 2019, Quik -Pak, announced it acquired Santa Clara -based QBBS for broadening its portfolio of the wafer preparation services. This addition of QBBS’s automated capability enables Quik-Pak in processing customer wafers in large volumes. Quik-Pak will integrate the QBBS technology into its wafer prep line in 2020. In 2019, Samsung Electronics acquired the panel level packaging business unit from its own Samsung Electro-Mechanics company to enhance its capability in the panel level packaging market. This is also, to regain Apple Inc.'s contract for application processor development, which has been taken by Taiwan Semiconductor Manufacturing Company, Limited (TSMC) in 2015 through commercialization of its FOWLP (Fan Out-Wafer Level Package) technology. Hence these factors are analysed to drive the market growth in the forecast period 2021-2026.

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Panel Level Packaging Market Challenges

High initial Cost

Fan-out packaging on a large square panel is significantly more difficult, and mass adoption is not expected anytime soon. High initial investment for setting up a panel level packaging is analyzed to hamper the market growth, several companies such as Advanced Semiconductor Engineering, Inc. (ASE), Powertech, Nepes, and Samsung are looking to panel-level packaging to reduce cost of investment. According to ASE, It costs about $100 million to $200 million to build a panel-level production line. This high initial cost of setup hinder the market growth in the forecast period 2021-2026.

Panel Level Packaging Market Landscape

Product launches, acquisitions, Partnerships and R&D activities are key strategies adopted by players in the Panel Level Packaging market. Panel Level Packaging top 10 companies include Amkor Technology, Inc., Deca Technologies, Lam Research Corporation, ASE Group, Siliconware Precision Industries Co., Ltd., Fraunhofer Institute for Reliability and Micro integration IZM, Taiwan Semiconductor Manufacturing Company, Shinko Electric Industries Co, Ltd., Samsung Electro-Mechanics, Jiangsu Changjiang Electronics Tech Co. among others.

Acquisitions/Product Launches

In 2020, Taiwan Semiconductor Manufacturing (TSMC) announced plans to build a $12 billion factory in Arizona with support from the state and the U.S. government. TSMC said the plant would be able to produce 20,000 semiconductor wafers a month, directly employing more than 1,600 people.

In 2019, Deca Technologies has reached an agreement with nepes Corporation whereby nepes will expand its geographic footprint and manufacturing capabilities by taking over the operations of Deca Technologies Philippines manufacturing facility.

Key Takeaways

Consumer Electronics sector is expected to witness a highest CAGR of 19.9% the forecast period, as this segment is powering a new wave of developments in electronic packaging.

According to Semiconductor Industry Association (SIA), memory, logic, analog, and MPU related semiconductor products accounts for more than 80% of the total sales in the semiconductor industry; hence providing a surged opportunity for market leaders to focus on packaging process for these particular products.

Panel Level Packaging companies are strengthening their position through mergers & acquisitions and continuously investing in research and development (R&D) activities to come up with solutions to cater to the changing requirements of customers.

Related Reports

A.Fan-out Panel-level Packaging Market

https://www.industryarc.com/Research/Fan-out-Panel-level-Packaging-Market-Research-507535

B.Image Sensors Market

https://www.industryarc.com/Report/15000/image-sensors-market.html

For more Electronics Market reports, please click here

#Panel Level Packaging Market #Panel Level Packaging Market share Panel Level Packaging Market size

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sweetyiarc · 3 years ago

Text

Panel Level Packaging Market Size Forecast to Reach $3.5 Billion by 2026

Panel Level Packaging Market Segment Analysis - By integration type

Request for Sample Report @ https://www.industryarc.com/pdfdownload.php?id=509499

Report Price: $ 5900 (Single User License)

Panel Level Packaging Market Segment Analysis - By Industry Vertical

Panel Level Packaging Market Segment Analysis - By Geography

Panel Level Packaging Market Drivers

High Growth in Processing Technologies for Semiconductor Industry

Growing R&D activities

Inquiry Before Buying @ https://www.industryarc.com/reports/request-quote?id=509499

Panel Level Packaging Market Challenges

High initial Cost

Panel Level Packaging Market Landscape

Acquisitions/Product Launches

Key Takeaways

Consumer Electronics sector is expected to witness a highest CAGR of 19.9% the forecast period, as this segment is powering a new wave of developments in electronic packaging.

Related Reports

A.Fan-out Panel-level Packaging Market

https://www.industryarc.com/Research/Fan-out-Panel-level-Packaging-Market-Research-507535

B.Image Sensors Market

https://www.industryarc.com/Report/15000/image-sensors-market.html

For more Electronics Market reports, please click here

#PanelLevelPackagingMarket #PanelLevelPackagingMarketShare #PanelLevelPackagingMarketSize

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marketwire · 3 years ago

Text

Panel Level Packaging Market Size Forecast to Reach $3.5 Billion by 2026

Panel Level Packaging Market Segment Analysis - By integration type

Request for Sample Report @ https://www.industryarc.com/pdfdownload.php?id=509499

Report Price: $ 5900 (Single User License)

Panel Level Packaging Market Segment Analysis - By Industry Vertical

Panel Level Packaging Market Segment Analysis - By Geography

Panel Level Packaging Market Drivers

High Growth in Processing Technologies for Semiconductor Industry

Growing R&D activities

Inquiry Before Buying @ https://www.industryarc.com/reports/request-quote?id=509499

Panel Level Packaging Market Challenges

High initial Cost

Panel Level Packaging Market Landscape

Acquisitions/Product Launches

Key Takeaways

Consumer Electronics sector is expected to witness a highest CAGR of 19.9% the forecast period, as this segment is powering a new wave of developments in electronic packaging.

