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t2mip · 6 days ago

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Accelerate Wireless Innovation with Wi-Fi 7 (802.11be) RF Transceiver IP Core

T2M IP, a global leader in semiconductor IP cores and advanced connectivity solutions, has announced the availability of its partner’s cutting-edge Dual-Band Wi-Fi 7 RF Transceiver IP Core. Featuring an integrated Front-End Module (FEM), this next-generation IP solution is optimized for both consumer and industrial applications and is now available for licensing in TSMC’s 22nm ULL process.

Designed to meet the growing demands of bandwidth-hungry and latency-sensitive applications, the new Wi-Fi 7 RF Transceiver IP core supports a broad range of high-performance use cases—from set-top boxes and smart TVs to AR/VR headsets, streaming devices, automotive infotainment systems, and industrial IoT applications. The integration of the FEM simplifies system design, reduces bill of materials (BoM), and enhances RF performance, making it a highly attractive solution for chipmakers developing the next wave of wireless SoCs.

Wi-Fi 7: The Future of Wireless Connectivity

As wireless data consumption continues to surge, Wi-Fi 7 (IEEE 802.11be) is set to become a game-changer in the world of connectivity. Offering data rates well into the multi-gigabit range, ultra-low latency, and significantly improved spectral efficiency, Wi-Fi 7 enables truly seamless connectivity across an array of smart devices.

The T2M IP partner’s transceiver IP fully complies with the Wi-Fi 7 standard and includes backward compatibility with Wi-Fi 6/6E. Supporting both 1024-QAM and 4096-QAM modulation schemes, this IP core delivers highly efficient and high-throughput wireless communications. The advanced modulation enables higher data rates within the same spectrum, resulting in better performance in environments crowded with competing wireless signals—such as smart homes, public venues, and industrial facilities.

Optimized for Performance and Efficiency

One of the core highlights of this IP solution is its compact design and power efficiency. Engineered for minimal die area, the transceiver operates with ultra-low power consumption, making it especially suitable for battery-powered and thermally constrained devices like wearables and AR/VR headsets.

In addition to superior RF performance, the IP core includes built-in features for robust interference mitigation, seamless roaming, and reliable data transmission in dynamic environments. These capabilities ensure high-quality connectivity for mobile and embedded systems that must operate in varying and often challenging RF conditions.

Tri-Band Support and Scalability

The transceiver IP supports operation across the 2.4GHz, 5GHz, and 6GHz bands, providing full tri-band coverage for maximum flexibility and network performance. This tri-band support enables a broader range of applications and ensures compatibility with existing Wi-Fi infrastructure, while also future-proofing devices for emerging Wi-Fi 7 deployments.

Currently, the IP supports bandwidths of up to 80MHz, which is suitable for a wide range of high-speed applications. Looking ahead, the roadmap includes support for 160MHz bandwidth by Q2 2025, which will further elevate the performance of multi-user MIMO and OFDMA (Orthogonal Frequency-Division Multiple Access) technologies. This scalability makes the IP ideal for building flexible, future-ready wireless SoCs that can evolve alongside the Wi-Fi standard.

Accelerating Next-Gen SoC Development

With the introduction of this highly integrated Wi-Fi 7 RF Transceiver IP core, T2M IP and its partner aim to accelerate innovation in the semiconductor industry. By providing a complete, production-ready IP solution that balances high performance, power efficiency, and small footprint, T2M IP enables SoC developers to meet tight design schedules and get their products to market faster.

This IP is particularly beneficial for Access Point applications, including home and enterprise routers, where enhanced range, bandwidth, and throughput are critical. Integrating this solution into next-generation SoCs will empower OEMs to deliver faster, smarter, and more reliable wireless experiences to users worldwide.

Availability and Licensing

The Dual-Band Wi-Fi 7 RF Transceiver IP Core is now available for immediate licensing. Interested parties can reach out to T2M IP for more information on licensing models, deliverables, and pricing details.

About T2M IP

T2M IP is a leading global technology provider specializing in the licensing of semiconductor IP cores. With a robust portfolio that includes wireless, cellular, analog, mixed-signal, and connectivity IP solutions, T2M IP serves semiconductor companies worldwide in developing innovative, next-generation products across consumer, automotive, and industrial markets.

#ipcores #semiconductorip #interfaceips

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agnisystechnology · 5 months ago

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How Agnisys is Revolutionizing Chip Design with AI and AI-Enabled Chips

In the ever-evolving semiconductor landscape, the integration of Artificial Intelligence (AI) in chip design and the creation of AI-specific chips have emerged as transformative forces. The complexity of modern System-on-Chip (SoC) designs, coupled with the growing demand for AI-powered solutions, has fueled the need for innovative approaches to hardware design and development. At Agnisys, we are pioneering these advancements by leveraging AI to optimize the design process while crafting cutting-edge AI chips that redefine performance and efficiency.

AI-Driven SoC Design: Bridging Complexity with Innovation

The design and verification of a SoC involve managing an intricate web of components, specifications, and workflows. From designing Control and Status Registers (CSRs) and memory maps to integrating third-party IPs, each step requires precision and collaboration. AI enhances this process by introducing intelligent automation, pattern recognition, and predictive analysis, enabling design teams to:

Streamline Verification: AI-powered tools can automatically identify bugs, optimize test coverage, and predict potential design bottlenecks.

Accelerate RTL Generation: Automating repetitive tasks, such as generating Register Transfer Level (RTL) code from high-level specifications, allows engineers to focus on critical design aspects.

Improve IP Integration: AI algorithms can analyze IP compatibility, suggest configurations, and ensure seamless integration into the SoC.

By incorporating AI into these workflows, Agnisys empowers semiconductor companies to reduce development cycles, minimize errors, and deliver cutting-edge SoCs to market faster.

Our approach combines domain knowledge with advanced AI-driven tools to ensure these chips deliver unparalleled performance and adaptability.

Exclusive Features and Highlights

AI in SoC Workflows: Learn how Agnisys integrates AI into chip design processes to enhance efficiency and accuracy.

Custom AI Chips: Explore our innovations in creating AI-specific chips tailored for next-generation applications.

Automation and Verification: Discover how AI automates critical aspects of design verification and testing.

Real-World Applications: Insights into how AI chips are transforming industries such as automotive, healthcare, and IoT.

What’s on the Agenda?

AI-Powered SoC Design

Overview of AI integration into SoC workflows.

Intelligent automation and its impact on design cycles.

Best practices for AI-driven IP management and RTL generation.

Building AI-Specific Chips

Key architectural considerations for AI workloads.

Energy-efficient designs for edge and IoT applications.

Customizing hardware for training and inference at scale.

Case Studies and Applications

Success stories of AI-powered SoCs and AI-specific chips.

Industry-specific insights and future trends.

You’ll Learn:

How AI can streamline SoC design workflows and enhance collaboration.

Practical applications of AI in verification, RTL generation, and IP integration.

Techniques for designing energy-efficient, high-performance AI chips.

Real-world strategies to reduce time-to-market and improve design quality.

Reserve your spot today and explore how Agnisys is shaping the future of semiconductor design through AI innovation!

Click here for register

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namanr · 1 year ago

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Semiconductor IP Market Expected to Reach $14.6 Billion, Globally, by 2032 at 8.3% CAGR: Allied Market Research

The Semiconductor IP market share is expected to witness considerable growth in coming years, owing increase in the adoption of wireless technology-based devices, rise in demand for modern System-on-Chip (SoC) designs and growing adoption of Internet of Things (IoT) and Artificial Intelligence (AI) applications.

Saurav Singh - Lead AnalystSemiconductor and Electronics at Allied Market Research

Download Research Report Sample & TOC: https://www.alliedmarketresearch.com/request-sample/4643 (We look forward to moving quickly to provide the Report Analysis needed for your Business Success) •151 – Tables •70 – Charts •355 – Pages

Semiconductor IP comprises pre-designed and pre-verified functional elements, necessary for crafting integrated circuits (ICs) and System-on-Chip (SoC) devices. These elements, including processors, memory modules, analog circuits, and diverse interface modules, are developed and licensed by specialized companies to semiconductor manufacturers and system designers. Semiconductor IP is pivotal in expediting the chip design process, curbing development expenses, and enhancing overall operational efficiency. By integrating proven and standardized IP cores into their designs, manufacturers and designers can concentrate on application-specific aspects, rather than re-creating foundational components. This strategy is particularly crucial in an era characterized by intricate and advanced semiconductor technologies.

