#DDR5memory

[govindhtech]

The 2022 DRAM Module Supplier of the Year is Kingston Technology

Kingston Technology created 2022 DRAM Module Supplier of the Year

Commanding the Market: Kingston’s Unassailable 78.12% Market Share

In a resounding affirmation of its industry prowess, Kingston Technology Company, Inc.’s affiliate stands tall as the paramount third-party DRAM module supplier for 2022. The latest revenue-based rankings by TrendForce unequivocally place Kingston at the zenith, boasting an astounding 78.12% market share, with a revenue totaling $13.5 billion USD. This achievement not only cements Kingston’s top-tier status but also marks an unparalleled 20-year reign as a recognized world leader.

A Decades-Long Reign: 20 Years at the Pinnacle

The enduring success of Kingston Technology is underscored by its two-decade-long dominance in the DRAM module sector. The company’s unbroken streak at the forefront speaks volumes about its unwavering commitment to excellence and innovation.

TrendForce Report: A Global Recognition of Kingston’s Supremacy

The accolades bestowed upon Kingston in the TrendForce report are a testament to its resilient performance in the face of a challenging market. Despite a 4.6% year-over-year decline in DRAM module sales industry-wide, Kingston’s revenue experienced a marginal dip while solidifying its position as the global leader.

The Power of Brand Scale: Kingston’s Robust Strategy

Consumer buying trends for electronic products encountered headwinds from high inflation, impacting several market players. However, Kingston’s robust brand scale and a comprehensive product supply chain acted as a shield, mitigating the decline and preserving its preeminence in market share rankings.

Market Landscape: Kingston’s Commanding Presence

The report reveals that the top five memory module houses globally accounted for a staggering 90% of total sales in 2022. Kingston, with its dominant market share of 78.12%, emerges as the indisputable leader. The chart below, sourced from TrendForce, outlines the rankings of the top 10 DRAM module suppliers in 2022.

Innovation Beyond Boundaries: Kingston’s Product Evolution

In 2022, Kingston’s award-winning Kingston FURY Beast DDR5 and Renegade DDR5 memory modules underwent a transformative redesign. The introduction of white heat spreaders offers users the freedom to choose the color that best aligns with their individual style. In an era where system aesthetics matter, Kingston provides modules that complement both traditional all-black systems and the burgeoning trend of all-white PCs.

Insights from Kingston: Navigating a Demanding Business Landscape

Iwona Zalewska, DRAM Business Manager at Kingston, EMEA, reflects on the 2022 findings from TrendForce. “The findings not only highlight Kingston’s ongoing expansion and adaptability but also underscore our resilience and significance within the industry,” she remarks. “Maintaining our top position for the 20th consecutive year is a testament to our enduring dominance.”

About Kingston Technology Europe Co LLP

Kingston Technology Europe Co LLP, alongside Kingston Technology Company, Inc., operates within the same corporate group. Kingston stands as the world’s largest independent manufacturer of memory products. From big data solutions to laptops, PCs, and IoT-based devices like smart and wearable technology, Kingston plays a pivotal role in delivering the technology that shapes our daily lives. The world’s foremost PC manufacturers and cloud-hosting companies rely on Kingston for their manufacturing needs, showcasing the trust placed in Kingston’s passion-fueled technology.

Read more on Govindhtech.com

[luckyfalconcomputer]

Crucial Pro

Introducing the new Crucial DDR5 Pro Memory: Overclocking Edition. Experience lightning-fast speeds of 6000MT/s, 25% lower latency, and enjoy dual compatibility with Intel XMP 3.0 and AMD EXPO. Plus, get peace of mind with our limited warranty. Upgrade to the future of memory today!

[phonemantra-blog]

The landscape of business computing is undergoing a significant transformation. Artificial intelligence (AI) is rapidly permeating various aspects of business operations, from data analysis and automation to customer service and security. To keep pace with this evolution, businesses require powerful and secure computing solutions. AMD has risen to the challenge with the introduction of its next-generation Ryzen PRO 8000 Series processors, specifically designed to empower businesses of all sizes to harness the transformative power of AI. This article delves into the key features and functionalities of the Ryzen PRO 8000 Series, exploring how it elevates business computing to new heights. AMD Reimagines Business Ryzen PRO 8040 Series: The Mobile Powerhouse Fueled by AI The Ryzen PRO 8040 Series spearheads the lineup, specifically designed for high-performance business laptops and mobile workstations. These processors boast a groundbreaking feature – integrated AI engines. Measured in trillion operations per second (TOPS), these engines deliver exceptional processing power specifically tailored for AI workloads. This translates to significant performance improvements when businesses leverage AI-powered applications like data analytics, machine learning, and image recognition. The Ryzen PRO 8040 Series caters to the ever-growing demand for on-the-go productivity. Business professionals working remotely or traveling frequently can benefit from the exceptional processing power and efficient power management offered by these processors. Whether tackling complex presentations, video conferencing, or running demanding AI applications, the Ryzen PRO 8040 Series empowers a seamless mobile work experience. A Desktop Revolution: Introducing the First Integrated AI Engine for Desktops AMD breaks new ground with the Ryzen PRO 8000 Series for desktops. These processors mark a significant leap forward by integrating a dedicated AI engine directly on the chip. This groundbreaking feature unlocks the potential for immersive AI experiences on business desktops. Imagine AI-powered data analysis tools that crunch numbers at lightning speed or intelligent assistants that streamline daily workflows – the Ryzen PRO 8000 Series paves the way for these possibilities. Furthermore, these desktop processors don't compromise on power efficiency. Despite the presence of the AI engine, they continue to deliver exceptional performance while maintaining low power consumption. This translates to cost savings on energy bills and a reduced environmental footprint for businesses. Beyond AI: Unparalleled Performance and Security for Businesses The capabilities of the Ryzen PRO 8000 Series extend far beyond just AI. Here's a closer look at some of the additional features that make this series an attractive option for businesses: Blazing-Fast Performance: Benchmarks indicate significant performance improvements over previous generations of processors. Businesses can expect to experience faster application loading times, smoother multitasking capabilities, and an overall more responsive system. Cutting-Edge Connectivity: The Ryzen PRO 8000 Series boasts support for the latest DDR5 memory standard and cutting-edge PCIe 4.0 technology. DDR5 memory offers significantly faster data transfer speeds compared to its predecessor, DDR4, ensuring smoother system operation and accelerated application loading times. PCIe 4.0 technology provides substantial bandwidth improvements, allowing for the seamless utilization of high-performance storage devices and graphics cards, crucial for businesses that rely on data-intensive tasks or creative workflows. Superior Graphics Capabilities: Integrated AMD Radeon graphics deliver enhanced visual performance, enabling businesses to handle applications that demand strong graphics processing capabilities, such as video editing and engineering software. Uncompromising Security: Security remains a top priority for any business computing solution. The Ryzen PRO 8000 Series integrates the Microsoft Pluton security processor. This advanced security solution safeguards sensitive business data from the chip level up to the cloud. This multi-layered approach to security protects businesses from cyber threats and ensures data privacy. Widespread Availability through Strong Partnerships AMD has established strong partnerships with leading PC manufacturers like HP and Lenovo. These partnerships ensure that the Ryzen PRO 8000 Series processors will be readily available in a wide range of business PCs, including desktops, laptops, and workstations. This diverse selection empowers businesses to choose the ideal computing solution that aligns perfectly with their specific needs and budgets. FAQs Q: What sets the Ryzen PRO 8040 Series apart from previous processors? A: The Ryzen PRO 8040 Series boasts unparalleled AI capabilities, delivering lightning-fast performance for AI workloads crucial for modern businesses. Q: How does the Ryzen PRO 8000 Series redefine desktop computing? A: The Ryzen PRO 8000 Series introduces the industry's first integrated AI engine for desktop processors, promising immersive AI experiences with exceptional power efficiency. Q: What security features are integrated into Ryzen PRO processors? A: Ryzen PRO processors feature the Microsoft Pluton security processor, ensuring comprehensive protection from chip-level to cloud security threats. Q: Which manufacturers are integrating Ryzen PRO processors into their business PC offerings? A: Leading manufacturers like HP and Lenovo are collaborating with AMD to incorporate Ryzen PRO processors into their lineup, ensuring businesses have access to powerful and versatile solutions.

