#Sputtering

[fishthegenderwitch]

Customer in the store this morning tells me that in one of our sister-stores, the book dept was shelved BY SPINE COLOUR.

Absolutely atrocious. You've turned your merchandise into decor. Nobody's gonna wanna read every single title like that.

I'm so appalled I don't even have WORDS FOR THIS

[ultramet2]

Overview of Vacuum Coating Materials And Technologies

Vacuum coating technology mainly involves the use of different vacuum coating equipment and process methods to generate coated materials on the surface of specific substrates in order to prepare a variety of thin film materials with specific functions. Application areas for vacuum coating technology include flat-panel displays, semiconductors, solar cells, magnetic and optical recording medias, optical components, energy saving glass, LEDs, tool modifications, high-end decorative items, etc. Thin film materials grow on top of substrate materials (such as screen glass, optical glass, etc.) and are generally formed by metal, non-metal, alloy or compound materials (collectively referred to as coating materials) after coating, and have the functions of increased transmission, absorption, cut-off, spectroscopy, reflection, light filtering, interference, protection, water and dirt repellency, anti-static, electrical conductivity, magnetic conductivity, insulation, abrasion resistance, high temperature resistance, corrosion resistance, oxidation resistance, radiation protection, decoration and composite and other functions. Thin film materials can improve product quality, environmental protection, energy saving, extend the life of the product and improve the original performance, etc. As the thin film material is formed after the transfer of the coating material to the substrate, the quality of the film is directly related to the quality of the coating material. Currently, thin film material preparation technologies mainly include: physical vapour deposition (PVD) and chemical vapour deposition (CVD) technologies. Among them, physical vapour deposition (PVD) technology mainly includes vacuum sputtering coating, vacuum evaporation coating and vacuum ion coating.

Vacuum sputter coating. It refers to the technique of using ions generated by an ion source, which are accelerated and gathered in a vacuum to form a high ion beams, to bombard the surface of the target (coating material), where kinetic energy is exchanged between the ions and the atoms on the surface of the target, causing the atoms on the surface of the target to leave and be deposited on the surface of the substrate material. The object bombarded with ions is the raw material for the deposition of thin film materials by the vacuum sputtering method and is called a sputtering target.

Principle of vacuum sputtering coating

Generally speaking, sputtering targets are mainly composed of target blanks, back plates (or back tubes) and other parts, of which, target blanks are the target material bombarded by high-speed ion beams, belonging to the core part of sputtering targets. In the sputtering coating process, target blanks are hit by ions and its surface atoms are sputtered out and deposited on the substrate, making thin film materials. As the sputtering target needs to be installed in special equipment to complete the sputtering process, the equipment has a high voltage, high vacuum inner working environment and most of the target blank material is soft or highly brittle, not suitable for direct installation in the equipment, therefore, it need to be bound with the back plate (or back tube) which mainly plays a role as the fixator of sputtering target and has good electrical and thermal conductivity.

Characteristics of vacuum sputtered films:

Good controllability and repeatability of film thickness. The thickness of the film is controlled at a predetermined value, known as controllability of film thickness. The required film thickness can occur repeatedly, called film thickness repeatability. In vacuum sputter coating, the film thickness can be controlled by controlling the target current.

Strong adhesion of the film to the substrate. The energy of the sputtered atoms is 1-2 orders of magnitude higher than the energy of the evaporated atoms, and the energy conversion of the high-energy sputtered atoms deposited on the substrate is much higher than that of the evaporated atoms, generating higher energy and enhancing the adhesion of the sputtered atoms to the substrate.

In the preparation of alloy and compound films, the components of the target material are very close to that of the film material deposited onto the substrate, avoiding variation and inconsistency in the components and structure of the coating material as it is transferred to produce the film material.

New material films can also be prepared which are different from the target material. If a reactive gas is passed through the sputtering so that it reacts chemically with the target, a new material film which is completely different from the target can be obtained.

High purity of the film layer. The purity of the film is high. The sputtering method does not have the crucible component of the evaporation method, so the sputtering coating does not mix with the crucible heater material and has a higher purity. The disadvantages of the sputtering method are that the film formation speed is lower than that of evaporation, the substrate temperature is higher, it is more susceptible to impurity gases and the device structure is more complex.

Vacuum sputtering has become one of the mainstream technologies for the preparation of thin film materials due to the reproducibility and controllable thickness of the sputtering process, the ability to obtain uniform thickness films on large areas of substrate materials, the high purity of the films prepared, the good density and the strong bonding with the substrate materials. Various types of sputtering targets have been widely used, so the demand for sputtering targets, a functional material with high added value, is increasing at a high rate year by year, and sputtering targets have become the largest market application of PVD coating materials.