Prime determinants of growth:

The semiconductor IP market outlook is expected to witness notable growth owing to an increase in the adoption of wireless technology-based devices, a rise in demand for modern system-on-chip (soc) design, and a growing adoption of IoT and AI applications. Moreover, the surge in demand for consumer electronics and technological advancement is expected to provide lucrative opportunities for the growth of the market during the forecast period. On the contrary, intellectual property (IP) security concerns limit the growth of the semiconductor IP market.

Competitive analysis and profiles of the major Semiconductor IP market players, such as Frontgrade Gaisler, Faraday, Arm Limited., Synopsys, Inc., Arteris, CEVA Inc., Cadence Design Systems, Inc., ALPHAWAVE SEMI, VeriSilicon, and Rambus Inc are provided in this report. Product launch and acquisition business strategies were adopted by the major market players in 2022.

Report Coverage and Details:

Aspects

Details

Market Size By 2032

USD 14.6 billion

Growth Rate

CAGR of 8.3%

Forecast period

2022 - 2032

Report Pages

355

By Design IP

Processor IP

Interface IP

Memory IP

By IP Source

Licensing

Royalty

By IP Core

Soft IP

Hard IP

By Application

Consumer Electronics

Telecom

Automotive

Others

COVID-19 Scenario:

The COVID-19 pandemic significantly affected the semiconductor IP market, causing disruptions in the global supply chain, manufacturing delays, and increased demand for certain semiconductor products. Despite challenges, the industry adapted with increased remote work and accelerated digital transformation, driving innovation and resilience in semiconductor IP development and sales.

Semiconductor IP is the design specifications of the logic, cell, or ship layout of part or all a microprocessor. In a world where chips power so many of our everyday devices, these semiconductor designs are ubiquitous. Semiconductor IP can remain proprietary to the company that invented the design, or the inventing body might license their designs to other companies. The intellectual property (IP) of a semiconductor encompasses specifications, source code, or any essential information required for manufacturing that semiconductor. By securing appropriate patents and providing supporting evidence for these patents, the creator of a semiconductor can safeguard their design from patent infringement and transform their designs into a source of income.

Inquiry Before Buying: https://www.alliedmarketresearch.com/purchase-enquiry/4643

Leading Market Players:

Frontgrade Gaisler,

ALPHAWAVE SEMI,

VeriSilicon,

Synopsys, Inc.,

Cadence Design Systems, Inc.,

Faraday Technology Corporation,

ARTERIS, INC,

CEVA Inc.,

Arm Limited,

Rambus Inc.

The report provides a detailed analysis of these key players of the global Semiconductor IP Market. These players have adopted different strategies such as product development and product launch to increase their market share and maintain dominant shares in different regions. The report is valuable in highlighting business performance, operating segments, product portfolio, and strategic moves of market players to showcase the competitive scenario.

Key Benefits for Stakeholders:

This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the semiconductor IP market analysis from 2022 to 2032 to identify the prevailing Semiconductor IP market opportunity.

The market research is offered along with information related to key drivers, restraints, and opportunities.

Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.

In-depth analysis of the semiconductor IP market forecast segmentation assists to determine the prevailing market opportunities.

Major countries in each region are mapped according to their revenue contribution to the global market.

Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.

The report includes the analysis of the regional as well as global semiconductor IP market trends, key players, market segments, application areas, and market growth strategies.

By Region:

North America (U.S., Canada, and Mexico)

Europe (U.K., Germany, France, Italy, Spain, Russia, Netherlands, Belgium, Poland, and Rest of Europe)

Asia-Pacific (China, Japan, India, South Korea, Australia, Malaysia, Thailand, Philippines, Indonesia, and Rest of Asia-Pacific)

LAMEA (Latin America, Middle East and Africa)

Trending Reports in Semiconductor and Electronics Industry (Book Now with Up to 20% Discount + COVID-19 Scenario):

Antenna Market size is projected to reach $40.1 billion by 2032, growing at a CAGR of 9.1% from 2023 to 2032.

Image Sensor Market size is projected to reach $87.5 billion by 2032, growing at a CAGR of 12.9% from 2023 to 2032.

Superconductors Market share is projected to reach $17.4 billion by 2032, growing at a CAGR of 10% from 2023 to 2032.

Power Cable Market size is projected to reach $277.8 billion by 2031, growing at a CAGR of 6.4% from 2022 to 2031

Embedded Systems Market size is projected to reach $163.2 billion by 2031, growing at a CAGR of 6.5% from 2022 to 2031.

About Us:

Allied Market Research (AMR) is a full-service market research and business-consulting wing of Allied Analytics LLP based in Wilmington, Delaware. Allied Market Research provides global enterprises as well as medium and small businesses with unmatched quality of "Market Research Reports Insights" and "Business Intelligence Solutions." AMR has a targeted view to provide business insights and consulting to assist its clients to make strategic business decisions and achieve sustainable growth in their respective market domain.

We are in professional corporate relations with various companies and this helps us in digging out market data that helps us generate accurate research data tables and confirms utmost accuracy in our market forecasting. Allied Market Research CEO Pawan Kumar is instrumental in inspiring and encouraging everyone associated with the company to maintain high quality of data and help clients in every way possible to achieve success. Each and every data presented in the reports published by us is extracted through primary interviews with top officials from leading companies of domain concerned. Our secondary data procurement methodology includes deep online and offline research and discussion with knowledgeable professionals and analysts in the industry.

Contact:

David Correa

1209 Orange Street, Corporation Trust Center, Wilmington, New Castle, Delaware 19801 USA.

Int'l: +1-503-894-6022 Toll Free: +1-800-792-5285

UK: +44-845-528-1300

India (Pune): +91-20-66346060 Fax: +1-800-792-5285 [email protected]

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govindhtech · 2 years ago

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New MediaTek 5G RedCap technology transforms connectivity

MediaTek 5G RedCap technology

MediaTek, which makes has introduced its The company solutions, which will allow them to provide 5G technology download speeds as well as impressive power efficiency to a wide variety of Internet of Things equipment.

The previously the RedCap software modem technology and chipset family have been introduced by MediaTek as part of the company’s efforts to accelerate the migration to 5G-NR for consumer, corporate, and industrial IoT applications.

MediaTek T300 chipset series

MediaTek has announced that it would be extending its line of modems and chipsets to enable 5G RedCap. This announcement was made possible by MediaTek’s industry experience in 5G connection. The new solutions, the M60 modem IP and the MediaTek T300 chipset series, will make it simple for MediaTek to ease the transition to 5G-NR for a wide variety of applications. These applications include things like wearables, lightweight augmented reality devices, IoT modules, and devices built with edge artificial intelligence in mind.

RedCap, an abbreviation that stands for “reduced capability,” is an initiative that aims to bring the advantages of 5G to non-traditional radio (NR) consumer, corporate, and industrial devices. RedCap promises to bring dependability for devices that have minimal bandwidth needs by fully using the movement of 5G networks to the Standalone (SA) network architecture. This will offer many of the advantages of 5G without the expense and complexity of standard 5G solutions. RedCap will take full use of the evolution of 5G networks to the SA network design.

As stated by JC Hsu, Technical Senior Vice President at MediaTek, “Our 5G RedCap solutions constitute an important aspect of our objective to make accessible 5G, allowing consumers with the ability to maximize the efficiency of component while delivering devices capable of supporting 5G spanning a range of purposes and a range of price points.” “Our customers now have the ability to deliver 5G-enabled devices from a range of applications and a range of price points,” he said.

“The migration to 5G RedCap will replace legacy 4G/LTE solutions, offering significantly better power efficiency and more reliable user experiences when compared to leading edge 5G eMMB modem solutions and legacy 4G LTE Cat 4 and Cat 6 devices.”

The MediaTek T300 series is pioneering new territory in the 5G RedCap area since it is the world’s first single die solution for 5G RedCap that utilizes a 6nm Radio Frequency System-On-Chip (RFSOC) architecture. This RFSOC will enable marketers to build creative designs for corporate, industrial, consumer, augmented reality (AR), and data-card applications, allowing them to profit on the burgeoning RedCap market.

The MediaTek T300 series incorporates a single-core Arm Cortex-A35 in a substantially more compact PCB area. This is made possible by the extremely efficient TSMC 6nm process, which was used to build the series. The MediaTek T300 series is capable of supporting data transfer speeds of up to 122 Mbps in the uplink direction and 227 Mbps in the downlink direction.