[lusin333]

I, @Lusin333 have a Kingston FURY Beast 16GB DDR5 RAM memory kit (KF556C36BBEK2-16).

I will use this in my crypto mining rig.

Thanks to Kingston Technology for giving this DDR5 RAM kit to me FOR FREE.

[icchipcompany]

(通过 Amazon released a new server chip Graviton3: machine learning performance is three times the original, energy consumption reduced by 60% - IC CHIP CO., LIMITED)

[govindhtech]

ASRock Z890 Taichi OCF: A Milestone In Memory Overclocking

By overclocking its memory to an unprecedented DDR5-12527MHz, the ASRock Z890 Taichi OCF breaks the world record!

This accomplishment demonstrates the Z890 Taichi OCF‘s remarkable performance and dependability in harsh environments, enhancing its standing as the best option for enthusiasts and expert overclockers. The motherboard’s 10-layer PCB, server-grade ultra-low-loss material, and ASRock’s patent-pending Memory OC Shield, which lowers EMI noise, provide unparalleled stability and performance for overclocking. It can handle memory frequencies up to DDR5-12527MHz.

ASRock Z890 Taichi OCF Overview

Unleashing Extreme Performance

Image Credit To ASRock

This motherboard, made for dedicated overclockers, is designed to use LN2 cooling to push your system to its maximum potential. Gain the greatest advantage in smashing records and optimizing hardware capabilities by experiencing previously unheard-of performance and stability in harsh environments.

Extreme Memory Overclocking

Based on the design principle of “built for stable and reliable,” ASRock doesn’t skimp on any aspects. This motherboard is constructed from premium materials, and by turning on the pre-tested profiles, enthusiasts may benefit from the increase in DDR5 memory overclocking capability. Verify that the RAM modules support AMD EXPO and Intel XMP, and that overclocking is inexpensive, fulfilling, and completely painless.

Memory overclocking has some hazards and might compromise the stability of your system. Please be aware that overclocking is something you should undertake at your own risk and cost. Support for EXPO/XMP profiles may change depending on the motherboard type, RAM modules, and system setup. The completed support list may be found in Memory QVL.

Top-tier hardware specifications, a sturdy power design, Thunderbolt 4 Type-C, and DIY-friendly functionality are all aspects of the Z890 Taichi OCF Taiichi series flagship motherboard. With its opulent design and potent performance, it is designed for high-end gamers.

Overclock Toolkit

OC Buttons Taichi OCF’s OC Buttons provide hardware-level controls to help with severe overclocking and improve your overclocking experience.

+/- Rapid OC Buttons: These buttons let users change the OC frequency in Rapid OC fast and simply.

Buttons for OC Profiles 1, 2, and 3: To load the preset OC Profiles 1, 2, or 3 rapidly, use the OC Profile Buttons in Rapid OC.

LN2 Mode Switch: When using liquid nitrogen for high overclocking, the LN2 mode helps to remove the cold-boot bug problems in CPUs.

Slow Mode Switch: To stabilize the system for extreme overclocking, use Slow Mode to operate the processor at its lowest frequency.

Retry Button: When a forced shutdown is required, restart the system right away.

To boot using the BIOS’s default settings, use the “Safe Boot” button.

DIY Friendly Design

Graphics Card EZ Release

To meet customer demands, ASRock changed the PCIe slot installation process, making it simple to install and remove the graphics card.

Professional Overclocking

CPU Heater Header

It is designed to improve overclocking results by preventing CPU SoC Tile freezing during LN2 intense overclocking with up to 42W of heating power by duty. It is equipped with a heater header that makes it simple to connect ceramic heating pads into the CPU socket.

Dual Thunderbolt 4 Type-C

It links a variety of devices with a single Thunderbolt 4 connection and allows for lightning-fast data transmission up to 40Gbps.

Premium PCB Solution

Server-Grade Ultra Low-Loss PCB

By enhancing signal integrity, the server-grade ultra low-loss PCB enables the motherboard to support PCIe 5.0 for both graphics cards and M.2 SSDs. It also enhances memory OC capability to provide the highest possible memory performance.

Deluxe 6xM.2 Sockets

Supports a maximum of six NVMe M.2 SSDs, one of which can support the most recent PCI Express 5.0 standard.

22+1+2+1+1 Power Phase, 110A SPS

The most recent SPS (Smart Power Stage) technology is included into the Dr.MOS design. It is designed to monitor the temperature and current of each phase, allowing for more efficient power delivery to the CPU, improving performance and OC potential.

Ultra-Fast Networking

802.11be Wi-Fi 7

Wi-Fi 7 provides multi-link operation, reduced latency, and increased data speed. The VR/AR experience is made more immersive and linked by these characteristics, which guarantee a seamless and real-time interactive experience.

Dual USB 3.2 Gen2x2 Type-C (1 Rear, 1 Front)

Reversible USB 3.2 Gen2x2 Type-C can connect either way and transport data at 20 Gbps, twice as fast as the previous iteration.

BIOS Flashback

With a single click, get the most convenient BIOS flashing. With just a USB and power supply, users may effortlessly get the most recent BIOS support; no CPU, RAM, or other parts are needed.

Read more on govindhtech.com

[govindhtech]

NVIDIA MGX And Intel Xeon Powered DC-MHS Servers At SC24

MSI, a leading global provider of high-performance server solutions, displayed its AI server based on the NVIDIA MGX architecture and DC-MHS server portfolio powered by Intel Xeon 6 processors at booth 3655 at Supercomputing 2024 (SC24) from November 19–21 MSI’s most recent products are made with the goal of optimising compute density, energy efficiency, and modular flexibility in order to meet the demanding requirements of AI, HPC, and data-intensive applications. MSI provides the scalable performance and resilience required for data centres to keep up with changing HPC demands with its Intel Xeon 6 DC-MHS servers, which are designed on a flexible DC-MHS architecture.

NVIDIA MGX Server for Next-Gen AI

With its two Intel Xeon 6 CPUs and eight FHFL dual width GPU slots, MSI’s CG480-S5063 AI server, which is based on the MGX architecture, is specifically designed to meet the high needs of AI. It supports the potent NVIDIA H200 NVL GPUs, which enable enormous parallel processing for workloads related to AI, LLM, and data analytics. High throughput for data-intensive applications is provided by its 20 PCIe 5.0 E1.S NVMe bays and 32 DDR5 DIMM slots, while PCIe 5.0 x16 slots allow for flexible and fast network integration. For AI systems that prioritize optimal computational efficiency and scalability, this 4U server provides the performance and scalability required.

Intel Xeon 6 DC-MHS Servers Solutions for HPC Data Centers

High-performance data center and HPC environments benefit from unparalleled scalability and flexibility with MSI’s Intel Xeon 6 processor-based DC-MHS servers and server motherboards. Microsoft’s solutions provide optimal resource allocation across a variety of applications with Intel Xeon 6 processors, which have P-cores for optimal performance and E-cores for energy-efficient operations under heavy workloads.

Data centers can effectively scale and swiftly adjust to the ever-increasing demands of AI, analytics, and intensive computing workloads with these DC-MHS solutions, which were designed with efficient thermal management and modularity in mind. They use Extended Volume Air Cooling (EVAC) CPU heatsinks to maintain stable operation even under intense use. These solutions, which combine the potent Intel Xeon 6 processors with the flexible DC-MHS architecture, give data centers the tools they need to remain competitive in the quickly changing HPC market of today.