Vacuum evaporation coating. It is a deposition technique that uses the thermal energy of a film heating device (called an evaporation source) under vacuum conditions to deposit a substance on the surface of a substrate material by heating it to evaporate. When the mean free path of the evaporated molecules is larger than the dimension line between the evaporation source and the substrate, the evaporated particles escape from the surface of the evaporation source and are rarely hindered by the collision of other particles (mainly residual gas molecules) in the process of flying towards the surface of the substrate, and arrive directly at the surface of the substrate, condensing and producing a thin film. The evaporated material is the raw material for the deposition of thin film materials by vacuum evaporation coating and is called vapour deposition material.

Vacuum evaporation coating system generally consists of three components: the vacuum chamber, the evaporation source or evaporation heating unit, and the device for placing and heating the substrate. In order to evaporate the material to be deposited in a vacuum, a vessel is required to support or contain the evaporate and to provide evaporation heat to bring the evaporate to a high enough temperature to generate the required vapour pressure.

Principle of vacuum evaporation coating

Features of vacuum evaporation coating technology: simple equipment, easy operation, high purity and quality of the film made, accurate controllability of the thickness, fast filming rate , high efficiency, relatively simple growth mechanism of the film, etc.; the disadvantage are that it is not easy to obtain the film with crystalline structure; the adhesion of the film formed on the substrate is small; the repeatability of the process is not good enough, etc.

Vacuum ion coating. This refers to a process in which the film is evaporated or sputtered in a vacuum atmosphere, using an evaporation source or sputtering target, and part of the evaporated or sputtered particles are ionized into metal ions in the gas discharge space, and these particles are deposited onto the substrate under the action of an electric field to produce a thin film. The principle is shown in followed Figure. Firstly, the pressure of the coating chamber is evacuated to below 10-3pa, then the working gas is passed in to increase the pressure to 10^0~10^-1pa and the high pressure is accessed. As the cathode of the evaporation source grounded, the substrate is connected to the adjustable negative bias voltage, then the power supply can establish a low temperature plasma area with low pressure gas discharge between the evaporation source and the substrate, after the evaporation source of resistance heating type is energised and heats the film material, part of the neutral atoms escape from the surface of the film material and ionise into positive ions due to collision with electrons when passing through the plasma in the process of migration to the substrate; another part of the neutral atoms ions can also be generated by colliding with ions in the working gas and exchanging charges. These ions are then accelerated by the electric field and shot towards the substrate where they are connected to the negative potential, resulting in a thin film.

Principle of Vacuum Ion Coating

Characteristics of vacuum ion coating:

film/substrate adhesion is strong and the film layer is not easy to fall off;

ion plating has good diffraction, thus improving the coverage of the film layer;

high quality of the coating;

high deposition rate, film speed. 30 micron thick film can be prepared;

coating can be applied to a wide range of substrate materials and film materials.

Chemical Vapour Deposition (CVD). It is a filming technique that uses heating, plasma enhancement and light assist to make a solid film on the surface of a substrate by chemical reaction of gaseous substances under atmospheric or low pressure conditions.

Chemical vapour deposition CVD technology has the following characteristics:

the process and operation of the equipment is relatively simple and flexible, enabling the preparation of single or composite film layers and co-layers in various ratios;

the chemical vapour deposition CVD method is widely applicable;

the deposition rate can be as high as a few microns to hundreds of microns per minute, resulting in high production efficiency;

compared to the PVD method (vapour deposition, sputtering), it has good diffraction properties and is suitable for coating substrates with complex shapes;

good denseness of coating;

low damage after exposure to radiation and integration with the MOS integrated circuit (an integrated circuit consisting of metal-oxide-semiconductor field-effect transistors as the main components) process.

Summary: Vacuum coating technology mainly includes physical vapour deposition (PVD) technology and chemical vapour deposition (CVD) technology. The above mentioned vapour deposition, sputtering and ion deposition are all physical vapour deposition PVD, the basic principle of which can be summarised as follows: vapourisation of the plating material → migration of the atoms, molecules or ions in plating materials → deposition of atoms, molecules or ions in the plating materials on the substrate to recreate a thin film. Chemical vapour deposition CVD can be summarised as: formation of volatile substances → transfer of the substances to the deposition area → chemical reaction on the solid and production of a solid film substance.

