#AIoT
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Monitoring Isn’t Enough Modern Operations Need More
In today’s world real time monitoring is not enough. Manufacturers and enterprises require insights that are predictable and have efficient automation which would improve its overall productivity while finding out errors to reduce downtime and to cut costs. That's where INTERSCOPE AI comes into play.
Interscope AI™ by Bridgera combines IoT and AI into a platform designed for large-scale infrastructure and operations.
With Interscope AI™, organizations can:
Detect potential issues early
Monitor performance through live dashboards
Automate key operational tasks
Use Jera, the AI assistant, for quick insights
Designed for evolving industries, it helps you make better decisions with less guesswork. See the platform in action: INTERSCOPE AI
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#EdgeComputing#AIoT#ASRock#UbuntuPro#IndustrialAI#Innovation#Security#powerelectronics#powermanagement#powersemiconductor
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AI + IoT: Why These Two Tech Giants Can’t Dance Alone
I’ve seen enough buzzwords thrown around boardrooms to fill a dictionary. But there’s one pair that actually lives up to the hype: AI and IoT. Separately, they’re impressive. Together? They’re unstoppable. Like Batman and Robin. Like nasi lemak and sambal. Like data and decisions. But let’s not just throw metaphors—let’s break this down. Why AI Needs IoT (And Vice Versa) AI is smart. It…
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Introducing the FET-MX8MPQ-SMARC System on Module — Built for Real-World Edge Intelligence

Looking to power your next-gen edge AI solution with industrial-grade reliability?
Meet the FET-MX8MPQ-SMARC from Forlinx Embedded — a high-performance SMARC 2.1-compliant SoM based on the NXP i.MX 8M Plus Quad-Plus processor.
✅ 4× Cortex-A53 @ 1.6 GHz + Cortex-M7 @ 800 MHz
✅ 2.3 TOPS NPU + ISP for AI vision and multimedia processing
✅ Dual-band Wi-Fi 5 + Bluetooth 5.3 built-in
✅ –40°C to +85°C industrial temperature range
✅ Preloaded with Linux 6.1.36 LTS, BSP, drivers, and sample code
✅ Compatible with all SMARC 1.x/2.x carrier boards
Whether you're building for smart cities, industrial IoT, intelligent transport, or medical devices, this module is ready for deployment at the edge.
📩 Want to learn more or request documentation?
👉 Contact us: [email protected]
#Forlinx#EmbeddedSystems#NXP#iMX8MPlus#EdgeAI#SMARC#SOM#IndustrialIoT#LinuxEmbedded#AIoT#SmartCity#MachineLearning#ComputerVision#EmbeddedDevelopment
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IoT Devices: Smarter Connectivity!
IoT devices are reshaping industries with real-time data, automation, and AI-driven insights. From smart homes to industrial automation, these devices enhance efficiency and connectivity. With 5G & edge computing, the future of IoT is faster, smarter, and more secure! 🚀
#IoTDevice#SmartTech#5GIoT#ConnectedFuture#AIoT#Innovation#iotnbo#iot platform#iot#web development#iot applications#iot development services#iotsolutions#bluetooth#software development
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KT1025A Dual-Mode Bluetooth Audio Chip Layout Description and Design Precautions
1.Brief Overview
1. First, please refer to the provided BT201 test DEMO module as the standard.
2. If using the chip independently without testing the BT201 module and directly proceeding to layout, background noise is highly likely if experience is limited. Therefore, always compare with the manufacturer’s test board first.
3. The BT201 solution does not include FM functionality. Please note this. The FM circuit should be left floating without hesitation.
2.Precautions
1. Background noise or interference is common in Bluetooth audio products. Do not be careless during layout.
2. If you have not worked on audio products before, study online resources thoroughly. Assuming things casually will naturally lead to noise issues.
3. The core principle is to separate analog ground and digital ground. If unclear, consult an experienced engineer.
4. Ensure a clean power supply. Use an LDO whenever possible instead of a DC-DC converter.
5. Bluetooth operates at high-frequency RF and radiates energy, so some background noise is inevitable but can be minimized. With good design, noise is imperceptible to the human ear, though it may be measurable with instruments.
3.Antenna Description
1. For antenna and component packaging, directly refer to the PCB files of the DEMO module, available in the document library.
2. The Bluetooth antenna has no special requirements. Follow the provided package and reference instructions.
3. The Bluetooth antenna does not require impedance matching, and standard copper thickness is sufficient. Don't over complicate it—Bluetooth has a low entry barrier.
4.Power Supply Description
(1)The BT201 test board has minimal background noise, barely noticeable to the human ear.
(2)You can try powering it with a phone charger, which should not produce significant noise.
(3)Battery power is ideal as it provides pure DC and is very clean. However, consider the battery's load capacity.
(4)USB output from a desktop computer may produce significant ripple, leading to background noise. Avoid using it.
(5)If the board includes a DC-DC converter, it may cause noise. The optimal power supply is an LDO, such as a 7805.
(6)The BT201 module can drive a maximum speaker of 4 ohms, 3W with a 5V supply.
(7)When driving speakers, ensure sufficient current with a stable power supply. Insufficient current can cause speaker distortion, buzzing, etc.
(8)If possible, purchase various amplifier modules online for comparison testing. We sell Bluetooth chips, but amplifier-related noise, distortion, or other issues are extended topics that are complex and cannot be explained briefly.
5.How to check if the board has background noise?
(1)Use a clean power supply, ideally a battery, and disconnect all front-end power circuits.
��2)Connect the chip's headphone output and listen for noise. If none, check the rear-stage amplifier circuit.
(3)If USB playback has no noise but Bluetooth does, this does not necessarily indicate a problem.