DC-MHS Servers

Intel Xeon 6 processors, DDR5 DIMM slots, and broad PCIe 5.0 compatibility enable MSI DC-MHS servers to provide unparalleled computational density and modular scalability. These platforms, which are based on the OCP DC-MHS architecture, offer data centers the adaptability, strength, and efficiency they need to succeed in demanding HPC and AI environments. They include DC-SCM2 server management modules with A speed AST2600 BMC support and improved front I/O design.

For demanding computation and memory-bound workloads in HPC environments, the CD270-S3061-X2 is a 2U, two-node server. The system offers significant processing power and memory bandwidth necessary for parallel tasks,with its single Intel Xeon 6 CPU with up to 350W TDP and 16 DDR5 DIMM slots per node. High-speed data access is made possible by its six PCIe 5.0 x4 U.2 NVMe bays per node, which makes it perfect for high-performance and scalable data center architecture.

The CX270-S5062 is a 2U server with 32 DDR5 DIMM slots and dual-socket Intel Xeon 6 processors with a maximum TDP of 350W each that is designed for maximum computation throughput. This device facilitates quick data processing and AI-driven calculations by supporting up to 24 PCIe 5.0 x4 U.2 NVMe bays and dual GPU options to offer both large storage and GPU acceleration capabilities.

A single Intel Xeon 6 processor with a maximum TDP of 350W powers the CX271-S3066, a 2U server that offers balanced performance and scalability. This server, which supports up to 24 PCIe 5.0 x4 U.2 NVMe bays and 16 DDR5 DIMM slots, is designed for data-centric applications that need quick access to data and effective processing, guaranteeing that data centers can quickly meet the demands of AI and HPC.

DC-MHS Server Motherboards

The latest Intel Xeon 6 processors with P-cores and E-cores power the full-width M-FLW and density-optimized M-DNO (Type-4, Type-2) motherboards in the MSI DC-MHS series, which offers optimal performance and energy efficiency for a range of compute-intensive applications. These motherboards offer the processing power and scalability required for sophisticated AI, data analytics, and HPC applications with their DDR5 memory slots, fast PCIe 5.0 connectivity, and flexible I/O options.

A single Intel Xeon 6 CPU, up to 500W TDP, and 12 DDR5 DIMM slots are supported by the D3071 M-DNO Type-2 HPM.

32 DDR5 DIMM slots, up to 350W TDP, and dual Intel Xeon 6 CPUs are supported by the D5062 M-FLW HPM.

The D3066 M-DNO Type-4 HPM has 16 DDR5 DIMM slots, a single Intel Xeon 6 processor, and a maximum TDP of 350W.

The D3061 M-DNO Type-2 HPM has 12 DDR5 DIMM slots, a single Intel Xeon 6 processor, and a maximum TDP of 350W.

The OCP DC-SCM v2.0-compliant MGT1 DC-SCM2 Module facilitates cross-platform use, lowers deployment and maintenance expenses, and streamlines testing and validation.

Read more on govindhtech.com

[govindhtech]

MSI Introduces Modern AM273QP AI Series, All-in-One(AIO) PCs

Modern AM273QP AI Series

The Modern AM273QP AI Series and Modern AM273Q AI are MSI’s newest All-in-One PCs. The most recent Intel Core Ultra processor with Intel AI Boost NPU, DDR5 RAM, Microsoft Copilot, and the MSI AI Engine are all integrated into these devices.

Enhanced Your Productivity

A 27-inch WQHD (2560 x 1440) IPS screen in the Modern AM273Q/QP AI Series provides incredibly sharp images and a captivating viewing experience. These PCs provide seamless multitasking and cutting-edge AI capabilities with the most recent Intel Core Ultra CPU with Intel AI Boost NPU. Users may increase productivity and streamline daily chores with Microsoft Copilot integration’s user-friendly AI-driven capabilities.

AI-Powered Effectiveness

No human modifications are required because the MSI AI Engine automatically detects user scenarios and optimizes performance. Use tools like Windows Studio Effects and Live Captions to enhance video conferences and make conversation more interesting and clear. With Image Creator, a tool that helps users create original artwork, the AIO PCs offer improved performance for content summarization, idea generation, and creativity enhancement.

Making AI on PC Easy: Intel AI Playground

With support for Intel AI Playground, the contemporary AM273Q/QP AI Series provides customers with an easy-to-use AI interface. The platform offers a range of user-friendly AI features, such as the ability to create and improve images and receive responses from an AI chatbot. When working with AI, users have complete control over their input and content because all features operate locally on your PC, protecting your privacy.Image credit to MSi

Elevate Visual Experience: MSI EyesErgo Technology and 100Hz High Refresh Rate

TÜV-certified Anti-Flicker, Less Blue Light PRO, an anti-glare panel, and the Eye-Q Check system are all examples of MSI EyesErgo technology found in the Modern Series All-in-One PCs. A hardware-based filter called Less Blue Light PRO preserves vibrant colors while shielding the eyes. Smoother, sharper images are guaranteed by a 100 Hz high refresh rate display, which lessens eye strain. The Modern AM273QP AI Series’ tilt-height adjustable stand provides ergonomic versatility for optimal comfort.

Comprehensive Connectivity

A variety of connectors, such as Thunderbolt 4, HDMI, USB Type-C, USB 5Gbps Type-A, 2.5G LAN, and an accessory slot Modern AM273QP AI Series, are included in both versions to increase efficiency for a range of user requirements. The PC may operate as a monitor without booting up with MSI Instant Display Technology, which enables the screen to power up quickly when connected. With support for up to four displays via Thunderbolt 4 and HDMI-out, the series offers more screen real estate for multitasking needs. For online meetings, the retractable Full HD webcam provides crisp video while maintaining confide

Working Smarter and Greener

Sustainability is given first priority in the Modern AM273Q/QP AI Series through careful material selection, energy-efficient design, and conscientious end-of-life management. Each and every aspect demonstrates MSI’s dedication to environmental responsibility, from the use of post-consumer recycled plastic to 100% recyclable packaging and FSC-certified boxes.

MSI keeps pushing innovation with the introduction of the Modern AM273QP AI Series and Modern AM273Q AI Series, which empowers users to succeed in the digital era. The product will be released in Italy, Spain, and France first in November 2024, with other nations to follow shortly after.

In Summary

Details regarding the most recent MSI Modern AM273QP AI Series and Modern AM273Q AI series All-in-One PCs are available from the source. The newest Intel Core Ultra processor with Intel AI Boost NPU, DDR5 memory, and Microsoft Copilot integration for improved multitasking and AI capabilities are all features of these productivity-focused devices. For more immersive visual experiences, the PCs include a 27-inch WQHD IPS screen with a refresh rate of 100 Hz. Additionally, MSI EyesErgo technology is integrated for enhanced eye comfort. The source also emphasizes the PCs’ extensive connectivity features, which include a retractable Full HD camera, HDMI, and Thunderbolt 4. The source concludes by highlighting MSI’s dedication to sustainability through careful material selection and energy-efficient design.

Read more on Govindhtech.com

[luckyfalconcomputer]

What Is DDR5?

[govindhtech]

AMD EPYC 9005: 5th Gen AMD EPYC CPU With Zen 5 Design

AMD EPYC 5th Gen Processors

The AMD EPYC 9005 family of processors, designed specifically to speed up workloads in data centers, the cloud, and artificial intelligence, are pushing the boundaries of corporate computing performance.

The world’s top server CPU for cloud, AI, and corporate applications, the 5th Gen AMD EPYC processors, originally codenamed “Turin,” are now available, according to AMD.

The AMD EPYC 9005 Series processors build on the record-breaking performance and energy efficiency of the previous generations with the “Zen 5” core architecture, compatible with the widely used SP5 platform and offering a wide range of core counts from 8 to 192. The top of the stack 192 core CPU can deliver up to 2.7X the performance compared to the competition.