[longhua1]

ITO Target

ITO target is made up of a combination of indium oxide and tin oxide and serves as a crucial component in the production of ITO film. This film holds a significant position in the electronic information area and is used in a range of applications such as liquid crystal displays, organic light emitting diodes, touch screens and thin-film solar cells.

Operating Principle of ITO Target

An ITO target is a combination of indium oxide and tin oxide and serves as a crucial raw material in the field of electronic information, specifically in the production of ITO film. Due to its superior electrical conductivity, optical transparency, and high stability, ITO film is employed in different applications such as liquid crystal displays, organic light emitting diodes, touch screens, and thin-film solar cells.

Japan and South Korea have enjoyed a monopoly in the ITO target market for some time now, particularly in high-end TFT applications. However, our company has achieved independent innovation by acquiring core technology for mass-producing high-end ITO target, with multiple intellectual property rights and patent achievements. Presently, our production capacity for ITO targets is approximately 300 tons per year and we provide a steady supply to all TFT production lines ranging from G2.5 to G10.5. The quality of our targets ranks top in China, reaching world-class standards. Our growing market share is a testament to the satisfaction of our clients in the industry.

[pikminzoro]

s... skr.... sir....

[storkmuffin]

"according to Lincoln [Kirstein], the dancer Holly Howard, who was by then George's girlfriend for over a year, had what was rumored to be her fourth or fifth abortion, an illegal and potentially dangerous procedure, especially for a girl who was barely of age."

from "Mr B" by Jennifer Homans.

This was sometime in 1936. Three paragraphs later the book says "we don't really know" and includes things like "rumors flew in all directions ... that Holly became a whore - no eviddence - and it was George's fault."

[longhua1]

IGZO Target

IGZO target is a crucial material used in the manufacturing of transparent conductive oxide (TCO) thin-film transistors (TFTs). It is a composite material composed of indium oxide (In₂O₃), gallium oxide (Ga₂O₃), and zinc oxide (ZnO). IGZO TFTs offer superior performance, such as high electron mobility, transparency, and low power consumption. Therefore, IGZO targets are highly demanded in the electronics industry, specifically in the production of LCDs, OLEDs, and touchscreens.

Operating Principle of IGZO Target

IGZO (indium-gallium-zinc oxide) targets are used in sputter deposition processes to create thin films of transparent conductive oxides (TCOs) that exhibit excellent electrical and optical properties. During sputter deposition, positively charged ions, such as argon, are accelerated towards the negatively charged IGZO target. This bombardment of ions ejects atoms from the target surface, which then deposit onto a substrate to form a thin film.

The indium, gallium, and zinc oxide material properties of the IGZO target enable the formation of high-quality thin films with improved electronic performance. The presence of gallium in the IGZO target allows for higher electron mobility, while zinc aids in stabilizing the crystal structure and reducing lattice defects. These properties make IGZO targets a popular choice for creating thin-film transistors (TFTs), such as those found in LCD displays and touchscreens, due to their high electrical conductivity, transparency, and low power consumption.

Overall, the operating principle of IGZO targets involves the use of sputter deposition technology to create high-quality TCO thin films with exceptional electrical and optical properties, making them a valuable component in electronic devices.

Manufacturing Process of IGZO target

The manufacturing process of IGZO targets involves several steps, including the production of IGZO powder, target fabrication, and sintering.

The first step involves the production of IGZO powder using techniques such as solid-state reactions, spray pyrolysis, and pulsed laser deposition. These methods create a high-quality IGZO powder with controlled particle size and composition.

In the second step, the IGZO powder is pressed into a target shape using a hydraulic press with a pressure between 15-30 MPa. The powder is placed in a die and subjected to continuous pressure to ensure uniform density and shape.

Lastly, the sintering step involves heating the IGZO target at high temperatures, typically around 1500°C, in a vacuum or controlled atmosphere furnace. This process fuses the IGZO powder particles together to form a dense and uniform target material suitable for use in sputtering processes.

Overall, the manufacturing process of IGZO targets requires careful control of the particle size and composition of the IGZO powder, as well as precise target fabrication and sintering conditions. These variables can significantly impact the final quality and performance of the IGZO targets, making it important to ensure consistency and accuracy throughout the manufacturing process.