(4)Use headphones to check for noise. If none, the issue lies in the amplifier section, so inspect it.
(5)If noise is present with headphones, disconnect the rear-stage amplifier and inspect the Bluetooth chip's peripheral circuits. Determine whether noise occurs during Bluetooth or MP3 playback. For Bluetooth noise, check if capacitors around the main controller are properly soldered and if they are too close to the Bluetooth module. Refer to other instructions for troubleshooting.
(6)For noise testing, avoid using a computer's USB or a charger's USB. Use a clean power supply with strong load capacity, ideally tested at 5V, not 3.7V.
6.Methods to Reduce Bluetooth Background Noise
(1)Keep the Bluetooth antenna and Bluetooth module as far as possible from analog circuits.
(2)The chip's analog ground must be connected to the power ground at the input.
(3)Check capacitors around the chip for issues such as short circuits or poor soldering.
(4)Add multiple vias to the GND of the Bluetooth section.
7.Selection and index requirements of crystal oscillators
(1)Bluetooth has high frequency offset requirements, so the crystal oscillator's quality is critical for performance. During selection, ensure consistency and stability, with a frequency deviation of ≤±10ppm and a recommended load capacitance (CL) of 12pF.
Note: Crystal-to-ground capacitors C102 = C103 = 2*CL – (4pF~6pF), where CL is the crystal's load capacitance.
(2)For designs with no size constraints, use the crystal specified in our DEMO, which is cost-effective and high-performing.
(3)For size-constrained designs, use a 24M-3225 crystal, which is slightly more expensive but performs well.
Recommendation: Use our provided crystal, which is more cost-effective and quality-assured compared to random purchases.
8.Simple PCB Layout Precautions
(1)The input voltage to LDO_IN (Pin 18 of the chip) must not exceed +5.5V.
(2)The chip must strictly separate digital GND and analog AGND (refer to the provided BT201 PCB).
(3)During PCB routing, digital GND and analog AGND must be routed separately and connected only at the battery input. If the design includes a pre-amplifier ground, connect AGND to it.
(4)All decoupling capacitors on the main controller must be placed as close as possible to the chip pins, with short ground return paths.
(5)Prioritize the placement of the Bluetooth antenna. The RF antenna must be near the board edge (or in an open area if structural constraints apply). The antenna matching circuit must be close to the RF pin, with short routing. The antenna's ground plane should follow the yellow outline in the antenna package, and the space on both sides should be as wide as possible, as shown in the diagram avove.
(6)The 24M crystal must be placed close to the chip's clock pins (BTOSCO and BTOSCI). Its routing must be shielded with a ground plane, kept away from interference sources, and not routed parallel to other data lines.
(7)Audio signal lines (DACL, DACR, AUXL, AUXR, MIC, etc.) must be routed away from digital signals (LCD/LED signals, USB, SD, etc.).
#bluetooth#audiochip#bluetoothchip#voicechip#ble#spp#electronic#coding#embeddeddevelopment#devlog#aiot
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Unlock AI Potential with Data Readiness | Bridgera Discover how data readiness can supercharge your AI initiatives. Bridgera explains why clean, connected, and contextualized data is the foundation of successful AI-driven transformation. Learn how enterprises can move from raw data to real impact through a structured readiness model. 👉 Ready to see it in action? Start your free trial and explore the possibilities.
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#ASRockIndustrial#EdgeAI#SmartAutomation#COMPUTEX2025#IndustrialIoT#AIoT#SmartFactory#Innovation#powerelectronics#powermanagement#powersemiconductor
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Needleleaf Foundation: AIOT for Smart Safety & Environmental Resilience
Needleleaf Foundation integrates AIOT SOLUTIONS (Artificial Intelligence of Things) to prevent wildfires and protect students. Our AI-powered predictive analytics, real-time fire detection, and automated emergency response systems provide proactive disaster prevention and rapid risk mitigation. Meanwhile, our AI-driven school security solutions ensure intelligent risk monitoring, proactive threat detection, and emergency alerts to protect students and educational institutions. By safeguarding invaluable assets—forests, schools, and communities—through AI-driven automation, Needleleaf Foundation ensure climate resilience and student safety.

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System Update Alert! Forlinx Embedded has officially launched Forlinx Desktop 24.04, marking full system compatibility for the FET3576-C System on Module (SoM) with Linux 6.1, Android 14, and the new Forlinx Desktop OS!
Powered by the high-performance Rockchip RK3576 with a 6 TOPS NPU, the FET3576-C SoM is now more versatile than ever—ready to tackle challenges in industrial automation, AIoT, edge computing, and more.
✅ Multi-system support ✅ Rigorous reliability testing ✅ Faster time-to-market ✅ Comprehensive tech support
💡 Whether you’re building smart terminals or embedded AI solutions, the FET3576-C SoM delivers power, stability, and flexibility.
🔗 Learn more:
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Leading IoT Product Development Companies Driving Innovation
IoT product development companies are revolutionizing industries with cutting-edge smart solutions, integrating AI, cloud computing, and edge technologies. These companies specialize in designing and developing connected devices, ensuring seamless communication, security, and efficiency across various sectors like healthcare, automotive, industrial automation, and smart homes. Explore the top Top Hardware Design Companies in India firms that are transforming the future of connected technology with innovative hardware, software, and end-to-end IoT solutions.
#IoTIndia#TechInnovation#SmartSolutions#DigitalTransformation#AIoT#ConnectedDevices#Industry40#FutureTech#IoTStartups#SmartCities
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The proliferation of connected devices and advancements in AI algorithms are the factors expected to propel the growth of the global AIoT market. However, data privacy and security concerns and high cost of implementation are anticipated to hamper the growth of the global market.
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