AMD EPYC 9575F

The 64-core AMD EPYC 9575F, a new CPU in the AMD EPYC 9005 Series, is designed specifically for GPU-powered AI applications that need the highest host CPU performance. Boosting up to 5GHz5, it offers up to 28% quicker processing than the competition’s 3.8GHz CPU, which is necessary to keep GPUs loaded with data for demanding AI applications.

The World’s Best CPU for Enterprise, AI and Cloud Workloads

From supporting corporate AI-enablement programs to powering massive cloud-based infrastructures to hosting the most demanding business-critical apps, modern data centers handle a wide range of workloads. For the wide range of server workloads that power corporate IT today, the new 5th Gen AMD EPYC processors provide industry-leading performance and capabilities.

AI, HPC, and business computing get up to 37% and 17% more instructions per clock (IPC) with the new “Zen 5” core design. and cloud applications than “Zen 4.”6.

When comparing AMD EPYC 9965 processor-based servers to Intel Xeon 8592+ CPU-based servers, users may anticipate significant improvements in their real-world workloads and applications, including:

Results in commercial applications like video transcoding may be obtained up to 4 times quicker.

The time to insights for scientific and HPC applications that address the most difficult challenges in the world may be up to 3.9 times faster.

Performance per core in virtualized infrastructure may increase by up to 1.6X.

Whether they are running a CPU or a CPU + GPU system, 5th Gen AMD EPYC processors allow clients to drive quick time to insights and deployments for AI installations in addition to providing leading performance and efficiency in general purpose workloads.

In contrast to the competition:

In order to drive an efficient approach to generative AI, the 192 core EPYC 9965 CPU can perform up to 3.7X better on end-to-end AI workloads, such as TPCx-AI (derivative).

In enterprise-class generative AI models of small and medium sizes, such as Meta Llama 3.1-8B, the EPYC 9965 offers 1.9 times the throughput performance of its competitors.

Lastly, a 1,000 node AI cluster may push up to 700,000 additional inference tokens per second with the aid of the EPYC 9575F, a specially designed AI host node CPU, and its 5GHz maximum frequency increase. doing more tasks more quickly.

Customers can achieve 391,000 units of SPECrate2017_int_base general purpose computing performance by modernizing to a data center powered by these new processors. This allows them to use approximately 87% fewer servers and an estimated 71% less power while still receiving impressive performance for a variety of workloads. This offers CIOs the choice to boost performance for routine IT activities while achieving remarkable AI performance, or they may take advantage of the space and power reductions.

AMD EPYC CPUs: Pioneering the Next Innovation Wave

EPYC CPUs have been widely used to power the most demanding computing operations due to their demonstrated performance and extensive ecosystem support among partners and consumers. AMD EPYC CPUs enable clients rapidly and effectively create value in their data centers and IT environments with their industry-leading performance, features, and density.

Features of the 5th Gen AMD EPYC

With support from Cisco, Dell, Hewlett Packard Enterprise, Lenovo, Supermicro, and all major ODMs and cloud service providers, the whole array of 5th Gen AMD EPYC processors is now available, offering businesses looking to lead in compute and AI a straightforward upgrade path.

The AMD EPYC 9005 series CPUs include the following high-level features:

Options for the leadership core count range from 8 to 192 per CPU.

The main architectures for “Zen 5” and “Zen 5c”

Each CPU has 12 DDR5 memory channels.

Up to DDR5-6400 MT/s of support

Up to 5GHz5 leadership increase frequencies

The whole 512b data route for AVX-512

Every component in the series is undergoing FIPS certification, and trusted I/O for confidential computing

Read more on govindhtech.com

[govindhtech]

AMD EPYC Embedded 8004 Series Processors For Systems

AMD Presents the Embedded 8004 Series, an Energy-Efficient EPYC for Systems. AMD EPYC Embedded CPUs regularly set the industry standard for networking, storage, and industrial applications due to their performance, efficiency, connection, and innovation. It maintain this leadership with the fourth-generation AMD EPYC Embedded 8004 Series CPUs.

AMD EPYC Embedded 8004 Series

AMD EPYC Embedded 8004 Series processors are suited for compute-intensive embedded systems with limited space and power due to their tiny form factor and strong performance. Additionally, it has several integrated functions to improve system efficiency and reliability. The AMD EPYC Embedded 8004 Series excels in the most demanding embedded environments. Corporate and cloud warm/cold storage, networking systems, routers, security appliances, and industrial edge applications benefit from it. Dynamic workloads are also easy for it.

Breakthrough performance and power efficiency

AMD EPYC Embedded 8004 Series processors boost performance-per-watt and core density using AMD “Zen 4c” cores. The EPYC Embedded 8004, AMD’s first processor series with these cores, sets a new bar for platform innovation and efficiency. Hardware manufacturers may now create unique, energy-efficient platforms with up to 30% more performance per watt than the previous generation (“Zen 3”) with this breakthrough.

These processors are intended to fulfill a variety of application demands. They are available in 1P configurations with 12 to 64 cores (24 to 128 threads) and support up to 1.152TB DDR5 memory capacity (2 DIMMs/channel with 96GB DIMM size). Their Thermal Design Power (TDP) profiles range from 70W to 225W.

Sizeable I/O And Function Packed In A Small Footprint

Because of its extensive memory capacity (6 channels of DDR5-4800) and high-speed I/O connectivity (96 lanes PCIe Gen 5), AMD EPYC Embedded 8004 Series processors are designed to easily handle data-intensive tasks. System designers may easily link SSDs, networking cards, and other components with these characteristics to construct scalable and adaptable system setups.

They are more energy-efficient and take up less room because to their tiny, SP6 socket form factor, which is 19% smaller than AMD EPYC Embedded 9004 Series processors. In addition, the devices come with a seven-year lifetime warranty, which aids system designers in preserving platform lifespan.

Improved Embedded Functions

The AMD EPYC Embedded 8004 Series CPUs are exceptional in terms of data preservation, system dependability, and data transport capabilities. Important characteristics that are incorporated include:

Direct Memory Access (AMD EPYC 4th Gen DMA): Intended to increase system speed and efficiency by relieving the CPU of data transfers, freeing up cores for important application activities.

Non-Transparent Bridging (NTB): By facilitating data sharing between two CPUs in active-active configurations via PCI Express (PCIe), Non-Transparent Bridging (NTB) improves system dependability and allows for sustained operation in the event of a breakdown.

DRAM Flush to NVMe: In the case of a power outage, this technique helps to guarantee that important data is kept safe by flushing it from DRAM to nonvolatile memory.

Dual SPI Support: Offers an extra degree of protection by allowing the use of two SPI ROMs, one for the secure bootloader and one for the BIOS image.

Device Identity Attestation: Enables cryptographic processor authentication, which helps prevent illegal CPU upgrades.

Support for the Yocto Framework: Enables users to design a thin, efficient Linux operating system for embedded devices.

Processors from the AMD EPYC Embedded 8004 Series are perfect for markets where high performance is required while maintaining strict standards for platform compactness, thermal dexterity, and energy economy. AMD EPYC Embedded 8004 Series processors are designed to meet the demands of demanding workloads in harsh environments, especially in networking, storage, and industrial edge systems. These Processors provide customers cutting-edge capabilities and unprecedented performance-per-watt advantages.

Uses

The Optimal Blend: Highest Efficiency and Maximum Performance.

Security and Networking

AMD Embedded networking solutions provide a comprehensive, unified architecture across the whole security product range by extending the performance and scalability of the client platforms.

Keepsake

High-performance storage processors with a wealth of capabilities are provided by AMD Embedded storage solutions, making storage solutions dependable and effective for embedded applications.

Commercial

For industrial control applications, AMD Embedded Industrial Control solutions provide embedded processor solutions with outstanding performance, a wide range of capabilities, and consistent long-life availability.