The T300 series and the M60 5G modem IP both satisfy the 3GPP R17 standard and combine MediaTek’s industry-leading power efficiency with coverage upgrades and exceptionally low latency. Furthermore, the two of these products have been compatible using 5G networks. The The substance M60 is able to give users up to 70 percent reduction in energy consumption in compared to competitive 5G eMBB technologies and as much as seventy-five percent power savings in comparing to 4G LTE network solutions. This is possible via the incorporation of MediaTek’s UltraSave 4.0 semiconductor and the minimization of needless paging receptions.

To continue to address the constantly evolving relationship needs and standards, MediaTek’s The company solution are bringing about an exciting new era of efficiency, stability, and savings in expenses for devices with 5G RedCap capabilities across the consumer, businesslike, and industrial markets. Samples of devices included in the Broadcom T300 category will be accessible throughout the first half of 2024, and commercial samples will be available in the second half of the same year.

Read Also

Top 10 semiconductor companies (infographic)

#intel #tower semiconductor #israel #semiconductor #semiconductors #microchips #cpu #computing

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jyotifestpost · 3 years ago

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Intel acquires Israeli chip maker Tower Semiconductor for $5.4 bn

Chip-maker Intel on Tuesday confirmed it is acquiring Israeli contract chip manufacturer Tower Semiconductor for approximately $5.4 billion.

The acquisition advances Intel's IDM 2.0 strategy as the company further expands its manufacturing capacity, global footprint and technology portfolio to address unprecedented industry demand, the company said in a statement.

"This deal will enable Intel to offer a compelling breadth of leading-edge nodes and differentiated specialty technologies on mature nodes - unlocking new opportunities for existing and future customers in an era of unprecedented demand for semiconductors," said Pat Gelsinger, Intel CEO.

As a key part of its IDM 2.0 strategy, Intel established Intel Foundry Services (IFS) in March 2021 to help meet the growing global demand for semiconductor manufacturing capacity and to become a major provider of US- and Europe-based foundry capacity to serve customers globally.

Tower's expertise in specialty technologies, such as radio frequency (RF), power, silicon-germanium (SiGe) and industrial sensors, extensive IP and electronic design automation (EDA) partnerships, and established foundry footprint will provide broad coverage to both Intel and Tower's customers globally.

Tower serves high-growth markets such as mobile, automotive and power, and operates a geographically complementary foundry presence with facilities in the US and Asia serving fabless companies as well as IDMs and offers more than 2 million wafer starts per year of capacity - including growth opportunities in Texas, Israel, Italy and Japan.

"Together with Intel, we will drive new and meaningful growth opportunities and offer even greater value to our customers through a full suite of technology solutions and nodes and a greatly expanded global manufacturing footprint," said Russell Ellwanger, Tower CEO.

With the addition of Tower, Intel said it is positioned to bring more value to customers across the nearly $100 billion addressable foundry market.

"We are building Intel Foundry Services to be a customer-first technology innovator with the broadest range of IP, services and capacity," said Dr Randhir Thakur, president of Intel Foundry Services.

The transaction is expected to close in approximately 12 months.

#intel #israel #companies #news

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techblog4u · 5 years ago

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What's the Relevance of Technology?

"Technology in the long-run is without a doubt irrelevant". That is what a customer of mine told me whenever i made a presentation to him about a new products. I had been talking about the product's features and many benefits and listed "state-of-the-art technology" or something to that impression, as one of them. That is when he made his statement. My spouse and i realized later that he was correct, at least within the situation of how I used "Technology" in my presentation. But When i began thinking about whether he could be right in other sorts of contexts as well. What is Technology? Merriam-Webster defines it because: 1 a: the practical application of knowledge especially from a particular area: engineering 2 h: a capability given by the practical application of knowledge 2: a manner of attaining a task especially using technical processes, methods, or understanding 3: the specialized aspects of a particular field of undertaking Wikipedia defines it as: Technologies (from Greek τÎχνη, techne, "art, skill, cunning regarding hand"; and -λογÎ¯α, -logia[1]) is the building, modification, usage, and knowledge of tools, machines, techniques, crafting, systems, and methods of organization, in order to solve a problem, strengthen a preexisting solution to a problem, achieve a goal, handle the applied input/output relation or perform a specific function. This can possilby refer to the collection of such tools, including machinery, tweaks, arrangements and procedures. Technologies significantly affect human and also other animal species' ability to control and adapt to their herbal environments. The term can either be applied generally or to precise areas: examples include construction technology, medical technology, and i . t. Both definitions revolve around the same thing - application not to mention usage. Technology is an enabler Many people mistakenly believe it is products which drives innovation. Yet from the definitions above, that may be clearly not the case. It is opportunity which defines innovation and also technology which enables innovation. Think of the classic "Build a better mousetrap" example taught in most business schools. You could have the technology to build a better mousetrap, but if you have basically no mice or the old mousetrap works well, there is no occasion and then the technology to build a better one becomes unimportant. On the other hand, if you are overrun with mice then the opportunity is out there to innovate a product using your technology. Another example, one particular with which I am intimately familiar, are consumer electronics international companies. I've been associated with both those that succeeded and those the fact that failed. Each possessed unique leading edge technologies. The variance was opportunity. Those that failed could not find the opportunity to develop a meaningful innovation using their technology. In fact to survive, they then had to morph oftentimes into something totally different and if they were lucky they could take advantage of derivatives of their original technology. By and large, the original technology wound up in the scrap heap. Technology, hence, is an enabler whose ultimate value proposition is to help with our lives. In order to be relevant, it needs to be used to develop innovations that are driven by opportunity. Technology as an affordable advantage? Many companies list a technology as one in their competitive advantages. Is this valid? In some cases yes, but also in most cases no . Technology develops along two ways - an evolutionary path and a revolutionary path. An important revolutionary technology is one which enables new industries or perhaps enables solutions to problems that were previously not possible. Semiconductor technological innovation is a good example. Not only did it spawn new industries plus products, but it spawned other revolutionary technologies - transistor technology, integrated circuit technology, microprocessor technology. All which will provide many of the products and services we consume today. But will be semiconductor technology a competitive advantage? Looking at the number of semiconductor companies that exist today (with new ones forming each day), I'd say not. How about microprocessor technology? Once more, no . Lots of microprocessor companies out there. How about quad primary microprocessor technology? Not as many companies, but you have Intel, AMD, ARM, and a host of companies building made to order quad core processors (Apple, Samsung, Qualcomm, etc). Therefore again, not much of a competitive advantage. Competition from competitions technologies and easy access to IP mitigates the recognized competitive advantage of any particular technology. Android vs iOS is a good example of how this works. Both operating systems are derivatives of UNIX. Apple used their technologies to introduce iOS and gained an early market advantages. However , Google, utilizing their variant of Unix (a competing technology), caught up relatively quickly. The reasons for this rest not in the underlying technology, but in how the products granted by those technologies were brought to market (free or walled garden, etc . ) and the differences in the strategize your move visions of each company. Evolutionary technology is one which incrementally builds upon the base revolutionary technology. But by it is extremely nature, the incremental change is easier for a competitor enhance or leapfrog. Take for example wireless cellphone technology. Firm V introduced 4G products prior to Company A buying enough it may have had a short term advantage, as soon as Company The introduced their 4G products, the advantage due to technology gone away. The consumer went back to choosing Company A or Enterprise V based on price, service, coverage, whatever, but not dependant on technology. Thus technology might have been relevant in the short term, but in the long run, became irrelevant. In today's world, technologies tend to quickly become commoditized, and within any particular technology lies the signs of its own death. Technology's Relevance This article was crafted from the prospective of an end customer. From a developer/designer viewpoint things get murkier. The further one is removed from typically the technology, the less relevant it becomes. To a creator, the technology can look like a product. An enabling supplement, but a product non-etheless, and thus it is highly relevant. Bose uses a proprietary signal processing technology to enable products who meet a set of market requirements and thus the technology as well as what it enables is relevant to them. Their customers are definitely concerned with how it sounds, what's the price, what's withstand, etc ., and not so much with how it is achieved, therefore the technology used is much less relevant to them. Fairly recently, I was involved in a discussion on Google+ around the new Motorola X phone. A lot of the people on the posts slammed the phone for various reasons - rate, locked boot loader, etc . There were also plenty of knocks on the fact that it didn't have a quad-core processor for instance the S4 or HTC One which were priced similarly. The things they failed to grasp is that whether the manufacturer employed 1, 2, 4, or 8 cores in the end causes no difference as long as the phone can deliver a cut-throat (or even best of class) feature set, kind of functionality, price, and user experience. The iPhone is one of the almost all successful phones ever produced, and yet it runs about the dual-core processor. It still delivers one of the best user experience on the market. The features that are enabled by the technology will be what are relevant to the consumer, not the technology itself. Typically the relevance of technology therefore , is as an enabler, not only a product feature or a competitive advantage, or any myriad of other things - an enabler. Looking at the Android computer, it is an impressive piece of software technology, and yet Google gives the software away. Why? Because standalone, it does nothing for The search engines. Giving it away allows other companies to use their proficiency to build products and services which then act as enablers for Google's products and services. To Google, that's where the real value is.