[deadendtracks]

THE MARCH FOR LIFE

[jerseyclown]

ur new hair has me on the mf floor u look gorgeous

AAAYAYHUUUUGUVGGggg thank you anon im glad u like it <3

[materialsscienceandengineering]

If you want to remove a layer of paint from a metal surface, you can use a sandblaster: Countless grains of sand are blasted onto the surface, and what emerges is clean metal. "Sputtering" can be imagined in a very similar way -- only much smaller, on an atomic scale. The surface is irradiated with ions, i.e. charged atoms, allowing microscopic impurities to be removed, for example.

If you are dealing with perfect surfaces where all the surface atoms are arranged exactly in a smooth plane, established theoretical models can predict the effects of ion bombardment quite easily. But in practice, this is very rarely the case. For complicated, rough surfaces, it is difficult to say how much material will be removed during sputtering. A computational model developed by researchers from TU Wien now makes it possible to characterize the surface roughness in a simple way and thus correctly describe the sputtering process even for more complicated samples.

Removing or depositing thin layers

"Sputtering of surfaces by ion bombardment is a very popular and versatile technique," says Prof. Friedrich Aumayr from the Institute of Applied Physics at TU Wien. "On the one hand, it can be used to remove material very precisely, for example in semiconductor technology, to create perfectly clean surfaces. On the other hand, however, it can also be used to selectively evaporate any material, which is then deposited on another surface, for example to produce super-reflective eyeglass lenses or hard material coatings on special tools." To use the right amount of material in this process, one must understand the sputtering process in great detail.

Read more.

[buschmicrophones]

I'm currently trying to build my own sputtering machine. This way I might gold-plate diaphragmes myself. #buschmicrophones #sputtering #sputteringtargets #sputteringmachine #diymachine #goldcoating #gold #fusion #fusion360 #rendering #3d https://www.instagram.com/p/CREy1cPhZ0Y/?utm_medium=tumblr

[titaniumalloys]

High Purity Metal Alloy Targets in our company including: Titanium, Tantalum, Niobium, Nickel, Zirconium, Tungsten and its alloys. Sputtering Targets can be provided in various of shapes, like Circular, Tubular, Planar, Rotating Targets, Disc and custom-made shapes at your request. The purity of metal targets can reach to 5N (99.999%).

[pvdir]

پمپ‌های توربومولکولار | چگونه از یک پمپ توربومولکولار مراقبت کنیم؟

https://bit.ly/3sYH8mp

امروزه طیف متنوعی از پمپ‌های مکانیکی برای فرایند خـلاء‌سازی (پمپ خلاء یا پمپ وکیوم)، وجود دارند که در طول سالیان متوالی اعتماد گسترده‌ای را جلب کرده‌اند. اگرچه این پمپ‌ها توان تولید خلاء متوسطی را دارند اما برای ایجاد خلاءهای بالا (HV) و خلاءهای فوق‌العاده بالا (UHV) استفاده از پمپ‌های توربوملکولار (Turbomolecular Pumps) برای تولید فیلم‌‌های نازک در دستگاه‌های تبخیر حرارتی، دستگاه‌های کندوپاش و دستگاه‌های لایه نشان کربن، امری حیاتی است. بنابراین برای بعضی از فناوری‌های مدرن و پیشرفته استفاده از یک پمپ توربومولکولار که دارای تکنولوژی بالایی باشد، لازم است.

در مورد پمپ‌های توربومولکولار در وهله اول باید گفت که در این پمپ خلاء، هیچ گونه ماده روان‌کننده مانند روغن یا آب وجود ندارد، پس بسیار تمیز و در عین حال بسیار حساس می‌باشند. به طور معمول، تیغه‌ای چرخان با فاصله چند دهم میلیمتر از دیواره پمپ می‌چرخد و شافت روتور چند دهم میلیمتر از تیغه‌های استاتور فاصله دارد. اگرچه وجود این فواصل برای حرکت پمپ ضروری است، اما این شرایط باعث می‌شود بخش کوچکی از گاز از طریق پمپ، جریان رو به عقب داشته باشد یا در واقع، گاز به عقب برگردد. این یکی از دلایلی است که پمپ های توربومولکولی باید حتما دارای یک پمپ پشتیبان باشند، تا فشار خلاء را بر روی دریچه اگزوز ایجاد کند. به عبارت دیگر، یک پمپ توربومولکولار باید توسط یک پمپ دیگر (معمولا پمپ روتاری) پشتیبانی شود.