Summary

The AMD EPYC Embedded 8004 Series processors deliver unprecedented performance-per-watt with extensive I/O agility by using the performance and efficiency advantages of the “Zen 4” and “Zen 4c” core architecture (5nm).

These CPUs have outstanding compute performance and comprehensive I/O capabilities, making them perfect for next-generation networking, security, storage, and industrial applications. They are optimized for demanding workloads and “always on” embedded systems.

Read more on Govindhtech.com

[govindhtech]

The DDR5 9000 48GB Overclocked Memory Kit From G.SKILL

Performance overclock memory and PC components leader G.SKILL International Enterprise has again raised the standard for high-performance memory technology. The company recently overclocked DDR5 9000 CL44-56-56 with a 48GB (24GBx2) kit, a major DDR5 memory feat. This achievement shows G.SKILL’s commitment to memory technology and AMD’s latest platforms’ remarkable overclocking capabilities. The AMD EXPO profiles may deliver exceptional performance, as shown by an ASUS ROG CROSSHAIR X870E HERO motherboard and AMD Ryzen 7 8700G processor.

This article discusses this breakthrough, its technological advancements, and its implications for PC performance, notably for gamers, content makers, and overclockers.

G.SKILL’s Performance and Overclocking Focus

G.SKILL is known for making high-performance RAM for enthusiasts and pros. Overclocking and stability have made their Trident Z series famous. G.SKILL has innovated with DDR5 to increase memory frequencies and performance.

Today’s DDR5 9000 overclock at CL44-56-56 with a 48GB kit capacity is another company milestone. With this performance, strengthens its dominance in overclocked memory kits.

Knowing DDR5-9000 and CL Timings

DDR5 is the next memory technology after DDR4. DDR5’s greater bandwidth boosts data speeds and multitasking. The memory’s transfer rate is 9000 MT/s, hence “DDR5 9000”. This speed is significantly above what most DDR5 kits can get out of the box.

The CL44-56-56 timings quantify RAM latency, which measures response time. CL44 is the CAS latency, or the delay between the processor’s data request and the RAM’s delivery. These values are greater than lower-clocked DDR5 kits, but the faster speed more than offsets the higher latency. This makes the memory efficient for fast data processing operations like gaming, 3D rendering, and video editing.

AMD Expo: Simplifying AMD System Overclocking

G.SKILL’s AMD EXPO (Extended Profiles for Overclocking) implementation is a highlight. AMD’s EXPO overclocking capability is user-friendly, like Intel’s XMP. Pre-configured profiles that customers can use to their BIOS simplify overclocking and boost performance without manually modifying parameters.

The AMD EXPO overclock profile on G.SKILL’s DDR5 9000 memory kit makes it easier to use at high speeds. This helps folks who are new to manual overclocking but desire faster memory performance.

ASUS ROG Crosshair X870E HERO with AMD Ryzen 7 8700G: Perfect Match

The flagship AMD-compatible ASUS ROG CROSSHAIR X870E HERO motherboard overclocked DDR5 9000. For enthusiasts who want to push their gear, the CROSSHAIR X870E HERO is appropriate because to its high build quality, power delivery, and overclocking options. Even with extreme overclocking, the motherboard‘s power architecture and cooling keep the system stable.

The motherboard was paired with AMD’s Zen 4-based Ryzen 7 8700G processor. High clock speeds, sophisticated multi-core performance, and DDR5 memory make this CPU ideal for performance fanatics. THE Ryzen 7 8700G’s processing power and the CROSSHAIR X870E HERO’s overclocking made G.SKILL’s DDR5 9000 memory kit ideal for testing.

Modern Computing’s Need for Fast Memory

DDR5 9000 speeds with 48GB storage are a technical milestone with real-world ramifications for computer activities. For memory-intensive tasks like gaming, multimedia creation, and scientific computing, high-speed memory improves system performance.

In memory-intensive games, faster memory can improve frame rates and latency, making gameplay smoother and more responsive. Content makers who edit 4K or 8K video, render 3D models, and simulate complicated simulations need fast memory. Quickly loading and processing big volumes of data reduces rendering times and boosts workflow.

G.SKILL’s DDR5 kit’s 48GB capacity gives customers adequate memory to multitask. Multitaskers and resource-intensive users like virtual machines, big datasets, and machine learning algorithms benefit from this.

G.SKILL Heat Dissipation Technology

Heat dissipation is difficult at high overclock speeds. Heat from overclocking, especially at such high levels, can cause system instability and damage if not managed appropriately. G.SKILL fixed this by adding sophisticated cooling to its DDR5 memory kits.

A sleek metal heat spreader dissipates heat under high-performance workloads in the DDR5 9000 kit. Even during extended overclocking, their heat spreaders keep the memory within acceptable temperatures.

Conclusion

The world’s top performance overclock memory and PC component brand, G.SKILL International Enterprise is excited to present an extraordinarily fast overclock of G.SKILL DDR5 memory at DDR5-9000 CL44-56-56 with 48GB (24GBx2) kit capacity, featuring AMD EXPO overclock profile and showcasing the AMD Ryzen 7 8700G processor and ASUS ROG CROSSHAIR X870E HERO motherboard’s memory overclocking capabilities.

A Whole New 24GBx2 High-Speed Frontier

G.SKILL presents an incredible DDR5-9000 CL44-56-56 with two 24GB capacity modules, continuing to investigate the DDR5 memory speed overclock limits in conjunction with the new ASUS NitroPath DRAM technology that offers increased DDR5 memory overclock performance.

Read more on govindhtech.com

[govindhtech]

MSI MEG Z890 Unify-X Motherboard BIOS Performance

The MEG Z890 Unify-X leaks, which showcase MSI’s newest high-performance motherboard targeted at enthusiasts and professional gamers, have generated excitement within the tech world as expectation grows. As a member of the MSI MEG series, this board is particularly designed to overclock Intel’s 14th generation CPUs to the maximum while maintaining reliable connection. It’ll go over the important features, leaked specs, and how this motherboard differs from the others in terms of performance, design, and thermal control in this extensive post.

Improved Overclocking Performance: Exceeding New Heights

The powerful overclocking capabilities of the MEG Z890 Unify-X are among the most important talking points that have leaked. This motherboard is designed to meet the needs of enthusiasts who want to get the most out of their gear. With its 105A smart power stages and 24+2 phases of power delivery, the MEG Z890 Unify-X guarantees very steady power supply to the CPU, enabling remarkable overclocking performance without compromising system stability.

Another area in which this motherboard shines is DDR5 memory overclocking. According to reports, it can handle memory speeds of up to 8000+ MHz, which makes it one of the finest motherboards for high-performance memory tweaking. Professionals, content producers, and gamers that need fast, low-latency memory performance will be served by this.

Modern PCIe 5.0 and Storage Capabilities

Support for PCIe 5.0, which offers double the bandwidth of PCIe 4.0, is another feature of the MEG Z890 Unify-X motherboard. Users may anticipate next-generation gaming and graphics rendering capabilities, fully using the newest high-end GPUs, with x16 lanes devoted to the GPU.

In addition, the motherboard has four M.2 slots, one of which can accommodate PCIe 5.0 x4 speeds. This results to lightning-fast storage performance, which is perfect for high-definition video rendering and content producers handling big data. Multiple NVMe SSDs may be used concurrently to guarantee there are no bottlenecks and speedier game and application load times.

Sturdy Connectivity in Current Configurations

With its twin 2.5G LAN connections, the MEG Z890 Unify-X meets customers’ demands for fast networking by providing higher data transfer rates for high-speed local networks. For online gaming and multimedia streaming, quicker, more dependable wireless internet connections with lower latency are made possible with the addition of Wi-Fi 7 compatibility, which represents a significant advancement in wireless networking. USB4 ports offer very fast transfer rates and flexible connection for storage and peripheral devices.