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usacounselingcredit · 2 years ago

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Houston Texas Appliance Parts: AI-Powered Chip Design Goes Mainstream

Houston Texas Appliance Parts

AI-Powered Chip Design Goes Mainstream

by Houston Texas Appliance Parts on Friday 10 February 2023 03:21 PM UTC-05

AI in chip design has gone mainstream, with Synopsys' AI-powered DSO (design space optimization) tool reaching 100 commercial tapeouts.

The company's DSO was released in 2020, with its first commercial tapeout in August 2021. The tool uses reinforcement learning to tackle physical layout optimization—that is, all the physical aspects of chip design.

"This technology has seen very fast adoption over the past two and a half years," Stelios Diamantidis, distinguished architect at Synopsys, told EE Times. "Importantly, [the 100 tapeouts] are across design nodes, across vertical markets and with very high coverage of the semiconductor leaders."

Synopsys expects "hundreds" more tapeouts this year, according to Diamantidis. The EDA company is working with customers designing cutting-edge chips, including CPUs, GPUs and AI accelerators, with new applications continuing to emerge.

Stelios Diamantidis (Source: Synopsys)

Synopsys customer SK Hynix was able to not only increase productivity using DSO, but also reduced die size for one of its designs by 5%. This 5% silicon area improvement can mean a considerable economic benefit, given that memory products are produced in the tens or hundreds of millions, Diamantidis said.

The tool's first 100 tapeouts includes the first commercial tapeout using the cloud-based version of DSO—an STMicroelectronics 7-nm FinFET design. ST said physical layout optimization for a new Arm core was 3× faster in terms of both time-to-result and engineering time spent on the design using DSO.

"We used the tools to accelerate the physical design of a key IP block that we integrated into an ASIC," Indavong Vongsavady, methods, tools and infrastructure director of the RF and communication division at STMicroelectronics, told EE Times. "As is true for highly complex designs, we don't have a one-size-fits-all approach to the design. We use different tools and approaches for different pieces and in this case, given DSO's ability to let us perform lots of experiments in a short period of time to optimize performance, power and area, it made sense to use it on a particular block of IP."

Using DSO during the design authoring process allowed ST to achieve a higher level of optimization than usual, he said, adding that ST is confident that the product will meet quality criteria during the normal verification and final sign-off process.

"We think that AI/ML algorithms are a good fit when we have extremely challenging optimization problems to solve," Vongsavady added. "The best way to solve these is using a huge number of experiments, and this is where the DSO.ai tool shines because it offloads the burden of mechanical tasks and gives our engineers more time for creative thinking."

The decision to use DSO in Microsoft's Azure cloud was made largely for flexibility and convenience; ST performed tens to hundreds of parallel runs on 16 or 32 CPU cores, peaking at a few thousand CPU cores.

"The cloud enhances our storage and compute capacity, and we exploited that elasticity in our use of the tool," Vongsavady said. "We can access as much server and CPU capacity as we need for massive parallel experiments without the risk of impacting other ST projects running on-premises."

Reinforcement learning

DSO uses a technique called reinforcement learning to tackle physical layout. The problem is complex; place and route alone has a state space of 10 to the power of 90,000. Reinforcement learning is a good fit since it doesn't require masses of data for training. This would mean having access to Synopsys' customers' chip designs, which are proprietary. Instead, the algorithm can be trained by designing chips from scratch and being given a score for how well it does. Over time, the algorithm tries over and over to achieve a better score.

Part of DSO's secret sauce is the ability to also learn from completed designs. In this case, customers would use their own existing designs to train their version of algorithm via supervised learning, as a way of using knowledge of prior designs. This can help the AI converge faster on an optimum design.

While much of the focus of the AI industry in general has been on transformers and large language models lately, Synopsys' Diamantidis said reinforcement learning is definitely the best fit for this application.

"We continue to see tremendous value in reinforcement learning," he said. "Comparing DSO in 2020 to the 2023 version, there is a clear evolution of technology as we ourselves become smarter and more research emerges that we can leverage."

While reinforcement learning will continue to be impactful both in EDA and other applications, it isn't the only horse in the race. Synopsys is interested in possible combinations with other learning paradigms, such as generative AI and graph networks, but reinforcement learning will continue to be the backbone, Diamantidis said.

"We may not have big data, which is generated out in the wild and we get to go out and mine it, but we do have what [machine learning pioneer] Andrew Ng calls 'good data,' which is we understand the origin of the data and can make some assumptions about its classification and behavior and that gives us some advantages that again play to reinforcement learning's strengths."

Synopsys will also continue to develop its statistical learning (non-AI) tools, according to Diamantidis.

Chip customization

Aart de Geus (Source: Synopsys)

One of the key downstream effects of AI-powered chip design is to make the ASIC model more attractive since it means more quickly and easily taping out customized versions of ASICs for particular verticals or customers. Other downstream effects of designing better performing chips on vastly condensed timescales with less engineering resource include prolonging Moore's law by squeezing better performance from older process nodes, and accelerating entry to market for companies without chip design experience.

This is what DSO can achieve today, but what's next for AI-powered EDA tools? Synopsys CEO Aart de Geus gave some hints in his keynote at ISSCC 2022, in which he talked about using AI to more efficiently remaster silicon designs for different process nodes, or different foundries. (This is a future technology; DSO's remastering capability doesn't have any commercial tapeouts yet).

In an interview with EE Times at the time, de Geus said that AI-powered remastering has the potential to help ease fab capability issues. The trick is using learning from the original chip design when remastering the chip for a different node, rather than starting from scratch.

"It was quite remarkable how the learning from [a tapeout at] N40 was absolutely still applicable in N10, which is 3 nodes more advanced," he said. "This tells me that certain characteristics of the design really determine its essence: its bottlenecks, what makes the speed, what makes the power and so on."

Versus a human-designed chip remastered for N10, the AI-designed version was faster and more power efficient, but also took less time to design.

Experimental results of remastering a design for a different process node. Red triangle is the results of manual design by a team of experts over a period of months. Yellow diamonds are designs produced by an AI with no training on the new target node, but with knowledge of the design on the old node. These results were produced by a single engineer in a matter of weeks. (Source: Synopsys)

"Something else is coming out of these experiments: the notion that if you are using high tech, which is fast-moving, but for products that have a long life cycle, you should start designing some of those products such that if you had to make a new version of it, you already captured the learning or the spec in such a way that in seven years it can be designed more easily," he added.

Not only can AI design better chips than human engineers, but we will need AI to keep up with future increases in device complexity—just like we needed design automation 35 years ago, de Geus said. The number of dimensions that need to be optimized is growing, including speed, area, dynamic power, static power, reliability, manufacturability and yield.

"One way that humans design when they don't know the exact answer is they put in margin," he said. "AI can find itsy bitsy little margin pieces all over the place, and so maybe it's a very small piece that it finds, but it finds 3 billion of them, and you can see the human challenge with that."

The post AI-Powered Chip Design Goes Mainstream appeared first on EE Times.

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#Houston Texas Appliance Parts: AI-Powered Chip Design Goes Mainstream

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strangemusictriumph · 3 years ago

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IO-Link Market - Forecast (2022 - 2027)

IO-link Market size was valued at $5.3 billion in 2020 and it is estimated to grow at a CAGR of 18.51% during the period 2021-2026, owing to high penetration of industry 4.0 across industries. IO-link is a point-to-point serial communication protocol that includes an IO-Link master and one or several IO-Link devices. This system is highly being used for increasing the level of efficiency of industrial automated processes. Thus high demand for automation drives the growth of IO-Link market. Moreover, its ability to offer support and sustainability for various Fieldbus and Ethernet communication protocol plays a major role in the growth of this market. Furthermore, the government’s initiative to promote the adoption of industrial automation such as programmable logic controllers (PLCs), MES, SCADA and IoT sensors (such as photoelectric sensors, proximity sensors and sensor nodes), is one of the primary factors augmenting the demand for IO-Link. This technology also reduces the overall operational cost and increases the operational efficiency. Hence, the above-mentioned factors will drive the growth of IO-link industry during the forecast period.