پمپ‌های توربومولکولار معمولا با استفاده از یک روتور چرخشی بسیار سریع و بدون جاروبک (Brushless) (معمولاً بین ۲۲۰۰۰ تا ۹۵۰۰۰ دور در دقیقه) کار می‌کنند. فشار آنها در خلاء بالا تا خلاء فوق‌العاده بالا معمولا، بین mbar 10-۳ – ۱۰-۱۱ است. در نتیجه، این پمپ‌ها درصورتی که به درستی از آنها استفاده نشود در معرض بیش از حد گرم شدن یا درهم شکستن می‌باشند، زیرا اجزایی از پمپ که در سرعت‌های بالایی هستند، ممکن است با تیغه‌های بی‌حرکت یا ورود جسم خارجی برخورد کنند. به همین دلیل مهندسان متخصص، نکاتی را پیشنهاد کرده‌اند که باید برای عملکرد بهتر و ماندگاری بیشتر پمپ‌های خلاء (TMP) در نظر گرفته شوند.

روش‌های نگهداری پمپ‌های توربومولکولار

در وهله اول، لازم است محفظه و لوله‌های خلاء کاملا تمیز باشند و دارای نشتی نباشند (به این معنی که وقتی خلاء می‌شوند میزان نشت گاز از اتمسفر به داخل محفطه خلاء در حد استاندارد باشد). برای اطمینان از تحقق این امر، روش‌های مختلفی وجود دارد که به چند مورد از آنها اشاره می‌شود:

نشت‌یاب هلیومی یا Helium Leak Detector (وسیله ای برای تشخیص نشت با استفاده از گاز هلیوم – HLD)

آنالیزور گاز باقیمانده یا RGA (برای ردیابی گاز‌هایی که در هر گوشه و کناری به دام افتاده باشند).

به طور معمول، نرخ نشت‌خلاء قابل قبول برای محفظه خلاء بالا، mbar · l / s  ۱۰-۶ است. برای تمیزی خلاء، یک آنالیز‌کننده گاز باقیمانده (RGA) می‌تواند رد پای گاز‌ها را در دستگاه خلاء تشخیص دهد. اگر پیکی بالاتر از ۴۴ amu وجود نداشته باشد به معنی عدم وجود روغن، اثر انگشت یا ماده هیدرو کربنی دیگر، در سیستم است.

علاوه بر این، میزان فشار در دهانه خروجی پمپ وکیوم توربومولکولار، خیلی مهم است. این قسمت بخشی از لوله کشی بین پمپ توربومولکولار و پمپ پشتیبان (پمپ روتاری) است. یکی از توصیه‌های مهم، اندازه‌گیری فشار در این ناحیه است است، تا اطمینان حاصل شود که خلاء کافی وجود دارد و پمپ توربومولکولی به درستی پشتیبانی می‌شود یا نه. فشار پمپ پشتیبان استاندارد، برای پمپ‌های روتاری معمولا ۱۰-۳ تور است (برای پمپ‌های دیافراگمی این میزان حدود چند تور است). فشارهای بالاتر از این‌ حد در خروجی، به معنی وجود نشتی است که از جمله عوامل گرم شدن بیش از حد پمپ و خاموش شدن آن می‌باشد، البته در صورتی که پمپ مجهز به سنسورهای حرارتی باشد (پمپ‌های توربومولکولار مورد استفاده در دستگاه‌های لایه نشانی ساخت شرکت پوشش‌های نانو ساختار همگی از معتبر‌ترین کمپانی‌های اروپایی تهیه می‌شوند).

برای مطالعه موارد بیشتر به لینک زیر مراجعه نمایید:

https://bit.ly/3sYH8mp

[moved-flixlz]

CANCELLED!!! @night-slash-nike​ SHIPS THESE:

-asslesschapsshipping 

-redlobstershipping

and is associated with kinnie drama please steer clear!!!!

[vaccoat]