Related Reports

A.Fan-out Panel-level Packaging Market

https://www.industryarc.com/Research/Fan-out-Panel-level-Packaging-Market-Research-507535

B.Image Sensors Market

https://www.industryarc.com/Report/15000/image-sensors-market.html

For more Electronics Market reports, please click here

#Panel Level Packaging Market #Panel Level Packaging Market share #Panel Level Packaging Market size

0 notes

industryarcmarketresearch · 3 years ago

Text

Panel Level Packaging Market Size Forecast to Reach $3.5 Billion by 2026

Panel Level Packaging Market Segment Analysis - By integration type

Request for Sample Report @ https://www.industryarc.com/pdfdownload.php?id=509499

Report Price: $ 5900 (Single User License)

Panel Level Packaging Market Segment Analysis - By Industry Vertical

Panel Level Packaging Market Segment Analysis - By Geography

Panel Level Packaging Market Drivers

High Growth in Processing Technologies for Semiconductor Industry

Growing R&D activities

Inquiry Before Buying @ https://www.industryarc.com/reports/request-quote?id=509499

Panel Level Packaging Market Challenges

High initial Cost

Panel Level Packaging Market Landscape

Acquisitions/Product Launches

Key Takeaways

Consumer Electronics sector is expected to witness a highest CAGR of 19.9% the forecast period, as this segment is powering a new wave of developments in electronic packaging.

Related Reports

A.Fan-out Panel-level Packaging Market

https://www.industryarc.com/Research/Fan-out-Panel-level-Packaging-Market-Research-507535

B.Image Sensors Market

https://www.industryarc.com/Report/15000/image-sensors-market.html

For more Electronics Market reports, please click here

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IndustryARC primarily focuses on cutting edge technologies and newer Applications in a Market. Our Custom Research Services are designed to provide insights on the constant flux in the global supply-demand gap of markets. Our strong team of analysts enables us to meet the client research needs at a rapid speed, with a variety of options for your business.

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#PanelLevelPackagingMarket #PanelLevelPackagingMarketshare

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technogeekstmr · 5 years ago

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Power Management Integrated Circuit (PMIC) Market Size, Analytical Overview, Growth Factors, Demand, Trends And Forecast To 2027

Providers of power management integrated circuit (PMIC) solutions have been tapping into the wide cross-section of demands for ICs in space-constrained applications. Revenue streams in the power management ICs market stem from the need for high-power density and a configurable power management design in computationally intensive platforms, notes Transparency Market Research. Key players have been seeing new opportunities from the constant flux of wearable, sensors, and internet of things devices in several industry verticals. They are quick to unveil solutions that increase programmability, maximize performance per watt, and reduce power dissipation.

Some of the companies who have been at the forefront of the revenues in the PMIC market are Maxim Integrated Products, Texas Instruments, Inc., ON Semiconductor Corporation, Mitsubishi Electric Corporation, STMicroelectronics N.V., and Analog.

The global PMIC market is projected to climb to US$ 56.48 bn by the end 2026, clocking a CAGR of 4.6% from 2018 to 2026.

Interpret a Competitive outlook Analysis Report with PDF Brochure – https://www.transparencymarketresearch.com/sample/sample.php?flag=B&rep_id=749

Rapid Uptake of Portable Consumer Electronics Fuel Application

Automotive manufacturers and industrial sectors adopting voltage converters and regulators are key factors propelling the expansion of the global PMIC market. World over, there has been substantial uptake of PMICs extending battery life and reducing power dissipation in several of the compact devices hitting the consumer markets. Over the years, various emerging consumer markets have seen a surge of such devices. A large drive for the business proposition for PMICs stems from the proliferating sales of such consumer electronics, most notably smartphones.

Semiconductor devices with configuration and programmable features are gathering traction among electronics manufacturers in various parts of the world. A case in point is the growth in popularity of field-programmable gate array and systems-on-chip semiconductor ICs.

Deluge of Mobile Connected Devices Reflects on Promising Avenues of Emerging Markets

Several of aforementioend growth factors are the salient characteristics of emerging markets, notably Asia Pacific. In fact, the report projects the Asia Pacific PMIC market to expand at CAGR of 5.5% from 2018 to 2026. Proliferating demands for Li-ion battery-based applications in portable devices among the regional consumers have catalyzed the rise in opportunities in the regional market. Further, the growth has been fueled by the rapid applications of PMICs in automotive.

The deluge of mobile connected devices has kept the prospect of Asia Pacific substantially lucrative in the global PMIC market over the past few years. Further, the rapidly growing demands for PMIC in networking devices in the key economies of the region has also driven new prospects in the market.

Growing demand for energy-efficient products have propelled the popularity of low-power PMICs. The uptake has been motivated increasingly by government regulations to optimize the energy consumption and heat dissipation from consumer electronics. Advances made in wearable have also stimulated high level of integration of chips, thus unlocking new potential in the global PMIC market. Semiconductor companies striving for solutions that reduce the standby power consumption of an appliance has expanded the scope of innovations in the market.

The study presented here is based on a report by Transparency Market Research (TMR) titled “Power Management Integrated Circuit (PMIC) Market (Product - Voltage Regulators, Motor Control IC, Integrated ASSP Power Management IC, Battery Management IC, Microprocessor Supervisory IC; End use - Automotive, Consumer Electronics, Industry, Telecom and Networking) - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2018 – 2026.”

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Our reports are single-point solutions for businesses to grow, evolve, and mature. Our real-time data collection methods along with ability to track more than one million high growth niche products are aligned with your aims. The detailed and proprietary statistical models used by our analysts offer insights for making right decision in the shortest span of time. For organizations that require specific but comprehensive information we offer customized solutions through ad hoc reports. These requests are delivered with the perfect combination of right sense of fact-oriented problem solving methodologies and leveraging existing data repositories.

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govindhtech · 2 years ago

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