Report Coverage

The report: “IO-link Market Forecast (2021-2026)”, by IndustryARC, covers an in-depth analysis of the following segments of the IO-link Market.

By Type: IO-Link Wired, IO-Link Wireless

By Component: IO-Link Master(PROFINET, EtherNet/IP, Modbus-TCP, EtherCAT, Multiprotocol and Others), IO-Link Devices(Sensor Nodes (Position sensor, Temperature sensor, Pressure sensor, Vibration sensor and Others), Modules, Actuators, RFID Read Heads and Others).

By Application: Machine Tool, Handling and Assembly Automation, Intra-logistics, Packaging and Others

By End User Industry: Process Industry (Oil & Gas, Chemical, Power and others), Discrete Industry (Automotive, Aerospace & Defense, Semiconductor & Electronics, Machine Manufacturing and Others)and Hybrid Industry (Pharmaceutical, Metal & Mining, Food & Beverage, Cement And Glass and Others)

By Geography: North America (US, Canada, Mexico), Europe (Germany, France, UK, Italy, Spain, Rest of Europe), APAC (Japan, China, India, Australia, South Korea, rest of APAC), South America (Brazil, Argentina, rest of South America) and RoW (Africa, Middle East)

Key Takeaways

IO-Link Master held the major IO-link market share in 2020, due to high penetration of industrial 4.0 across industries and rapid industrialization.

Europe dominated the market in 2020, and is anticipated to witness significant growth during the forecast period 2021-2026, owing to early adoption of this technology and presence of major market players in this region.

Rapid adoption of automation and field bus independency of IO-link are the major growth drivers of this market.

IO-link Market outlook is consolidated with top market players including Siemens AG, Hans Turck GmbH & Co. KG, Balluff GmbH, Rockwell Automation, Inc., SICK AG, and others.

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IO-link Market Segment Analysis – By Component

By component, this market is segmented intoIO-Link Master and IO-Link Devices. IO-link master segment is further segmented intoPROFINET, EtherNet/IP, Modbus-TCP, EtherCAT, Multiprotocol and Others, and IO-Link Devices segmented into Sensor Nodes, Modules, Actuators, RFID Read Heads and others. IO-link master held major IO-link market share around 35.99% in 2020, owing to rapid industrialization, increasing penetration of automation and industry 4.0 across sectors. For instance, in June 2019, UiPath published a report on present and future progress of automation and according to the survey report, 90% organizations are already using the automation technology to conduct their business processes. High adoption rate of automation across industries creates huge demand for IO-link masters and to fulfill such demand major players of this market are launching new products as well as investing heavily for the advancement of this solution. In June 2019, Contec Co. introduced a new IO-Link master solution CPSL-08P1EN, which supports use with four types of industrial Ethernet-based system protocols, including CC-Link IE Field Basic, EtherNet/IP, Modbus TCP and PROFINET. Hence, the above mentioned factors will drive the demand for IO-link Maters during the forecast period.

IO-link Market Segment Analysis - By End-User Industry

Based on end-user industry, IO-link Market is segmented into process industry, discrete industry and hybrid industry. Hybrid industry is sub-segmented into pharmaceutical, metal & mining, food & beverage, cement and glass and other industries. Pharmaceutical industry is the fastest growing segment in IO-link market and estimated to grow at a CAGR of 19.06% during forecast period 2021-2026, specifically due to the increasing investment in this sector. According to the report of Invest-India, the pharmaceutical sector is analyzed to reach $65 billion by 2024 and to reach $120 billion by the year 2030. Furthermore, rapid adoption of industry 4.0, increasing demand for reliable as well as sustainable communication and remote monitoring system in this industry are the key factors behind the growth of this market. IO-Link offers end-to-end communication to the whole process operation which reduces the overall downtime of the machines, which reduces the overall operational and maintenance cost. Moreover, out-break of COVID-19 has a positive impact on the growth of pharmaceutical industry. The rise in COVID cases and the growing health awareness among public are the key factors behind this high investment that creates the massive requirement of IO-link solutions, which in turn drives the growth of IO-link market. Hence, rising investment in pharmaceutical industry is being seen as the opportunity for the players operating in the IO-linkmarket during 2021-2026.

Inquiry Before Buying

IO-link Market Segment Analysis - By Geography

Europe dominated the IO-Link Market in 2020 with a share close to 30.18%, followed by North America and APAC. Moreover, it is estimated that Europe will have a significant amount of market growth during the forecast period 2021-2026, owing to technological advancement, early adoption of this technology and government’s initiatives for the development of smart factories. Rising demand for IoT enabled connected devices, industrial automation are the key factors fuelling the growth of this market. Furthermore, this technology has a well-established customer base in this region. Apart from that, continuous development, new advanced product launches of the technology also plays a major role towards the market growth. Europe-based companies such as Siemens AG and General Electric is one of the largest manufacturers of this technology in the world. Devices produced in Siemens are generally equipped with PROFINET and this company dominates the European market. In November 2020, a Germany-based company, Igus joined PI organization, for advancing the research of PROFINET technology in dynamic applications. In February 2019, SICK announced the launch of Safe EFI-pro System, which offers standard industrial Ethernet-based safety network integration for highly-adaptive as well as dynamic safeguarding in automated production and logistics environments to SIL 3/PLe.This kind of strategic movements and technologically advanced product launches will drive the market for this region during the forecast period.

IO-link Market Drivers

Increasing Penetration of Automation:

Increasing adoption of automation across industries is one of the major drivers for IO-Link, triggering the growth for this technology. Integration of automation system across industries offers greater efficiency, higher reliability, enhanced asset management, production boost, better process speed and cost effectiveness, which is accelerating the amount of investments made by organizations to remain productive. This in turn, drives the growth of IO-Link technology, as this technology is a point-to-point serial communication protocol, which is highly being used for communicating with sensors and actuators in industrial automation processes. In July 2020, for digital industrial transformation, Carlo Gavazzi announced the launch of its new IIoT-enabled IO-Link Masters, YL212 and YN115, that supports leading industrial Ethernet-based system protocols including EtherNet/IP, PROFINET IO and MODBUS TCP access. This product has advanced features such as embedded web interface and OPC UA, which offers full remote access, control of the IO-Link masters and connected devices. This product also offers reliability, transparent process data transmission into the cloud-based systems from the sensors and actuators along with access to the data, attached to the smart devices through the Programmable Logic Controller (PLC) and OPC UA clients. This type of product with such unique features fuels the growth of his market. PI Organization’s recent research report shows that, the performance of Profinet RT fulfills 95% timing requirements of industry-based automation. Hence, the adoption of automation will drive the growth of IO-link market during the forecast period.

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Fieldbus Integration:

IO-Link is an open source interface, which makes this technology a Fieldbus independent solution. It can be integrated into all the fieldbus systems including PROFINET, AS-i, CANopen, CC-Link, PROFIBUS, EtherCAT, EtherNet/IP, DeviceNet, Interbus, Powerlink and others. Different organizations use different networking protocols for their systems, which make the fieldbus-independent IO-Link more suitable for the companies, as it allows the businesses to connect their products to different systems and control level devices including Programmable Logic Controller (PLC), Supervisory control and data acquisition (SCADA) and others. This in turn, saves the investments that are already made by the manufacturers, plant operators, machine builders and others, on the systems. Even when the organizations decide to migrate from one technology to other technology, IO-Link makes the process cost effective, by reducing the overall cost. In January 2019, Korenix introduced a new cost-effective Profinet supported, Fieldbus gateway, JetLink 1302, which can transmit the data faster among the devices and provide seamless communication between fieldbus and industrial Ethernet communication protocol. Hence, the fieldbus independency of IO-Link is one of the major growth drivers of this market.

IO-link Market Challenges

Security Issues:

IO-link technology is vulnerable to various security threats such as cross site request forgery (CSRF), reflected cross-site scripting (XSS), blind command injection, denial-of-service (DoS) issues, spear phishing and others, which hinders the growth of this market. Furthermore, in February 2020, OTORIO security researchers discovered a security weakness in PROFINET-IO stack, which is responsible for handling the packets that being used in device management. If a device is overloaded with multiple diagnostic packets, it may create a security threat that allows the attackers to send the devices into a denial-of-service (DoS) condition, which can create disruption in operational processes. Many industrial devices such as devices produced by Siemens, MoxaEDS Ethernet switches and others; that rely on Siemens PROFINET-IO stack are highly being affected. Hence, the above mentioned factor creates security related issues that will hinder the growth of this market during 2021-2026.