Controlling Heat and Effective Cooling

Any high-end motherboard must have good thermal performance, which the MEG Z890 Unify-X delivers. This motherboard’s innovative cooling system includes massive heat sinks, heat pipes, and thermal pads that are positioned across crucial components such as the chipset, VRM, and M.2 slots.

By dynamically adjusting fan speeds in response to system temperatures, MSI’s Frozr AI Cooling technology ensures effective and quiet cooling at both idle and peak performance levels.

Superior Style and Sturdiness

In addition to being a performance beast, the MEG Z890 Unify-X has a luxurious look that highlights its strength. It appeals to those who want a simple, elegant design with its all-black PCB and minimalist RGB lights.

This motherboard is made with military-grade parts, such as multi-layer PCBs and solid capacitors, which provide life and durability even in the most severe environments.

Software Suite and BIOS

The Click BIOS 5 from MSI provides an easy-to-use interface for controlling overclocking and system adjustments. While MSI’s Dragon Center software offers complete control over system performance, fan curves, and even RGB lighting, the Memory Try It! function makes memory setting simpler. In addition, the motherboard has BIOS Flashback compatibility, which enables BIOS updates without a CPU a crucial feature for upcoming CPU upgrades.

Summary

For enthusiasts, the MEG Z890 Unify-X is a game-changer. The MEG Z890 Unify-X motherboard seems to be a game-changer in the high-performance motherboard industry based on the leaked information. Its robust overclocking, PCIe 5.0 compatibility, clever cooling solutions, and fast networking options make it a great choice for gamers, over clockers, and professionals who demand the best.

Designing for longevity, performance, and future-proofing sets this motherboard apart. The MEG Z890 Unify-X is expected to become the preferred option for those constructing high-end systems due to its advanced features.

MEG Z890 Unify-X Release Date

MSI’s MEG Z890 Unify-X motherboard will launch in late 2024 with Intel’s Arrow Lake CPUs in Q4. The motherboards will debut at Computex 2024. Intel’s LGA-1851 socket will enable next-gen CPUs in the Z890 series but not Alder Lake or Raptor Lake processors. This high-end motherboard may include advanced overclocking for gamers and enthusiasts.

Read more on Govindhtech.com

[govindhtech]

Amazon EC2 X8g: Graviton-4 Memory-Optimized AWS Instances

The most affordable price per gigabyte of memory among Graviton4-based EC2 instances is offered by Amazon Elastic Compute Cloud (Amazon EC2) X8g instances, which are driven by the most recent AWS Graviton4 processors. In addition, X8g instances provide up to 60% faster performance than X2gd instances and up to 3TiB of memory. They also offer larger instance sizes with up to three times more memory and vCPUs.

Customers can run memory-intensive workloads like in-memory databases (Redis, Memcached), relational databases (MySQL, PostgreSQL), electronic design automation (EDA) workloads, real-time big data analytics, and real-time caching servers with X8g instances’ increased performance and extra memory. To further optimize their computational infrastructure, X8g instances allow several memory-intensive containerized apps to run on a single instance. With up to 3 TiB of DDR5 memory and up to 192 vCPUs, Graviton-4-powered, memory-optimized X8g instances are now offered in 10 virtual sizes and two bare metal sizes.

With the finest price-performance and scale-up capability of any comparable EC2 Graviton instance to date, this instance is its most energy-efficient to date. These instances are optimized for Electronic Design Automation, in-memory databases & caches, relational databases, real-time analytics, and memory-constrained microservices, and have a memory to virtual CPU ratio of 16 to 1. The instances include with extra AWS Nitro System and Graviton4 security capabilities, and they completely encrypt all high-speed physical hardware interfaces.

This new instances are an even better host for these applications because they come in twelve sizes, giving you the option to scale up (using a larger instance) or scale out (using multiple instances). They also give you more flexibility for memory-bound workloads that are currently running on different instances.

The X8g instances vs X2gd instances

It offer three times as much memory, three times as many virtual CPUs, more than twice as much EBS capacity (40 Gbps vs. 19 Gbps), and twice as much network bandwidth (50 Gbps vs. 25 Gbps) as the previous generation (X2gd) instances.

With 160% more memory bandwidth and twice as much L2 cache per core as the Graviton2 processors in the X2gd instances (2 MiB vs. 1 MiB), the Graviton4 processors within the X8g instances can achieve up to 60% better compute performance.

The 5th generation of AWS Nitro System and Graviton4 processors, which include additional security features like Branch Target Identification (BTI) to protect against low-level attacks that try to disrupt control flow at the instruction level, are used in the construction of the X8g

ENA, ENA Express, and EFA Enhanced Networking are supported by the instances. The following table shows that they support all EBS volume types, including io2 Block Express, EBS General Purpose SSD, and EBS Provisioned IOPS SSD, and that they offer a sizable amount of EBS bandwidth.

Now let’s examine a few use cases and apps that can utilize up to 3 TiB per instance and 16 GiB of RAM per vCPU:

Databases: SAP HANA and SAP Data Analytics Cloud can now manage heavier and more ambitious workloads thanks to X8g instances. When compared to the same workloads operating on Graviton3 instances, SAP has measured up to 25% greater performance for analytical workloads and up to 40% better performance for transactional workloads when running on Graviton4 powered instances. SAP may now use Graviton-based utilization to even larger memory-bound solutions.

Workloads related to Electronic Design Automation (EDA) are essential to the process of developing, testing, confirming, and implementing new chip generations, such as Inferentia, Trainium, Graviton, and those that serve as the foundation for the Nitro System.

In order to take advantage of scalability and elasticity and provide the right amount of compute power for every stage of the design process, AWS and numerous other chip makers have selected the AWS Cloud for these workloads. Because they are not waiting for outcomes, engineers are able to develop more quickly as a result. This is a long-term image from one of the clusters utilized in late 2022 and early 2023 to support Graviton4 development. As you can see, this cluster operates at a very high scale, reaching peaks up to five times the typical usage.

Periodic spikes in daily and weekly activity are evident, followed by an increase in overall usage throughout the tape-out phase. Since the cluster’s instances are on the larger end of the size range, the peaks signify several hundred thousand cores that are operating simultaneously. Without having to make a specific hardware investment, it may achieve unparalleled scalability because to this capacity to spin up compute when needed and down when not.

With the support of the new X8g instances, AWS and its EDA clients will be able to execute even more workloads on Graviton processors, which will save costs and energy consumption while also accelerating the release of new products.

Accessible Right Now

X8g instances are currently offered in On Demand, Spot, Reserved Instance, Savings Plan, Dedicated Instance, and Dedicated Host forms in the US East (North Virginia), US West (Oregon), and Europe (Frankfurt) AWS Regions.

Read more on govindhtech.com

[govindhtech]

G593-SD1 & ZD1 : High-Capacity, Liquid-Cooled GPU Servers

Customized Cooling for the G593 Series

With an 8-GPU baseboard specifically designed for it, the GPU-focused G593 series boasts both liquid and air cooling. The industry’s most easily scalable chassis, the 5U, can accommodate up to 64 GPUs in a single rack and sustain 100kW of IT infrastructure. This reduces the footprint of the data center by consolidating the IT hardware. Growing consumer desire for higher energy efficiency has led to the development of the G593 series servers for DLC. Liquids can quickly and efficiently remove heat from heated components to maintain lower operating temperatures since they have a higher thermal conductivity than air. Additionally, the data center uses less energy overall because it depends on heat and water exchangers.

“With the NVIDIA HGX H200 GPU, they provide an excellent AI scaling GIGABYTE solution,” stated Vincent Wang, vice president of sales at Giga Computing. “It is necessary to make sure the infrastructure can handle the computational demand and complexity of AI/ML, and data science models due to the complexity of business data centers. Increasing optimization is required due to the growing complexity. They are able to create and fund scalable AI infrastructure. Additionally, by working with the NVIDIA NVAIE platform, They can handle every facet of AI data center infra services, from software stack deployment to overall coverage.