Pyrolytic Graphite

https://vaccoat.com Pyrolytic graphite is a polycrystalline form of graphite that is deposited from the vapor phase by thermal decomposition of a simple hydrocarbon such as methane. Pyrolytic graphite is a man-made material similar to graphite, except that there are covalent bonds between its graphene layers. Graphite has a layered structure, and each carbon atom in each layer is bonded to three adjacent atoms. The atomic structure of graphite is a two-dimensional lattice of hexagons whose first and third layers exactly match each other, while the second layer is slightly displaced relative to these two layers. https://www.diigo.com/user/vaccoat/b/565463365 Pyrolytic Graphite Structure But the material deposited as pyrolytic graphite consists of layers of wavy, twisted plans composed of carbon atoms arranged in a hexagonal structure. These layers are mutually parallel to each other but rotated randomly around an axis perpendicular to the deposition plan(c axis). The layered structure, with strong intra-layer covalent bonds and weak electrostatic bonds(Van der Waals bonding) between the layers, leads to a high degree of anisotropy in all properties. It is inherently brittle at room temperature. Properties Due to the structural differences between pyrolytic graphite and conventional commercial graphite, different properties should be expected from this material. Thermal and electrical properties: Linear thermal expansion Thermal conductivity more than four times that of copper Very high electrical resistance in the direction parallel to the deposition plan(perpendicular to C axis) Very good thermal insulation Very high electrical conductivity in the direction perpendicular to the deposition plan(parallel to the C axis) From a mechanical point of view, the ultimate strength of pyrolytic graphite in stress, bending and compression increases significantly with increasing temperature. And magnetically, this material is a great diamagnetic material at room temperature(X = -4 × 10-4). Magnetic Levitation is a phenomenon that can be implemented using materials with high diamagnetic properties. This material is a suitable option for magnetic levitation due to its high diamagnetic properties. Applications Applications of pyrolytic graphite include the following: Used in the rocket industry as a strong heating and cooling conductor Used in nuclear reactors as a neutron modulator coating Used in electronic devices as Heat sink Used in the construction of grid structures in some high power vacuum lamps Used in the automotive industry to create a certain amount of friction between two parts Used in medical engineering industries, for example in the manufacture of artificial hearts, heart valves and artificial vessels due to the lack of rapid blood clot formation https://bit.ly/33sCd2w VacCoat For the use of pyrolytic graphite in the thin film and semiconductor industry, this material can be deposited by sputtering method. Pyrolytic graphite is available in the market as a sputtering target. Ordinary graphite deposition using the sputtering method is difficult and time consuming due to the low sputtering yield of the graphite. Pyrolytic graphite targets are created using the CVD(Chemical Vapor Deposition) method and have a much higher density than graphite targets and less porosity. As a result, its sputtering yield is higher and outgassing phenomenon occurs quickly. To create thin films of pyrolytic graphite, vacuum deposition systems made by VacCoat Ltd. can be used in different models that are able to do deposition by sputtering method. Products of VacCoat Ltd. that are able to perform sputtering are divided into different models according to the number of cathodes, type of power supply, chamber dimensions and ultimate vacuum. DST3, DST1-300, DSCT, DST3-T models are among the products that can deposit different materials by sputtering method. For more information about the products of this company, refer to the site. https://lnkd.in/dnjmuqv https://bit.ly/33sCd2w

[highpuritysputteringtarget-blog]

Optical Properties of Lanthanum Titanate Films

In the field of thin-film technology, coating materials with low loss absorption, excellent mechanical properties, easy preparation, and stable performance have always been the materials of choice for process and designers. The lanthanum titanate film shows incomparable superior performance in this respect. Sputter coater targets are important materials for making thin films.

The lanthanum titanate crystal La2Ti2O7 belongs to the monoclinic system and has a perovskite-like structure. The space group at room temperature is P21. Lanthanum titanate crystals have good ferroelectric, photocatalytic, and electro-optical characteristics, and have a wide range of application prospects in the fields of light and electricity. It has a very high Curie temperature (1500 ℃) and a large coercive field (45kV / cm), which can be applied to high-temperature electro-optical equipment and information storage, such as high-temperature inverters, ferroelectric random access memory (FRAM), etc.

Lanthanum titanate crystals have excellent photocatalytic activity and have good application prospects in water decomposition reactions, fuel cells and other energy conversion technologies. Studies have shown that lanthanum titanate thin films have good process stability. Whether at room temperature or under heating deposition, or no matter how much oxygen is charged (or not oxygenated) during evaporation, the refractive index of the evaporation beam is not changed. And the extinction coefficient is extremely small, and the laser damage threshold is stable.

Lanthanum titanate thin film materials are used in the manufacture of optoelectronic devices, such as display technology, imaging technology, light output and light integrated devices. This material has a stable high refractive index, high homogeneity, and high transmittance. At present, lanthanum titanate crystals have been widely used as coating materials in the manufacture of high-performance photovoltaic devices. In view of the excellent properties of lanthanum titanate thin film with low loss absorption, easy preparation and stable performance, it can be used as an excellent coating material for laser thin film preparation.

SAM Sputter Targets specializes in the production of lanthanum titanate sputtering targets, mainly sintered particles and crystal particles, with a purity of more than 99.99%. We have more than 20 years of production experience, stable quality and strong technology.

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