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IO-link Market Landscape

Partnerships and acquisitions along with product launches are the key strategies adopted by the players in the IO-link Market. As of 2020, IO-link Market top 10 companies includesSiemens AG, Hans Turck GmbH & Co. KG, Balluff GmbH, Rockwell Automation, Inc.,SICK AG, Omron Corporation, Pepperl+Fuchs SE,Schneider Electric, General Electric,B&R Industrial Automation GmbH among others.

Acquisitions/Technology Launches

In March 2020, Harting Americas had launched Single Pair Ethernet (SPE) technology, thatutilizes Power over Data Line (PoDL) technology to bring communication to the devices and also the voltage and amperage needed to power the device. SPE communication protocols are available for Ethernet/IP, Profinet, EtherCat and others.

In February 2020, European company, SICK had launched a sensor integrated PROFINET gateway, which is the first product that can act as both IO-Link Masters and control system.

For more Electronics related reports, please click here

#IO-link Market price #IO-link Market share #io link market #IO-link Market trends #IO-link Market report #IO-link Market analysis #IO-link Market forecast #IO-link

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pressreleasestrendsz · 3 years ago

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Industrial Network Market - Forecast (2022 - 2027)

Industrial Network Market

is expected to reach 69.9 billion by 2026 at a CAGR of 6.1% during the forecast period 2021-2026. The rising adoption of connected factory and the machine to machine communication will significantly boost the industrial network market and is estimated to gain a huge demand. With the increase in adoption of asset tracking and supply chain management using industrial internet of things (IIoT) in the facilities will be driving the market.

The industrial network are designed to fulfill the real time needs of large number of systems. The increase in number of unmanned machinery in the facilities has also given a massive boots to the industrial network market. The necessity to efficiently manage the security, vulnerability, and the performance is another factor in increasing the market growth during the forecast period of 2021-2026.

Report Coverage

The report:

“Industrial Network Market– Forecast (2021-2026)”

, by Industry ARC covers an in-depth analysis of the following segments of the Industrial Network market.

By Category –

Ethernet Network (Ethernet/IP, Profinet, EtherCAT, Modbus TCP, Powerlink and Others), Wireless Network (WLAN, Bluetooth and Others), Fieldbus Network (Profibus, Modbus RTU, CC-Link and Others).

By Product Type –

Controller, Coupler, Remote Terminals, Code Readers, Routers and Switches, Other.

By End User –

Automotive, Logistics and Transportation, Aerospace and Defense, Electronics & Semiconductor, Medical & Healthcare, Oil and Gas, Food & Beverage, Power, Water and Waste Water Treatment, Chemical, Pharmaceutical, Other.

By Geography -

North America (U.S, Canada, Mexico), Europe (Germany, UK, France, Italy, Spain, Russia and Others), APAC(China, Japan India, South Korea and Others), South America(Brazil, Argentina and others), and RoW (Middle east and Africa).

Request Sample

Key Takeaways

The rising adoption of connected factory and the machine to machine communication will significantly boost the industrial network market and is estimated to gain a huge demand. With the increase in adoption of industrial internet of things (IIoT) in the facilities will be driving the market.

The supplier ecosystem worked with the automakers to develop and commercialize the technology for the benefit of the industry. The automotive industry has strengthened its foundation with the use of SPE servers in the manufacturing process, and controls system industries.

APAC being an industrial hub of many several industries such as electronics, automotive and electrical has the largest market growth.

Industrial Network Market Segment Analysis –By Category

In the category segment the Ethernet network has the largest market at 65% in 2020, since it is being used and all the wired connection are done while the facilities are setup so the network type has still managed to hold a huge amount of share in the market. In the era of digitization the wireless network has the fastest market growth with the penetration of Industry 4.0 and rising adoption of Industrial Internet of Things. For instance ORBCOMM an American that offers industrial Internet of things and machine to machine communications hardware has lunched dual mode industrial IoT for better way to effectively track and connected assets.

Industrial Network Market Segment Analysis –By End User

The supplier ecosystem worked with the automakers to develop and commercialize the technology for the benefit of the industry. The automotive industry’s success with SPE serves to strengthen its foundation for use in manufacturing, process, and controls system industries. Similarly, these industries are embracing the technology to achieve a single converged network cloud to device and displace the prevalent legacy systems.

Industrial Network Market Segment Analysis – By Geography

APAC being an industrial hub of many several industries such as electronics, automotive and electrical has the largest market growth. In APAC countries like India, China and South Korea are the largest manufactures of electronics like smartphones laptops televisions. With the implementation of Industry 4.0 and 5G North America is a fast growing market region for the industrial network market during the forecast period of 2021-2026 at 5.6%.

Inquiry Before Buying

Industrial Network Market Drivers

Growing demand to improve the network infrastructure

With growing technology evolution, the adoption of sensor-based industrial devices including industrial internet of things (IIOT) across industries has increased drastically. The industrial network comprises of different components like routers switches connection devices. These components offer higher speed and has an ability of connecting more nodes across the network.

Migration shift towards Adaptation of wireless technologies in the facilities

Wireless technologies have posted impressive growth rates of 6.4% or more in each of the past three years, although they still represent a relatively small portion of the overall market of newly installed nodes. The development of wireless technologies and the easy availability of the equipment are some major factors that will be boosting the market. This facilitates efficient networking of different application areas such as production and office. These extensive functional capabilities are boosting the growing market demand for industrial network.

Industrial Network Market Challenges

Security concerns on cloud

Data security and data migration are the main challenges in hampering market growth. The detection of the loopholes and handling them before the data breach occur is another major challenge. With the rapid growth of industrial network nodes deployed at the field level, possible sensitive/confidential information will need to be protected with network-level authentication, such as with VPN (a virtual private network) and firewalls, to prevent unauthorized access to a network. The lack of standardization in the communicating interface may results in misreading and can cause data loss and loss in other type of data loss related to the facility.

Industrial Network Market Landscape

Product launches, acquisitions, and R&D activities are key strategies adopted by players in the industrial network market. The offshore wind energy market is dominated by major companies such Huawei Technologies Co. Ltd., Cisco System Inc., Belden Inc., Moxa Inc., Rockwell Automation Inc., Juniper Networks Inc., Sierra Wireless, Belden Incorporated, Eaton Corporation Inc., and Aruba Networks.

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Acquisitions/Technology Launches/Partnerships

In April 2020, ZTE Corporation deployed the core router single servers and network clusters for China Telecom in Jinzhou, Liaoning province, and Ganzhou, Jiangxi province, despite the trouble in transportation, supplies, and dispatching brought by the COVID -19 outbreak.

In April 2020, Cisco announced the intent to acquire privately-held Fluid mesh Networks, a provider wireless backhaul system.

Related Reports

Industrial Ethernet Switch Market

Report Code: ESR 99123

Ethernet Powerlink Market

Report Code: ITR 0309

For more Automation and Instrumentation Market reports - Please click here

#Industrial Network Market size #Industrial Network Market share #Industrial Network Market price

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agnisystechnology · 9 months ago

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Agnisys at DVCon India 2024: Empowering Innovation in Design and Verification

The Design and Verification Conference DVCon India 2024 promises to be a pivotal event in the electronic design automation (EDA) industry. Known for bringing together innovators, engineers, and thought leaders, DVCon India is a key platform for discussing emerging trends, technologies, and methodologies in the design and verification space. This year, one of the standout participants is Agnisys, a company renowned for its groundbreaking solutions in IP development, design, and verification automation.

Who is Agnisys?

Agnisys, Inc. has earned a stellar reputation for its cutting-edge tools designed to automate the design, verification, and implementation of intellectual property (IP), registers, and system-on-chip (SoC) architectures. As industries increasingly demand higher levels of innovation and performance, Agnisys has consistently been at the forefront of providing robust automation solutions to help semiconductor companies streamline their development processes.

The company's tool suite, which includes IDesignSpec and other automation products, has gained traction globally by enhancing the productivity of design and verification engineers. With a strong focus on user-friendly tools, Agnisys aims to reduce the manual effort and errors in designing complex systems, ultimately shortening time-to-market.

The Theme of Agnisys at DVCon India 2024

At DVCon India 2024, Agnisys will focus on the theme of "Empowering Innovation in Design and Verification Automation." Agnisys will showcase how its comprehensive solutions can help teams achieve higher efficiency and accuracy in their design and verification processes. The company’s tools are designed to automate critical tasks, making it easier for engineers to handle the increasing complexity of SoC development and register management.