For the NVIDIA HGX H200 and NVIDIA HGX H100 platforms, GIGABYTE has now launched variants of its G593 series that are air-cooled and DLC compatible. Future GIGABYTE servers with the NVIDIA HGX B200A architecture will additionally be available with liquid or air cooling. As a solution to the requirement for a full supercluster with 256x NVIDIA H100 GPUs, GIGABYTE has already launched GIGAPOD for rack-scale deployment of all these NVIDIA HGX systems. This system consists of five racks for DLC servers, four of which are filled with eight G593 servers apiece. Additionally, a nine-rack system may accommodate the same thirty-two G593-SD1 for air cooling.

NVIDIA NVLink and NVIDIA NVSwitch provide excellent interconnectivity, and systems are combined with InfiniBand to facilitate interconnectivity across cluster nodes. All things considered, a full cluster can handle scientific simulations, large-scale model training, and more with ease.

G593-ZD1-LAX3

GPU + CPU Direct cooling solution in liquid

GPU: NVIDIA HGXTM H200 8-GPU liquid-cooled

GPU-to-GPU bandwidth of 900GB/s using NVIDIA NVLink and NVSwitch

Two Processors AMD EPYC 9004 Series

24-piece DDR5 RDIMM with 12 channels

Architecture with Dual ROM

2 x 10Gb/s LAN ports through the Intel X710-AT2

2 x M.2 slots with x4 and x1 PCIe Gen3 interfaces

8 × 2.5″ Gen5 hot-swappable bays for SAS-4, SATA, and NVMe

Four FHHL Gen5 x16 PCIe slots

PCIe Gen5 x16 slots with 8 LPs

4+2 3000W 80 PLUS Titanium backup power sources

G593-SD1-LAX3

GPU + CPU Direct cooling solution in liquid

8-GPU NVIDIA HGX H200 liquid-cooled

GPU-to-GPU bandwidth of 900GB/s using NVIDIA NVLink and NVSwitch

Two Intel Xeon Scalable Processors, Generations 5 and 4

Intel Xeon Dual Core Max Series

32 DIMMs, 8-Channel DDR5 RDIMM

Architecture with Dual ROM

Compliant with SuperNICs and NVIDIA BlueField-3 DPUs

Intel X710-AT2 provides two 10Gb/s LAN ports.

8 × 2.5″ Gen5 hot-swappable bays for SAS-4, SATA, and NVMe

Four FHHL Gen5 x16 PCIe slots

PCIe Gen5 x16 slots with 8 LPs

4+2 3000W 80 PLUS Titanium backup power sources

Fueling the Next Wave of Energy Efficiency and Server Architecture

G593-ZD1

AMD EPYC 9004 Series processors continue the EPYC breakthroughs and chiplet designs that led to AMD’s 5nm ‘Zen 4’ architecture. The new EPYC processor family includes several new capabilities to target a wide range of applications, improving performance per watt and CPU performance. on a platform with double the throughput of PCIe 4.0 lanes and support for 50% more memory channels. With components designed to maximize the performance of EPYC-based systems that enable fast PCIe G593, Gen5 NVMe SSDs, and highly performant DDR5 memory, GIGABYTE is prepared for this new platform.

AMD EPYC 4th Generation Processors for SP5 Socket

5 nm architecture

More transistors crammed into a smaller space led to an improvement in compute density.

128 cores for the CPU

Zen 4c and Zen 4 cores have dedicated cores and intended workloads.

Big L3 cache

Specific CPUs for technical computing feature three times or more L3 cache.

Compatibility with SP5

There is a single platform that supports all 9004 series processors.

Twelve channels

Six terabytes of memory can fit in one socket.

DDR5 RAM

Increased DDR5 capacity per DIMM and increased memory throughput

PCIe 5.0 lanes

Enhanced IO throughput on PCIe x16 lanes, reaching 128GB/s bandwidth

Support for CXL 1.1+

Compute Express Link makes disaggregated compute architecture viable.

G593-SD1

Accelerating AI and Leading Efficiency

on business transformation, Intel has increased CPU performance by engineering richer features on a new platform. The 4th and 5th Gen Intel Xeon Scalable processors’ built-in AI acceleration engines boost AI and deep learning performance, while networking, storage, and analytics use other accelerators. Adding a host of new features to target a wide range of workloads, the new Intel Xeon processor families will deliver even better CPU performance and performance per watt Using a PCIe 5.0 platform with 2x the previous gen throughput to speed GPU-storage data transfer. Intel introduced the Intel Xeon CPU Max Series with HBM to boost memory-bound HPC and AI applications. GIGABYTE has solutions ready for Intel Xeon CPU-based systems with fast PCIe Gen5 accelerators, Gen5 NVMe SSDs, and high-performance DDR5 memory.

Why Opt for GIGABYTE Servers for Liquid Cooling?

Amazing Performance

Due to the great performance of liquid-cooled components that run well below CPU TDP, servers will operate with exceptional stability.

Energy Conservation

A liquid-cooled server can outperform an air-cooled server by requiring less electricity, fans, and speeds.

Reduced Noise

Numerous loud, high-speed fans are needed for servers. With fewer fans and a liquid cooling method, GIGABYTE has discovered a way to cut down on noise.

A Track record of success

The direct liquid cooling system supplier has served desktop PCs and data centers for 20 years. GIGABYTE has 20+ years of experience.

Dependability

Maintenance for liquid cooling solutions is low and visible. GIGABYTE and liquid cooling suppliers warranty components.

Usability

GIGABYTE liquid-cooled servers can be rack-mounted or connected to a building’s water supply. and provides dry, simple, and fast disconnects.

Elevated Efficiency

Compatible with NVIDIA HGX H200 8-GPU

High-speed interconnects and H200 Tensor Core GPUs are combined by the NVIDIA HGX H200 to provide every data center with exceptional performance, scalability, and security. With configurations of up to eight GPUs, the world’s most potent accelerated scale-up server platform for AI and HPC is created, offering unparalleled acceleration and an astounding 32 petaFLOPS of performance. Over 32 petaflops of FP8 deep learning computing and 1.1TB of aggregate high-bandwidth memory are offered by an eight-way HGX H200. In order to facilitate cloud networking, composable storage, zero-trust security, and GPU computing elasticity in hyperscale AI clouds, NVIDIA HGX H200 also incorporates NVIDIA BlueField-3 data processing units (DPUs).

Energy Efficiency

Controlled Fan Speed Automatically

Automatic Fan Speed Control is enabled on GIGABYTE servers to provide optimal cooling and power efficiency. Intelligently placed temperature sensors across servers will automatically adjust fan speeds.

Elevated Availability

Ride-through Smart (SmaRT)

In order to guard against data loss and server outages due to AC power outages, GIGABYTE has included SmaRT into all of server platforms. The system will throttle in response to such an occurrence, maintaining availability and lowering power consumption. Power supply capacitors can provide power for 10–20 ms, enough time to switch to a backup power source and continue running.

SCMP means Smart Crises Management and Protection

SCMP is patented by GIGABYTE and utilized in non-redundant PSU servers. SCMP puts the CPU in ultra-low power mode to prevent an unintended shutdown, component damage, and data loss. In the event of a malfunctioning PSU or overheated system

Architecture with Dual ROM

The backup BMC and/or BIOS will replace the primary BIOS upon system reset if the ROM cannot boot. The backup BMC’s ROM will immediately update the backup through synchronization as soon as the primary BMC is updated. Users can upgrade the BIOS based on firmware version.

Hardware Safety

TPM 2.0 Module Option

Passwords, encryption keys, and digital certificates are kept in a TPM module for hardware-based authentication to keep unauthorized users from accessing your data. There are two types of GIGABYTE TPM modules: Low Pin Count and Serial Peripheral Interface.