Highlights of Agnisys' Participation

1. Technical Sessions

Agnisys will host several technical sessions during DVCon India 2024, aimed at educating attendees about the latest advancements in automation for design and verification. These sessions will cover topics such as:

Automating Register and IP Design: A demonstration of how IDesignSpec™ enables the automated generation of register files and verification environments, ensuring consistency between design and documentation.

Enhancing UVM Verification: Agnisys will present how their tools integrate with Universal Verification Methodology (UVM) environments to automate the generation of testbenches and improve coverage.

AI and Machine Learning in EDA: Agnisys will explore how artificial intelligence (AI) and machine learning (ML) can be leveraged to enhance verification processes, optimize design flows, and predict verification coverage gaps.

2. Live Demonstrations

In addition to the technical sessions, Agnisys will offer live demonstrations of its tools at their booth. Attendees can get a firsthand look at how these tools can be used to streamline design and verification tasks.

IDesignSpec™: The flagship tool that enables specification-driven design and verification of registers and IP blocks.

DVinsight: A tool focused on improving functional coverage and verification through automated insights.

These demonstrations will provide an interactive platform for engineers and decision-makers to see how Agnisys' solutions can be customized to fit their unique needs.

3. Panel Discussions

Agnisys experts will participate in panel discussions alongside other leaders in the EDA space. These panels will explore current industry challenges such as managing verification complexity in modern SoCs and how automation can help address these issues. Agnisys will offer its perspective on how its tools are helping to shape the future of design and verification.

4. Networking Opportunities

DVCon India 2024 will also provide numerous networking opportunities for attendees to engage with Agnisys’ experts. Whether it’s through Q&A sessions following the technical presentations or more informal discussions at the booth, engineers will have ample opportunity to exchange ideas with the Agnisys team and gain insights on how to improve their design and verification processes.

Why Agnisys Matters to the Industry

The semiconductor industry is experiencing rapid growth, with an increasing demand for more powerful and efficient chips. This has led to an increase in the complexity of SoC architectures, placing enormous pressure on design and verification teams to meet time-to-market deadlines. Agnisys addresses these challenges head-on by automating repetitive tasks, reducing human errors, and ensuring consistency across the design flow.

Moreover, Agnisys’ solutions are designed to integrate seamlessly into existing workflows, making it easier for teams to adopt their tools without a significant learning curve. Their tools provide a significant boost in productivity, making it possible to manage larger, more complex designs within shorter timeframes.

The Future with Agnisys

As the demands on chip design and verification teams continue to grow, the need for robust automation tools will become even more critical. Agnisys is committed to pushing the boundaries of innovation in this space, and its participation in DVCon India 2024 is a testament to its leadership in the field.

With the ability to automate essential aspects of SoC design, verification, and IP management, Agnisys is well-positioned to remain a key player in the industry. Their tools not only improve efficiency but also empower engineers to focus on the more creative aspects of their work, leading to faster, more reliable innovations.

In conclusion, Agnisys' presence at DVCon India 2024 will showcase its continued commitment to transforming the design and verification landscape. By attending the event, engineers, managers, and decision-makers can learn how Agnisys' automation solutions are driving the future of the semiconductor industry.

#uvm register #uvm register model

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namanr · 1 year ago

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Semiconductor IP Market Expected to Reach $14.6 Billion by 2032 at 8.3% CAGR: Allied Market Research

Wilmington, Delaware

According to a new report published by Allied Market Research, titled, “Semiconductor IP Market By Design IP, IP Source, IP Core, and Application: Global Opportunity Analysis and Industry Forecast, 2023-2032", the semiconductor ip market size was valued at $6.6 billion in 2022, and is estimated to reach $14.6 billion by 2032, growing at a CAGR of 8.3% from 2023 to 2032.

Prime determinants of growth:

Report Coverage and Details:

Aspects

Details

Market Size By 2032

USD 14.6 billion

Growth Rate

CAGR of 8.3%

Forecast period

2022 - 2032

Report Pages

355

By Design IP

Processor IP

Interface IP

Memory IP

By IP Source

Licensing

Royalty

By IP Core

Soft IP

Hard IP

By Application

Consumer Electronics

Telecom

Automotive

Others

COVID-19 Scenario:

Inquiry Before Buying: https://www.alliedmarketresearch.com/purchase-enquiry/4643

Leading Market Players:

Arm Limited,

Frontgrade Gaisler,

Faraday Technology Corporation,

Synopsys, Inc.,

Cadence Design Systems, Inc.,

Rambus Inc.,

ARTERIS, INC,

ALPHAWAVE SEMI,

CEVA Inc.,

VeriSilicon

The report provides a detailed analysis of these key players of the global Semiconductor IP industry. These players have adopted different strategies such as product development and product launch to increase their market share and maintain dominant shares in different regions. The report is valuable in highlighting business performance, operating segments, product portfolio, and strategic moves of market players to showcase the competitive scenario.

Key Benefits for Stakeholders:

The market research is offered along with information related to key drivers, restraints, and opportunities.

Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.

In-depth analysis of the semiconductor IP market forecast segmentation assists to determine the prevailing market opportunities.

Major countries in each region are mapped according to their revenue contribution to the global market.

Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.

The report includes the analysis of the regional as well as global semiconductor IP market trends, key players, market segments, application areas, and market growth strategies.

By Region:

North America (U.S., Canada, and Mexico)

Europe (U.K., Germany, France, Italy, Spain, Russia, Netherlands, Belgium, Poland, and Rest of Europe)

Asia-Pacific (China, Japan, India, South Korea, Australia, Malaysia, Thailand, Philippines, Indonesia, and Rest of Asia-Pacific)

LAMEA (Latin America, Middle East and Africa)

Trending Reports in Semiconductor and Electronics Industry (Book Now with Up to 20% Discount + COVID-19 Scenario):

Antenna Market size is projected to reach $40.1 billion by 2032, growing at a CAGR of 9.1% from 2023 to 2032.

Image Sensor Market size is projected to reach $87.5 billion by 2032, growing at a CAGR of 12.9% from 2023 to 2032.

Superconductors Market share is projected to reach $17.4 billion by 2032, growing at a CAGR of 10% from 2023 to 2032.

Power Cable Market size is projected to reach $277.8 billion by 2031, growing at a CAGR of 6.4% from 2022 to 2031

Embedded Systems Market size is projected to reach $163.2 billion by 2031, growing at a CAGR of 6.5% from 2022 to 2031.

About Us:

Contact:

David Correa

1209 Orange Street, Corporation Trust Center, Wilmington, New Castle, Delaware 19801 USA.

Int'l: +1-503-894-6022 Toll Free: +1-800-792-5285

UK: +44-845-528-1300

India (Pune): +91-20-66346060 Fax: +1-800-792-5285 [email protected]

#semiconductorsolutions

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blueweave · 3 years ago

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Global Electronic Design Automation Software Market to Grow at a CAGR of 8.9%, during Forecast Period

Global Electronic Design Automation Software Market is flourishing owing to the increased importance of EDA in electrical design processes, advancements in system-on-chip (SoC) technology, and increased adoption of modern technologies such as the internet of things and artificial intelligence.

A recent study conducted by the strategic consulting and market research firm, BlueWeave Consulting, revealed that the Global Electronic Design Automation Software Market was worth USD 9.87 billion in the year 2021.

The market is projected to grow at a CAGR of 10.1%, earning revenues of around USD 19.16 billion by the end of 2028. The increasing use of FinFET architecture in the design of advanced processors is a major factor driving the growth of the electronic design automation software market. The increased adoption of AI, IoT, and VR, as well as the rise in SoC technology, are all contributing to the massive demand for this software. However, the availability of open-source EDA software is expected to stymie the growth of the EDA software market. During the forecast period, the rising demand for smaller electronic devices, as well as the increasing penetration of AI and machine learning in EDA, are expected to provide profitable opportunities for electronic design automation software market players.

Increasing Adoption of Connected Devices

Over the last few years, the use of connected devices such as smartphones, wearables, and smart home systems has increased dramatically. The incorporation of power electronics into these devices is expected to drive the global electronic design automation market forward. The growing demand for high performance with low power consumption capability is expected to fuel future demand for electronic design automation solutions, influencing industry participants to make developments in their IP cores. The number of IoT-connected devices is expected to reach 50 billion by 2025. The majority of devices would not be traditional PCs or smartphones, but rather a growing web of interconnected devices that would include home appliances, security systems, and other devices.