Easy to Use

Tool-free Drive Bays Style

A clip secures the drive. It takes seconds to install or swap out a new drive.

Management with Added Value

Gigabete provides free management programs with a dedicated tiny CPU integrated into the server.

Console for GIGABYTE Management

Every server comes with the GIGABYTE Management Console, which can manage a single server or a small cluster. After the servers are up and running, the browser-based graphical user interface allows IT workers to monitor and manage each server’s health in real time. Furthermore, the GIGABYTE Management Console offers:

Support for industry-standard IPMI specifications that allow open interface service integration onto a single platform.

Automatic event recording makes it simpler to decide what to do next by capturing system behavior up to 30 seconds before an event happens.

Integrate SAS/SATA/NVMe devices and RAID controller firmware into GIGABYTE Management Console to monitor and manage Broadcom MegaRAID adapters.

Management of GIGABYTE Servers (GSM)

A software suite called GSM can manage many server clusters online. Any GIGABYTE server can run GSM on Windows and Linux. GSM, available from GIGABYTE, meets Redfish and IPMI standards. The following tools are among the full set of system administration features that are included with GSM:

GSM Server: Software that runs on an administrator’s PC or a server in the cluster to enable real-time, remote control via a graphical user interface. Large server clusters can have easier maintenance thanks to the software.

GSM CLI: A command-line interface designed for remote management and monitoring.

GSM Agent: An application that is installed on every GIGABYTE server node and interfaces with GSM Server or GSM CLI to retrieve data from all systems and devices via the operating system.

GSM Mobile: An iOS and Android mobile application that gives administrators access to real-time system data.

The GSM Plugin is an application program interface that enables users to manage and monitor server clusters in real time using VMware vCenter.

Read more on govindhtech.com

[govindhtech]

G.SKILL Ultra-Low Latency DDR5 6000 CL28 DDR5 Memory Kit

DDR5 6000 CL28

The ultra-low latency specification of DDR5 6000 CL28-36-36-96 in 32GB (2x16GB) and 64GB (2x32GB) kit capacities, and DDR5 6000 CL28-38-38-96 in 48GB (2x24GB) and 96GB (2x48GB) kit capacities under the new Trident Z5 Royal Neo series, designed for compatible AMD AM5 platforms, is excitedly announced by G.SKILL International Enterprise Co., Ltd., the world’s leading brand of performance overclock memory and PC components. This low timing overclock performance memory kit is the perfect DDR5 memory solution for enthusiasts and over clockers, and it includes AMD EXPO technology for a simple memory overclocking experience in the BIOS.

DDR5 CL28 6000

Memory Timing Optimization

Latency, or memory timing, is critical for enthusiasts and over clockers trying to maximum memory kit performance. A lower latency is preferred since memory timing is the interval of time between certain activities; performance can be enhanced by determining the ideal balance between memory speed and latency. This new DDR5 6000 CL28 memory specification intends to give a more optimized combination on compatible AMD AM5 systems as compared to a regular DDR5 memory speed and latency of DDR5-4800 CL40.

AMD EXPO Availability & Support

Beginning in August 2024, this new specification which supports AMD EXPO (Extended Profile for Overclocking) technology for simple memory overclocking through the motherboard BIOS will be made available to G.SKILL’s global distribution partners.Image credit to G.SKILL

G.SKILL’s latest DDR5 invention is the Ultra-Low Latency DDR5 6000 CL28 Memory Kits. These unique kits exceed memory performance norms, giving incredible speed and efficiency for professional and gaming use. These innovative memory kits’ features, benefits, and technical advances will be discussed in this essay.

6000 CL28

Outstanding Efficiency and Low Latency

Ultra-low latency distinguishes the new G.SKILL DDR5 6000 CL28 kits. CAS Latency (CL) affects memory data access speed. Real-time data processing and game require fast data retrieval, so faster reaction times reduce latency. With a CAS Latency of only 28, the G.SKILL DDR5 6000 CL28 kits are among the quickest DDR5 memory options available.

Latency’s Significance in High-Performance Memory

Gaming and multimedia production benefit from low-latency high-performance memory. When playing games, every millisecond counts, and low-latency memory processes data quickly to enhance performance and input lag. Low latency helps video editors and 3D artists multitask and render faster. Engineered to satisfy these expectations, the G.SKILL DDR5-6000 CL28 kits offer a notable benefit over higher-latency memory alternatives.

Novel Characteristics and Details

Packed with cutting-edge AI capabilities, the G.SKILL DDR5 6000 CL28 memory kits meet the demands of contemporary computing. Among the essential requirements are:

High Speed and Bandwidth

These memory kits provide large bandwidth and fast data transmission rates, with a claimed speed of 6000 MHz. For customers like data scientists and software developers who need quick access to big databases, this high-speed performance is perfect. These kits are a flexible option for various applications because to their low latency and large bandwidth.

Enhanced Energy Efficiency

The DDR5-6000 CL28 kits from G.SKILL have also been designed with power efficiency optimization in mind. In comparison to DDR4, the new DDR5 standard delivers higher power efficiency by default. G.SKILL has improved this feature by adding sophisticated power management capabilities. By lowering overall power consumption, these characteristics not only increase the memory kits’ power but also make them eco-friendly. Those who want to create energy-efficient systems and are concerned about their carbon footprint may find this especially helpful.

Improved Dependability and Stability

High-performance memory also needs to be reliable, and G.SKILL has put in place a number of safeguards to guarantee the stability of their DDR5 6000 CL28 kits. To ensure that they satisfy strict quality standards, the memory modules are constructed using premium components and put through a thorough testing process. By paying close attention to every little detail, the memory kits are guaranteed to work consistently under a variety of circumstances, giving users piece of mind.

Suitability and Possibility of Overclocking

The most recent AMD and Intel systems are compatible with the G.SKILL DDR5 6000 CL28 kits. Their extensive interoperability renders them an adaptable option for both fresh builds and enhancements. Furthermore, G.SKILL has enhanced these kits for overclocking, enabling enthusiasts to overclock their computers above the recommended limits. Because to their sturdy heat spreader architecture, which effectively distributes heat, the memory modules operate steadily even at faster clock speeds.

Boosting Performance with Overclocking

Overclocking is a common option for people who want to get the most out of their system. Because of their superior ICs and well-thought-out PCB design, the G.SKILL DDR5-6000 CL28 kits are built to withstand intense overclocking. With the right motherboard and cooling, users may boost system performance by increasing frequencies and lowering latencies. G.SKILL’s BIOS profiles and software tools let even novice over clockers alter RAM settings.

Optimal Visual Appeal through RGB Lighting

Along with their impressive functionality, G.SKILL DDR5 6000 CL28 memory kits are stylish. Users can modify their systems by adjusting the modules’ RGB lighting to offer beautiful colours and lighting effects. Because they work with most motherboard RGB software, RGB LEDs can be synchronized with other RGB components. G.SKILL DDR5-6000 CL28 kits are popular with PC enthusiasts and game play due to their beautiful design.

Personalization Choices

Individual tastes can be accommodated by customizing the RGB lighting, which offers options for static colors, dynamic effects, and more. Users can customize their system with a variety of colors and effects to give it a distinctive and unified appearance. The G.SKILL DDR5-6000 CL28 kits are an exceptional option for individuals who like both performance and style because of their ability to synchronize the RGB lighting with other components, including fans and graphics cards, which improves the overall aesthetic appeal.

Conclusion, DDR5 Memory Sets a New Standard

The G.SKILL Ultra-Low Latency DDR5 6000 CL28 memory kits enhance memory technology. These kits’ broad features, high-speed performance, and minimal latency could make them industry standards. G.SKILL DDR5-6000 CL28 kits are the best memory for gamers, multimedia makers, and professionals seeking performance and reliability.

Read more on Govindhtech.com