Sample Report @ https://www.blueweaveconsulting.com/report/electronic-design-automation-software-market/report-sample

Cloud-based Services are Becoming More Popular

The processing, power, and infrastructure required for designing, testing, validating, and building electronic systems have increased significantly as they have become more sophisticated. CAE and electronic design automation have fueled the demand for massive scale computation and data management in next-generation electronic devices. Because verifying components take up a large portion of the overall design time in these systems, electronic design automation companies have made significant investments in large server farms and high-performance storage systems to enable excellent quality and fast turnaround of semiconductor tests and validation. Cloud-based services are now used by semiconductor companies to benefit from the quick and flexible deployment of electronic design automation infrastructure.

Challenges: Continuous Technological Advancements

Particularly in the semiconductor sector, technology is a concept that is constantly evolving. New technologies would enter the market and upset the balance with each leap. The same is true for the IC sector, where process nodes are crucial. Design complexity, chip form factor, and IP core design architecture are all affected by changes in a semiconductor chip's nodes. Therefore, technical difficulties with device integration and the creation of a new design methodology are some of the difficulties in SoC designing. The sizes of technology nodes are constantly changing as a result of evolution. Therefore, the IP core design architecture must be changed by semiconductor chip manufacturers. The majority of businesses have been improving their electronic design automation solutions to meet consumer demand.

Segmental Coverage

Global Electronic Design Automation Software Market – By Application

Global Electronic Design Automation Software Market is classified into the following applications: automotive, healthcare, defense & aerospace, industrial, communication, consumer electronics, and others. In terms of application, the consumer electronics industry accounted for the largest revenue share for electronic design automation software in 2020. This is due to the constant advancement of consumer electronics such as smartphones, tablets, laptops, desktop computers, and cameras. It is also expected that EDA software will fill a gap in the market for models, methods, and tools. During the forecast period, all of these factors will drive the growth of the Global Electronic Design Automation Software Market (2022-2028).

Impact of COVID-19 on Global Electronic Design Automation Software Market

The COVID-19 pandemic is expected to have a significant impact on the development of the market for electronic design automation software. Spending in the electronic design automation industry is expected to fall when compared to pre-pandemic levels. It is caused by several factors, including a decline in semiconductor industry revenue in 2020. The slow rate of production and scarcity of raw materials harm market growth. Several factories in several countries have been forced to close due to the pandemic. A large number of semiconductor organizations, on the other hand, are urging the government to classify the semiconductor industry as critical. They will be able to continue operations, ensuring that customer demand is met and industry supply is maintained.

Competitive Landscape

The leading market players in the Global Electronic Design Automation Software Market are Cadence Design Systems, Inc., Synopsys, Inc., Siemens, ANSYS, Inc., Keysight Technologies, Inc., Xilinx, Inc., eInfochips, Altium Limited, Zuken Inc., Silvaco, Inc., Altair, Aldec, Inc., Autodesk, Vennsa Technologies, Boldport Limited, and other prominent players. The Global Electronic Design Automation Software Market is highly fragmented with the presence of several manufacturing companies in the country. The market leaders retain their supremacy by spending on research and development, incorporating cutting-edge technology into their goods, and releasing upgraded items for customers. Various tactics, including strategic alliances, agreements, mergers, and partnerships, are used.

Don’t miss the business opportunity in the Global Electronic Design Automation Software Market. Consult our analysts to gain crucial insights and facilitate your business growth.

The in-depth analysis of the report provides information about growth potential, upcoming trends, and statistics of the Global Electronic Design Automation Software Market. It also highlights the factors driving forecasts of total market size. The report promises to provide recent technology trends in the Global Electronic Design Automation Software Market and industry insights to help decision-makers make sound strategic decisions. Furthermore, the report also analyzes the growth drivers, challenges, and competitive dynamics of the market.

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pavanghage · 4 years ago

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Electronic Design Automation Market 2021 New Innovations Trends, Research, Global Share and Growth Factor till 2027

The ELECTRONIC DESIGN AUTOMATION MARKET accounted for 10.31 Bn in the year 2018 and is expected to grow at a CAGR of 12.0% during the forecast period 2019 - 2027, to account for US$ 28.27 Bn in the year 2027.

Global ELECTRONIC DESIGN AUTOMATION MARKET is segmented by region into North America, Europe, Asia-Pacific, Middle East and Africa, South and Central America.

The key players profiled in the ELECTRONIC DESIGN AUTOMATION MARKET research study includes:

Agnisys Inc.

Aldec, Inc.

Autodesk, Inc.

Cadence Design Systems, Inc.

Labcenter Electronics Ltd.

Keysight Technologies

Mentor Graphics Corporation

Silvaco, Inc.

Synopsys, Inc.

Zuken Inc.

Request Sample Copy of ELECTRONIC DESIGN AUTOMATION MARKET research report at – https://www.theinsightpartners.com/sample/TIPTE100001022/

Since, the key findings in the ELECTRONIC DESIGN AUTOMATION MARKET research reports highlight crucial progressive industry trends, it allows the companies across the value chain to develop effective long-term strategies. The clients get to understand a clear picture of the competitors and can develop strategies and modify business expansion plans accordingly. The ELECTRONIC DESIGN AUTOMATION MARKET research reports cover thousands of global players that based on several parameters, such as company revenue, product portfolio, and geographic presence.

The Insight Partners adheres to the codes of practice of the Market Research Society and Strategic and Competitive Intelligence Professionals. The following methodology has been followed for the collection and analysis of data presented in this report:

Coverage:

The objective of updating “The Insight Partners” coverage is to ensure that it represents the most up-to-date vision of the industry possible. The estimated revenues of all major companies, including private and governmental, are gathered and used to prioritize coverage. Companies which are making the news, or which are of particular interest due to their innovative approach, are prioritized.

Secondary Research:

The research process begins with exhaustive secondary research using internal and external sources to obtain qualitative and quantitative information relating to each Market. The secondary research sources that are typically referred to include, but are not limited to:

· Company Websites, Annual Reports, Financial Reports, Broker Reports and Investor Presentations

· Industry Trade Journals and Other Literature

· National Government Documents, Statistical Databases and Market Reports

· News Articles, Press Releases and Web-Casts Specific to the Companies Operating in the Market

NOTE: All the financials considered in Company Profile’s section have been standardized to US$. This has been achieved after converting the financials (for those not in US$) with respective currency exchange rates of the particular year.

Primary Research:

“The Insight Partners” conducts hundreds of primary interviews a year with industry participants and commentators in order to validate its data and analysis. A typical research interview fulfils the following functions:

· Provides First-Hand Information on the Market Size, Market Trends, Growth Trends, Competitive Landscape and Future Outlook

· Validates and Strengthens Secondary Research Findings

· Further Develops the Analysis Team’s Expertise and Market Understanding

ELECTRONIC DESIGN AUTOMATION MARKET Market Segmentation:

Global Electronic Design Automation Market - By Type

· Computer Aided Engineering (CAE)

· Semiconductor IP (SIP)

· IC Physical Design & Verification

· Printed Circuit Board (PCB) & Multi-Chip Module (MCM)

Global Electronic Design Automation Market - By Application

· Aerospace & Defense

· Consumer Electronics

· Telecom

· Automotive

· Industrial

· Others

Order a copy of this research ELECTRONIC DESIGN AUTOMATION MARKET research report at – https://www.theinsightpartners.com/buy/TIPTE100001022/

Primary research involves email interactions and telephone interviews for each market, category, segment and sub -segment across geographies. The participants who typically take part in such a process include, but are not limited to:

· Industry Participants: VPs, Business Development Managers, Market Intelligence Managers and National Sales Managers

· Outside Experts: Valuation Experts, Research Analysts and Key Opinion Leaders Specializing in the Industry

ABOUT US:

The Insight Partners is a one stop industry research provider of actionable solutions. We help our clients in getting solutions to their research requirements through our syndicated and consulting research services. We are specialist in industries such as Semiconductor and Electronics, Aerospace and Defense, Automotive and Transportation, Biotechnology, Healthcare IT, Manufacturing and Construction, Medical Device, Technology, Media and Telecommunications, Chemicals and Materials.

Our research model is very simple. We believe in client servicing and delivering best quality to our customers. Through our research content, we are making sure that our customers get value of their money along with better quality data and analysis.

Our research content is majorly focused towards market trends in terms of market sizing, competitive landscaping, company analysis, regional or country analysis etc. We provide detailed break-up of segmentation in terms of geography, technology, product and services etc.; which helps our clients to get a deeper analysis on various research topics.

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